WO2004105129A1 - Unite de carte de circuits imprimes et son procede de production - Google Patents

Unite de carte de circuits imprimes et son procede de production Download PDF

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Publication number
WO2004105129A1
WO2004105129A1 PCT/JP2003/006450 JP0306450W WO2004105129A1 WO 2004105129 A1 WO2004105129 A1 WO 2004105129A1 JP 0306450 W JP0306450 W JP 0306450W WO 2004105129 A1 WO2004105129 A1 WO 2004105129A1
Authority
WO
WIPO (PCT)
Prior art keywords
solidified body
printed circuit
heat
circuit board
component
Prior art date
Application number
PCT/JP2003/006450
Other languages
English (en)
Japanese (ja)
Inventor
Tsuyoshi So
Akihiko Fujisaki
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2003/006450 priority Critical patent/WO2004105129A1/fr
Publication of WO2004105129A1 publication Critical patent/WO2004105129A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Definitions

  • the present invention relates to a printed circuit board unit including an electronic component mounted on a substrate and a heat radiating component for promoting heat radiation from the electronic component, and a method for manufacturing the same.
  • Heat sinks and other heat dissipating components are widely used to cool the LSI chip mounted on a printed circuit board. These heat-dissipating components are received on the flat surface of the LSI chip. At this time, a thermally conductive fluid such as thermal grease is sandwiched between the surface of the LSI chip and the opposite surface of the heat radiating component. According to such a thermally conductive fluid, formation of a gap between the LSI chip and the heat radiating component can be prevented as much as possible. The heat of the LSI chip can be efficiently transferred to the heat dissipating component.
  • Printed circuit boards are often equipped with multiple LSI chips. On a printed circuit board, the height varies for each LSI chip. If a single heat sink is used in common for these LSI chips, the thickness of the thermal grease will vary between the facing surface of the heat sink and the surface of each LSI chip. As the thickness of the thermal grease increases, the heat transfer from the LSI chip to the heat dissipating component becomes extremely bad.
  • Patent Document 1
  • the present invention has been made in view of the above situation, and has a printed circuit board unit capable of suppressing a variation in the film thickness of a fluid disposed between an electronic component and a heat dissipation component. It is an object of the present invention to provide a method for producing the same. An object of the present invention is to provide a printed circuit board unit which is very useful for realizing such a method for manufacturing a printed circuit board unit.
  • a step of preparing an electronic component mounted on a substrate, a step of preparing a heat-radiating component that holds a solidified body on a flat surface, and a step of melting the solidified body A method of manufacturing a printed circuit board unit including a step of sandwiching a solidified body between a flat surface of a heat radiating component and a surface of an electronic component and a step of solidifying a molten solidified body.
  • the solidified body during melting can change its shape following the surface of the electronic component. After that, when the solidified body solidifies, a contact surface reflecting the height and inclination of the surface of the electronic component can be formed on the opposing surface of the heat dissipating component. When the heat dissipating component is received on the electronic component at such a contact surface, the surface of the electronic component can completely contact the solidified body.
  • Such a method of manufacturing a printed circuit board unit may further include a step of sandwiching a thermally conductive fluid between the solidified body after solidification and the surface of the electronic component. At this time, the heat conductive fluid can be uniformly sandwiched between the surface of the solidified body and the surface of the electronic component with a minimum thickness.
  • a heat-dissipating component unit that includes a heat-dissipating component that defines a flat surface and a solidified body attached to the flat surface may be provided.
  • the solidified body may be raised from a flat surface.
  • the solidified body should contain at least either the solder or the silver paste.
  • the electronic component mounted on the substrate, the heat radiating component received on the surface of the electronic component at the opposing surface facing the electronic component, and the solidified body fixed to the opposing surface of the heat radiating component And a fluid interposed between the solidified body and the electronic component.
  • a printed circuit board unit can greatly contribute to the realization of the manufacturing method described above.
  • the solidified body may face the surface of the electronic component at a contact surface inclined at a predetermined angle with respect to the facing surface of the heat radiating component. Coagulation The melting point of the solid only needs to be lower than the melting point of the conductive material connecting the electronic component and the substrate. Such a solidified body may contain at least either the solder or the silver paste. .
  • a step of preparing an electronic component mounted on the substrate a step of pressing the flat surface of the pressing member against the solidified body while melting the solidified body held on the surface of the electronic component, And a step of solidifying the formed solidified body.
  • the surface of the solidified body during melting can change its shape following the flat surface of the pressing member. Thereafter, when the solidified body solidifies, a flattened surface that spreads in one plane is established on the surface of the solidified body. When a heat-dissipating component is received on such a solid, the flat surface of the heat-dissipating component can contact the solid.
  • a heat dissipating component may be used for the pressing member.
  • Such a manufacturing method includes a step of arranging a thermally conductive fluid on a solidified body after solidification, a step of superposing a heat radiating component on the solidified body, and sandwiching the thermally conductive fluid between the solidified body and the heat radiating component.
  • the method may further include a step. At this time, the heat conductive fluid can be uniformly sandwiched between the surface of the solidified body and the facing surface of the heat radiating component with a minimum thickness.
  • an electronic component mounted on the board, a heat radiation component received on the surface of the electronic component on the facing surface facing the electronic component, a solidified body fixed to the surface of the electronic component, A solid body having a lower melting point than a conductive material connecting the electronic component and the board, the printed circuit board unit being provided.
  • a printed circuit board unit can greatly contribute to the realization of the manufacturing method described above.
  • the solidified body may be fixed to the surface of the electronic component at a contact surface inclined at a predetermined angle with respect to the facing surface of the heat radiating component.
  • the solidified body may contain at least one of the solder and the silver paste.
  • an electronic component mounted on the board, a heat dissipating component received on the surface of the electronic component on the opposing surface facing the electronic component, and a heat dissipating component disposed on the opposing surface of the heat dissipating component
  • a printed circuit board comprising: a contact surface inclined at a predetermined angle with respect to a facing surface of the electronic component; Unit is provided.
  • a heat dissipating component unit that defines a flat surface and a contact unit that is disposed on the flat surface and has a contact surface inclined at a predetermined angle with respect to the flat surface are used. It should be provided.
  • Such a printed circuit board unit can include a structure such as a single chip module (SCM) or a multichip module (MCM).
  • SCM single chip module
  • MCM multichip module
  • FIG. 1 is a perspective view schematically showing the appearance of the mother pod.
  • FIG. 2 is an enlarged partial vertical sectional view taken along line 2-2 of FIG.
  • FIG. 3 is an enlarged partial vertical sectional view of a printed circuit board unit showing a situation where a printed circuit board and a heat sink are prepared.
  • FIG. 4 is an enlarged partial vertical sectional view of a printed circuit board unit showing a situation in which a heat sink is mounted on an electronic component.
  • FIG. 5 is an enlarged partial vertical cross-sectional view of a printed circuit board unit showing a scene in which a heat sink is detached from an electronic component.
  • FIG. 6 is an enlarged partial vertical sectional view corresponding to FIG. 2 and showing the structure of the multi-chip module (MCM).
  • MCM multi-chip module
  • FIG. 7 is an enlarged partial vertical sectional view of a printed circuit board unit according to the second embodiment of the present invention, corresponding to FIG.
  • FIG. 8 is an enlarged partial vertical sectional view of a printed circuit board unit showing a scene of preparing an electronic component holding a solidified body.
  • FIG. 9 is an enlarged partial vertical cross-sectional view of the printed circuit board unit showing a situation where a pressing member is pressed on the solidified body.
  • FIG. 10 is an enlarged partial vertical sectional view of a printed circuit board unit showing a situation where a fluid is placed on a solidified body.
  • FIG. 11 is an enlarged partial vertical sectional view corresponding to FIG. 2 and showing the structure of the multi-chip module (MCM).
  • MCM multi-chip module
  • FIG. 12 is an enlarged partial vertical sectional view of a printed circuit board unit according to the third embodiment of the present invention, corresponding to FIG.
  • FIG. 13 is an enlarged partial vertical cross-sectional view of a printed circuit board unit showing a scene where an electronic component holding a heat spreader is prepared.
  • FIG. 14 is an enlarged partial vertical sectional view of the printed circuit board unit showing a situation where the surface of the heat spreader is flattened.
  • FIG. 15 is an enlarged partial vertical sectional view of a printed circuit board unit showing a situation where a fluid is placed on a heat spreader.
  • FIG. 1 schematically shows the appearance of the mother port 11.
  • the mother port 11 includes a large resin substrate 12.
  • SCM single chip module
  • Such a mother board 11 is incorporated in a computer system such as a global server.
  • the SCM 13 includes a heat dissipating component or heat sink 14.
  • the heat sink 14 is formed with a flat plate-shaped main body, that is, a heat receiving portion 14a, and a plurality of fins 14b rising vertically from the heat receiving portion 14a.
  • An air passage 15 extending in the same direction is defined between adjacent fins 14 b.
  • the airflow passing through the ventilation path 15 may be generated by the function of the ventilation unit.
  • the heat sink 14 may be molded from a metal material such as aluminum or copper.
  • the SCM 13 includes a ceramic printed wiring board 16 as shown in FIG. 2, for example.
  • a ceramic printed wiring board 16 On the surface of the printed wiring board 16 One electronic component, that is, an LSI chip 17 is mounted.
  • the LSI chip 17 is fixed to the printed wiring board 16 with a plurality of terminal bumps 18.
  • the terminal bumps 18 may be made of a conductive material such as solder, for example.
  • the heat sink 14 is fixed to the printed wiring board 16 with the support part 19.
  • the heat sink 14 may be adhered to the surface of the support component 19.
  • a screw (not shown) may be used for fixing the heat sink 14.
  • the heat sink 14 is received on the surface 17 a of the LSI chip 17 with a flat surface facing the LSI chip 17, that is, the facing surface 21.
  • the solidified body 22 is fixed to the facing surface 21 of the heat sink 14.
  • the solidified body 22 rises with the opposite face 21 force.
  • a material having a lower melting point than the terminal bumps 18 is used for the solidified body 22.
  • a low melting point solder or a silver base may be used for the solidified body 22.
  • the solidified body 22 has a contact surface 22 a that is inclined at a predetermined angle with respect to the facing surface 21.
  • the solidified body 22 is opposed to the surface 17a of the LSI chip 17 at the contact surface 22a.
  • the thermal grease 23 is composed of, for example, silicone grease and a heat conductive filler dispersed in the silicone grease.
  • a heat conductive filler for example, ceramic particles or metal particles may be used for the heat conductive filler.
  • the surface 17a of the LSI chip 17 may be covered with a heat conductive plate, that is, a heat spreader (not shown).
  • the thermal grease 23 is sandwiched between the solidified body 22 and the LSI chip 17 with a uniform film thickness. Heat can be reliably transferred from the LSI chip 17 to the heat sink 14.
  • a relative lateral displacement occurs between the surface 17 a of the LSI chip 17 and the facing surface 21 of the heat sink 14 based on a so-called difference in coefficient of thermal expansion.
  • Thermal grease 23 can easily absorb such lateral slippage based on the flowability of silicone grease. Therefore, the generation of stress in the LSI chip 17 and the heat sink 14 can be reduced as much as possible.
  • FIG. 3 first, an LSI chip 17 mounted on a printed wiring board 16 is prepared. A support component 19 is fixed on the printed wiring board 16 in advance. Subsequently, a heat sink 14 for holding the solidified body 22 on the flat surface, that is, the opposing surface 21 is prepared. Here, a low melting point solder is used for the solidified body 22. The low melting point solder has a lower melting point than the terminal bump 18. When mounting the solidified body 22, a plating film (not shown) may be formed on the facing surface 21 of the heat sink 14.
  • the heat sink 14 is overlaid on the printed wiring board 16. That is, the solidified body 22 is sandwiched between the facing surface 21 and the surface 17 a of the LSI chip 17.
  • the printed wiring board 16 is put in, for example, a heating furnace. At this time, a weight may be placed on the heat sink 14.
  • the solidified body 22 held on the facing surface 21 is melted by heating.
  • the heat sink 14 is pressed against the printed circuit board 16 by the weight of the weight. Thereafter, the molten solidified body 22 is cooled to room temperature.
  • the solidified body 22 solidifies.
  • an inclined surface that is, a contact surface 22 a is formed on the solidified body 22 following the LSI chip 1 ⁇ inclined at a predetermined angle with respect to the facing surface 21 of the heat sink 14.
  • the thermal seal lease 23 is sandwiched between the solidified body 22 after solidification and the surface 17 a of the LSI chip 17.
  • the heat sink 14 is pulled up when the thermal grease 23 is inserted.
  • thermal grease 23 is applied to the surface 17 a of the LSI chip 17.
  • the adhesive 24 is applied to the surface of the support part 19.
  • the solidified body 22 after solidification is again superimposed on the surface 17 a of the LSI chip 17.
  • the thermal dust 23 spreads between the surface 17 a of the LSI chip 17 and the contact surface 22 a of the solidified body 22.
  • the facing surface 21 is adhered to the surface of the support component 19 based on the adhesive 24.
  • the heat sink 14 is fixed to the printed wiring board 16.
  • the solidified body 22 has a contact surface according to the inclination of the surface 17 a of the LSI chip 17. 22a can be formed.
  • Thermal grease 23 is uniform with minimum film thickness It can be sandwiched between the contact surface 22 a of the solidified body 22 and the surface 17 a of the LSI chip 17. According to the verification of the present inventor, it was confirmed that when the film thickness of the thermal grease 23 was increased, heat transfer from the LSI chip 17 to the heat sink 14 was significantly inhibited.
  • silver paste may be used for the solidified body 22 instead of the low melting point solder.
  • the silver paste may be composed of a resin material and silver particles dispersed in the resin material.
  • the silver paste is applied to the facing surface 21 of the heat sink 14.
  • the heat sink 14 is superimposed on the printed wiring board 16 as described above.
  • the silver paste solidifies as the resin material cures in the silver paste based on the heating.
  • an inclined surface that is, a contact surface 22 a is formed on the solidified body 22 following the LSI chip 17 inclined at a predetermined angle with respect to the facing surface 21 of the heat sink 14.
  • the thermal grease 23 may be inserted between the contact surface 22 a of the solidified body 22 and the surface 17 a of the LSI chip 17 in the same manner as described above.
  • the above manufacturing method may be applied, for example, to the manufacture of a multi-chip module (MCM).
  • MCM multi-chip module
  • the solidified body 22 may be fixed for each individual LSI chip 17.
  • the heat sink 14 may be attached to the printed wiring board 16 with screws, for example.
  • each solidified body 22 has a corresponding surface 17 a of the LSI chip 17.
  • the contact surface 22a can be formed following the pattern. Therefore, as described above, the thermal grease 23 can be uniformly sandwiched between the contact surface 22 a of the solidified body 22 and the surface 17 a of the LSI chip 17 with the minimum film thickness.
  • the MCM 13 is mounted on the resin substrate 12 of the mother port 11 as described above.
  • FIG. 7 schematically shows a printed circuit board unit, that is, a SCM 13a according to a second embodiment of the present invention.
  • the SCM 13a is mounted on the large resin substrate 12 as described above.
  • the heat sink 14 is fixed to the printed wiring board 16 by a supporting part 19.
  • the heat sink 14 is received on the surface 17 a of the LSI chip at the facing surface 21 facing the LSI chip 17.
  • the solidified body 25 is fixed to the surface 17 a of the LSI chip 17.
  • a material having a lower melting point than the terminal bumps 18 is used for the solidified body 25.
  • a low-melting-point solder or a silver paste may be used for the solidified body 25 as described above.
  • the solidified body 25 has a contact surface 25a that is inclined at a predetermined angle with respect to the facing surface 21.
  • the solid 25 is fixed to the surface 17a of the LSI chip 17 at the contact surface 25a.
  • a fluid, that is, thermal grease 23 having a uniform film thickness is sandwiched between the surface of the solidified body 5 and the facing surface 21 of the heat sink 14.
  • the thermal grease 23 is uniformly sandwiched between the solidified solid 25 and the heat sink 14 with the minimum thickness. Heat can be reliably transferred from the LSI chip 17 to the heat sink 14. Thermal grease 23 can easily absorb lateral slippage based on the fluidity of silicone grease. Therefore, the generation of stress in the LSI chip 17 and the heat sink 14 can be reduced as much as possible.
  • an LSI chip 17 mounted on a printed wiring board 16 is prepared.
  • a support component 19 is fixed on the printed wiring board 16 in advance.
  • the solidified body 25 is fixed to the surface 17 a of the LSI chip 17.
  • a low melting point solder is used for the solidified body 25 .
  • the solidified body 25 has a lower melting point than the terminal bump 18.
  • a plating film (not shown) may be formed on the surface 17a of the LSI chip 17.
  • the printed wiring board 16 is put into, for example, a heating furnace.
  • a pressing member 26 is mounted on the printed wiring board 16.
  • the solidified body 25 held on the surface 17a of the LSI chip 17 melts.
  • the flat surface 26 a of the pressing member 26 is pressed toward the printed wiring board 16.
  • the molten solidified body 25 is cooled to room temperature.
  • the coagulated body 25 solidifies.
  • a heat sink 14 may be used instead of the pressing member 26.
  • thermal grease 23 is applied to the surface of the solidified body 25 after solidification.
  • an adhesive 24 is applied to the surface of the support component 19.
  • the opposing surface 21 of the heat sink 14 is superimposed on the surface of the solidified body 25. You.
  • the thermal grease 23 ' is interposed between the solidified body 25 and the heat sink 14.
  • the facing surface 21 of the heat sink 14 is adhered to the surface of the supporting component 19 based on the adhesive 24.
  • the heat sink 14 is fixed to the printed wiring board 16.
  • a silver paste may be used for the solidified body 25 instead of the low melting point solder.
  • the silver paste is applied to the surface 17 a of the LSI chip 17. Thereafter, the flat surface 26a of the pressing member 26 is pressed against the silver paste. At this time, the resin material evaporates and the silver particles solidify in the silver paste based on the heating.
  • the solidified body 25 has an inclined surface or contact surface following the LSI chip 17 inclined at a predetermined angle with respect to the facing surface 21 of the heat sink 14.
  • the thermal grease 23 may be sandwiched between the surface of the solidified body 25 and the facing surface 21 of the heat sink 14 as described above.
  • the solidified body 25 has a surface parallel to the facing surface 21 of the heat sink 14.
  • Can be The thermal grease 23 can be uniformly sandwiched between the surface of the solidified body 25 and the facing surface 21 of the heat sink 14 with a minimum thickness.
  • the manufacturing method as described above may be applied to, for example, the manufacture of a multi-chip module (MCM) as described above.
  • MCM multi-chip module
  • the solidified body 25 may be fixed for each LSI chip 17.
  • the heat sink 14 may be attached to the printed wiring board 16 with screws, for example.
  • the solidified body 25 has a parallel shape with the facing surface 21 of the heat sink 14.
  • the surface can be specified.
  • the thermal grease 23 is uniformly sandwiched between the surface of the solidified body 25 and the facing surface 21 of the heat sink 14 with the minimum thickness. be able to.
  • the MCM 13a is mounted on the resin board 12 of the mother port 11 as described above. '
  • FIG. 12 shows a printed circuit board unit according to a third embodiment of the present invention, that is, MCM 1.
  • MCM 13b is mounted on a large resin substrate 12 as described above.
  • the surface 17 a of each LSI chip 17 is covered with a heat spreader 27.
  • the heat spreader 27 has a contact surface 27a that is inclined at a predetermined angle with respect to the facing surface 21 of the heat sink 14.
  • the heat spreader 27 is received on the LS chip 17 at the contact surface 27a.
  • the heat sink 14 is received on the surface of the heat spreader 27 at the opposing surface 21 facing the LSI chip 17.
  • a fluid, that is, a thermal drier 23 is sandwiched uniformly with a minimum film thickness.
  • the thermal grease 23 is uniformly sandwiched between the heat spreaders 27, 27, 27 and the heat sink 14 with the minimum film thickness.
  • the heat from the LSI chips 17, 17, 17 can be reliably transferred to the heat sink 14.
  • Thermal grease 23 can easily absorb the side slip based on the fluidity of silicone grease. Therefore, the generation of stress in the LSI chip 17 and the heat sink 14 can be reduced as much as possible.
  • FIG. 13 A brief description will be given of a method of manufacturing MCM13b as described above. As shown in FIG. 13, first, an LSI chip 17 mounted on a printed wiring board 16 is prepared. A heat spreader 27 having a uniform film thickness is fixed on the surface 17a of the LSI chip 17.
  • Heat spreaders 27, 21 and 27 are polished plates for flattening
  • each heat spreader 27 is formed with a surface extending in a horizontal plane.
  • thermal grease 23 is applied to the surface of the heat spreader 27. Thereafter, the facing surface 21 of the heat sink 14 is superimposed on the surface of the heat spreader 27. Thus, the thermal grease 23 is sandwiched between the heat spreader 27 and the heat sink 14.
  • the heat sink 14 is fixed to the printed distribution board 16 with screws, for example.
  • the heat spreader 27 has the opposite surface 2 of the heat sink 14.
  • a surface parallel to 1 can be defined.
  • the thermal grease 23 has a uniform thickness between the surface of the heat spreader 27 and the opposing surface 21 of the heat sink 14 with a minimum film thickness. Can be pinched.
  • the present invention it is possible to provide a method of manufacturing a printed circuit board unit capable of suppressing a variation in thickness of a fluid disposed between an electronic component and a heat radiating component.
  • the present invention can provide a printed circuit board unit that is very useful for realizing such a method for manufacturing a printed circuit board unit.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé permettant de produire une unité de carte de circuits imprimés, comprenant les étapes qui consistent : à préparer une partie électronique (17) montée sur un substrat (16), et une partie de rayonnement (14) supportant un corps solidifié (22) sur sa surface plate (21) ; à maintenir ledit corps solidifié (22) entre la surface plate (21) de la partie de rayonnement (14) et la surface (17a) de la partie électronique (17), et à simultanément faire fondre le corps solidifié (22) ; à engendrer la solidification du corps solidifié fondu (22), et ; à maintenir un corps fluidique thermoconducteur (23) entre le corps solidifié (22) après solidification, et la surface (17a) de la partie électronique (17). Selon l'invention, même si la surface (17a) de la partie électronique (17) est inclinée, une surface de contact peut être formée sur le corps solidifié (22) en fonction de l'inclinaison de ladite surface (17a), et le corps fluidique thermoconducteur (23) peut être maintenu entre la surface de contact du corps solidifié (22) et la surface (17a) de la partie électronique (17), de manière uniforme, selon une couche d'épaisseur minimale.
PCT/JP2003/006450 2003-05-23 2003-05-23 Unite de carte de circuits imprimes et son procede de production WO2004105129A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/006450 WO2004105129A1 (fr) 2003-05-23 2003-05-23 Unite de carte de circuits imprimes et son procede de production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/006450 WO2004105129A1 (fr) 2003-05-23 2003-05-23 Unite de carte de circuits imprimes et son procede de production

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WO2004105129A1 true WO2004105129A1 (fr) 2004-12-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1959493A1 (fr) * 2005-12-08 2008-08-20 Fujitsu Limited Procede pour la production de piece electronique, procede pour la production d'element conducteur de chaleur, et procede de montage d'element conducteur de chaleur pour piece electronique
CN108428685A (zh) * 2017-01-27 2018-08-21 丰田自动车株式会社 半导体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453764A1 (fr) * 1990-04-27 1991-10-30 International Business Machines Corporation Joint thermique
JPH09219473A (ja) * 1996-02-13 1997-08-19 Hitachi Ltd 電子部品冷却構造を備えたパッケージおよびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453764A1 (fr) * 1990-04-27 1991-10-30 International Business Machines Corporation Joint thermique
JPH09219473A (ja) * 1996-02-13 1997-08-19 Hitachi Ltd 電子部品冷却構造を備えたパッケージおよびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1959493A1 (fr) * 2005-12-08 2008-08-20 Fujitsu Limited Procede pour la production de piece electronique, procede pour la production d'element conducteur de chaleur, et procede de montage d'element conducteur de chaleur pour piece electronique
EP1959493A4 (fr) * 2005-12-08 2010-03-10 Fujitsu Ltd Procede pour la production de piece electronique, procede pour la production d'element conducteur de chaleur, et procede de montage d'element conducteur de chaleur pour piece electronique
US8709197B2 (en) 2005-12-08 2014-04-29 Fujitsu Limited Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component
CN108428685A (zh) * 2017-01-27 2018-08-21 丰田自动车株式会社 半导体装置
CN108428685B (zh) * 2017-01-27 2019-09-03 丰田自动车株式会社 半导体装置

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