WO2004099284A1 - Composition de durcissement anaerobie - Google Patents
Composition de durcissement anaerobie Download PDFInfo
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- WO2004099284A1 WO2004099284A1 PCT/JP2004/006131 JP2004006131W WO2004099284A1 WO 2004099284 A1 WO2004099284 A1 WO 2004099284A1 JP 2004006131 W JP2004006131 W JP 2004006131W WO 2004099284 A1 WO2004099284 A1 WO 2004099284A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
Definitions
- the present invention relates to an anaerobic curable composition mainly used as an adhesive for electronic components, and more particularly to an anaerobic curable composition that generates less gas than conventional ones. Background technology>
- the anaerobic curable composition contains a (meth) acrylate monomer as a main component and is kept in a liquid state without being gelled while in contact with oxygen in the air or the like. It has the property of hardening rapidly when it is removed, and by utilizing such properties, the composition can be used for bonding, fixing, fitting of components such as screws and bolts, bonding of components, bonding between flange surfaces, sealing, ⁇ Used for filling burrows generated in structural parts. When faster curing is required, it is used in combination with a curing accelerator such as a primer.
- Anaerobic curable compositions have rapid curability at room temperature and have stable physical properties even after curing, so that their use in the electric field has increased significantly.
- an anaerobic curable adhesive composition used in combination with a curing accelerator is used for adhesion between a bearing and its shaft, and for fitting and bonding around the shaft due to its productivity.
- the magnetic recording plate magnetic disk
- the distance between the magnetic head and the magnetic disk that reads the data has become extremely small. For this reason, if an art gas from the adhesive adheres to the magnetic disk or the magnetic head, a read / write failure occurs and the function of the HDD cannot be exhibited.
- the present invention overcomes the above-mentioned conventional problems.For example, the generation of art gas at a high temperature after a baking process at about 90 ° C. for 1 hour after bonding of parts is compared with the case of using a conventional anaerobic curable composition.
- An object of the present invention is to provide an anaerobic curable composition which is reduced to about one tenth in comparison with the present invention.
- the present invention provides: (a) a compound having at least one or more radical polymerizable functional groups in a molecule: 100 parts by weight; (b) an organic peroxide: 0.1 to 5 parts by weight; ) Compound having at least one glycidyl group in the molecule: 30 to 200 parts by weight, (d) amine compound: 100 parts by weight based on the total amount of components (a) and (c) An anaerobic curable composition comprising 0.1 to 10 parts by weight.
- the compound (a) having at least one or more radically polymerizable functional groups in the molecule used in the present invention is a compound having a butyl group such as acrylic acid or methacrylic acid in the molecule, preferably at the terminal of the molecule. Yes, monomer, oligomer, polymer Is mentioned.
- the polymerizable monomer may be, for example, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethyl hexylhexyl (meth) acrylate, phenyl (meth).
- Monoesters such as acrylate and benzinole (meta) acrylate; hydroxyalkyl esters such as 2-hydroxyshethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; ethylene glycol dia Polyesters such as acrylate, polyethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropanetri (meth) acrylate, and pentaerythritol tetraacrylate, but are not limited to these. Not something to be done What is usually used in the field of anaerobic adhesives can be used. These polymerizable monomers can be used alone or as a mixture of two or more.
- polymerizable oligomer examples include a curable resin having a malate group, a fumarate group, an aryl group, a (meth) acrylate group, an isocyanate-modified acryloligomer, an epoxy-modified acrylyl oligomer, a polyester acrylyl oligomer, and a polyether acrylate.
- Clinole oligomers and the like, and these oligomers can be used alone or as a mixture of two or more.
- polymerizable polymer a polymerizable unsaturated polymer such as an unsaturated polyester resin and an unsaturated acryl resin can be used.
- These monomers, oligomers and polymers having polymerizability can be used together for the purpose of adjusting the viscosity of the anaerobic curable composition or adjusting the physical properties of the cured product.
- the organic peroxide (b) used in the present invention is conventionally used in anaerobic curable compositions, and is not particularly limited.
- cumenehide mouth baroxide t-pentinoleide mouth peroxide, ⁇ -menthanehydride dropoxide, methinoleethynoletone ketone peroxide, cyclohexane peroxide, dicumyl peroxide, diiso Hydroperoxides such as propylbenzene hydroperoxide, etc., ketone peroxides, diarylperoxide Organic peroxides such as oxides and peroxyesters, and the like can be mentioned.
- the compounding amount of the component (b) is 0.1 to 5 parts by weight, preferably 0.5 to 4 parts by weight based on 100 parts by weight of the component (a). In this case, if it is less than 0.1 part by weight, it is insufficient to cause a polymerization reaction, and if it is more than 5 parts by weight, the storage stability of the thermosetting composition is reduced.
- the component (c) used in the present invention is a compound having at least one glycidyl group in the molecule.
- the glycidyl group is also called an oxysilane ring or ethylene oxide, and a compound having a glycidyl group is sometimes simply called an epoxy resin.
- a typical example of the component (c) is an epoxy resin containing an average of two or more epoxy groups per molecule.
- bisphenol A epoxy resin bisphenol F epoxy resin, bisphenol S epoxy resin , Glycidyl dimer ester type epoxy resin, polyalkylene ether type epoxy resin, phenol novolak type epoxy resin, orthocresol nopolak type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthol type epoxy resin Resin, naphthalene type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, diglycidyl epoxy resin, glycidylamine type epoxy resin, etc., and these may be used alone or in combination of two or more. May be.
- Epoxy resins containing only one glycidyl group in the molecule are usually low molecular weight compounds, and are called reactive diluents for epoxy resins, and are used to adjust viscosity, adjust physical properties of cured products, and adjust curing speed. To be added.
- the component (c) is blended in an amount of 30 to 200 parts by weight, preferably 30 to 100 parts by weight, based on 100 parts by weight of the component (a). If the amount is less than 300 parts by weight, the amount of art gas generated during curing increases, and if it is more than 200 parts by weight, the anaerobic curability deteriorates.
- the component (d) is an amine compound.
- Component (d) acts as a curing agent for component (c).
- examples of the amine compounds include heterocyclic compounds such as 1,2,3,4-tetrahydroquinoline and 1,2,3,4-tetrahydroquinaldine.
- the mixing ratio of the component (d) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the total amount of the component (a) and the component (c). If the compounding ratio of the curing agent is less than 0.1 part by weight, there is no effect as a curing agent, and if it exceeds 10 parts by weight, the storage stability deteriorates. However, when it is desired to add more than 10 parts by weight, for example, to further improve the curability, the component (d) is not added to the present composition, but becomes two-part when mixed when used. It is also possible. In this case, the amount of the component (d) exceeding 10 parts by weight may be separately mixed, or the entire component (d) may be separately mixed.
- a component that promotes polymerization of component (a), that is, anaerobic curability can be added to the present composition.
- the polymerization accelerator include o-benzoxyl humide, a mercaptan compound, and a hydrazine compound.
- the mercaptan compound include straight-chain mercaptans such as n-dodecyl mercaptan, ethyl mercaptan, and butyl mercaptan.
- the hydrazine compound As the hydrazine compound,
- the present invention can further use various additives.
- a radical absorbent such as benzoquinone, hydroquinone, or hydroquinone monomethinoleate, ethylenediamine tetraacetic acid or its 2-sodium salt, oxalic acid, acetylaceton, o-- Metal chelating agents such as aminophenol may be added.
- These additives for improving the storage stability are preferably 0 to 1 part by weight based on 100 parts by weight of the component (a).
- a thickener a filler, a plasticizer, a colorant, and the like can be used as needed to adjust the properties of the anaerobic curable resin and the properties of the cured product.
- a curing accelerator can be used to accelerate anaerobic curability.
- the curing accelerator is obtained by dissolving a metal complex useful for improving anaerobic curability in an organic solvent, and is generally called a primer.
- the solvent is volatilized by applying it to the adherend in advance, and the metal complex adheres to the surface of the adherend, which has the effect of accelerating the anaerobic curing of the anaerobic adhesive to be applied later.
- various copper complexes typified by copper 2-ethylhexanoate and copper naphthenate, and vanadium are generally used, but any metal complex that improves anaerobic curability can be used. Can be used.
- the composition of the present invention has anaerobic curability, air or oxygen is cut off by applying and bonding or fitting to an adherend, and the composition is cured and adhered. This is due to the fact that the components (a) and (b) harden and develop an adhesive force. (C) The component is not cured at this point, but is cured by heating in the baking step, and the entire composition is completely cured. Then, a cured product that hardly generates outgas can be obtained.
- an acrylyl monomer mixture (1: 1 mixture of BP-2EM (Kyoeisha Chemical) and light ester HO (Kyoeisha Chemical) was used as the component (a).
- BP-2EM Kinyoeisha Chemical
- HO light ester HO
- component (a) an acrylyl monomer mixture
- 2 parts by weight of cumene hydroperoxide as a component (b)
- 1 part by weight of o-benzoituxulamide as a polymerization accelerator
- a component (c) the following Table 1
- the amount of Epicot 828 (oiled shell epoxy) and Epicot 807 (oiled shell epoxy) shown in 11 were blended.
- an adhesive was prepared using 5 parts by weight of 1-benzyl-1-methylimidazole with respect to 100 parts by weight of the component (a).
- adhesives were prepared by changing the composition as shown in Tables 12 and 13 below.
- the test piece used in the set time test and the adhesive strength test was made of SPCC_SD, 100 mm x 25 mm (JISG3141), and 0.5 parts of 2-ethylhexane was used as a primer in 100 parts of acetoneton. What melt
- Comparative Example 1 Comparative Example 2 Comparative Example 3 Specific Acryl Monomer Mixture 100 100 100 Cumene Halo Dropperoxide 2 2 2 Polymerization Accelerator 1 1 1 Epicoat 828 0 20 0 Epicoat 807 0 0 10
- the composition of the present invention shows a remarkable decrease in the amount of art gas generated as compared with Comparative Example 1 which is a conventional thermosetting adhesive to which the component (c) was not added. Can be Also, the set time and strength are satisfactory. As a matter of course, as in Comparative Example 4 and Comparative Example 6, the composition without the component (a) and the component Z or the component (b) did not result in curing.
- the present invention has the quick curing property unique to the anaerobic curable composition and the easiness of the bonding step, and can drastically reduce the amount of outgas generated. Therefore, the present composition can be used in locations where art gas, such as HDD, is problematic when generated.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003131837A JP2004331879A (ja) | 2003-05-09 | 2003-05-09 | 嫌気硬化性組成物 |
JP2003-131837 | 2003-05-09 |
Publications (1)
Publication Number | Publication Date |
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WO2004099284A1 true WO2004099284A1 (fr) | 2004-11-18 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/006131 WO2004099284A1 (fr) | 2003-05-09 | 2004-04-28 | Composition de durcissement anaerobie |
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JP (1) | JP2004331879A (fr) |
WO (1) | WO2004099284A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114015397A (zh) * | 2021-11-16 | 2022-02-08 | Tcl华星光电技术有限公司 | 框胶和液晶显示面板 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5713170B2 (ja) | 2010-03-18 | 2015-05-07 | スリーボンドファインケミカル株式会社 | 硬化性組成物 |
CN103282402A (zh) * | 2010-12-24 | 2013-09-04 | 三键株式会社 | 厌氧固化性组合物 |
WO2015125354A1 (fr) * | 2014-02-20 | 2015-08-27 | スリーボンドファインケミカル株式会社 | Agent adhésif à durcissement anaérobie |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54145781A (en) * | 1978-03-29 | 1979-11-14 | Loctite Corp | Anaerobic composition and stabilizing method |
JPS5765712A (en) * | 1980-10-11 | 1982-04-21 | Suriibondo:Kk | Curable composition |
JPS60235827A (ja) * | 1984-04-28 | 1985-11-22 | チバ‐ガイギー アクチエンゲゼルシヤフト | 硬化性組成物 |
JPH02502652A (ja) * | 1987-12-22 | 1990-08-23 | ソシエテ・ナシオナル・エルフ・アキテーヌ | 化学的に安定な嫌気性アクリル系接着配合物 |
JPH03294329A (ja) * | 1990-04-13 | 1991-12-25 | Cemedine Co Ltd | 樹脂組成物 |
JPH05105862A (ja) * | 1991-10-14 | 1993-04-27 | Three Bond Co Ltd | 二液型接着剤 |
JP2004169912A (ja) * | 2002-11-07 | 2004-06-17 | Osaka Gas Co Ltd | 配管用シール工法とシール剤 |
-
2003
- 2003-05-09 JP JP2003131837A patent/JP2004331879A/ja active Pending
-
2004
- 2004-04-28 WO PCT/JP2004/006131 patent/WO2004099284A1/fr active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54145781A (en) * | 1978-03-29 | 1979-11-14 | Loctite Corp | Anaerobic composition and stabilizing method |
JPS5765712A (en) * | 1980-10-11 | 1982-04-21 | Suriibondo:Kk | Curable composition |
JPS60235827A (ja) * | 1984-04-28 | 1985-11-22 | チバ‐ガイギー アクチエンゲゼルシヤフト | 硬化性組成物 |
JPH02502652A (ja) * | 1987-12-22 | 1990-08-23 | ソシエテ・ナシオナル・エルフ・アキテーヌ | 化学的に安定な嫌気性アクリル系接着配合物 |
JPH03294329A (ja) * | 1990-04-13 | 1991-12-25 | Cemedine Co Ltd | 樹脂組成物 |
JPH05105862A (ja) * | 1991-10-14 | 1993-04-27 | Three Bond Co Ltd | 二液型接着剤 |
JP2004169912A (ja) * | 2002-11-07 | 2004-06-17 | Osaka Gas Co Ltd | 配管用シール工法とシール剤 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114015397A (zh) * | 2021-11-16 | 2022-02-08 | Tcl华星光电技术有限公司 | 框胶和液晶显示面板 |
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