WO2004086617A1 - 機械共振器 - Google Patents
機械共振器 Download PDFInfo
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- WO2004086617A1 WO2004086617A1 PCT/JP2004/004091 JP2004004091W WO2004086617A1 WO 2004086617 A1 WO2004086617 A1 WO 2004086617A1 JP 2004004091 W JP2004004091 W JP 2004004091W WO 2004086617 A1 WO2004086617 A1 WO 2004086617A1
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- electrode
- vibrating body
- mechanical resonator
- mechanical
- vibration
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2457—Clamped-free beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane
Definitions
- the present invention relates to a mechanical resonator, and more particularly to a small-sized and high-performance filter circuit-switch circuit in a high-density integrated electric circuit.
- FIG. Figure 22 shows the "High-Q HF" by Frank D. Bannon III, John R. Clark, and Clark T.-Nguyenc.
- This filter is formed by forming a thin film on a silicon substrate. It consists of an input line 104, an output line 105, doubly supported beams 101 and 102 arranged with a gap of 1 micron or less for each line, and a connecting beam 103 connecting the two beams. ing.
- the signal input from the input line 104 is capacitively coupled to the beam 101, and generates an electrostatic force in the beam 101. Since mechanical vibration is excited only when the frequency of the signal is close to the resonance frequency of the elastic structure composed of the beams 101 and 102 and the coupling beam 103, the mechanical vibration is further increased between the output line 105 and the beam 102. By detecting the change in the capacitance of the input signal, the filtering output of the input signal can be extracted.
- Equation 1 the index indicating the ease of bending of the beam is the ratio d / L of the deflection d at the center of the beam and the length L of the beam when a static load is applied to the beam surface of the doubly supported beam, and d / L Is expressed by the following proportional relationship.
- a second method that does not use such a composite material is to change the dimensions of the beam in (Equation 1) to increase h ⁇ L ⁇ 2 .
- Equation 2 increasing h and decreasing L decrease dZL in (Equation 2), which is an index of flexibility, and It becomes difficult to detect the deflection of the beam.
- An object of the present invention is to provide a small mechanical resonator that realizes high performance of circuit components such as a filter.
- the present invention increases the capacitance change per unit displacement of a vibrating body that performs resonance vibration by forming the electrode surface shape when deformed in the resonance mode of the vibrating body, A structure that efficiently converts electrical signals into mechanical vibrations or a structure that efficiently converts mechanical vibrations into electrical signals has been realized.
- a mechanical resonator includes: a vibrating body that performs mechanical resonance vibration; and the vibrating body is arranged to be close to the time of the resonance vibration and to be curved in the amplitude direction of the resonance vibration. Electrodes. As a result, it is possible to increase the capacitance change per unit displacement of the vibrating body that performs resonance vibration, and to efficiently convert electric signals into mechanical vibrations, or to convert mechanical vibrations into electric signals efficiently. it can.
- a mechanical resonator according to a second aspect of the present invention is characterized in that the surface shape of the curved electrode of the first aspect is the same as the shape when the vibrator is deformed in the resonance mode. Things.
- the capacitance of the vibrating body can be increased to the maximum, so that the capacitance change per unit displacement of the vibrating body that performs resonance vibration is increased, and a structure that efficiently converts an electric signal into mechanical vibration is provided.
- mechanical vibration can be efficiently converted to an electric signal.
- a mechanical resonator according to a third aspect of the present invention is characterized in that the surface area of the electrode facing the vibrator according to the first or second aspect of the present invention is smaller than the surface area of the vibrator. It is.
- excessive charge generation in capacitive coupling between the vibrating body and the electrode can be suppressed, so that unnecessary leaking AC current can be reduced.
- the relationship between voltage and force, displacement and current becomes more linear, and control becomes easier. Can be easier.
- a mechanical resonator includes a vibrator that performs mechanical resonance vibration, and an electrode that is close to the vibrator and vibrates in a resonance mode having the same resonance frequency.
- the mechanical resonator according to the fifth aspect of the present invention includes the first to fourth aspects of the present invention. And a bias power supply connected between the vibrating body and the electrodes, and generating a static electric field between the vibrating body and the electrodes. It vibrates. As a result, the electric signal can be efficiently converted into mechanical vibration.
- the mechanical resonator according to the sixth aspect of the present invention further includes a detection unit that detects a signal from a voltage change between the electrode and the vibrator according to the first to fourth aspects of the present invention, The detection unit detects a signal converted from the vibration into an electric signal based on a change in capacitance between the vibration body and the electrode when the vibration body vibrates. As a result, mechanical vibrations can be efficiently converted into electric signals.
- a mechanical resonator according to a seventh aspect of the present invention is characterized in that, in the first to fourth aspects of the present invention, an insulating layer is provided on at least one of the opposing surfaces of the electrode and the vibrator. I do.
- the insulating layer is characterized by being polymer particles having insulating properties and lubricity.
- the thickness of the insulating layer becomes constant and the fluororesin has lubricity, so that even if the vibrator comes into contact with the fluororesin particles 5, it is possible to reduce the uncontrollable adsorption force called sttcion.
- the mechanical resonator according to the eighth aspect of the present invention is the mechanical resonator according to the first to fourth aspects of the present invention, wherein the first contact is disposed on the surface of the vibrator facing the electrode and insulated from the vibrator. It further has an electrode and a second electrode that is arranged insulated from the electrode so as to fit with the first contact electrode.
- the dynamic displacement of the vibrating body due to the electrostatic force is Q times larger than the static displacement, so that the contact electrodes can be brought into contact with a small voltage.
- the device further includes a bias power supply connected to the vibrating body and the electrode, and generating a static electric field between the vibrating body and the electrode.
- a bias power supply connected to the vibrating body and the electrode, and generating a static electric field between the vibrating body and the electrode.
- the first contact electrode approaches the second contact electrode, it is electrostatically attracted by the voltage of the bias power supply.
- the resonance vibration of the vibrating body The amount of displacement is controlled to the extent that it collides with the electrode, and at the moment of approaching again, the vibrating body is attracted to the electrode by the attraction of electrostatic force between the vibrating body and the electrode. Since the second contact electrode can be fixed by contact, a switching function using this can be realized.
- a mechanical resonator according to a ninth aspect of the present invention is characterized in that a plurality of the mechanical resonators according to the first to fourth aspects of the present invention are electrically arranged in parallel or in series. And the electrode may vibrate in a resonance mode having the same resonance frequency as the vibrating body.
- the mechanical resonator according to the tenth aspect of the present invention is characterized in that the mechanical resonator according to the first to ninth aspects of the present invention is housed in a case where the atmosphere is sealed in a vacuum. It is a sign. As a result, the damping effect on the vibrating body due to the viscosity of air can be eliminated, and the Q value can be increased.
- a filter according to a eleventh aspect of the present invention uses the mechanical resonator according to the first to seventh aspects of the present invention.
- a switch according to a twelfth aspect of the present invention uses the mechanical resonator according to the eighth aspect of the present invention.
- an electric circuit according to a thirteenth aspect of the present invention uses the mechanical resonator according to the first to twelve aspects of the present invention.
- FIG. 1 is a schematic diagram showing a structure of a mechanical resonator according to an embodiment of the present invention, in which an electrode surface shape is a lateral vibration primary resonance mode waveform of a doubly supported beam.
- FIG. 2 is a schematic diagram showing a structure of an electro-mechanical converter according to one embodiment of the present invention.
- FIG. 3 is a schematic diagram showing the structure of a conventional mechanical resonator in which electrodes are formed in a parallel plate shape.
- FIG. 6 is a schematic diagram showing the structure of a mechanical to electrical converter according to one embodiment of the present invention.
- FIG. 7 is a schematic diagram showing a configuration of a mechanical resonance filter arranged in parallel according to an embodiment of the present invention.
- FIG. 8 is a top view of a six-point fixed beam structure according to an embodiment of the present invention.
- FIG. 9 is a schematic diagram showing a configuration of mechanical resonance filters arranged in series using the beam structure of FIG. 8 according to an embodiment of the present invention.
- FIG. 10 is a schematic diagram showing the structure of a mechanical resonance filter having a simple electric-to-mechanical-to-electrical conversion function according to an embodiment of the present invention.
- FIGS. 11A and 11B are schematic diagrams showing a configuration of a mechanical resonator having electrodes also having a resonance structure according to an embodiment of the present invention.
- FIG. 12 is a schematic diagram showing a structure of a mechanical resonator having both ends of an electrode insulated according to an embodiment of the present invention.
- FIG. 13 is a characteristic diagram showing the relationship between the vibration displacement y and the capacitance C in the structure of FIG. 12 according to one embodiment of the present invention.
- FIG. 14 is a schematic diagram showing the structure of a mechanical resonator having an electrode central portion insulated according to an embodiment of the present invention.
- FIG. 15 is a characteristic diagram showing the relationship between vibration displacement y and capacitance C in the structure of FIG. 14 according to one embodiment of the present invention.
- FIG. 16 is a schematic diagram showing the structure of a mechanical resonator having a switch structure according to one embodiment of the present invention.
- FIG. 17 is a schematic diagram showing an insulating layer using tetrafluoroethylene resin particles according to an embodiment of the present invention.
- FIGS. 18A to 18D are schematic views showing the steps of manufacturing a mechanical resonator according to one embodiment of the present invention.
- FIG. 19 is a schematic diagram showing a structure of a mechanical resonator according to an embodiment of the present invention, in which an electrode surface shape has a cantilever transverse vibration primary resonance mode waveform.
- FIG. 2OA is a diagram showing the waveform of the secondary vibration mode of the lateral vibration of the cantilever.
- FIG. 20B is a schematic diagram showing a structure of a mechanical resonator according to an embodiment of the present invention, in which an electrode surface shape has a cantilever transverse vibration secondary resonance mode waveform.
- FIG. 20C is a schematic diagram showing another structure of a mechanical resonator according to an embodiment of the present invention, in which the electrode surface shape is a cantilever transverse vibration secondary resonance mode waveform.
- FIG. 20D is a schematic diagram showing a structure of a mechanical resonator combining FIGS. 20B and C according to an embodiment of the present invention.
- FIGS. 21A to 21D are schematic views showing a manufacturing process of a mechanical resonator having an electrode and a resonance structure according to an embodiment of the present invention.
- FIG. 22 is a schematic diagram showing a filter using a conventional mechanical resonator.
- Fig. 23 is a characteristic diagram showing the relationship between the dimensions of the mechanical resonator and the increase in frequency in the conventional example.
- FIG. 1 is a schematic diagram of a mechanical resonator according to the first embodiment of the present invention.
- the vibrating body 1 is a doubly supported beam having both ends fixed at a fixed end 7, and has a thickness of!, A width W, and a length L.
- the electrode 2 is provided close to the vibrator 1.
- An insulating layer 3 having a thickness d and a relative permittivity ⁇ r is provided on the surface of the electrode 2 in order to avoid an electrical short circuit caused by contact between the two.
- the surfaces of the electrode 2 and the insulating layer 3 also have a gentle concave shape having the shape of (Equation 3), and the depth ⁇ 5 maX is larger than the vibration amplitude ymaX of the vibrator 1. ing.
- the surface shape of the electrode 2 is set as in the following equation.
- V (X) one ⁇ ⁇ -it (cos kx-cosh kx) + sinbc-sinh kx ⁇ -d (4)
- Fig. 2 shows a case where the mechanical resonator of Fig. 1 is used for electro-mechanical conversion, in which a bias voltage Vb and an AC signal Vi (vi «Vb) are applied between the vibrator 1 and the electrode 2.
- Vb bias voltage
- Vi AC signal
- m AC signal
- F the electrostatic force
- C the capacitance between the vibrator and the electrode.
- the first term on the right side represents the bias force due to the bias voltage Vb.
- Figure 4 shows. The relationship between y and C in the structure of Fig. 3 at the same values of d, ⁇ r, (5max, L, W is also shown in Fig. 4. That is, in Fig. 4, the characteristic curve 401 is The change in the mechanical resonator having the structure is shown, and the characteristic curve 402 shows the change in the mechanical resonator having the structure in FIG.
- ⁇ C / ⁇ y has a constant value in the region where the relationship between y and C can be regarded as linear in Fig. 4.From (Equation 5), the relationship between the AC voltage and the excitation force should be treated as linear. Can be.
- FIGS. 1 manufacturing steps of the mechanical resonator according to the present embodiment shown in FIG. 1 are shown in FIGS.
- the substrate 10 is a high-resistance silicon substrate having a silicon oxide film formed by thermal oxidation and a silicon nitride film formed by a reduced-pressure CVD method deposited on the surface.
- a sacrificial layer made of photoresist is spin-coated, exposed, and developed on a substrate 10, and then baked on a hot plate to form a sacrificial layer 11 (FIG. 18A).
- the photoresist pattern and the sacrificial layer 11 are removed by oxygen plasma.
- the vibrating body 13 becomes a doubly supported beam that can vibrate, and forms a capacitor with the electrode 14 (FIG. 18D).
- the vibration of the vibrating body 13 can be generated by an electrostatic force between the vibrating body 13 and the electrode 14. In this case, the vibration direction of the vibrating body 13 is horizontal to the substrate.
- a high-resistance silicon substrate is used in this embodiment, a normal silicon substrate, a compound semiconductor substrate, or an insulating material substrate may be used.
- a silicon oxide film and a silicon nitride film are formed as insulating films on the high-resistance silicon substrate 10, the formation of these insulating films may be omitted when the resistance of the substrate is sufficiently high.
- aluminum is used as a material for forming the vibrating body and the electrodes in the present embodiment, other metal materials Mo, Ti, Au, Cu, and a semiconductor material into which impurities are introduced at a high concentration, such as Amorphous silicon, a conductive polymer material, or the like may be used.
- sputtering is used as a film forming method, the film may be formed using a CVD method, a plating method, or the like.
- the vibrating body in this embodiment is a cantilever beam
- i AC / ⁇ y I is similarly increased by making the surface shape of the electrode the same as the mode shape of the cantilever for the cantilever. Effect can be obtained.
- FIG. 19 is a schematic diagram of a mechanical resonator when the vibrating body is a cantilever.
- the vibrator 21 is a cantilever having one single surface fixed, and has a thickness h, a width W, and a length L.
- the electrode 22 is provided close to the vibrating body 21, and has an insulating layer 23 having a thickness d on the surface.
- the vibration mode of the cantilever beam or the cantilever beam is the primary mode of the transverse vibration, but the surface shape of the electrode is not limited to the secondary mode or higher mode.
- Fig. 2 The solid curve drawn on the xy plane of the OA represents the second-order mode waveform of the lateral vibration of the cantilever. That is, the cantilever of length L has one node at 0.774 L from the fixed end. At this time, if the surface shape of the electrode is a waveform in the resonance mode over the entire length L, the resonance of the beam at the free end from the node is disturbed by the electrode. Keep the length from the fixed end to the node I have.
- the same effect can be obtained by arranging the electrode at a position from the node to the free end as shown in FIG. 20C.
- the electrodes 22 of FIG. 20B and FIG. 20C are arranged with the vibrating body interposed therebetween.
- the electrode 22 a is used for exciting the vibrating body 21.
- the electrode 22 b can be used for detecting the vibration of the vibrating body 21.
- the electrode surface shape is a shape in the resonance mode of the vibrating body, the capacitance change per unit displacement of the vibrating body performing the resonance vibration is maximized. It is possible to efficiently convert electric signals into mechanical vibrations and convert mechanical vibrations into electric signals efficiently. It is not essential that the shape of the electrode surface completely match the shape of the resonance mode of the vibrator, and the closer the shape is, the higher the effect is obtained.
- Fig. 6 shows an example in which the mechanical resonator having the structure shown in Fig. 1 is used for a mechanical to electrical converter.
- the displacement of the vibrating body 1 that performs lateral vibration in the y-axis direction is detected as a change in the capacitance C between the vibrating body 1 and the electrode 2.
- the flowing current i is given by the following equation, and is expressed by the product of the vibration velocity and ⁇ C / ⁇ y.
- FIG. 7 is a structural diagram of a mechanical vibration filter using the mechanical resonator according to the present embodiment.
- the mechanical vibration filter is a capacitive coupling portion between the input line 104 and the doubly supported beam 101, which is an electro-mechanical converter of the filter structure shown in FIG. 22, and a mechanical-electric converter.
- the electrodes having the shape in the resonance mode shown in FIG. 1 as the first and second embodiments of the present invention are applied to both the capacitive coupling portions of the output line 105 and the doubly supported beam 102.
- this mechanical vibration filter includes a plurality of filters each comprising a set of an electric-to-mechanical converter and a mechanical-electric converter, arranged in parallel, splitting an input voltage and inputting the input voltage to each filter, and It has a structure that collectively outputs the output current signals of the above.
- Fig. 8 is a top view of the beam structure, in which the beam side al, a2, bl, b2, cl, and c2 are fixed as fixed surfaces at six locations.
- This configuration is almost equivalent to the configuration of two cantilever beams of length L and width W in series. This is because the vibration of one of the doubly supported beams is transmitted to the other doubly supported beam between the fixed surfaces b 1 and b 2, and the portion between the fixed surfaces bl and b 2 serves as a coupling beam. Play.
- FIG. 9 is a structural diagram of a mechanical vibration filter using the above-described mechanical resonator having a beam structure.
- the beam 102 and the output line 105 having the electrode structure of FIG. 1 are capacitively coupled.
- the mechanical vibration filter having this beam structure has a structure in which a plurality of filters are arranged in series.
- impedance matching by series connection can be easily achieved by employing the beam structure of FIG.
- the strength is increased and the production yield is improved.
- Fig. 10 shows a machine with a mechanical resonator structure that realizes both functions with one vibrator, unlike the filter structure of Fig. 22 that has an electro-mechanical converter and a machine-to-electrical converter separately. It is a vibration fill evening.
- the present embodiment has a structure common to both the electric-to-mechanical converter shown in FIG. 2 of Embodiment 1 and the mechanical-to-electrical converter shown in FIG. 6 of Embodiment 2. Sharing.
- the feature of this structure is that it has a simple configuration, but in addition to the alternating current generated due to the change in capacitance due to the displacement of the vibrating body 1 excited by the input signal Vi, it also has a constant capacitor. Unnecessary alternating current leaks through the capacitor.
- the mechanical resonator is a structure in which the electrode 2 facing the vibrator 1 also vibrates in the resonance mode having the same resonance frequency as the vibrator 1, The relative position is shifted by 1/2 of the wave wavelength.
- the electrode 2 is shifted in the X direction by 1 Z 2 of the beam length L.
- This mechanical resonator is a mechanical vibration filter having the parallel structure shown in the third embodiment, and FIG. 11A shows only a part of the repeating structure in the X direction.
- FIG. 11B shows the vibration state of the vibrator 1 and the electrode 2.
- FIG. 11B showing the resonance state the capacitance approaches the capacitance between extremely close conductors, that is, the capacitance in the structures of FIGS. 2 and 6 described in the first and second embodiments of the present invention.
- the capacitance C of the mechanical resonator having the structure of FIG. 11 is smaller than that of the conventional parallel plate structure shown in FIG. 3, while I ⁇ / ⁇ I It is shown that can be made as large as the structures in Figs.
- the mechanical resonator according to the present embodiment has a simple configuration, reduces the capacitance when the displacement of the vibrating body is small, and reduces the capacitance when the vibrating body is in the resonance mode and the displacement is large. Can be larger. Therefore, unnecessary AC current is reduced, and the electric signal can be efficiently converted to mechanical vibration, and the mechanical vibration can be efficiently converted to the electric signal.
- a mechanical vibration filter using this mechanical resonator can realize a downsized mechanical vibration filter with excellent conversion efficiency by attaching excitation and detection electrodes to the doubly supported beam.
- 21A to 21D are diagrams showing the process of manufacturing the mechanical resonator according to the present embodiment shown in FIG.
- a vibrating body is formed on a substrate 10.
- the substrate 10 is a high-resistance silicon substrate on which a silicon oxide film formed by thermal oxidation and a silicon nitride film formed by a low-pressure CVD method are deposited.
- a layer made of a photoresist is spin-coated, exposed, and developed on the substrate 10, and then baked on a hot plate to form a sacrificial layer 11 (FIG. 21A).
- a sacrificial layer 11 (FIG. 21A).
- fine holes 15a and 15b are formed in the sacrifice layer 11 at a constant pitch.
- the fine holes 15a and 15b are formed at positions shifted from each other by 12 pitches as shown in the figure.
- a photoresist is formed on aluminum and patterning is performed by photolithography. Then, the vibrating body 13a and the vibrating body 13b are formed by performing dry etching of aluminum using the pattern made of the photoresist as a mask (FIG. 21C). At this time, the vibrating body 13a is formed on the fine hole 15a, and the vibrating body 13b is formed on the fine hole 15b.
- the photoresist pattern and the sacrificial layer 11 are removed by oxygen plasma.
- the vibrating body 13 becomes a vibrable beam.
- the vibrating body 13 is fixed on the substrate 10 by the aluminum anchor 16 embedded in the fine hole 15, the doubly supported beam having the anchor 16 as a fixed end is continuously formed. Will be.
- the mechanical resonator structure shown in FIG. 11 can be realized.
- the vibration direction of the vibrating body 13 is horizontal to the substrate.
- a high-resistance silicon substrate is used in this embodiment, a normal silicon substrate, a compound semiconductor substrate, or an insulating material substrate may be used.
- a silicon oxide film and a silicon nitride film are formed as insulating films on the high-resistance silicon substrate 10, the formation of these insulating films may be omitted if the substrate has a sufficiently high resistance.
- aluminum is used as a material for forming the beam.
- metal materials Mo, Ti, Au, Cu, and a semiconductor material in which impurities are introduced at a high concentration for example, Amorphous silicon, a conductive polymer material, or the like may be used.
- sputtering is used as a film forming method, it may be formed by using a CVD method, a plating method, or the like. (Embodiment 5)
- the present embodiment relates to a method for reducing the capacitance of the mechanical resonator in order to suppress unnecessary AC current for the same purpose as in the fourth embodiment.
- FIG. 12 is a structural diagram of the mechanical resonator according to the present embodiment.
- FIG. 12 differs from the structure in FIG. 1 in that the conductor 121 corresponding to the length ⁇ L from both ends of the electrode 2 is replaced with an insulator.
- FIG. 13 is a characteristic diagram showing a relationship between the vibration displacement y and the capacitance C when ALZL is a parameter.
- d 0.1 rn
- the capacitance C can be reduced by increasing the insulating portions at both ends of the electrode, that is, by increasing AL / L.
- I AC / Ay I also decreases, and gradually approaches the value of I AC / Ay I of the conventional parallel plate structure shown in FIG.
- I ⁇ / ⁇ I the optimal y-C characteristics can be selected according to the use conditions.
- the effect obtained by replacing the both ends of the electrode with an insulator as described above is, in other words, in order to increase I AC / Ay I compared to the case of the conventional parallel plate type structure, It is not necessary to dispose an electrode whose surface shape is a wave shape in the resonance mode over the entire length L, and the same effect can be obtained even if a part of the total length is a wave shape in the resonance mode. It can be said.
- the mechanical resonator according to the present embodiment has a simple structure, reduces the capacitance when the displacement of the vibrating body is small, and reduces the capacitance when the displacement of the vibrating body is large in the resonance mode. Since the capacity can be increased, unnecessary AC current is reduced, and an electric signal can be efficiently converted into mechanical vibration, and mechanical vibration can be efficiently converted into an electric signal.
- the present embodiment relates to a method for improving the nonlinearity of the relationship between the vibration displacement y of the vibrating body and the capacitance C.
- the use of the electrode having the wave shape in the resonance mode shown in FIGS. Although IAC / AyI, which is an index of the mechanical / electrical conversion efficiency, has been improved, the negative displacement of the vibrating body, that is, the non-linearity when the vibrating body approaches the electrode side, becomes remarkable.
- FIG. 14 is a structural diagram of the mechanical resonator according to the present embodiment. 14 differs from the structure of FIG. 1 in that a conductor having a length of ⁇ L is replaced with an insulator on both sides in the X direction from the center of the electrode 2.
- FIG. 15 is a characteristic diagram showing the relationship between the vibration displacement y and the capacitance C when ALZL is set as a parameter.
- d 0.1
- the effect obtained by replacing the center of the electrode with an insulator as described above is, in other words, in order to increase I ⁇ / ⁇ I compared to the case of the conventional parallel plate type structure, It is not necessary to dispose an electrode whose surface shape is a wave shape in the resonance mode over the entire length L, and the same effect can be obtained even if a part of the total length is a wave shape in the resonance mode. It can be said.
- the mechanical resonator according to the present embodiment has a simple structure, reduces the capacitance when the displacement of the vibrating body is small, and reduces the capacitance when the displacement of the vibrating body is large in the resonance mode. Unnecessary AC current is reduced because the capacity can be increased, and electrical signals can be efficiently converted to mechanical vibrations, and mechanical vibrations can be efficiently converted to electrical signals. And can be converted. Further, in the mechanical resonator according to the present embodiment, the relationship between the voltage and the force, and the relationship between the displacement and the current become more linear, and the control can be easily performed.
- the present embodiment relates to a switch structure utilizing the fact that a large amplitude of the vibrating body can be obtained even when the input voltage is low by setting the electrode surface shape to a waveform in the resonance mode.
- FIG. 16 is a structural view of the switch according to the present embodiment.
- a contact 4a is formed as a first contact electrode in the insulating layer 3a near the center of the electrode 2, and the surface is exposed on the insulating layer 3a.
- a contact 4b is formed as a second contact electrode at the center of the lower surface of the vibrating body 1 via the insulating layer 3b, and a DC bias voltage Vb and an AC voltage Vi are applied between the vibrating body 1 and the electrode 2. are doing.
- the point that these contacts 4a and 4b are provided is different from the structure of the mechanical resonator according to the sixth embodiment.
- a normal switch applies an electrostatic force to the vibrator 1 by applying only the DC voltage Vb without using the AC voltage Vi.
- V b exceeds the pull-in voltage
- the electrostatic force exceeds the spring restoring force of the vibrating body 1 and the vibrating body 1 is suddenly attracted toward the electrode, and the contacts 4 a and 4 b close.
- the pull-in voltage is usually as high as several tens to several hundreds of volts, a high-voltage generating circuit is required.
- vibrating body 1 is excited by AC voltage Vi having the same frequency as the resonance frequency of vibrating body 1.
- the amount of vibration displacement of the vibrating body at this time reaches Q times the equivalent static force applied, so that the vibrating body 1 easily reaches the vicinity of the insulating layer 3a, and then the bias voltage Oscillator 1 is electrostatically adsorbed to electrode 2 by Vb.
- the atmosphere is sealed in a vacuum by housing in a case, and the damping effect on the vibrating body due to the viscosity of air is eliminated as much as possible.
- a switch mechanism can be realized in which a vibrating body in a resonance state is brought into contact with an electrode and held by electrostatic force.
- FIG. 17 is a detailed view of the insulating layer 3 on the electrode 2 of the switch according to the present invention, and shows a state where the fluororesin particles 5 having a particle size of 1 m are formed on the electrode in a single layer together with the electroless plating film 6. Is shown.
- the present invention is useful for mechanical vibration filters and switches using a mechanical resonator, and is suitable for miniaturization and high performance of devices.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04723030A EP1610459A4 (en) | 2003-03-25 | 2004-03-24 | MECHANICAL RESONATOR |
US10/538,319 US7453332B2 (en) | 2003-03-25 | 2004-03-24 | Mechanical resonator |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2003-082430 | 2003-03-25 | ||
JP2003082430 | 2003-03-25 | ||
JP2004074288A JP4513366B2 (ja) | 2003-03-25 | 2004-03-16 | 機械共振器、フィルタおよび電気回路 |
JP2004-074288 | 2004-03-16 |
Publications (1)
Publication Number | Publication Date |
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WO2004086617A1 true WO2004086617A1 (ja) | 2004-10-07 |
Family
ID=33100362
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/004091 WO2004086617A1 (ja) | 2003-03-25 | 2004-03-24 | 機械共振器 |
Country Status (4)
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US (1) | US7453332B2 (ja) |
EP (1) | EP1610459A4 (ja) |
JP (1) | JP4513366B2 (ja) |
WO (1) | WO2004086617A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US8450902B2 (en) * | 2006-08-28 | 2013-05-28 | Xerox Corporation | Electrostatic actuator device having multiple gap heights |
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CN100568720C (zh) * | 2005-01-13 | 2009-12-09 | 松下电器产业株式会社 | 扭转谐振器和采用其的滤波器 |
JP4604730B2 (ja) * | 2005-01-20 | 2011-01-05 | ソニー株式会社 | 微小振動子、半導体装置及び通信装置 |
JP4635619B2 (ja) * | 2005-01-20 | 2011-02-23 | ソニー株式会社 | 微小共振器及び通信装置 |
JP4438786B2 (ja) * | 2005-11-17 | 2010-03-24 | セイコーエプソン株式会社 | Mems振動子及びその製造方法 |
JP4965962B2 (ja) * | 2006-10-13 | 2012-07-04 | 学校法人立命館 | マイクロメカニカル共振器 |
JP5046966B2 (ja) * | 2007-01-23 | 2012-10-10 | パナソニック株式会社 | 電気機械共振器及びその製造方法 |
US7544531B1 (en) | 2007-03-13 | 2009-06-09 | Sitime Inc. | Ground strap for suppressing stiction during MEMS fabrication |
CN100434882C (zh) * | 2007-11-20 | 2008-11-19 | 东南大学 | 静电激励谐振器电容拾振结构 |
JP4645727B2 (ja) * | 2008-11-17 | 2011-03-09 | カシオ計算機株式会社 | アンテナ装置、受信装置および電波時計 |
JP4645730B2 (ja) * | 2008-12-03 | 2011-03-09 | カシオ計算機株式会社 | アンテナ装置、受信装置および電波時計 |
JP4645732B2 (ja) * | 2008-12-10 | 2011-03-09 | カシオ計算機株式会社 | アンテナ装置、受信装置および電波時計 |
JP2011004250A (ja) * | 2009-06-19 | 2011-01-06 | Sony Corp | 共振器およびその製造方法、発振器ならびに電子機器 |
US8928435B2 (en) | 2010-06-29 | 2015-01-06 | International Business Machines Corporation | Electromechanical switch device and method of operating the same |
FR2977747B1 (fr) * | 2011-07-08 | 2013-08-23 | Centre Nat Rech Scient | Resonateur a ondes de volume exploitant l'excitation/detection de la vibration |
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Also Published As
Publication number | Publication date |
---|---|
EP1610459A4 (en) | 2006-04-05 |
EP1610459A1 (en) | 2005-12-28 |
JP2004312710A (ja) | 2004-11-04 |
JP4513366B2 (ja) | 2010-07-28 |
US7453332B2 (en) | 2008-11-18 |
US20060214746A1 (en) | 2006-09-28 |
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