WO2004044980A3 - Bauelement mit hermetischer verkapselung und waferscale verfahren zur herstellung - Google Patents

Bauelement mit hermetischer verkapselung und waferscale verfahren zur herstellung Download PDF

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Publication number
WO2004044980A3
WO2004044980A3 PCT/EP2003/011448 EP0311448W WO2004044980A3 WO 2004044980 A3 WO2004044980 A3 WO 2004044980A3 EP 0311448 W EP0311448 W EP 0311448W WO 2004044980 A3 WO2004044980 A3 WO 2004044980A3
Authority
WO
WIPO (PCT)
Prior art keywords
waferscale
production
component
cover
encapsulated component
Prior art date
Application number
PCT/EP2003/011448
Other languages
English (en)
French (fr)
Other versions
WO2004044980A2 (de
Inventor
Wolfgang Pahl
Original Assignee
Epcos Ag
Wolfgang Pahl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag, Wolfgang Pahl filed Critical Epcos Ag
Priority to US10/527,932 priority Critical patent/US7102224B2/en
Priority to JP2004550698A priority patent/JP4636882B2/ja
Publication of WO2004044980A2 publication Critical patent/WO2004044980A2/de
Publication of WO2004044980A3 publication Critical patent/WO2004044980A3/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

Es wird ein Bauelement mit sandwichartigem Aufbau beschrieben, bei dem der Bauelementstrukturen tragende Chip mit einer Rahmenstruktur und einer diffusionsdichten Abdeckung so verklebt wird, dass die Bauelementstrukturen im Inneren des Aufbaus und vorzugsweise in einem Hohlraum angeordnet sind. Die Schichtübergänge des Aufbaus sind an den Seitenkanten mit einer Metallisierung geschützt. Durchkontaktierungen durch die Abdeckung verbinden Kontakte auf der Unterseiten der Abdekkung mit den Anschlussmetallisierungen der Bauelementstrukturen auf dem Chip. Die Durchkontaktierungen sind mit einer Unterseitenmetallisierung abgedichtet.
PCT/EP2003/011448 2002-11-14 2003-10-15 Bauelement mit hermetischer verkapselung und waferscale verfahren zur herstellung WO2004044980A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/527,932 US7102224B2 (en) 2002-11-14 2003-10-15 Encapsulated component and method for the production thereof
JP2004550698A JP4636882B2 (ja) 2002-11-14 2003-10-15 気密に密封された素子、及びこれを製造するための方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10253163.3 2002-11-14
DE10253163.3A DE10253163B4 (de) 2002-11-14 2002-11-14 Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung

Publications (2)

Publication Number Publication Date
WO2004044980A2 WO2004044980A2 (de) 2004-05-27
WO2004044980A3 true WO2004044980A3 (de) 2004-07-29

Family

ID=32185681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/011448 WO2004044980A2 (de) 2002-11-14 2003-10-15 Bauelement mit hermetischer verkapselung und waferscale verfahren zur herstellung

Country Status (4)

Country Link
US (1) US7102224B2 (de)
JP (1) JP4636882B2 (de)
DE (1) DE10253163B4 (de)
WO (1) WO2004044980A2 (de)

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* Cited by examiner, † Cited by third party
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CN106888002A (zh) * 2017-03-08 2017-06-23 宜确半导体（苏州）有限公司 声波设备及其晶圆级封装方法

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KR100807484B1 (ko) * 2004-10-07 2008-02-25 삼성전기주식회사 소수성 물질층을 구비한 ｍｅｍｓ 패키지
KR100855819B1 (ko) * 2004-10-08 2008-09-01 삼성전기주식회사 금속 밀봉부재가 형성된 ｍｅｍｓ 패키지
US7422962B2 (en) * 2004-10-27 2008-09-09 Hewlett-Packard Development Company, L.P. Method of singulating electronic devices
DE102005006833B4 (de) * 2005-02-15 2017-02-23 Epcos Ag Verfahren zur Herstellung eines BAW-Bauelements und BAW-Bauelement
DE102005026243B4 (de) 2005-06-07 2018-04-05 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
US7316965B2 (en) * 2005-06-21 2008-01-08 Freescale Semiconductor, Inc. Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level
KR100653089B1 (ko) * 2005-10-31 2006-12-04 삼성전자주식회사 탄성 표면파 디바이스 웨이퍼 레벨 패키지 및 그 패키징방법
EP1976118A4 (de) * 2006-01-18 2011-12-14 Murata Manufacturing Co Oberflächenwelleneinrichtung und rand-oberflächenwelleneinrichtung
US20070251719A1 (en) * 2006-04-27 2007-11-01 Rick Sturdivant Selective, hermetically sealed microwave package apparatus and methods
DE102006025162B3 (de) * 2006-05-30 2008-01-31 Epcos Ag Flip-Chip-Bauelement und Verfahren zur Herstellung
DE102006037587A1 (de) * 2006-08-11 2008-02-14 Advanced Chip Engineering Technology Inc. Halbleitervorrichtungs-Schutzstruktur und Verfahren zum Herstellen derselben
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US7671515B2 (en) * 2006-11-07 2010-03-02 Robert Bosch, Gmbh Microelectromechanical devices and fabrication methods
US20080112037A1 (en) * 2006-11-10 2008-05-15 Spatial Photonics, Inc. Hermetic sealing of micro devices
DE102006056598B4 (de) 2006-11-30 2013-10-02 Globalfoundries Inc. Verfahren zur Herstellung eines Transistorbauelements für eine integrierte Schaltung
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DE102007001518B4 (de) * 2007-01-10 2016-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Häusen eines mikromechanischen oder mikrooptoelektronischen Systems
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JP2015065553A (ja) 2013-09-25 2015-04-09 株式会社東芝 接続部材、半導体デバイスおよび積層構造体
CN106888001B (zh) * 2017-03-08 2020-07-17 宜确半导体（苏州）有限公司 声波设备及其晶圆级封装方法
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Also Published As

Publication number Publication date
US20060043601A1 (en) 2006-03-02
DE10253163B4 (de) 2015-07-23
DE10253163A1 (de) 2004-05-27
US7102224B2 (en) 2006-09-05
JP4636882B2 (ja) 2011-02-23
JP2006506805A (ja) 2006-02-23
WO2004044980A2 (de) 2004-05-27

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