WO2004079352A1 - 透明基板端面部の検査装置およびその検査方法 - Google Patents
透明基板端面部の検査装置およびその検査方法 Download PDFInfo
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- WO2004079352A1 WO2004079352A1 PCT/JP2004/002668 JP2004002668W WO2004079352A1 WO 2004079352 A1 WO2004079352 A1 WO 2004079352A1 JP 2004002668 W JP2004002668 W JP 2004002668W WO 2004079352 A1 WO2004079352 A1 WO 2004079352A1
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- WIPO (PCT)
- Prior art keywords
- transparent substrate
- face
- inspection
- substrate
- face portion
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
Definitions
- the present invention relates to an apparatus and method for inspecting the presence or absence of a defect or the like on an end face portion of a transparent substrate such as a transparent glass substrate divided into a predetermined size.
- a transparent substrate such as a transparent glass substrate divided into a predetermined size.
- a pair of glass substrates etc. is used for the transparent substrate.
- a liquid crystal display panel substrate used in a liquid crystal display device is configured by sealing liquid crystal between a pair of glass substrates. Wiring, TFTs, etc. are provided on one of the glass substrates, which is usually called a TFT substrate.
- the other substrate has a color filter
- CF CF
- CF substrate is usually referred to as a CF substrate.
- Such a display panel substrate is formed, for example, by bonding a pair of mother glass substrates to each other and then dividing the substrate into the size of the display panel substrate.
- a predetermined TFT, wiring, and the like are provided in advance for each display panel substrate on the mother glass substrate to be a TFT substrate.
- FIG. 13 is a schematic perspective view of a divided display panel substrate.
- the TFT substrate 11 (arranged on the lower side in FIG. 13) constituting the display panel substrate 10 is provided with a TFT, a wire, etc., and each side is connected to each wire.
- a terminal portion 11 a provided with the plurality of terminals 11 b is formed.
- the other CF substrate 12 is bonded to the TFT substrate 11 such that the terminal portion 11 a is exposed in a state in which liquid crystal is sealed at a predetermined interval.
- Terminal portion provided on the TFT substrate 11 A of the bonded glass substrate 1 OA is shown in FIG. 14 (a).
- the terminals 11 b of 1 1 a are electrically connected to each other by a short link 11 c provided on the side edge of the terminal portion 11 a in the TFT substrate 11 A.
- the short link 11 c prevents the charge from being accumulated in each terminal 11 b and each wiring, and prevents electrostatic breakdown of each wiring and the like. Then, after a plurality of bonded glass substrates 1 OA are respectively divided from the bonded mother 1 glass substrate obtained by bonding the mother 1 CF substrate and the mother-T F T substrate, the dividing line 1 shown in FIG. 14 (b)
- the edge portions on both sides of the end face 11 e are chamfered respectively.
- the upper edge of the CF substrate 12 and the T FT not only on the end surface 11 e along the terminal portion 11 a of the double substrate 11 but also on the end surface on which the terminal portion of the display panel substrate 10 is not formed.
- the lower edge of substrate 11 is chamfered D
- the bonded glass substrate 1 OA is formed by respectively dividing a pair of maza-one glass substrates bonded to each other.
- FIG. 15 is a cross-sectional view of a bonded glass substrate 1 OA divided from a bonded mother substrate.
- the dividing position of the CF substrate 12 A is the same as that of the TFT substrate 1 1 A Unlike the dividing position of the CF substrate 12 A, as shown in FIG. 15, the dividing position of the CF substrate 12 A is in the vicinity of the sealing material 13 provided for bonding the TFT substrate 11 A and the CF substrate 12 A to each other. Become.
- the tensile force by the sealing material 13 is applied to the end surface 12e of the divided CF substrate 12A, and the divided end surface 12e is a broken line in FIG.
- the sealing material 13 may be gradually inclined in the direction approaching the sealing material 13.
- the terminal portion of the TFT substrate 11A When dividing 11 a, there is a possibility that a chipping may occur on the end surface of the TFT substrate 11 of the divided display panel substrate 10 or the end surface of the CF substrate 12.
- the chip When a relatively large shell-like chip occurs in the end face 1 le adjacent to the terminal section 11 a of the TFT substrate 11, the chip extends over time to the inside of the TFT substrate 11 to form the terminal section 11 a. There is a risk that the terminal 11b provided on the terminal may be disconnected.
- the display panel substrate 10 in which a defect such as a chipping has occurred in the end face portion of the TFT substrate 11 or the end face portion of the CF substrate 12 divided from the pair of maza-one glass substrates bonded to each other is the next step. If the liquid crystal display device is transported to a state where the liquid crystal display device is manufactured, the manufactured liquid crystal display device may not operate properly, which may cause defective products.
- the end face portion of the TFT substrate 11 of the display panel substrate 10 or the end face portion of the CF substrate 12 divided from the bonded mother substrate is inspected before being transported to the next step. It is preferable to detect defects such as end face inclination and end face chipping. However, there is a problem that it is not easy to efficiently and accurately detect defects such as end face inclination and chipping in the display panel substrate 10.
- the end portion of the TFT substrate 11 of the display panel substrate 10 and the end portion of the CF substrate 12 are usually formed by injecting the liquid crystal between the TFT substrate 11 and the CF substrate 12, and then the edge portion of each end portion , Each, by wet grinding with a grinding wheel
- the problem that it is not easy to confirm that the chamfer has been reliably chamfered by a predetermined amount.
- the present invention solves such a problem, and an object thereof is to be able to efficiently and accurately detect a defect such as a chipping at an end face portion of a transparent substrate, and to inspect the state of a chamfered portion at an end face It is an object of the present invention to provide an inspection apparatus for an end face portion of a transparent substrate which can easily perform an inspection method and the like. Disclosure of the invention
- the inspection apparatus of the transparent substrate end face portion of the present invention is disposed facing the end face portion of the table supporting the transparent substrate and the transparent substrate placed on the table, and the light is directed toward the end face portion ,
- image processing means for detecting a defect in the end face based on the density of the image of the image data, thereby achieving the above object.
- the apparatus further comprises a first reflecting means for reflecting the light emitted along the transparent substrate toward the end face, and the imaging means is irradiated with the light reflected by the first reflecting means.
- the end surface portion and the vicinity thereof may be disposed as an imaging region.
- the imaging means may be disposed on the opposite side of the transparent substrate to the reflecting means.
- the table may be configured to horizontally support the transparent substrate, and the first reflection unit may be provided below the transparent substrate.
- the table may be configured to support the transparent substrate in a horizontal state, and a second reflection unit may be provided above the transparent substrate.
- the table may be movable in the horizontal direction.
- the table may be rotatable about an axis perpendicular to the surface of the table.
- the first reflecting means and the imaging means may be movable relative to the table together.
- the first reflecting means may be provided integrally movably with respect to the first illumination means.
- the first reflecting means may be capable of adjusting the reflection direction with respect to the end face portion of the transparent substrate.
- the second reflecting means and the imaging means may be movable relative to the table together.
- the second reflection means may be provided integrally movably with respect to the first illumination means.
- the second reflecting means may be capable of adjusting the reflection direction with respect to the end face portion of the transparent substrate.
- the light-emitting device may further comprise a second illumination means for intermittently emitting light to the end face portion of the transparent substrate during the extinguishing time of the first illumination means.
- the first illumination means may be a linear light source extending long in parallel to the end face of the transparent substrate.
- the linear light source may be an LED array.
- the imaging means may be a CCD camera.
- the first illumination means and the first reflection means may be respectively provided on the end face side of the side edges of the transparent substrate.
- the first illumination means and the second reflection means may be respectively provided on the end face sides of the side edges of the transparent substrate.
- the image processing means may determine the density of the image for each pixel in the image data captured by the imaging means, and specify the end face of the transparent substrate based on the density of the image of the pixel.
- the image processing means may detect a defect based on the density of the image of the end face portion of the transparent substrate and the pixel specified.
- the edge of the end face may be chamfered.
- the image processing means may detect irregular reflection at an end face portion of the transparent substrate as a defect portion with high light intensity.
- the transparent substrate may be a bonded glass substrate in which two glass substrates are bonded such that the terminal portion is exposed in a state in which a predetermined gap in which liquid crystal is sealed is provided.
- the image processing means may be switchable so that one or both of the end faces of each of the bonded glass substrates bonded to each other such that the terminal parts are exposed are to be inspected.
- the inspection method of the end face portion of the transparent substrate comprises the steps of: intermittently irradiating light to the end face portion of the transparent substrate by the first illumination means; and imaging the end face portion and the vicinity thereof by the imaging means. And the step of detecting a defect in the end face based on the density of the image of the image data taken by the imaging means, thereby achieving the above object.
- the light intermittently irradiated along the transparent substrate in the light irradiation step and the imaging step may be reflected by the reflection means toward the end face.
- the light may be intermittently emitted to the end face by the second illumination means during the extinguishing time of the first illumination means for intermittently emitting light to the end face.
- the density of the image is determined for each pixel in the image data captured by the imaging means, and the end face of the transparent substrate is identified based on the density of the image, and identified.
- the defect may be detected based on the density of the image of the end face of the transparent substrate and the pixel.
- the edge portion of the end face may be chamfered.
- the transparent substrate may be a bonded glass substrate in which two glass substrates are bonded such that the terminal portion is exposed in a state in which a predetermined gap in which liquid crystal is sealed is provided.
- the step of detecting the defect may be switchable so that one or both of the end faces of each of the bonded glass substrates bonded to each other so as to expose the terminal part is to be inspected.
- FIG. 1 is a schematic configuration view of the embodiment of the inspection apparatus of the transparent substrate end face portion of the present invention.
- FIG. 2 is a block diagram of a control system in the inspection apparatus of the transparent substrate end face portion of the present invention.
- FIG. 3 is a flow chart showing the operation procedure of the inspection device of the transparent substrate end face portion of the present invention.
- FIG. 4 is a flow chart showing the operation procedure of the inspection device of the transparent substrate end face portion of the present invention.
- FIG. 5 is an example of an image for explaining the operation of the inspection apparatus of the transparent substrate end face portion of the present invention.
- FIG. 6 (a) is an explanatory view of image processing of the inspection device of the transparent substrate end face portion of the present invention.
- FIG. 6 (b) is an explanatory view of image processing of the inspection device of the transparent substrate end face portion of the present invention.
- FIG. 7 (a) is an explanatory view of image processing of the inspection device of the transparent substrate end face portion of the present invention.
- FIG. 7 (b) is an explanatory view of image processing of the inspection device of the transparent substrate end face portion of the present invention.
- FIG. 8 is an example of an image for explaining the image processing of the inspection apparatus of the transparent substrate end face portion of the present invention.
- FIG. 9 is a flowchart showing an image processing procedure of the inspection apparatus of the transparent substrate end face portion of the present invention.
- FIG. 10 is an explanatory diagram of image processing of the inspection apparatus of the transparent substrate end face portion of the present invention.
- FIG. 11 is a diagram for explaining how the illumination of the end surface illumination unit and the epi-illumination are turned on and off.
- FIG. 12 is a schematic configuration diagram of an optical system of an inspection device of a transparent substrate end face portion for inspecting a chamfering amount.
- FIG. 13 is a perspective view showing a schematic configuration of a display panel substrate.
- FIG. 14 (a) is a schematic perspective view showing the manufacturing procedure of the display panel substrate.
- FIG. 14 (b) is a schematic perspective view showing the manufacturing procedure of the display panel substrate.
- FIG. 15 is a cross-sectional view of the main part of the display panel substrate.
- FIG. 1 is a schematic configuration view showing an example of the inspection apparatus of the transparent substrate end face portion of the present invention.
- the inspection apparatus 1 for the transparent substrate end face portion is used, for example, to inspect each end face portion of the TFT substrate 11 and the CF substrate 12 of the display panel substrate 10 shown in FIG. 13.
- the inspection apparatus 1 for the transparent substrate end face portion includes a slide table 23 provided slidably on a base 24 in a predetermined Y-axis direction, and a DD motor (direct drive provided on the slide table 23). Motor) 22 and a rotary table 21 provided so as to be rotated by the DD motor 22.
- the display panel substrate 10 is placed horizontally on the rotary table 21. It is supposed to be
- the rotary table 21 is configured to fix the display panel substrate 10 to be placed horizontally by vacuum suction.
- the rotation axis of the DD motor 22 provided on the slide table 23 is vertical, and the rotation table 21 can be rotated about the vertical axis by this DD motor 22. .
- the rotary table 21 is configured to support the display panel substrate 10 in a state in which the peripheral portion of the display panel substrate 10 to be placed protrudes to the outer periphery of the rotary table 21.
- the slide table 23 provided with the DD motor 22 is slidable along a pair of Y-axis guide rails 25 provided parallel to each other on the base 24.
- a Y-axis pole screw 26 is rotatably provided in parallel with each Y-axis guide rail 25 between the pair of Y-axis guide rails 25.
- the Y-axis pole screw 26 is Y-axis pole nuts 2 7 attached to the lower surface of the slide table 2 3 are screwed together.
- a Y-axis serpo motor 28 is connected to one end of the Y-axis pole screw 26. The Y-axis pole screw 26 is rotated forward and reverse by the Y-axis serpo motor 28.
- the slide table 2 3 is in both directions of Y axis along the pair of Y axis guide rails 25 (front and back direction perpendicular to the paper of FIG. 1) Slide on.
- the base 24 is constructed above the rotary table 21 so as to be horizontal along the X-axis direction orthogonal to the Y-axis ball screw 26 and each Y-axis guide rail 25.
- a support 31 is provided.
- the support base 31 has a pair of X-axis guide rails 3 along a direction orthogonal to the Y-axis pole screws 26 provided on the base 24 and the Y-axis guide rails 25. 2 are provided to align in a straight line.
- slide blocks 34 are engaged with the X-axis guide rails 32 in a slidable manner, respectively.
- X axis pole screws 33 are horizontally installed in parallel with the X axis guide rails 32 respectively, and each X axis ball screw 33
- the X axis pole nuts (not shown) attached to the slide block 34 are respectively screwed together.
- An optical system moving serpo motor 35 is connected to each end of each of the X axis pole screws 33 located apart from each other, and each optical system moving servo motor 35
- the X axis pole screw 33 is rotated forward and reverse respectively. Therefore, the slide block 34 reciprocates in the X-axis direction in both directions (left and right direction in FIG. 1) along the X-axis direction as the X-axis pole screws 33 are respectively rotated forward and reverse.
- Each slide block 34 extends to the lower side of the support base 31 and the lower end portion of each slide block 34 is in proximity to the display panel substrate 10 placed on the rotary table 21.
- a CCD camera for imaging the respective end face portions located on both sides of the TFT substrate 11 and the CF substrate 12 constituting the display panel substrate 10 mounted on the rotary table 21 is provided.
- 36 are provided with the optical axis vertical.
- each CCD camera 36 is such that the end face lie of the TFT substrate 11 of the terminal portion 1 1 a of the display panel substrate 10 and the end face 12 e of the CF substrate 12 can be imaged respectively.
- the range is about 15 mm with respect to the axis.
- the image data captured by each CCD camera 36 is given to the image processing device 5 1 (see FIG. 2), and predetermined image processing is performed.
- each CCD camera 36 the epi-illumination used when aligning the side edges of the display panel substrate 10 on the lower side of each CCD camera 36 with respect to the area imaged by each CCD camera 36. 37 are arranged vertically with their optical axis aligned with the optical axis of each CCD camera 36.
- connection block 38 extending along the vertical direction is attached on the far side of the other slide block 34, and at the lower end of each connection block 38, An end surface illumination unit 39 for emitting light to the end surface portions of the display panel substrate 10 placed on both sides of the turntable 21 is provided so as to face each end surface.
- Each end face illumination unit 39 is constituted, for example, by a linear light source extending along the horizontal direction, and in the present embodiment, it is constituted by an LED array in which a plurality of LEDs are arranged in the horizontal direction. ing.
- each upper reflector 4 For example, 1 is arranged at a distance of about 10 to 60 mm with respect to the optical axis of the CCD camera 36 in the vertical state.
- each lower region of each end face, light irradiated from the end surface illumination unit 3 9, the lower reflection mirror 4 2 c each lower reflecting mirror provided respectively for reflecting towards the end face located above For example, at a distance of about 5 to 30 mm from the optical axis of the CCD camera 36 in the vertical state, for example, 5 to 2 for the upper surface of the display panel substrate 10. They are arranged at intervals of about 5 mm.
- Each upper reflecting mirror 41 reflects the light emitted from each end surface illumination unit 39, and irradiates the end surface portion of the display panel substrate 10 located below it.
- each lower reflecting mirror 42 reflects the light emitted from each end surface illumination unit 39 and irradiates the end surface portion of the display panel substrate 10 located above it.
- Each upper reflecting mirror 41 has a length of 30 mm along the inclination direction in the inclined state shown in FIG. 1, and each lower reflecting mirror 42 has the inclined state shown in FIG. The length along the inclination direction in each is 10 mm.
- an upper reflecting mirror rotation motor 43 for rotating the upper reflecting mirror 41 along a horizontal axis along the end face of the display panel substrate 10 is provided.
- the respective upper reflecting mirror rotation motors 43 are connected to each other, and the respective upper reflecting mirrors 41 are rotated at an angle of 10 ° to 40 ° with respect to the vertical direction. The reflection direction of light by each upper reflecting mirror 41 is finely adjusted.
- each lower reflecting mirror 42 a lower reflecting mirror pivoting motor that pivots each lower reflecting mirror 42 along a horizontal axis along the end face of the display panel substrate 10
- the respective lower reflectors 42 are rotated at an angle of 10.degree. To 40.degree. With respect to the vertical direction.
- the reflection direction of light by each lower reflecting mirror 42 is finely adjusted.
- Each upper reflector rotation motor 4 3 is a cylinder 4 for the upper reflector slide
- each upper reflector slide cylinder 45 is vertically moved up and down by the upper reflector raising and lowering cylinder 46 so as to be positionally adjustable.
- each upper reflecting mirror lifting cylinder 46 is attached to a slide block 34 located above the corresponding upper reflecting mirror 41. Therefore, the corresponding upper reflecting mirror 41 is raised and lowered together with the upper reflecting mirror slide cylinder 45 by each upper reflecting mirror elevating cylinder 46.
- each lower reflector rotation motors 44 are respectively slid horizontally along the X-axis direction by the lower reflector slide cylinders 47 so that position adjustment can be performed. Further, each lower reflector slide cylinder 47 is vertically moved up and down by the lower reflector raising and lowering cylinder 48 so as to be positionally adjustable. Then, each lower reflector raising / lowering cylinder 48 is attached to a connecting block 38 to which an end face illumination unit 39 for irradiating light to the end face of the corresponding display panel substrate 10 is attached. ing. Therefore, each lower reflector raising and lowering cylinder 4 8 raises and lowers the corresponding lower reflector 42 together with the lower reflector sliding cylinder 4 7.
- FIG. 2 is a block diagram of a control system of the inspection apparatus 1 for the transparent substrate end face portion of the present invention.
- the image data captured by each CCD camera 36 is input to the image processing unit 51, and the image data captured by each CCD camera 36 is processed by the image processing unit 51. It is processed. Then, the output of the image processing unit 51 is output to the control unit 52, and the control unit 52 controls the DD motor 22, the Y axis serpo motor 28, the optical system moving shutter 35, Epi-illumination 3 7, each upper reflector rotation motor 4 3, each lower reflector rotation motor 4 4, each upper reflector slide cylinder 4 5, each upper reflector elevating cylinder 4 6, each lower reflection The mirror slide cylinder 4 7 and each lower reflector raising and lowering cylinder 4 8 are controlled respectively.
- the respective end face portions located on both sides of the display panel substrate 10 can be inspected simultaneously.
- Transparent group of the present invention In the inspection device 1 for the plate end face, first, the display panel substrate 10 to be inspected is placed on the rotating table 21. The display panel substrate 10 mounted on the rotary table 21 is fixed on the rotary table 21 by vacuum suction in the horizontal state where the outer peripheral edge thereof protrudes from the peripheral edge of the rotary table 21.
- the control unit 52 controls the Y axis servomotor 28 and the DD motor 22 to position the rotary table 21. Adjust the The rotary table 21 is adjusted such that a pair of corner portions of the fixed display panel substrate 10 is positioned within the imaging area of each of the CCD cameras 36 disposed above.
- control unit 52 turns on each of the epi-illumination lights 37, and irradiates light in the vicinity of the imaging area below each of the corresponding CCD cameras 36 with the respective epi-illumination lights 37. . Then, image data of a part of each of the scanners picked up by each CCD camera 36 is supplied to the image processing unit 51, and the image data is processed.
- the control unit 52 is provided with a support for moving each optical system 35 provided on the support base 31 and a protection for the Y axis 2 8 And the DD motor 22 is driven so that the pair of corner portions of the display panel substrate 10 fixed on the rotary table 21 coincides with the central position in the imaging region of each CCD camera 36. Adjust the position of rotary table 2 1.
- Each of the end face illumination portions 39 is in a state of facing each end face portion of the display panel substrate 10 fixed on the rotary table 21.
- the control unit 52 drives the Y-axis servomotor 28 to move the rotary table 21 supporting the display panel substrate 10 along the Y-axis direction.
- each end surface illumination unit 39 is provided at a predetermined time interval. It lights up intermittently. Then, while each end face illumination unit 39 is turned on, the state of each end face portion on both sides of the display panel substrate 10 is inspected based on the image captured by each CCD power camera 36.
- an end face 11 e adjacent to the terminal portion 1 1 a of the TFT substrate 11 in the display panel substrate 10 and the CF substrate 12 The TFT substrate 1 1 at the side edge opposite to the side edge of the display panel substrate 10 provided with the terminal portion 1 1 a and both of the end surface 1 2 e adjacent to the terminal portion 1 1 a And the end face of the CF substrate 12 can be inspected at the same time.
- control unit 52 is configured to move the upper reflecting mirror elevating cylinder 46 attached to each slide block 34 based on the image data captured by each CCD camera 36 and each upper reflecting mirror.
- the upper reflecting mirror slide cylinder 4 5 attached to the lifting cylinder 46 is controlled to adjust the position of the upper reflecting mirror 4 1 in the vertical direction and the Y axis direction, and the upper reflection
- the mirror rotation motor 43 is rotated along the horizontal axis along the Y-axis direction to adjust the direction of the reflected light.
- the light emitted by each end surface illumination unit 39 and reflected by each upper reflecting mirror 41 is captured by the CCD camera 36 including the end surfaces on both sides of the display panel substrate 10 and the vicinity thereof. Each area is illuminated.
- the control unit 52 is used to elevate each lower reflector attached to each slide block 34 via a connecting block 38.
- the cylinder 48 and each lower reflector slide cylinder 47 are driven to adjust the vertical position and the Y-axis direction position of each lower reflector 42 respectively, and each lower reflector rotation motor 4 Rotate each 4 along a horizontal axis along the Y-axis direction to adjust the direction of the reflected light.
- each CCD camera 36 including the end surfaces on both sides of the display panel substrate 10 and the vicinity thereof. Each area is illuminated.
- each end surface illumination unit 39 When each end surface illumination unit 39 is turned on, light emitted from each end surface illumination unit 39 and reflected by the corresponding lower reflector 42 is applied to each end surface portion of the display panel substrate 10, The light reflected at each end face is taken into each corresponding CCD camera 36. The light reflected by each upper reflecting mirror 41 is irradiated to each end face of the display panel substrate 10, and the light reflected from each end face is imaged by the corresponding CCD camera 36.
- each upper reflecting mirror 41 and each lower reflecting mirror 42 and reflected at each end face portion of the display panel substrate 10 is not affected by a defect such as a chip at each end face portion.
- the intensity of the light received at this point is constant, but if there is a defect such as a chip at each end face, the light will be reflected irregularly at that defect and will be received by each CCD camera 36. Light intensity increases.
- each CCD camera 36 When inspecting the terminal portion of the display panel substrate 10, the imaging area of each CCD camera 36 is the end surface 11 e of the display panel substrate 10 close to the terminal portion 11 a of the TFT substrate 11 and the terminal portion 1 1 of the CF substrate 12. It is configured to include both of the end faces 12 e adjacent to a, and when detecting both of these end faces 11 e and 12 e, and only one of these end faces 11 e and 12 e, respectively.
- the image processing by the image processing unit 51 can be switched depending on the case of detection.
- 3 and 4 are flowcharts showing the procedure of image processing by the image processing unit 51. Since the image processing of the captured image by each CCD camera 36 is the same, the image processing by one CCD camera 36 will be described below.
- both the end face of the display panel substrate 10 adjacent to the terminal portion 11a of the TFT substrate 11 and the end face of the CF substrate 12 adjacent to the terminal portion 11a are The inspection is set in advance, and in this case, two image processing areas A corresponding to the respective end faces are set in the image area imaged by one CCD camera 36 (step 1).
- FIG. 5 is an example of an image captured by the CDD camera 36 in this case.
- the end surface illumination unit 39 is turned on at the end surfaces 1 1 e and 1 2 e close to the terminal portion 1 1 a of the TFT substrate 1 1 in the display panel substrate 10, the upper reflecting mirror 4 1 and the lower reflecting mirror 4 2
- the reflected light is irradiated respectively, if there is no defect such as a chip on each end face 11 e and 12 e, each reflected light from each end face 11 e and 12 e has a constant intensity
- CCD camera 36 is imaged. Then, areas with a constant width centering on the end faces 11 e and 12 e are set as image processing areas A 1 and A 2 along the end faces 11 e and 12 e, respectively.
- the set image processing area is A.
- each pixel that has received light of a predetermined light intensity or more is extracted and extracted.
- Count the total number of pixels step S 2. That is, the density of the image of the pixel as the image data of the CCD camera 36 is determined, and the pixel having a predetermined density or more is extracted to count the total number of extracted pixels.
- the pixels receiving light of a predetermined light intensity or more are shown in black. The extraction of the pixels receiving the light having the predetermined light intensity or more is repeated each time the end-face illumination unit 39 is intermittently lit.
- step S 3 When the total number of pixels receiving light of a predetermined light intensity or more in the image processing area A is counted, the XY coordinates of the pixels having a predetermined density or more are specified (step S 3) When the XY coordinates of the pixel of X are identified, the number of pixels along the Y axis direction in the image processing area A along the Y axis direction from the X and Y coordinates of the pixel of the identified predetermined density or more is Aggregate (step S 4). Then, based on the tabulated results, a histogram is created as shown in Fig. 6 (b).
- the number nl of pixels having a predetermined density or more at each extracted X-coordinate position Calculate the absolute value of the difference (n 1-n 2) with the number n of pixels at the X coordinate position (X-1) (see step S7 in Figure 4), and the difference in the number of pixels calculated is large 2 Extract one X coordinate position.
- 100 and 110 are extracted as X coordinate positions (step S8). Each extracted X coordinate is taken as a candidate of a coordinate at which the end face of the inspection object is located. Then, the distance between the two X-coordinates, which are candidates for the end face position, is calculated.
- Such processing is sequentially performed each time the end surface illumination unit 39 is turned on at predetermined time intervals. Then, when the X coordinate position as a candidate of the end surface to be inspected and the distance between the two candidate X coordinates are sequentially calculated for each lighting of the end surface illumination unit 39, the calculation result is Each of the sequentially obtained average values (moving average value) is compared (step S9).
- the candidate X-coordinate of the end face to be inspected and the distance between the two candidate X-coordinates are respectively in a preset range with respect to the moving average value, and the end face of the object to be inspected
- the difference between the two is within a predetermined range that is set in advance. Determines the obtained X coordinate as the position of the end face to be inspected (step 10).
- the inspection of defects is carried out using the end face position determined in the above. In this way, when the X coordinate is specified and the specified X coordinate is the position of the end face to be detected, defect inspection is performed. In this case, first, for example, as shown in FIG. 8, a defect inspection area is set for the set end face. In FIG. 8,
- the defect inspection area includes both the end face lie adjacent to the terminal portion of the TFT substrate 11 in the display panel substrate 10 and the end face 12 e of the CF substrate 12 adjacent to the terminal portion
- defect inspection areas D1 to D4 are set along both sides of each set end face.
- the defect inspection area D 1 set outside the end face 1 1 e of the TFT substrate 1 1 is set to detect a convex defect portion projecting from the end face 1 1 e of the TFT substrate 1 1.
- the defect inspection area D2 set inside the end face 1 1 e of 1 is set to detect a defect portion recessed with respect to the end face 1 1 e of the TFT substrate 11.
- a defect inspection area D3 set outside the end face 12e of the CF substrate 12 is set to detect a convex defect that protrudes from the end face 12e of the CF substrate 12,
- the defect inspection area D 4 set inside the end face 12 e of the CF substrate 12 is set to detect a defect portion recessed with respect to the end face 12 e of the CF substrate 12.
- the defect detection area is not limited to the configuration in which the end face is set on both sides as described above.
- the end face 11 e of the TFT substrate 11 is chamfered, it may be concave. It is not necessary to set the defect detection area D 2 inside the end face 11 e of the TFT substrate 11 if it is not necessary to inspect the defect part.
- the present invention is not limited to the configuration in which the defect inspection area is provided on both sides of each end surface, and one defect inspection area may be set such that the end surface is positioned at the center of the defect inspection area for each end surface. In this way, when the defect inspection area is set, detection processing of defects on each end face is performed.
- FIG. 9 is a flowchart showing the defect detection processing procedure.
- each time the end surface illumination portions 39 are turned on at predetermined time intervals it is determined whether a high density island portion (land portion) exists in the set defect inspection area. inspect. Then, for each defect inspection area, calculate the total number of lands, the area of each land, the maximum value and the minimum value of X coordinates in each land part, and the maximum value and the minimum value of Y coordinates (step 9 in FIG. 9) See S 3 1, and so on).
- step S32 if the area of the land portion in each defect inspection area is smaller than the predetermined threshold area set in advance, the land portion is not recognized as a land portion, and therefore, it is regarded as a target of subsequent processing. Do not (step S32).
- FIG. 10 shows the relationship between the end face 11 e and the land L based on the maximum value and the minimum value of the X coordinate in the land part and the X coordinate of the end face 11 e.
- Figures 10 (a) and (c) are the cases where the X coordinate of end face 1 1 e is between the maximum value and the minimum value of the X coordinates at land L
- Figure 10 (b) is the case. If both the maximum and minimum values of the X coordinate in the land L are larger than the X coordinate of the end face 1 1 e, in each case the maximum value of the X coordinate in the land L and the end face 1 1 e
- the distance LA and the minimum value of the X coordinate in the land L and the distance LB between the end face 11 e are calculated to calculate the calculated distances LA and LB, and the X coordinate of the end face 1 e and the land From the relationship between the maximum value and the minimum value of the X coordinate in L, the position of the land portion L with respect to the end face 11 e is specified.
- the type of defect that is, concave or convex shape
- the type of defect that is, concave or convex shape
- each of the defects is identified.
- the size of the defect is identified based on the area of each land portion, and the depth of the concave defect or the amount of protrusion of the convex defect is respectively identified based on the distance between each land portion and the end face. It will be done (step S35).
- the size of the defect is compared with the depth or protrusion to determine if the detected defect is acceptable (step S 36). Then, if the existing defect is not within the allowable range, it is judged that the display panel substrate 10 to be inspected is a defective product (Step S 3 7), and if the existing defect is within the allowable range, it is the inspection object.
- the display panel substrate 10 is determined to be non-defective (step S 38).
- the rotary table 2 1 on which the display panel substrate 10 is mounted and fixed is again moved to the inspection start position.
- the slide block 34 is rotated for 90 ° around the vertical axis by the DD motor 2 1 while being moved to recover, and each slide block 34 is moved based on data such as the size of the display panel substrate 10, as described above.
- the inspection of the pair of end faces corresponding to the remaining two sides of the display panel substrate 10 is carried out by the same inspection method as the inspection method.
- the inspection of the end face corresponding to the four sides of the display panel substrate 10 is not limited to the configuration using one inspection apparatus for the transparent substrate end face portion of the present invention as described above, and the inspection processing time can be shortened. For this reason, it is possible to use two inspection devices.
- the end face illumination is turned on at a predetermined time interval during inspection of the end face portion.
- the light intensity of the reflected light is irradiated to the end face of the channel substrate 10 by each CCD camera 36
- the direction of light irradiated to the end face of the display panel substrate is increased. Accuracy in detecting defects such as chipping and escaping that occur on the part is improved.
- the defect which is easy to detect by the epi-illumination 37 and the defect which is easy to detect by the illumination of the end-face illumination unit 39 are different, and the material of the glass substrate is different. Since defects caused by the lighting conditions differ, inspection using illumination from both the epi-illumination 3 7 and end-face illumination unit 3 9 and inspection using either the epi-illumination 3 7 or illumination from the end-face illumination unit 3 can be selected. It is getting better.
- an image obtained by irradiating the end face portion of the display panel substrate 10 with the illumination of the end face illumination unit 39 and an image obtained by irradiating the end face portion of the display panel substrate 10 with the epi-illumination 37 are The shading will be reversed, and the image processing of the two will be slightly different.
- the end face of the TFT substrate 11 and the end face of the CF substrate 12 are usually the edges of the respective end faces after the liquid crystal is injected between the TFT substrate 11 and the CF substrate 12.
- the part is chamfered, for example, by wet grinding with a grinding stone or by irradiating the edge of each end face with the laser beam.
- the aforementioned short link is removed and the edge of the terminal part 1 1 a is chamfered. In this case, it is necessary to confirm that the predetermined amount is securely chamfered in order to completely remove the short link and to enhance the strength of the edge.
- FIG. 12 is a schematic configuration diagram of an optical system of an inspection apparatus of a transparent substrate end face portion for inspecting a chamfering amount after an edge portion of the end face portion of the display panel substrate 10 is chamfered.
- the lower CCD camera 3 6 B has been added without the drive for adjusting the position and angle of each falling reflector, each upper reflector, each lower reflector, each upper reflector, and each lower reflector from Figure 1. It is a structure.
- each end face illumination unit 39 A is irradiated to the end face of the bonded substrate 1 OA, and the end face is exposed to the upper CCD camera 36 A Photographing with the lower CCD camera 36 B, and using the same method as the image processing method described above, inspection can be performed to confirm whether the amount of chamfering is appropriate.
- each side edge portion on both sides of the display panel substrate 10 to be inspected placed on the rotary table 21 is the rotary table 2 1.
- the light emitted from each of the end face illumination units 39 is reflected by the lower reflection mirror 42 provided below the display panel substrate 10, and the display panel Since each end face portion of the substrate 10 is irradiated with light, light is reliably emitted to each end face portion of the display panel substrate 10.
- each end surface portion of the display panel substrate 10 to which the light is irradiated and the vicinity thereof are imaged by the CCD camera 36 provided respectively above the display panel substrate 10, Since the defect of the end face is detected based on the intensity of the light received by the CCD camera 36, the detection of the defect can be detected with high accuracy and with certainty. Furthermore, the type of defect, the location of the defect, the size of the defect, etc. can also be detected.
- the terminal 1 is formed in the vicinity of each end face of the display panel substrate 10 to which light is applied. Due to the presence of 1 a, there is a possibility that the image pattern can not be accurately recognized and the defect can not be detected accurately. However, in the inspection apparatus of the end face portion of the transparent substrate of the present invention, such a There is no fear.
- the end surface illumination unit 39 which emits light to each end surface portion of the display panel substrate 10, is intermittently turned on, it is possible to suppress the variation in luminance of the light emitted to each end surface portion. And, it can be used stably for a long time.
- the inspection device of the transparent substrate end face portion of the present invention and the inspection method thereof are applied to, for example, inspection of the end face portion such as a liquid crystal display panel which is a kind of flat panel display, organic EL panel, inorganic EL panel, plasma display panel. Effectively applied to inspection of the end face of transmission-type projectors and other substrates with quartz substrates bonded together. It is possible.
- the inspection object is not limited to the laminated glass substrate such as the display panel substrate 10, but also the transparent substrate such as one glass substrate plastic substrate.
- the present invention can also be applied to inspection of the end face of a substrate.
- defects at the end face of the transparent substrate can be reliably and accurately performed using a simple and inexpensive optical system and an image processing apparatus.
- the amount of chamfering after chamfering of the edge portion of the end face portion of the transparent substrate can be accurately detected.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN2004800121551A CN1784596B (zh) | 2003-03-04 | 2004-03-03 | 透明衬底端面部的检查装置及其检查方法 |
JP2005503078A JP3967759B2 (ja) | 2003-03-04 | 2004-03-03 | 透明基板端面部の検査装置およびその検査方法 |
EP04716705A EP1617209A4 (en) | 2003-03-04 | 2004-03-03 | DEVICE FOR INSPECTING THE END SURFACE OF A TRANSPARENT SUBSTRATE AND METHOD OF INSPECTING THE SAME |
US10/547,827 US7289201B2 (en) | 2003-03-04 | 2004-03-03 | Inspection device for transparent substrate end surface and inspection method therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003057840 | 2003-03-04 | ||
JP2003-057840 | 2003-03-04 |
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WO2004079352A1 true WO2004079352A1 (ja) | 2004-09-16 |
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PCT/JP2004/002668 WO2004079352A1 (ja) | 2003-03-04 | 2004-03-03 | 透明基板端面部の検査装置およびその検査方法 |
Country Status (7)
Country | Link |
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US (1) | US7289201B2 (ja) |
EP (1) | EP1617209A4 (ja) |
JP (1) | JP3967759B2 (ja) |
KR (1) | KR20050113634A (ja) |
CN (1) | CN1784596B (ja) |
TW (1) | TW200427980A (ja) |
WO (1) | WO2004079352A1 (ja) |
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Cited By (13)
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JP2008082949A (ja) * | 2006-09-28 | 2008-04-10 | Olympus Corp | 欠陥監視システム |
JP2013221959A (ja) * | 2012-04-13 | 2013-10-28 | Japan Display Inc | 液晶表示装置 |
KR20180068291A (ko) * | 2016-12-13 | 2018-06-21 | 캐논 가부시끼가이샤 | 리소그래피 장치, 물품의 제조 방법, 및 계측 장치 |
KR102180702B1 (ko) | 2016-12-13 | 2020-11-20 | 캐논 가부시끼가이샤 | 리소그래피 장치, 물품의 제조 방법, 및 계측 장치 |
KR20200062081A (ko) * | 2017-09-28 | 2020-06-03 | 닛토덴코 가부시키가이샤 | 광학 표시 패널의 손상 검사 방법 |
CN110945347A (zh) * | 2017-09-28 | 2020-03-31 | 日东电工株式会社 | 光学显示面板的损伤检查方法 |
JP2019060823A (ja) * | 2017-09-28 | 2019-04-18 | 日東電工株式会社 | 光学表示パネルの損傷検査方法 |
WO2019064622A1 (ja) * | 2017-09-28 | 2019-04-04 | 日東電工株式会社 | 光学表示パネルの損傷検査方法 |
TWI779055B (zh) * | 2017-09-28 | 2022-10-01 | 日商日東電工股份有限公司 | 光學顯示面板的損傷檢查方法 |
KR102495565B1 (ko) * | 2017-09-28 | 2023-02-03 | 닛토덴코 가부시키가이샤 | 광학 표시 패널의 손상 검사 방법 |
CN110945347B (zh) * | 2017-09-28 | 2024-01-12 | 日东电工株式会社 | 光学显示面板的损伤检查方法 |
JP7356941B2 (ja) | 2020-03-26 | 2023-10-05 | 株式会社奥村組 | 管渠損傷特定装置、管渠損傷特定方法および管渠損傷特定プログラム |
CN113899760A (zh) * | 2021-09-30 | 2022-01-07 | 长沙韶光铬版有限公司 | 一种玻璃基板的检测方法、装置、电子设备及存储介质 |
Also Published As
Publication number | Publication date |
---|---|
US7289201B2 (en) | 2007-10-30 |
TWI317422B (ja) | 2009-11-21 |
CN1784596B (zh) | 2011-07-06 |
EP1617209A4 (en) | 2010-10-06 |
US20060221333A1 (en) | 2006-10-05 |
KR20050113634A (ko) | 2005-12-02 |
JP3967759B2 (ja) | 2007-08-29 |
JPWO2004079352A1 (ja) | 2006-06-08 |
EP1617209A1 (en) | 2006-01-18 |
TW200427980A (en) | 2004-12-16 |
CN1784596A (zh) | 2006-06-07 |
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