WO2004055452A1 - 冷凍機の取付方法及び装置 - Google Patents
冷凍機の取付方法及び装置 Download PDFInfo
- Publication number
- WO2004055452A1 WO2004055452A1 PCT/JP2002/013149 JP0213149W WO2004055452A1 WO 2004055452 A1 WO2004055452 A1 WO 2004055452A1 JP 0213149 W JP0213149 W JP 0213149W WO 2004055452 A1 WO2004055452 A1 WO 2004055452A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- refrigerator
- heat
- cooling
- cooling stage
- temperature
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 93
- 238000005192 partition Methods 0.000 claims abstract description 31
- 239000003507 refrigerant Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 238000002844 melting Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 21
- 230000005494 condensation Effects 0.000 claims description 7
- 238000009833 condensation Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229910000634 wood's metal Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 47
- 229910052754 neon Inorganic materials 0.000 description 40
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 40
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 21
- 229910001873 dinitrogen Inorganic materials 0.000 description 9
- 239000001307 helium Substances 0.000 description 9
- 229910052734 helium Inorganic materials 0.000 description 9
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 239000002887 superconductor Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001417523 Plesiopidae Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/006—Thermal coupling structure or interface
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
- F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/06—Several compression cycles arranged in parallel
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/17—Re-condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/06—Damage
Definitions
- the present invention relates to a refrigerator mounting method and apparatus for detachably mounting a cooling stage of a refrigerator to a refrigerant container of a cooling device containing a refrigerant gas condensed by the cooling stage.
- a refrigerator mounting method and apparatus for detachably mounting a cooling stage of a refrigerator to a refrigerant container of a cooling device containing a refrigerant gas condensed by the cooling stage.
- the present invention relates to a method and an apparatus for mounting a refrigerator capable of replacing only a failed refrigerator while maintaining cooling of an object to be cooled without stopping the refrigerator.
- Power equipment using high-temperature superconductors such as generators, motors, and transformers, is cooled to about 30 K and operated.
- a large refrigeration capacity is required, and multiple (about five) giant MacMahon (GM) refrigerators or pulse tube refrigerators (except where necessary, simply Refrigerator) is used.
- GM giant MacMahon
- FIG. 1 shows an overview of a conventional cooling device.
- the cooling temperature of the object to be cooled for example, power equipment using a high-temperature superconductor, for example, a generator
- the helium gas circulating through the object 10 to be cooled by the piping 20 is cooled. It is a contact cooling system.
- the helium gas circulating in the pipe 20 is sent out by a helium gas circulation pump 22 at room temperature, and exchanges heat with helium gas returning through the first heat exchanger 24 to be cooled.
- the liquid enters the second heat exchanger 26 and is further cooled by liquefied neon in the liquefied neon container 12 and cooled to about 30K. Then, it passes through the third heat exchanger 28 for cooling the object 10 to be cooled, enters the first heat exchanger 2 again, is heated to room temperature, and returns to the circulation pump 22.
- the cylinders 44 of the chillers 40 and 42 provided in the cryo-units '30 of the cooling system which is a vacuum insulated container, have just four cylinders.
- Refrigerator mounting flanges 46 for mounting to the cryostats 40 and 42 with a cryogenic plate 30 have seal rings 4 8 to prevent neon gas from leaking out and air from entering inside. Is installed. In the figure, a zero ring is provided on the flange 46 of the refrigerator, but it may be provided on the cryostat 30 side. Also, the seal need not be an O-ring if it can be sealed.
- a plurality (two in the figure) of pipes 14 coming out of the liquefied neon container 12 are connected to the refrigerator mounting sleeve 32 at the upper part thereof.
- the inner diameter of the pipe 14 is set to a size that does not hinder circulation of the neon gas.
- the temperature of the low-temperature side cooling stage (two-stage cooling stage, hereinafter simply referred to as a cooling stage) 50
- the temperature (liquefaction temperature) drops, and the neon gas condenses, drops, and accumulates in the lower container 12.
- the low temperature part of 30 K must be highly insulated, and is usually installed in a vacuum insulated container (30 in the figure). Note that the vacuum evacuation device is omitted in the figure.
- 52 is a refrigerator compressor.
- Japanese Patent No. 3,265,139 and Japanese Patent Application Laid-Open No. 9-113048 disclose that a heat switch for quick precooling is provided by a high-temperature side cooling stage of a refrigerator cylinder and a low-temperature side. It is described that it is installed between the side cooling stages or between the cooling object and the heat shield or refrigerator that covers the low-temperature part.However, there is only one refrigerator, and there are multiple refrigerators. It was not at all conceived to remove only a part of it. Disclosure of the invention
- the present invention has been made to solve the above-mentioned conventional problems, and is operated when one of the refrigerators incorporated in the cooling device has deteriorated or failed and the cooling capacity has been reduced.
- the task is to make it possible to replace only the failed refrigerator without stopping the cooling device (without stopping other normal refrigerators), while continuing to cool the cooling object.
- the present invention relates to a method for mounting a refrigerator, comprising: a cooling stage of the refrigerator; and a refrigerant container of a cooling device containing a refrigerant gas condensed by the cooling stage.
- This problem has been solved by introducing a heat conducting member into the cooling member, and bringing the cooling stage and the refrigerant container, the heat pipe or the heat shield plate into thermal contact with the low melting point metal held by the heat conducting member. Things.
- the heat conduction member is a partition member that partitions between the cooling stage and the refrigerant container.
- the heat conduction member is inserted between the cooling stage and a heat pipe. Further, the heat conduction member is inserted between the cooling stage and a heat shield plate.
- the temperature of the low-melting-point metal is controlled to a constant temperature at which the low-melting-point metal melts when the refrigerator is replaced.
- the low melting point metal is indium, low melting point solder or wood metal.
- the refrigerator is a GM refrigerator or a pulse tube refrigerator.
- the present invention also provides a refrigerator attachment device for detachably attaching a cooling stage of a refrigerator to a refrigerant container of a cooling device containing a refrigerant gas condensed by the cooling stage, wherein the cooling stage comprises: By providing a heat conductive member inserted between a refrigerant container, a heat pipe or a heat shield plate, and a low melting point metal held by the heat conductive member for bringing the cooling stage into thermal contact with the refrigerant container.
- the present invention has solved the above problems. Further, a condensing fin is provided on the side of the heat conduction member on the side of the refrigerant container or the heat shield plate.
- the cooling stage a refrigerator mounting sleeve for accommodating a low melting point metal and a heat conducting member, and the refrigerant container or the heat shield plate are connected. Is provided. Further, the temperature of the heat conducting member and the temperature of heating the partition member And a temperature sensor for detection.
- the heater and the temperature sensor are made detachable.
- the present invention also provides a power device comprising a refrigerator attached by the above device.
- FIG. 1 is a cross-sectional view showing a schematic configuration of a conventional cooling device.
- FIG. 2 is a sectional view showing a schematic configuration of a first embodiment of a cooling device according to the present invention
- FIG. 3 is a sectional view showing a schematic configuration of the second embodiment
- FIG. 4 is a sectional view showing a schematic configuration of the third embodiment
- FIG. 5 is a sectional view showing a schematic configuration of the fourth embodiment
- FIG. 6 is a sectional view showing a schematic configuration of the fifth embodiment
- FIG. 7 is a sectional view showing a schematic configuration of the sixth embodiment. BEST MODE FOR CARRYING OUT THE INVENTION
- a plurality of refrigerator cylinders 44 are just inserted into a cryostat 30 which is a vacuum insulated container.
- a refrigerator mounting sleeve (hereinafter, simply referred to as a sleeve) 32 is provided.
- a plurality of pipes 1 coming out of a container 12 for storing liquefied neon are connected to a sleeve 32 at the upper part thereof.
- the sleeve 32 is made of a material having a low thermal conductivity such as stainless steel, and a heat transfer material made of a material having a high thermal conductivity (for example, copper or a copper alloy) is provided in a lower intermediate portion of the sleeve 32.
- a heat transfer material made of a material having a high thermal conductivity (for example, copper or a copper alloy) is provided in a lower intermediate portion of the sleeve 32.
- Condensing fins 6OF are provided on the lower surface of the partition member 60. The condensing fins 6OF can be omitted.
- the position of the partition member 60 is such that when the refrigerators 40 and 42 are attached to the sleeve 32, the cooling stage 50 at the tip of the refrigerator is in contact with the partition member 60 or a slight gap. (Preferably less than 5 mm and less than 1 mm).
- the gap is explicitly enlarged, and a recess 60 U is provided so that the low-melting-point metal 62 described later can accumulate.
- the partition member 60 is firmly attached to the sleeve 32 by gluing or welding, bonding, or screwing, and is airtight.
- the partition member 60 further includes an electric heater 64 and a temperature sensor 66.
- a low melting point metal for example, aluminum or low melting point solder, wood metal, mercury, etc.
- the cooling stage 50 at the tip of the refrigerator and the partition member 60 is provided with a low melting point metal.
- Amount that allows better thermal connection to metal 62 It is desirable that the upper surface of the partition member 60 and the surface of the cooling stage 50 of the refrigerator be pre-plated with a low-melting-point metal 62 so that good thermal connection can be achieved.
- the electric heater 64 When assembling the cooling device, the electric heater 64 is energized to heat the partition member 60, the low melting point metal 62 is melted, and the refrigerators 40 and 42 are attached.
- the temperature sensor 66 measures the temperature so as not to overheat when the electric heater 64 is energized to heat the partition member 50. Used for It is preferable to use a temperature controller to control the temperature at which the low melting point metal 52 is melted.
- the refrigerators 40 and 42 When the refrigerators 40 and 42 are mounted, if they are sealed with a 0 ring 48 to prevent air from entering the refrigerator mounting flange 46, the refrigerator There is no need to evacuate or replace the space created between the outside of the cylinder 44 and the inside of the sleeve 32 with helium gas, neon gas, or the like. Of course, vacuum exhaust or gas replacement may be used.
- each sleeve 32 is connected to the lower liquefied neon container 12 by a pipe 14 having a size that does not hinder the circulation of neon gas used for cooling.
- a pipe 14 having a size that does not hinder the circulation of neon gas used for cooling.
- the container 12 is filled with neon gas (when the cooling temperature with the object to be cooled 10 is around 30 K).
- the cooling stage 50 of the refrigerator is thermally connected to the partition member 60 by means of a low melting point metal 62 (for example, a small thermal resistance of 1 K or less for a heat transfer of about 100 W). ) Has been.
- the neon gas liquefies on the lower surface (condensation fin 60 F) of the partition member 60 and starts dripping.
- the liquefied neon that has been liquefied and dropped exchanges heat with the helium gas that cools the power equipment, evaporates, returns to the lower surface of the partition member 60 again, and repeats a cycle of condensation.
- Heat is transferred (cooled) by circulation of the neon gas in each of the plurality of refrigerators 40 and 42 mounted.
- Temperature sensor Reference numeral 66 is used to measure the temperature so as not to overheat when the partition member 60 is heated by energizing the electric heater 64. It is desirable to use a temperature controller to control the temperature at which the low-melting-point metal 62 melts.
- the length of the pipe 14 connecting the liquor neon container 12 with the pick-up and the refrigerator 32 attached with the refrigerator is Since the heat generated by the heat conduction between the pipe wall and the gas is less than an allowable value, the amount of heat transferred to the liquefied neon container 12 is a small allowable value even in such a state.
- a normal refrigerator can be installed where it was removed, and operation can be resumed immediately.
- the neon gas continues to be liquefied, and the object to be cooled 10 is continuously cooled to a low temperature.
- a refrigerator having a relatively large cooling capacity is used, and since the temperature is relatively high at 30 K, the heat shield plate is omitted.
- a similar structure can be used for cooling the heat shield plate 70.
- a heat conducting plate 72 is provided on the sleeve 32 on which the refrigerator is mounted, so that nitrogen gas (or argon gas) can be condensed by the refrigerator high-temperature stage (referred to as the first stage) 54.
- a pipe 74 for condensing and circulating nitrogen gas is attached to this.
- the heat conducting plate 72 is thermally connected to the first stage 54 of the refrigerator by using a low melting point metal 62.
- a condensation fin 72F for promoting the condensation of nitrogen gas is provided in the pipe 74 of the heat conduction plate 72. Note that this condensation Quinn 7 2 F can also be omitted.
- the nitrogen gas condensing circulation pipe 74 is made of a material having a low thermal conductivity (for example, stainless steel).
- the inner diameter of the pipe 74 is set to a size that does not hinder circulation of nitrogen gas.
- a liquefied nitrogen container (a pipe may be used if it does not hinder the circulation of nitrogen) 76 for cooling the heat shield plate 70 is provided below the pipe 74.
- the liquefied nitrogen container 76 is made of a material having high thermal conductivity (preferably copper or a copper alloy).
- the liquefied nitrogen container 76 is attached to the heat shield plate 70 by a method having sufficiently small thermal resistance (for example, soldering, soldering, mounting, screwing, etc.).
- the liquefied nitrogen container 76 is filled with nitrogen gas. Although not shown in the figure, a nitrogen gas supply (or recovery) device can be provided if necessary.
- reference numeral 78 denotes an electric heater for the first cooling stage 54 of the refrigerator, and ⁇ ⁇ ⁇ 0 denotes a temperature sensor. '
- the heat shield plate 70 is cooled by the nitrogen condensed by the heat conductive plate 72.
- the neon gas but also the heat shield plate 70 can be cooled by the method of the present invention.
- the neon gas and nitrogen gas containers 12 and 76 were connected to a plurality (two) of refrigerators 40 and 42. It may be independent. At this time, the part that repeats each condensation and evaporation has a so-called heat pipe structure.
- each heat pipe 82 is connected to one heat conducting member 84. And the helium gas circulating in the pipe 20 exchanges heat.
- reference numeral 86 denotes a neon gas supply and recovery tank.
- the neon gas supply and recovery tank 86 is usually a tank that can hold an appropriate amount of gas, but if the amount of neon gas inside the heat pipe 82 is insufficient, supply neon gas to the outside (or recover it). )
- a device (not shown) may be attached.
- the upper and lower diameters of the heat pipe 82 are made thicker, but the pipe may be kept at a constant diameter if allowable. When the refrigerator is replaced, the temperature of the upper partition member 60 has risen to a temperature at which the low-melting-point metal 62 melts.
- the gas inside the heat pipe wall and inside has a temperature gradient, and the thicker the pipe, the greater the heat load on the low-temperature part.
- short heat transfer fins condensed X have a very high heat transfer coefficient for evaporation, so long fins are meaningless
- the amount of heat transfer is large. In some cases, the fins may not be required.
- the heat conducting member 84 provided under the heat pipe is suitably made of copper, a copper alloy, aluminum, or an aluminum alloy.
- the heat pipe 82 extends straight down and is attached to the large heat conducting member 84.However, the heat pipe 82 is arranged diagonally, and the heat pipe 82 is attached to the relatively small heat conducting member 84. You may make it attach. In the case of the indirect cooling shown in the figure, this can reduce the temperature gradient formed inside the heat conducting member. In the case of directly cooling a large cooling object, if the lower end of the heat pipe is arranged to be dispersed, the cooling object can be uniformly cooled.
- the operation of the refrigerator 42 on the right side of the drawing is stopped for mounting (or removing). Then, in order to dissolve the low melting point metal 62, the electric heater 64 and the temperature sensor 66 are passed through the pipes 92, 94, and inserted into the partition member 60 from above, and attached. ing.
- the refrigerator 40 on the left is operating and is condensing and liquefying neon. At this time, the electric heater and the temperature sensor were removed, and the top of pipes 92 and 94 was fitted with a lid 96 to prevent air from entering.
- the object to be cooled 10 is inserted into the liquefied neon container 12 and the object to be cooled is liquefied neon gas.
- the object 10 may be cooled directly.
- the GM refrigerator is used as the refrigerator in each case.
- the type of the refrigerator is basically not limited, and the refrigerator is used for cooling as in the sixth embodiment shown in FIG. Pulse tube refrigerators 100 and 102 may be used.
- this pulse tube refrigerator is usually composed of a plurality of cylinders (pipes 104 filled with regenerator material and expansion tubes 106), the refrigerator mounting sleeve 32 is used for the GM refrigerator. It is larger than.
- neon gas was used because the cooling temperature was 30 K.
- argon gas 90 to 140 K
- nitrogen gas 70 to 120 K
- Hydrogen gas 14 to 30K
- helium gas 5K
- the present invention was applied to cooling of power equipment using a high-temperature superconductor, but the object to be cooled is not limited to this.
- the present invention can be similarly applied to superconducting magnets, physical property measuring devices, and the like.
- the refrigerator when replacing the refrigerator, the refrigerator could not be replaced without stopping the cooling device, collecting the refrigerant gas, and returning the entire device to room temperature. Therefore, the cooling target (for example, power equipment) cannot be operated during these operations and until it can be cooled to the specified temperature again.
- the cooling target for example, power equipment
- the thermal resistance between the partition member and the cooling stage of the refrigerator is
- the thin low-melting point metal because of the resistance of the thin low-melting point metal, it becomes smaller and has a very small temperature difference despite its large heat transfer (cooling capacity).
- the heater when an electric heater and a temperature sensor are attached to the partition member, if the heater is used to heat the low-melting-point metal to a temperature at which the low-melting-point metal can be melted, the entire range involved in the work will be at room temperature or slightly higher.
- the installation and removal of the refrigerator can be done easily without the need for troublesome work such as prevention of frost adhesion. This task is made even easier if the temperature of the low melting point metal is controlled to a constant temperature by using a temperature controller to heat the partition member.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/539,043 US7266954B2 (en) | 2002-12-16 | 2002-12-16 | Method and device for installing refrigerator |
JP2004560570A JP4040626B2 (ja) | 2002-12-16 | 2002-12-16 | 冷凍機の取付方法及び装置 |
PCT/JP2002/013149 WO2004055452A1 (ja) | 2002-12-16 | 2002-12-16 | 冷凍機の取付方法及び装置 |
DE10297837.9T DE10297837B4 (de) | 2002-12-16 | 2002-12-16 | Verfahren zum Befestigen einer Kühlmaschine und Befestigungsvorrichtung dafür |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2002/013149 WO2004055452A1 (ja) | 2002-12-16 | 2002-12-16 | 冷凍機の取付方法及び装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004055452A1 true WO2004055452A1 (ja) | 2004-07-01 |
Family
ID=32587949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/013149 WO2004055452A1 (ja) | 2002-12-16 | 2002-12-16 | 冷凍機の取付方法及び装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7266954B2 (ja) |
JP (1) | JP4040626B2 (ja) |
DE (1) | DE10297837B4 (ja) |
WO (1) | WO2004055452A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2430023A (en) * | 2005-09-09 | 2007-03-14 | Bruker Biospin Gmbh | A Superconducting Magnet System With a Refrigerator for Re-Liquifying Cryogenic Fluid in a Tubular Conduit |
JP2007127298A (ja) * | 2005-11-01 | 2007-05-24 | Kobe Steel Ltd | 極低温装置 |
JP2010054128A (ja) * | 2008-08-28 | 2010-03-11 | Taiyo Nippon Sanso Corp | 冷凍機用熱交換器、及び該熱交換器による液化ガスの冷却方法 |
JP2013174377A (ja) * | 2012-02-24 | 2013-09-05 | Taiyo Nippon Sanso Corp | ヘリウム液化装置 |
JP2014513267A (ja) * | 2011-05-09 | 2014-05-29 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | 極低温冷却装置及び方法 |
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DE10231434A1 (de) * | 2002-05-15 | 2003-12-04 | Siemens Ag | Einrichtung der Supraleitungstechnik mit thermisch an eine rotierende supraleitende Wicklung angekoppeltem Kaltkopf einer Kälteeinheit |
DE102004012452A1 (de) * | 2004-03-13 | 2005-10-06 | Bruker Biospin Gmbh | Supraleitendes Magnetsystem mit Pulsrohr-Kühler |
DE102004058006B3 (de) * | 2004-12-01 | 2006-06-08 | Siemens Ag | Supraleitungseinrichtung mit Kryosystem und supraleitendem Schalter |
US7290396B2 (en) * | 2005-01-19 | 2007-11-06 | Praxair Technology, Inc. | Cryogenic biological preservation unit |
DE102006046688B3 (de) * | 2006-09-29 | 2008-01-24 | Siemens Ag | Kälteanlage mit einem warmen und einem kalten Verbindungselement und einem mit den Verbindungselementen verbundenen Wärmerohr |
US8069675B2 (en) * | 2006-10-10 | 2011-12-06 | Massachusetts Institute Of Technology | Cryogenic vacuum break thermal coupler |
WO2008067494A1 (en) * | 2006-11-29 | 2008-06-05 | Rambus Inc. | Integrated circuit with built-in heating circuitry to reverse operational degeneration |
WO2008066127A1 (fr) * | 2006-11-30 | 2008-06-05 | Ulvac, Inc. | Machine frigorifique |
JP5084829B2 (ja) * | 2007-06-28 | 2012-11-28 | パナソニック株式会社 | 半導体素子の実装構造体の製造方法、半導体素子の実装方法、及び加圧ツール |
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Also Published As
Publication number | Publication date |
---|---|
DE10297837B4 (de) | 2019-05-09 |
DE10297837T5 (de) | 2005-11-10 |
US7266954B2 (en) | 2007-09-11 |
JP4040626B2 (ja) | 2008-01-30 |
JPWO2004055452A1 (ja) | 2006-04-20 |
US20060048522A1 (en) | 2006-03-09 |
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