WO2004012245A1 - 位置計測方法、位置制御方法、露光方法及び露光装置、並びにデバイス製造方法 - Google Patents
位置計測方法、位置制御方法、露光方法及び露光装置、並びにデバイス製造方法 Download PDFInfo
- Publication number
- WO2004012245A1 WO2004012245A1 PCT/JP2003/009691 JP0309691W WO2004012245A1 WO 2004012245 A1 WO2004012245 A1 WO 2004012245A1 JP 0309691 W JP0309691 W JP 0309691W WO 2004012245 A1 WO2004012245 A1 WO 2004012245A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- measurement
- stage
- exposure apparatus
- reticle
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
Definitions
- Position measurement method position control method, exposure method and exposure apparatus, and device manufacturing method
- the present invention relates to a position measurement method, a position control method, an exposure method and an exposure apparatus, and a device manufacturing method.
- Position measuring method for measuring using a length measuring instrument, for example, a laser interferometer, a position controlling method using the measuring method, an exposure method using the position controlling method, and an exposure suitable for performing the position measuring method, etc.
- the present invention relates to an apparatus and a device manufacturing method using the above-described exposure method or exposure apparatus. Background art
- a pattern formed on a mask or a reticle (hereinafter, collectively referred to as an “r reticle”) is exposed to light such as a resist through a projection optical system.
- Exposure devices that transfer onto a substrate such as a wafer or a glass plate (hereinafter, appropriately referred to as a “wafer”) coated with an agent are used.
- a stationary projection exposure apparatus such as a so-called stepper or a scanning projection exposure apparatus such as a so-called scanning stepper is mainly used.
- a scanning projection exposure apparatus not only a wafer stage on which a wafer is mounted but also a reticle stage on which a reticle is mounted needs to be largely moved in a predetermined scanning direction.
- a high-precision laser which is a type of lightwave interference type length measuring device, as a measuring device for measuring the position of the reticle stage in the scanning direction and the position in the non-scanning direction.
- the accuracy of position measurement in the scanning direction of the reticle stage greatly affects the overlay accuracy and synchronization accuracy of the wafer and the reticle, the rotation error of the reticle stage has been reduced in recent scanning projection exposure apparatuses.
- the accuracy of forming the reflective surface ⁇ Measurement due to a kind of so-called Abbe error caused by the rotation error of the reticle stage A relatively large number of retroreflectors adopt a retroreflector whose accuracy is much smaller than that of a plane moving mirror. This is because the retro-reflector emits the reflected beam along an axis parallel to the incident optical axis, so is the probability of occurrence of a decrease in the amount of the returned beam due to the residual rotation error of the reticle stage extremely low? It is.
- circuit patterns have been miniaturized year by year due to the high integration of semiconductor elements (integrated circuits, etc.). Therefore, the total total error that can be tolerated in recent exposure apparatuses is extremely small, and the reticle stage has a very small size. There is a need to further suppress position measurement errors and the like.
- the inventor found that the deviation of the optical axis (metering optical axis) of the measurement beam from the optical axis (reference optical axis) of the reference beam in the laser interferometer, which had not received any attention so far, was a measurement error. It has been found that the deviation of the optical axis can occur even when the reflecting surface of the movable mirror is in an ideally mounted state, and that it changes according to the position of the reticle stage. Hereinafter, this will be described in more detail.
- the deviation of the measurement optical axis from the reference optical axis causes a measurement error because the reference beam and the measurement beam of the laser interferometer usually have wavefront aberration. That is, as shown in FIG. 9A, the reference beam Ra (the optical axis is the reference optical axis) and the measurement beam Ma (the optical axis is the measurement optical axis) both have a wavefront aberration. The case where there is no optical axis deviation between rooms is defined as the reference state. Then, as shown in FIG. 9B, when the measurement optical axis deviates from the reference optical axis, the width WD 1 and the width WD 2 ( ⁇ WD 1) in FIG. 9A are clearly compared.
- the interference part between the two beams Ra and Ma (this part determines the measurement result) becomes relatively narrow.
- ⁇ L 2 ( ⁇ L 1) in FIG.
- the reference beam and the measurement beam of the laser interferometer are transmitted through glass (a transmission optical element such as a lens) in the optical path or reflected by a glass surface (a reflection optical element such as a mirror). This causes a wavefront aberration. Alternatively, even when a wavefront aberration occurs due to the relative inclination of the reference beam and the measurement beam, a measurement error similar to the case where the wavefront aberration exists exists.
- the position in the direction orthogonal to the measurement direction of the moving object (such as the reticle stage) (also referred to as the measurement orthogonal direction) is at the predetermined position, and at this time, the reference mirror 14 yi is irradiated on the reference mirror 14 yi as shown in Fig. 1OA.
- the optical axis (measurement optical axis) of the measurement beam Ma illuminated on the movable mirror 15 yi is exactly overlapped (reference state) with the optical axis (reference optical axis) of the reference beam Ra think of. From the state of Fig.
- the moving body moves in the direction perpendicular to the measurement (the amount of movement of the vertex of the movable mirror 15yi at this time also becomes ⁇ ), and when the state of Fig. 10B is reached, the optical axis of the measurement beam Ma becomes (Measurement optical axis) is shifted by 2 ⁇ from the reference state of OA in Fig. 1. In this case, it will be apparent that the shift amount 2 ⁇ changes according to the position of the moving body in the measurement orthogonal direction.
- the measurement beam is incident on a retro-reflector or the like, the emitted light is reflected by a reflecting mirror, and the reflected light is reflected in the opposite direction along the same optical path to receive return light.
- a so-called double-pass laser interferometer field Think about a match.
- the reflection mirror is mounted at an angle, if the optical axis shifts due to a change in the position of the moving body as described above, the incident point of the measurement beam on the reflection mirror Since the position of the (reflection point) in the measurement direction changes from the reference state, a measurement error occurs regardless of the presence or absence of the wavefront aberration of the beam.
- the present invention has been made based on the above-described novel findings obtained by the inventor, and a first object of the present invention is to provide at least one axis direction position information of a moving body provided with a reflecting surface with a light wave interference type length measurement.
- a position measurement method capable of measuring with high accuracy using a measuring instrument is provided.
- a second object of the present invention is to provide a position control method for accurately controlling a position of a moving object at least position information of which in one axis direction is measured using a lightwave interference type length measuring device ("").
- a third object of the present invention is to provide an exposure method for realizing highly accurate exposure by a scanning exposure method.
- a fourth object of the present invention is to provide an exposure apparatus that realizes highly accurate exposure by a scanning exposure method.
- a fifth object of the present invention is to provide a device manufacturing method capable of improving device productivity. Disclosure of the invention
- a position measuring method for measuring position information of at least one axial direction of a moving body provided with a reflecting surface using a lightwave interference type length measuring device. Measuring the position information of the moving body in the first axial direction based on the output of the lightwave interference type length measuring device that irradiates the measuring surface with the measuring beam and receives the reflected light beam; Measuring the position information of the moving body in a second axis direction orthogonal to the axis using a second axis direction position measuring device; and an optical axis of a measurement beam and an optical axis of a reference beam of the light wave interference type length measuring device.
- Correlation information indicating a relationship between the position measurement error of the reference point on the reflecting surface at least due to the positional relationship with the moving object and the position of the moving body in the second axis direction corresponding thereto. Calculating a measurement error of the position information of the moving object in the first axis direction by the lightwave interference measuring device based on the position information of the moving object in two axis directions. It is a measurement method.
- the movement in the first axis direction is performed based on the output of the light wave interference type length measuring device that irradiates the measuring beam to the reflecting surface on the moving body and receives the reflected light beam.
- the position information of the moving body in the second axis direction orthogonal to the first axis is measured using a second axis direction position measuring device.
- the position measurement error of the reference point on the reflecting surface caused by at least the positional relationship between the optical axis of the measurement beam and the optical axis of the reference beam of the lightwave interferometer and the corresponding second axial direction
- the lightwave interference length measuring device measures the position information of the moving body with respect to the first axis direction. Calculate the measurement error. This makes it possible to use the measurement error to correct the position information of the moving object in the first axis direction previously measured based on the output of the lightwave interference type length measuring device. It is possible to obtain the corrected position information of the moving body in the first axis direction.
- the first axial direction of the moving body is based on an output of the light wave interference type length measuring device that irradiates the measuring surface with the measuring beam and receives the reflected light beam.
- the method may further include a step of obtaining measurement errors, and creating the correlation information based on the position measurement errors obtained for each position.
- the position measurement error of the reference point on the reflection surface is calculated by a predetermined calculation based on the amount of deviation of the measurement optical axis of the light wave interference type length measuring device from the reference optical axis and the position information of the moving body in the second axis direction. It can be done.
- the position measurement error of the reference point on the reflecting surface is set on the measurement mark provided on a part of the moving body and the reference object. It can also be obtained based on the measurement result obtained by measuring the positional relationship with the obtained reference mark.
- the correlation information is obtained on the reflection surface obtained for each position in the second axial direction.
- the position measurement error of the reference point may be data of a function calculated based on the data of each plot point plotted on a predetermined coordinate system, or the correlation information may be:
- the data may be table data created using the position measurement error of the reference point on the reflection surface obtained for each position in the second axis direction.
- the step of calculating a measurement error includes the step of calculating the measurement error of the moving body in the second axial direction.
- An operation result obtained by interpolating the position measurement error for each position in the second axis direction in the correlation information according to the position information by a predetermined interpolation operation is used. Then, the measurement error can be calculated.
- the step of creating the correlation information includes the step of creating the correlation information based on an output of the lightwave interference type length measuring device.
- the moving body may be moved in the second axis direction while substantially maintaining the position of the moving body in the first axis direction at a predetermined coordinate position.
- the measurement error in the step of calculating the measurement error, may be calculated in further consideration of the posture of the moving body.
- the posture of the moving object includes at least one of the following operations: rolling, rolling, and pitching of the moving object.
- the position measurement error included in the correlation information may be further caused by at least a wavefront aberration generated in the measurement beam.
- the wavefront aberration refers to a wavefront aberration generated when a measurement beam passes through an optical element on the optical path or is reflected by the optical element. It includes any of the wavefront aberrations caused by having it.
- a prism or other reflecting surface may be used as the reflecting surface, but the reflecting surface is a reflecting surface of a hollow retro-reflector fixed to the moving body. You can also.
- the position measuring method of the present invention may further include a step of calculating position information of the moving body in the first axis direction in which the measurement error has been corrected.
- a position control method for controlling a position of a moving object in which at least one-axis direction position information is measured using a lightwave interference type length measuring device.
- the position information of the moving object in the first axis direction is measured by the lightwave interference type length measuring device. Can be measured with high accuracy. Then, based on the position information measured with high accuracy, the position information in at least one axis direction (first axis direction) is measured using the optical interference length measuring device. Therefore, the position of the moving object can be controlled with high accuracy.
- the position information of at least one of the first moving body on which the photosensitive object is placed and the second moving body on which the photosensitive object is placed is measured using the position measuring method of the present invention, and the result of the measurement is obtained.
- the position information of at least one of the first moving body on which the mask is mounted and the second moving body on which the photosensitive object is mounted in the predetermined direction is obtained by the position measuring method of the present invention.
- the position of at least one of the first mobile unit and the second mobile unit (for example, the mobile unit that becomes a follower during synchronous movement) in the predetermined direction is determined in consideration of the information obtained as a result of the measurement.
- the pattern is transferred onto the photosensitive object under control. Therefore, by the above-described position control, it is possible to improve the synchronization accuracy between the first moving body and the second moving body, that is, the mask and the photosensitive object, to shorten the synchronization settling time, and to realize highly accurate exposure by the scanning exposure method. This makes it possible to transfer a mask pattern onto a photosensitive object with high accuracy.
- an exposure apparatus for synchronously moving a mask and a photosensitive object in a predetermined scanning direction to transfer a pattern formed on the mask onto the photosensitive object.
- An optical device comprising: a first stage on which the mask is mounted and a reflecting surface; a second stage on which the photosensitive object is mounted; and a first stage and the second stage.
- a driving system for driving a light beam measuring a position of the first stage in the scanning direction by irradiating the reflecting surface with a measurement beam; and measuring a position of the first stage in the scanning direction; and orthogonal to the scanning direction of the first stage.
- a first measurement system having a measurement device for measuring position information in a non-scanning direction to be measured; a second measurement system for measuring at least position information of the second stage in the scanning direction; and the first and second measurements.
- System measurement results a position measurement error of the reference point on the reflecting surface at least due to the positional relationship between the optical axis of the measurement beam and the optical axis of the reference beam of the lightwave interference measuring device, and the corresponding In the non-scanning direction
- a first exposure apparatus comprising a; controller and for controlling the drive system based on the correlation information indicating the relationship between the position of the first stage to be.
- the first measurement system irradiates a measuring beam from the lightwave interference type length measuring device to the reflection surface provided on the first stage to measure the position information in the scanning direction of the first stage, and performs the measurement.
- the position information of the first stage in the non-scanning direction is measured using the device.
- the second measurement system measures position information of at least the second stage in the scanning direction.
- the control device is configured to control the measurement result of the first and second measurement systems and the position on the reflection surface at least due to the positional relationship between the optical axis of the measurement beam and the optical axis of the reference beam of the lightwave interference measuring device.
- the driving system is controlled on the basis of the position measurement error of the reference point and the corresponding correlation information indicating the relationship between the position of the first stage in the non-scanning direction. That is, the position measurement error of the first stage in the scanning direction due to the optical axis deviation of the lightwave interference type length measuring device (the deviation of the measurement optical axis from the reference optical axis) according to the position of the first stage in the non-scanning direction is taken into account. Then, the synchronous control of the first stage and the second stage, that is, the synchronous control of the mask and the photosensitive object is accurately performed by the control device via the drive system. This makes it possible to improve the synchronization accuracy between the mask and the photosensitive object and shorten the synchronization settling time. Realized by the exposure method, it becomes possible to transfer the pattern of the mask onto the photosensitive object with high accuracy.
- control device uses the correlation information and the position information of the first stage in the non-scanning direction, and uses the lightwave interference type length measuring device to cause a measurement error of the first stage.
- a relative position error between the mask and the photosensitive object in the scanning direction can be corrected.
- the control device is configured to control the first stage by the lightwave interference type length measuring device based on the correlation information and position information of the first stage in the non-scanning direction.
- Information about a measurement error may be calculated, and the calculated information may be used when the first stage moves in the scanning direction.
- the control device may correct the measurement error of the first stage based on the correlation information and the position information of the first stage in the non-scanning direction with respect to the scanning direction of the first stage.
- Position information may be calculated, and the calculated information may be used when the first stage moves in the scanning direction.
- the correlation information may include: the control device detects a position of the first stage in the scanning direction based on an output of the lightwave interference type length measuring device; The first stage is moved in the non-scanning direction via a non-scanning direction, and is created in advance based on a position measurement error of a reference point on the reflection surface obtained at each of a plurality of positions in the non-scanning direction. It can be.
- control device may include a storage device that controls the movement of the first stage via the drive system when the correlation information is created, and that stores the created correlation information. it can.
- the first exposure apparatus of the present invention may further include a mark measurement system that measures a positional relationship between a measurement mark provided on a part of the first stage and a reference mark provided on a reference object. Is obtained before based on the measurement result of the mark measurement system.
- the correlation information may be created in advance based on a position measurement error of a reference point on the reflective surface.
- the correlation information is table data created using a position measurement error of a reference point on the reflecting surface obtained for each position in the non-scanning direction. be able to.
- control device may determine the position measurement error for each position in the non-scanning direction in the correlation information according to the measured position information in the non-scanning direction of the first stage.
- the measurement error of the lightwave interference type length measuring device can be calculated using the calculation result interpolated by the interpolation calculation.
- the correlation information is obtained by plotting a position measurement error of a reference point on the reflection surface obtained for each position in the non-scanning direction on a predetermined coordinate system.
- the data may be function data calculated based on point data.
- the control device moves the first stage to a predetermined position in the scanning direction based on an output of the light wave interference type length measuring device. While moving in the non-scanning direction while substantially maintaining
- control device may calculate the position measurement error by further considering the attitude of the first stage.
- the position measurement error included in the correlation information may be further caused by a wavefront aberration generated in the measurement beam.
- the reflection surface may be a reflection surface of a hollow retro-reflector.
- an exposure apparatus that synchronously moves a first object and a second object to transfer the pattern of the first object onto the second object
- a first movable body for holding one object, a second movable body for holding the second object, and a stage system having a drive system for independently driving the first and second movable bodies
- a first interferometer system for irradiating a retro-reflector provided on the movable body with a measurement beam to measure position information of the first movable body in a scanning direction in which the first object is synchronously moved
- a second interferometer system for measuring body position information; based on measurement results of the first and second interferometer systems and error information relating to position measurement of the first movable body caused by the retro-reflector.
- a control device for controlling a drive system.
- the control device allows the measurement results of the first and second interferometer systems and error information relating to the position measurement of the first movable body caused by the retroreflector (for example, a change in the position of the retroreflector in the measurement orthogonal direction).
- the driving system is controlled on the basis of the error information relating to the position measurement of the first movable body caused by the optical axis deviation of the measurement optical axis from the reference optical axis. That is, in consideration of the error information relating to the position measurement of the first movable body caused by the retroreflector, the control device accurately controls the synchronization between the first movable body and the second movable body via the drive system. .
- control device may control the drive system using different error information according to a position of the first movable body in a non-scanning direction orthogonal to the scanning direction.
- the pattern of the microdevice is transferred onto the photosensitive object by using the exposure method of the present invention, so that the pattern can be formed on the photosensitive object with high accuracy.
- Microdevices can be manufactured with good yield.
- the exposure is performed by using any of the first and second exposure apparatuses of the present invention, whereby the photosensitive A pattern can be formed on an object with high accuracy, and thereby a microdevice with a higher degree of integration can be manufactured with a high yield. Therefore, from another viewpoint, the present invention can be said to be a device manufacturing method using any one of the exposure method of the present invention and the first and second exposure apparatuses of the present invention.
- FIG. 1 is a diagram showing a configuration of an exposure apparatus according to one embodiment of the present invention.
- Figure 2 shows the reticle stage shown in Figure 1, a reticle interferometer that measures the position of the reticle stage, and a mark and reference mark on the reticle R or reticle reference plate RFM.
- FIG. 2 is a perspective view showing components such as a reticle alignment system for simultaneous measurement with a reference mark on the FM.
- FIG 3 A is a plan view showing the arrangement of the reference mark WM "WM 2 on the reference mark plate FM
- FIG 3 B is a plan view showing the arrangement of measurement marks on reticle reference plate R FM.
- Fig. 4 is a flowchart showing the processing algorithm of the main controller (internal CPU) when creating correlation information for correcting the measurement error of the reticle Y interferometer.
- 5A, 5C, 5E, 5G and 5I show the mark image measured by one reticle alignment system RAi and the measurement of one reticle Y interferometer obtained based on the image. shows an error, Fig. 5 B, FIG. 5 D, FIG. 5 F, FIG. 5 H and Figure 5 J, the other reticle ⁇ Lai Men Bok system Ma measured by RA 2 - based on click image, and the image
- FIG. 9 is a diagram showing a measurement error of the other reticle Y interferometer obtained by the measurement.
- FIG. 6A is a diagram showing a plurality of points corresponding to measurement errors of one reticle Y interferometer plotted on a rectangular coordinate system and an approximate curve of these points
- FIG. 6B is a diagram showing a rectangular coordinate system
- FIG. 9 is a diagram showing a plurality of points corresponding to measurement errors of the other reticle Y interferometer plotted above, and approximate curves of these points.
- FIG. 7 is a flowchart for explaining an embodiment of the device manufacturing method of the present invention.
- FIG. 8 is a flowchart showing a detailed example of step 204 in FIG.
- FIGS. 9A and 9B are diagrams for explaining the principle that a measurement error occurs due to the interaction between the optical axis shift between the reference beam and the measurement beam and the wavefront aberration.
- FIGS. 1OA and 1OB are diagrams for explaining the principle that an optical axis shift occurs between the reference beam and the measurement beam due to the movement of the movable mirror (moving body) in the measurement orthogonal direction.
- FIG. 1 shows a schematic configuration of an exposure apparatus 100 according to an embodiment suitable for carrying out the position measurement method, the position control method, and the exposure method of the present invention.
- the exposure apparatus 100 is a step-and-scan scanning projection exposure apparatus, that is, a so-called scanning stepper.
- the exposure apparatus 100 includes an illumination system 100 including a light source and an illumination optical system, a reticle stage RST as a first stage (first moving body, moving body) holding a reticle R as a mask, and a projection optical system.
- System stage, wafer stage WST as second stage (second moving body) that can freely move in the XY plane while holding wafer W as a photosensitive object, and body BD with projection optical system PL etc. Is provided.
- the illumination system 10 includes a light source (not shown), a beam shaping optical system, an energy rough adjuster, an optical integrator (a fly-eye lens, a rod type (internal reflection type) integrator, or a diffractive optical element, etc.), and an illumination system aperture.
- An illumination optical system including an aperture plate, a beam splitter, a relay optical system, a fixed reticle blind, a movable reticle blind (all not shown), and the like are provided. This lighting system 10 JP2003 / 009691
- K r F excimer laser (oscillation wavelength 2 4 8 nm), A r F E Kishimare one The (oscillation wavelength 1 9 3 nm) or F 2 laser (oscillation wavelength 1 5 7 ⁇ m) and the like used Is done.
- This light source is actually installed on the floor F in the clean room where the exposure apparatus main body is installed, or in a room with a low degree of cleanness (service room) separate from the clean room. Is connected to the entrance end of the illumination optical system described above.
- the reticle stage RST is, for example, about several meters by an air bearing (not shown) provided on the bottom surface above the upper surface of a reticle base 36 constituting a top plate of a second column 34 described later. It is levitated and supported via clearance.
- a reticle R is fixed on the reticle stage R ST by, for example, vacuum suction (or electrostatic suction).
- the reticle stage RST is two-dimensionally (X-axis direction, Y-axis direction) in the XY plane perpendicular to the optical axis AX of the projection optical plan PL described later by the reticle stage drive unit 12 including a linear motor and the like. In addition, it can be driven very finely (in the rotation direction (0 z direction) around the Z axis perpendicular to the XY plane) and can be driven on the reticle base 36 at the specified scanning speed in the Y axis direction.
- reticle stage RST is a reticle coarse movement stage that can be driven in a predetermined stroke range in the Y-axis direction on reticle base 36 by a linear motor. 1 and a reticle fine movement stage that can be finely driven in the X-axis direction, Y-axis direction, and 0z direction by an actuator such as at least three voice coil motors for the reticle coarse movement stage.
- the reticle stage RST is shown as a single stage.
- the reticle stage RST can be finely driven in the X-axis direction, the Y-axis direction, and the 0-z direction by the reticle stage driving unit 12 as described above, and can be scanned in the Y-axis direction. Is described as a single possible stage.
- Reticle stage RST has a movement stroke in the Y-axis direction that allows the entire surface of reticle R to at least cross optical axis AX of projection optical system PL.
- the mover of the above-described linear motor is attached to one side and the other side (front side and back side in FIG. 1) of the reticle stage RST in the X-axis direction, respectively.
- reticle stage drive section 12 includes an actuator such as a linear motor or a poise coil motor, but is shown as a simple block in FIG. 1 for convenience of illustration.
- a reaction frame structure that allows a reaction force to escape through a support member provided separately from the body BD is adopted.
- a reaction frame structure that allows a reaction force to escape through a support member provided separately from the body BD is adopted.
- a configuration is described in, for example, Japanese Patent Application Laid-Open No. H08-3330202.
- US Patent Nos. 5,874,820, etc. to the extent permitted by the national law of the designated country designated in this international application or of the selected elected country.
- the disclosures in the official gazette and U.S. patent application are incorporated herein by reference.
- a reaction force canceling mechanism utilizing the law of conservation of momentum is disclosed in detail in Japanese Patent Application Laid-Open No. 8-63231 and US Patent No. 6,255,796 corresponding thereto.
- a reticle laser interferometer (hereinafter, referred to as a first measurement system) fixed to a reticle base 36 is provided on the upper surface of one end (+ Y side) of the reticle stage RST in the Y-axis direction.
- the moving mirror 15 that reflects the laser beam from 13 is fixed, and the position of the reticle stage RST in the XY plane (the rotation in the 0-z direction, which is the direction of rotation about the Z axis) is fixed.
- the reticle interferometer 13 With a resolution of, for example, about 0.5 to 1 nm.
- a pair of Y-axis movable mirrors each formed of a hollow retro-reflector at one end (+ Y side) in the Y-axis direction.
- 15 yi and 15 y 2 are fixed at predetermined intervals in the X-axis direction, and consist of a plane mirror having a reflection surface orthogonal to the X-axis direction at one end (+ X side) of the X-axis direction.
- X-axis movable mirror 15 X is fixed.
- a reticle Y interferometer 13 yi, 13 y composed of a pair of laser interferometers as a pair of lightwave interferometers respectively corresponding to these movable mirrors 15 yi , 15 y 2, and 15 x. 2 and a reticle X interferometer 13 x as a measuring device are provided.
- a plurality of reticle interferometers and a plurality of movable mirrors are provided, respectively.
- these are typically shown as a movable mirror 15 and a reticle interferometer 13, respectively.
- actually moving mirror 1 5 X, 1 5 y l 1 5 y 2 are provided on the reticle micro-moving stage.
- the + X side end surface of reticle stage RST may be mirror-finished to form a reflecting surface (corresponding to the reflecting surface of movable mirror 15X).
- a single-pass laser interferometer is used as the one reticle Y interferometer 13 yi.
- the reticle Y interferometer 13 yi uses, for example, a two-frequency laser using the Zeeman effect as a light source, and a polarized beam inside.
- a heterodyne laser interferometer having a splitter, a 1/4 wavelength plate, a polarizer, a photoelectric conversion element, and the like is used.
- 2-frequency laser described above for example, different frequency by 2 to 3 m H Z, and laser light including two components which polarization directions are perpendicular to each other, and more specifically the wavelength orthogonal polarization components of the two vertical and horizontal Instead, it outputs a circular beam with a Gaussian distribution.
- the vertical polarization component (V component) passes through the polarization beam splitter and becomes the measurement beam Ma passing through the measurement path
- the horizontal polarization component (H component) is reflected by the polarization beam splitter and passes through the reference path through the reference path. Ra.
- the measurement beam M a and the reference beam R a are converted into circularly polarized light when they pass through the 14-wave plate immediately before being emitted from the interferometer 13 yi.
- the measurement beam Ma returns to the reticle Y interferometer 13 yi via the first reflection surface and the second reflection surface of the moving mirror 15 yi as shown in FIG. The light enters the optical system and the polarizer.
- the reference beam Ra passes through the first and second reflecting surfaces of the reference mirror 14 yi, which is a hollow retroreflector fixed to the side of the lens barrel of the projection optical system PL.
- the light returns to the reticle Y interferometer 13 yi sequentially, and enters the internal optical system and polarizer.
- the polarizer is set so that the polarization angle is in the direction of 45 ° with respect to the H component and the V component, thereby returning both components, that is, the measurement beam Ma and the reference beam Ra.
- the interference light of the light beam is given to the photoelectric conversion element.
- the photoelectric conversion element photoelectrically converts the interference light of both components and supplies an electric signal (interference signal) to a signal processing system (not shown).
- the phase of the measurement beam is Doppler shifted with respect to the phase of the reference beam due to the movement of the movable mirror 15 yi , and a phase change occurs.
- the heterodyne detection of the phase difference between the reference beam and the measurement beam is performed, so that the moving distance of the moving mirror 15 yi , that is, the moving mirror 15 yi (more precisely, the reference of the moving mirror 15 yi The position of the reference mirror 14 yi of the point, that is, the vertex of the hollow retroreflector constituting the moving mirror 15 yi, or the position change is detected.
- This signal processing is well known for heterodyne interferometers. 2003/009691
- reticle Y interferometer 1 3 y 2 is configured similarly to the reticle Y interferometer 1 3 yi, measurement beams Mb from the interferometer 1 3 y2,, respectively Re reference beam Rb pixels shown in FIG. 2 moving mirror 1 5 y 2 consisting of a hollow retro-reflector being respectively irradiated on the reference mirror 1 4 Y2, interference signal Similarly reticle Y interferometer 1 3 y 2 inside of the above-described these reflected light (return light)
- the photoelectric conversion element detects the phase difference between the reference beam and the measurement beam by a signal processing system, and the moving mirror 15 y 2 (more precisely, the moving mirror 1
- the reference point of 5 y 2 that is, the movable mirror 15 a vertex of the hollow retro-reflector constituting Y 2), or the position or change in position of the reference mirror 1 4 y 2 is detected.
- the position of the reticle stage RST in the Y-axis direction is measured based on at least one of the measured values of the reticle Y interferometers 13 yi and 13 y 2 (for example, an average value of both measured values).
- the rotation of the reticle stage RST in the ⁇ z direction can be measured (calculated) based on the difference between the measured values and the distance between the measurement axes.
- the reticle X interferometer 13 X As the reticle X interferometer 13 X, the same heterodyne interferometer as the above interferometers 13 yi and 13 y 2 is used.
- the measurement beam and the reference beam from this reticle X interferometer 13 x irradiate the X movable mirror 15 x and the reference mirror 14 X consisting of a plane mirror shown in Fig. 2, respectively, and the reflected light (return light)
- the reticle X interferometer 13 X is photoelectrically detected by the photoelectric conversion element inside the X, and the signal processing system detects the phase difference between the reference beam and the measurement beam, and performs the dyne detection.
- a position or a change in position based on the position of the mirror 14 X is detected.
- the position of reticle stage RST in the X-axis direction is measured based on the measurement value of reticle X interferometer 13 X.
- the position information of reticle stage RST from reticle Y interferometers 13 yi and 13 y 2 and reticle X interferometer 13 X described above is sent to main controller 20, and In the device 20, the reticle stage RS # is controlled via the reticle stage drive unit 12 based on the position information of the reticle stage RST.
- a fixed mark plate made of the same material as the reticle that is, a reticle fiducial mark plate (hereinafter referred to as a “reticle reference plate”) is provided at one end of the upper surface of the reticle stage RS.
- RFM extends along the X-axis direction.
- predetermined pitches are provided along the X-axis direction at positions substantially opposed to the pair of ⁇ -axis moving mirrors 15 yi and 15 y 2 , respectively.
- Each set of at least three fiducial marks arranged in is formed. In the present embodiment, as shown in FIG.
- the projection optical system P is held in a first column 32 constituting a body BD below the reticle stage RST in FIG.
- the configuration of the body BD will be described.
- the body BD includes a first column 32 installed on a floor (or an upper surface of a frame) F of the clean room, and a second column 34 placed on the upper surface of the first column 32.
- the first column 32 has three legs 37A to 37C (however, the leg 37C on the back side of the paper in FIG. 1 is not shown) and the upper end surfaces of these legs 37A to 37C are
- the lens barrel base plate 38 is connected to the lower end surfaces and constitutes the ceiling of the first column 32.
- Each of the legs 37 A to 37 C has a vibration isolation unit 39 installed on the floor, A strut 40 fixed to the upper part of the vibration isolation unit 39 is provided.
- Each vibration isolating unit 39 insulates the slight vibration from the floor F at the micro G level, and hardly transmits it to the lens barrel base 38.
- the lens barrel base 38 has a circular opening (not shown) formed substantially at the center thereof, and the projection optical system PL is inserted into the opening from above with the optical axis AX direction being the Z axis direction.
- the lens barrel of the projection optical system PL is provided with a flange FLG, and the projection optical system P is supported by the lens barrel base 38 via the flange FLG.
- On the upper surface of the barrel base 38 for example, three legs 41A to 41C are provided at positions surrounding the projection optical system PL (however, the legs 41C on the far side of the drawing in FIG. 1 are not shown).
- the lower end of the reticle is fixed, and the above-described reticle base 36 is placed on the upper portions of the legs 41A to 41C, and is horizontally supported. That is, the second column 34 is constituted by the reticle base 36 and the three legs 41 A to 41 C supporting the reticle base 36.
- the projection optical system PL a double-sided telecentric reduction system is used, and a refraction optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis AX direction is used.
- a projection magnification of 8 is used, and as an example, a reduction optical system of 14 is used.
- the illumination light IL from the illumination system 10 illuminates the slit-shaped illumination area IAR on the reticle R
- the illumination light IL passing through the reticle R causes the reticle R in the slit-shaped illumination area IAR to be illuminated.
- a reduced image (partial inverted image) of the circuit pattern via the projection optical system PL is formed in an exposure area IA conjugate to the illumination area IAR on the wafer W coated with a photo resist on the surface.
- the wafer stage WS is actually configured to include an XY stage moving in an XY two-dimensional plane and a wafer table mounted on the XY stage.
- the XY stage can be freely driven along the upper surface of the stage base 16 in the XY two-dimensional plane (including 0z rotation) by a drive system (not shown) such as a linear motor or a planar motor. ing.
- the wafer table is tilted with respect to the optical axis AX direction (Z-axis direction) and the plane orthogonal to the optical axis (XY plane) by a drive system (not shown) including an actuator such as a Pois coil motor arranged on the XY stage, It is driven in the ⁇ X direction, which is the rotation direction around the X axis, and in the 0 y direction, which is the rotation direction around the Y axis.
- a drive system including an actuator such as a Pois coil motor arranged on the XY stage, It is driven in the ⁇ X direction, which is the rotation direction around the X axis, and in the 0 y direction, which is the rotation direction around the Y axis.
- a wafer W is held on a wafer table by vacuum suction (or electrostatic suction) via a wafer holder (not shown).
- the wafer stage WST is actually configured to include a plurality of components, but hereinafter, for convenience, the wafer stage WST includes a wafer stage driving unit controlled by the main controller 20. by 2 8 X, ⁇ , ⁇ , ⁇ ⁇ , be described as a single stage that is freely driven in directions of six degrees of freedom of ⁇ y ⁇ ⁇ ⁇ .
- the wafer stage drive unit 28 includes a linear motor, a planar motor, a voice coil motor, and the like, but is shown as a single block in FIG. 1 for convenience of illustration.
- the wafer stage WS may be a coarse / fine movement stage by making the wafer table finely movable in at least the X-axis and the ⁇ -axis directions with respect to the ⁇ stage.
- the stage base 16 is also called a surface plate.
- the stage base 16 is installed on the floor F via a plurality of vibration isolators 43. That is, the stage base 16 has a configuration separated from the body BD that holds the projection optical system PL and the like.
- a moving mirror 27 that reflects the laser beam from the wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 31 as the second measurement system is fixed on the wafer stage WST (more precisely, the wafer table).
- the position in the X plane of the wafer stage WS is constantly detected by the wafer interferometer 31 fixed to the body BD with a resolution of, for example, about 0.5 to 1 nm.
- a moving mirror having a reflecting surface orthogonal to the Y-axis direction which is the scanning direction at the time of scanning exposure, and a non-scanning direction X on the wafer stage WST (more precisely, the wafer table described above).
- a movable mirror having a reflecting surface orthogonal to the axial direction is provided,
- the laser interferometer is provided with an X laser interferometer for measuring the position in the X-axis direction and a ⁇ ⁇ laser interferometer for measuring the position in the Y-axis direction.
- Mirror 27 is shown as wafer interferometer 31.
- the end surface of the wafer stage WS may be mirror-finished to form a reflection surface (corresponding to the reflection surface of the movable mirror 27).
- the X laser interferometer and the ⁇ laser interferometer are multi-axis interferometers having a plurality of measurement axes, and in addition to the X and ⁇ positions of the wafer table, the rotation (the rotation around the ⁇ axis, 0 ° rotation) ), Pitching (0 X rotation around the X axis), and mouth ring (0 y rotation around the ⁇ axis) can also be measured.
- the wafer interferometer 31 measures the positions of the wafer stage WST in the directions of X, ⁇ , ⁇ 2, ⁇ y, and QX in five degrees of freedom.
- the multi-axis interferometer injects a laser beam through a reflecting surface installed on the wafer stage WST at an angle of 45 ° to a reflecting surface (not shown) installed on a body BD on which the projection optical system P is mounted. Irradiation may be used to detect relative position information in the optical axis direction (Z-axis direction) of the projection optical system PL.
- the position information (or speed information) of the wafer stage WST is sent to the main controller 20, and the main controller 20 transmits the wafer stage via a wafer stage driving unit 28 (not shown) based on the position information (or speed information). Control WST.
- a fiducial mark plate FM is fixed on the wafer stage WST.
- the surface of the fiducial mark plate FM has almost the same height as the surface of the wafer W held on the wafer stage WST.
- the reference mark plate FM surface a pair of reference marks WMi corresponding to total measurement mark RMii ⁇ RMi 5, RM 2 i ⁇ RM 25 described above, WM 2, reference marks for baseline measurement of Araimen Bok system to be described later
- a number of fiducial marks including such as are formed.
- Reference mark WIVh, WM 2 is that are located in the reference mark plate on the FM arranged in the X-axis direction at intervals D, as shown in FIG. 3 A.
- These reference marks WMi, as the WM 2, where is needed use a box mark. Note that at least a part of these many reference marks is Alternatively, it may be formed directly on the WST (eg, a wafer table).
- an image sensor such as a CCD.
- a pair of image processing type reticle alignment systems RAL RA 2 (however, in FIG. 1, the reticle alignment system on the back side of the drawing) uses light having an exposure wavelength (in this embodiment, illumination light I) as illumination light for alignment.
- RA2 is omitted from the figure; see Fig. 2).
- the pair of reticle alignment systems RA ⁇ RA 2 are installed symmetrically (symmetrically) with respect to the YZ plane including the optical axis AX of the projection optical system PL.
- the pair of reticle alignment systems RAi and RA 2 have a structure capable of reciprocating in the X-axis direction in the XZ plane passing through the optical axis AX.
- the disclosures in the above-mentioned gazettes and corresponding US patents are incorporated herein by reference to be a part of the description of this specification.
- a pair of reticle alignment systems RAi and RA 2 are provided with a pair of reticle alignment marks arranged outside the light-shielding band of reticle R while reticle R is mounted on reticle stage RST. It is set at a position where observation is possible.
- the pair of reticle alignment marks are arranged at an interval of 4D in the X-axis direction.
- the exposure apparatus 100 of the present embodiment has a light source whose ON / OFF is controlled by the main control device 20 and is related to the optical axis AX direction (Z-axis direction) of the wafer W.
- An oblique incidence type multi-point focal position detection system (hereinafter, appropriately referred to as “multi-point AF system J”) for detecting the position and the inclination with respect to the XY plane is provided.
- the point AF system is disclosed in detail in, for example, JP-A-6-283403 and US Patent No. 5,448,332 corresponding thereto.
- the main controller 20 controls the flow from the multipoint AF system at the time of scanning exposure, which will be described later.
- the occus signal FS in addition to the movement of the wafer stage WST in the Z-axis direction via the wafer stage drive unit 28, it also controls the two-dimensional inclination (that is, rotation in the ⁇ X and ⁇ V directions).
- the image plane of the projection optical system PL and the surface of the wafer W can be controlled within the irradiation area of the illumination light IL (area shared with the illumination area IAR). Perform autofocus (autofocusing) and autoleveling to substantially match
- the disclosures in the above-mentioned publications and US patents are incorporated herein by reference, to the extent permitted by the national laws of the designated country or selected elected countries, as specified in this international application.
- an off-axis alignment system for detecting an alignment mark (alignment mark) on the wafer W, a reference mark on the reference mark plate FM, and the like is provided by a projection optical system. It is located on the side of the lens barrel of the system PL.
- the alignment system for example, irradiates the target mark with a broadband detection light beam that does not expose the resist on the wafer W, and reflects the target mark image formed on the light receiving surface by the reflected light from the target mark.
- An image processing type FIA (Field Image Alignment) sensor that captures the image of the illustrated index using an image sensor (such as a CCD) and outputs those image signals is used.
- a target mark is irradiated with coherent detection light to detect scattered or diffracted light generated from the target mark, or two diffracted lights generated from the target mark (for example, the same order).
- coherent detection light for example, scattered or diffracted light generated from the target mark, or two diffracted lights generated from the target mark (for example, the same order).
- the alignment sensor for detecting by causing interference with each other alone or in an appropriate combination.
- the main controller 20 includes a workstation (or a microcomputer) and the like. As shown in FIG. 1, the main controller 20 includes a storage device 51 including a hard disk, a keyboard, and a mouse. And an input / output device 30 provided with a display such as a CRT or a liquid crystal panel.
- the storage device 51 has the reticle Y interferometer 13 yi , 1 One
- the flowchart in FIG. 4 starts when a measurement start command is input via the input / output device 30 by the operator.
- a counter n indicating the mark number of a pair of measurement marks to be measured is initialized to 1 (n-1).
- the wafer interferometer 31 while monitoring the measurement values pair of standards mark WMi, controls the wafer stage driving unit 28 based on the design value of the WM 2, the measurement position of the wafer stage WS T Moving.
- the measurement position is a position at which the midpoint between the pair of fiducial marks WM ⁇ WMs almost coincides with the optical axis of the projection optical system PL, and the above-mentioned pair of reticle alignment systems RA RA 2 is usually used.
- the reference mark WM ls WM 2 is located in the detection field of the reticle alignment system RAi, RA 2 .
- FIG. 5A are measured by the reticle alignment system RAi, and the measurement mark RM 2 shown in FIG. i image RM 2 i 'as a reference image WM2 of the mark WM 2' with, but is measured by the reticle ⁇ Rye instrument system RA 2.
- the displacement amount ⁇ yin of the measurement mark image RM ln 'with respect to the reference mark image WIVh' and the reference mark image WM 2 ' calculating a positional deviation amount a y 2n image RM 2n 'measurement marks and stores the calculation result in a memory such as RAM.
- a yu in FIG. 5A and A y 2 i in FIG. 5B are calculated.
- step 1 1 2 the point Pin ( ⁇ ym. X tract) corresponding to the displacement amount ym and the point P 2n (Ay 2n ) corresponding to the displacement amount ⁇ y 2n calculated in step 110 above.
- ⁇ ⁇ ) are plotted on a coordinate system where the horizontal axis is the position in the X-axis direction (X position) of reticle stage RS ⁇
- a point P 21 is plotted on the coordinate system shown in B.
- step 108 the image R ⁇ 12 ′ of the measurement mark RMi 2 and the image WIV ′ of the reference mark WMi shown in FIG. 5C are measured by the reticle alignment system RAi, and are shown in FIG. 5D.
- the image RM 22 ′ of the measurement mark RM 22 to be measured and the image WM 2 ′ of the reference mark WM 2 are measured by the reticle alignment system RA 2 .
- FIG. 5 C of A yi 2 FIG. 5 A y 2 2 of D is calculated.
- step 1 1 2 the point P 12 on the coordinate system shown in FIG. 6 A is a point P 22 on the coordinate system Ru shown in FIG. 6 B are respectively plotted Bok.
- step 1 08 shown in FIG. 5 E, 'and the reference mark image of WMi WIVh' image R Mis measurement marks RM 13 and is, measured by the reticle ⁇ Rye instrument system RAi, shown in FIG. 5 F image RM 23 measurement marks RM 23 'and the reference mark WM 2 of the image WM 2' and but is measured by the reticle ⁇ Rye member Bok based RA 2.
- Step 1 1 A y 13 of FIG. 5 E, the A y23 in Fig. 5 F is calculated.
- step 1 1 2 the point Pi3 on coordinate system shown in FIG. 6 A, the point P 23 on the coordinate system Ru shown in FIG. 6 B are respectively plotted Bok.
- step 108 the image R1 'of the measurement mark RMi4 and the image WMi' of the reference mark WMi shown in FIG. 5G are measured by the reticle alignment system RAi, and the measurement shown in FIG. 5H 'and reference image WM 2 of the mark WM 2' image RM 24 marks RM 24 and it is measured by the reticle ⁇ Rye instrument system RA2.
- step 110 A yi 4 in FIG. 5G and A y 24 in FIG. 5H are calculated.
- step 1 12 a point P 14 is plotted on the coordinate system shown in FIG. 6A, and a point P 24 is plotted on the coordinate system shown in FIG. 6B.
- step 108 the image R of the measurement mark RM 15 shown in FIG. M15 'and the reference mark image of WMi WMi' and but is measured by the reticle ⁇ Rye instrument system RAi, 5 images RM 25 measurement marks RM 25 shown in J 'as a reference image WM 2 of the mark WM 2' and but, It is measured by the reticle ⁇ line instrument system RA 2. Further, in Step 1 1 0, Figure 5 I of delta yi 5, Figure 5 J of ⁇ y 25 are calculated. In step 1 1 2, the point P 15 on the coordinate system shown in FIG. 6 A is a point P 25 on the coordinate system Ru shown in FIG. 6 B are respectively plotted Bok.
- a suitable interpolation operation for example, by a spline method, is performed as the above-described statistical operation to obtain a function by continuously interpolating between the aforementioned discrete data, and this function is used as the correlation information. Is also good.
- the coordinate values of the points Pin and P 2n are sequentially stored in a memory such as a RAM.
- the data may be stored to create table data (correction map), and this table data may be used as the correlation information.
- a pair of measurement marks RM ln , RM is provided for each step position while stepping at a pitch ⁇ in the X-axis direction while maintaining the Y position of reticle stage RST at a predetermined value while trusting the measured value.
- a reticle R is transported by a reticle transport system (not shown), and is held by suction at a reticle stage RST at a loading position.
- the main controller 20 controls the positions of the wafer stage WST and the reticle stage RST, and the reference mark plate FM corresponding to at least a pair of reticle alignment marks formed on the reticle R and corresponding to the reference mark plate FM.
- the relative position measurement of the reticle ⁇ Lai Men Bok reference mark is performed by a pair of reticle ⁇ Lai Men Bok based RA "RA 2 described above, reticle interferometer 1 3 of the measurement axes based on a result of the relative position measurement
- the calculation of the relationship between the reticle stage coordinate system defined by the above and the wafer stage coordinate system defined by the measurement axis of the wafer interferometer 31, that is, reticle alignment is performed.
- the main control unit 20 changes the reference mark plate FM to the off-axis PT / JP2003 / 009691
- the wafer stage WST is moved so as to be located immediately below the hardware system, and the positional relationship between the detection center of the alignment system and the reference mark for baseline measurement on the reference mark plate FM is measured.
- main controller 20 this positional relationship, the positional relationship between a pair of reticle alignment marks obtained at the time of the previous reticle alignment and the corresponding reference mark, and the time of measurement of each positional relationship are described.
- the alignment system baseline Based on the measurement value of the wafer interferometer 31, the alignment system baseline, that is, the relationship between the projection position of the reticle pattern and the detection center of the alignment system is obtained.
- the above reticle alignment, baseline measurement, and the like are disclosed in detail in, for example, the above-mentioned Japanese Patent Application Laid-Open No. H7-176468 and the corresponding US Pat. No. 5,646,413.
- the main controller 20 controls the EGA (Enhans) disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 61-44429 and the corresponding US Pat. No. 4,780,617.
- EGA Enhans
- a wafer alignment such as the “global” alignment method is performed, and the positions of all shot areas on the wafer W are required.
- the disclosures in the above-mentioned publications and corresponding US patents are incorporated herein by reference.
- main controller 20 monitors the wafer stage WS stack while monitoring the position information from interferometers 31 and 13 based on the position information and the baseline of each shot area on wafer W obtained above. Is moved to a scanning start position (acceleration start position) for exposure of the first shot area, and the reticle stage RST is moved to a scanning start position to start scanning exposure of the first shot area.
- main controller 20 sets X of reticle stage RST measured by reticle interferometer 13 (more precisely, reticle X interferometer 13 X).
- the measurement error values (correction values) of the reticle Y interferometers 13 y and 13 y 2 are different, the 0 Z rotation of the reticle stage RST is also corrected.
- Main controller 20 starts relative scanning of reticle stage RST and wafer stage WS in the Y-axis direction in the opposite direction, and when both stages RST and WST reach their respective target scanning speeds, illumination light IL is used.
- the pattern area of the reticle R starts to be illuminated, and scanning exposure starts. Prior to the start of the scanning exposure, light emission of the light source has been started, but the movement of each blade of the movable blind constituting the reticle blind is synchronously controlled by the main controller 20 with the movement of the reticle stage RST. Therefore, the irradiation of the illumination light I to the outside of the pattern area on the reticle R is prevented in the same manner as in a normal scanning stepper.
- the moving speed Vr of the reticle stage RST in the Y-axis direction and the moving speed Vw of the wafer stage WST in the X-axis direction correspond to the projection magnification S of the projection optical system PL.
- the reticle stage RST and the wafer stage WST are controlled synchronously so that the speed ratio is maintained.
- Main controller 20 also measures reticle interferometer 13 (more precisely, reticle X interferometer 13 X) during the synchronous control of reticle stage RST and wafer stage WST, as described above.
- reticle Y interferometer 1 3 yi Correct the measured value of 1 3 y 2 .
- the circuit pattern of reticle R is reduced and transferred to the first shot area via projection optical system PL.
- the auto-focusing / auto-repellering described above is performed by the main controller 20 using the multipoint AF system described above.
- a stepping operation between shots for moving the wafer stage WST to a scanning start position (acceleration start position) for exposure of the second shot area is performed.
- scanning exposure of the second shot area is performed in the same manner as described above. Thereafter, the same operation is performed in the third shot area and thereafter.
- the stepping operation between shots and the scanning exposure operation of the shots are repeated, and the pattern of the reticle R is transferred to all the shot areas on the wafer W by the step-and-scan method.
- the above-described process of creating the correlation information (the processes of steps 102 to 118 in FIG. 4) is repeated at a predetermined timing, for example, according to an instruction of an operator.
- the correlation information in the storage device may be updated using 2 (X). In this way, even if the measurement error of the reticle Y interferometer fluctuates over time due to some factor, the position of the reticle stage RST can always be accurately controlled without being affected by the fluctuation. Become.
- a drive system that drives the reticle stage RS and the wafer stage WST in the scanning direction is configured by the reticle stage drive unit 12 and the wafer stage drive unit 28. Have been.
- the main control device 20 forms a control device.
- the main controller 20 when measuring the position of the reticle stage RST, uses the pair of Y-axis movable mirrors 15 y on the reticle stage RST. 1; A reticle Y that irradiates the measurement beams Ma and Mb to 15 y 2 and receives the reflected light beam Y-axis direction of the reticle stage RST based on the output of the 13 yi and 13 y 2 (first Along with the reticle stage RST in the X-axis direction (second axis direction) using the reticle X interferometer 13 X as the second axis position measurement device. I do.
- the main controller 20 stores the optical axes of the measurement beams M a and M b of the reticle Y interferometers 13 yi and 13 y 2 and the reference beams R a and R b stored in the storage device 51.
- main controller 20 obtains the above-described correlation information by actual measurement by performing processing according to the flowchart of FIG. 4 in advance, and stores the information in storage device 51. I remember.
- main controller 20 obtains the above-described correlation information by actual measurement by performing processing according to the flowchart of FIG. 4 in advance, and stores the information in storage device 51. I remember.
- the position information in the Y-axis direction (and the 02 direction) of the reticle stage RST is converted into the reticle Y interferometer 13 yi , 1 by the position measurement method described above. Accurate measurement can be performed using 3 y 2 . Then, main controller 20 performs reticulation based on the position information measured with high accuracy. Since the position of the reticle stage RST in the Y axis direction (first axis direction) is controlled, the position of the reticle stage RS in the ⁇ axis direction (scanning direction) can be controlled with high precision.
- the main controller 20 controls the measurement results of the reticle ⁇ interferometers 13 yi , 13 y 2 and the reticle X interferometer 13 x respectively.
- the position information of the reticle stage RST on which the reticle R is mounted is measured in the Y-axis direction (scanning direction) and the X-axis direction (non-scanning direction) based on the measurement result of the wafer interferometer 31.
- the position information of the wafer stage WST on which the wafer W is mounted is measured in at least five degrees of freedom including the Y axis, the X axis, and the 0 z direction.
- main controller 20 determines the reticle stage RST based on the measurement result of the position information in the X-axis direction and the above-described correlation information stored in storage device 51, reticle Y interferometer 1 3 y 1 3 Obtains position information on the Y-axis direction (and direction) of the first stage after correcting the measurement error due to V 2, and calculates the corrected position information on the Y-axis direction (and 0z direction) of reticle stage RST.
- the reticle stage RST and the wafer stage WS are controlled based on positional information of the wafer stage WST in at least five degrees of freedom including the Y-axis, X-axis, 0z, and direction.
- main controller 20 accurately controls the synchronization between reticle stage RST and wafer stage WST, that is, the synchronization control between reticle R and wafer W, thereby improving the synchronization accuracy between reticle R and wafer W.
- the reticle R pattern can be accurately transferred to each shot area on the wafer W by realizing high-precision exposure using the scanning exposure method, which can improve and shorten the synchronization settling time. It works.
- At least one of the interferometers 13 yi and 13 y 2 for measuring the position of the reticle stage RS in the ⁇ -axis direction is constituted by a two-axis interferometer having two measurement axes.
- 0 X direction pitching direction
- the position measurement error of the reticle stage RST is determined based on the measurement values of the reticle Y interferometers 13 yi and 13 y 2.
- the reticle stage RST is step-moved to a plurality of positions in the X-axis direction using the measurement values of the reticle X interferometer 13 X while maintaining the coordinate position of the reticle X interferometer 13 X, and the movable mirror 15 yi , If a position measurement error of the vertex of 15 y 2 (a reference point on the reflection surface) is to be obtained, any method of measuring or calculating the position error may be used. For example, the wavefront aberrations of the measurement beam and the reference beam are measured in advance, and the optical axis shift amount of the beam is calculated from the relationship described in FIGS. 1OA and 1OB according to the X position (estimated).
- the correlation information may be created in the same manner as described above, based on the position measurement error obtained for each step position.
- the main controller 20 When measuring the position of the actual reticle stage RST The position measurement error (discrete data) for each of the step positions in the correction map is interpolated by a predetermined interpolation operation in accordance with the calculated position information of the reticle stage RST in the X-axis direction.
- the measurement error of the interferometers 13 y 1 and 13 y 2 may be calculated.In this case, the position information in which the calculated measurement error is corrected may be calculated. .
- the main controller 20 uses the measured values of the reticle Y interferometers 13 yi and 13 y 2 (that is, the position in the scanning direction and the rotation amount in the ⁇ z direction) based on the aforementioned correlation information. ), And the position and rotation of the reticle stage RST in the scanning direction are controlled based on the correction value.
- the present invention is not limited to this, and the main controller 20 includes the reticle Y interferometer 13 yi , 1 3 by y 2, in order to correct the relative positional error between the reticle R and ⁇ E c W caused by the at least one related measurement error between the position and theta z direction of rotation of the scanning direction, the reticle
- the position and rotation of the wafer stage in the scanning direction of the WST can be controlled using the aforementioned correlation information and the position information of the reticle stage RST in the non-scanning direction. good.
- main controller 20 does not correct the measured values of reticle Y interferometers 13 yi and 13 y 2 , and uses the above-described correlation information and position information of reticle stage RST in the non-scanning direction to perform the above-described operations. It is only necessary to calculate the measurement error of the reticle stage based on the calculated measurement error so that the relative position error between the reticle R and the wafer W caused by the measurement error becomes almost zero. At least one of the position and the rotation may be controlled by at least one of the RST and the wafer stage WST.
- the main control unit 20 determines at least one of the reticle stage RST and the wafer stage WST in the scanning direction (Y-axis direction) based on the aforementioned correlation information and the position information of the reticle stage RST in the non-scanning direction. ) May be corrected, and the movement of at least one stage may be controlled so that the corrected target position information substantially matches the measured value of the Y interferometer. Further, in the above embodiment, when the above-described correlation information or table data is created, n measurement marks RM ln and RM 2n are detected by the pair of reticle alignment systems RAi and RA 2 respectively.
- the reticle stage RST is moved stepwise in the X-axis direction, the reticle stage RST is continuously moved without positioning (stopping) the reticle stage RST when the measurement marks RM ln and RM 2n are detected. It may move to detect it.
- the reticle stage RST is adjusted based on the measurement values of the reticle Y interferometers 13 yi and 13 y 2 .
- the movement is performed while maintaining the position in the Y-axis direction at the predetermined coordinate position, the position of the reticle stage RS in the ⁇ -axis direction does not need to be maintained at the predetermined coordinate position during this movement.
- the measurement marks RM ln accordance reticle Araimento based RA RA 2, based on the measurement values of reticle Y interferometer 1 3 yi, 1 3 y 2 are Tokura upon detection of RM 2n, For instance Rechikurua Leimen Bok system RAi, RA
- the detection result of step 2 the above-mentioned positional deviation amounts ⁇ y ln and ⁇ y 2n
- the above-mentioned correlation information or table data may be calculated using the correction value.
- the mounting error and the manufacturing error of the reticle reference plate RFM or the reference mark plate FM (that is, the measurement marks RM ln , RM 2n and the reference mark
- the above-mentioned correlation information and the like may be calculated using at least one of these errors.
- the error information is updated periodically by calculation / simulation or actual measurement is performed, and based on the results, the aforementioned correlation is performed.
- the reference mirrors 14 yi and 14 y 2 not only hollow retro-reflectors but also non-hollow retro-reflectors (also called corner cube prisms) may be used, as well as plane mirrors.
- the position measuring device in the non-scanning direction of reticle stage RST is not limited to the laser interferometer, and an encoder or other position measuring device may be used.
- the reticle X interferometer described above adds the position information in the non-scanning direction (X-axis direction) and the 0y and 0z directions.
- a multi-axis interferometer having a plurality of length measurement axes so that at least one of the rotation amounts can be measured may be used.
- the present invention is not limited to this, and the measurement is performed on a dedicated measurement reticle or a reticle for device manufacture. Those having marks formed thereon may be used. In any case, it is desirable to measure the manufacturing error of the measurement mark in advance and correct this measurement error when measuring the position of the reticle stage, controlling the position, or creating the above-mentioned correlation information. .
- the measurement mark formed on the reticle reference plate RFM or the measurement reticle is not limited to a cross mark, and its shape may be arbitrary.
- the reticle alignment system of the imaging method is used to obtain the above-described correlation information and the like.
- the method is not limited to the above, but may be a method of detecting scattered light or diffracted light generated from the above-described measurement mark or reference mark, or a reticle alignment system using another optical sensor.
- one of a measurement mark arranged on the object plane side of the projection optical system and a reference mark arranged on the image plane side is irradiated with a coherent beam, and emitted from one of the marks via the projection optical system.
- a method may be used in which the diffracted light generated is applied to the other mark, and the diffracted lights of the same order generated from the other mark interfere with each other and are detected.
- the present invention is not limited to this. That is, a so-called double-pass laser interferometer may be used as the reticle Y interferometers 13 yi and 13 y 2 , and in this case, the main controller 20 corrects with high accuracy by the same procedure as described above. It is possible to perform position measurement and position control of the reticule stage RST. Further, the present invention can be suitably applied not only to a laser dyne interferometer but also to other types of laser interferometers as well as other types of laser interferometers. .
- the pair of Y-axis movable mirrors 15 yi and 15 y 2 are fixed on the upper surface of the reticle stage RST.
- the arrangement is not limited to this. It may be fixed to the side surface of the stage RST, or may be an integrated structure in which the end of the reticle stage RST (reticle fine movement stage) is machined to be a movable mirror.
- the measurement axis (measurement beam) of the reticle Y interferometer substantially coincides with the pattern surface of the reticle R in the optical axis direction (Z axis direction) of the projection optical system PL. As long as the measurement beam can be reflected by the sensor, its arrangement may be arbitrary.
- the number of Y-axis movable mirrors 15 yi and 15 y 2 may be one or three or more.
- the reference mirrors 14 x, 14 yi , and 14 y 2 of the reticle interferometer 13 are connected to the projection optical system PL. Although fixed to the lens barrel, it is not limited to this, and its arrangement may be arbitrary.
- a moving mirror is provided on the reticle fine movement stage.
- a Y-axis interferometer is also provided on the reticle coarse movement stage.
- a reflector may be provided, and in this case, the present invention can be applied.
- reticle stage RST is not limited to the coarse / fine movement stage, and its configuration may be arbitrary.
- the present invention is not limited to this, and at least a stage apparatus having a relatively large moving stroke in one axial direction is provided.
- the present invention can be suitably applied to any one exposure apparatus.
- a scanning exposure apparatus of the same size used as a liquid crystal exposure apparatus
- the mask stage is used.
- the position measurement method and the position control method of the present invention can be applied to a substrate stage together with a mask stage.
- the position measurement method and the position control method of the present invention are not limited to the stage of the exposure apparatus, but include a reflection surface, a predetermined stroke in at least one axis direction, and a movement in a direction orthogonal to the one axis. Any applicable moving object can be applied suitably.
- the present invention is not limited to this.
- a liquid crystal for transferring a liquid crystal display element pattern onto a square glass plate may be used.
- the present invention can also be applied to an exposure apparatus used for manufacturing a DNA chip and the like.
- microdevices such as semiconductor devices, they are used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, and electron beam exposure equipment.
- the present invention can also be applied to an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer in order to manufacture a reticle or mask.
- a transmissive reticle is generally used in an exposure apparatus using DUV (far ultraviolet) light or VUV (vacuum ultraviolet) light, and quartz glass, fluorine-doped quartz glass, or fluorite is used as a reticle substrate.
- DUV far ultraviolet
- VUV vacuum ultraviolet
- quartz glass, fluorine-doped quartz glass, or fluorite is used as a reticle substrate.
- Magnesium fluoride, quartz, or the like is used.
- a transmission type mask stencil mask, membrane mask
- a silicon wafer is used as a mask substrate.
- an ultraviolet light source such as K r F excimer laser light source as the light source, F 2 laser
- a pulsed laser light source in the vacuum ultraviolet region of A r F excimer laser is not limited thereto
- a r 2 laser light source (output wavelength 1 2 6 nm) may use other vacuum ultraviolet light source such as.
- a harmonic that is amplified by a fiber amplifier doped with (E r) (or both erbium and ytterbium (Y b)) and wavelength-converted to ultraviolet light using a nonlinear optical crystal may be used.
- the present invention can be applied to, for example, an exposure apparatus using EUV light or X-ray, or a charged particle beam such as an electron beam or an ion beam.
- the present invention is applied to, for example, an immersion type exposure apparatus in which liquid is filled between a projection optical system PL and a wafer, which is disclosed in, for example, International Publication No. WO 9949504. May be.
- the present invention may be applied to an exposure apparatus having two independently movable wafer stages.
- the twin wafer stage type exposure apparatus is disclosed, for example, in Japanese Patent Application Laid-Open No. H10-214,833 and corresponding US Pat. No. 6,341,077, or International Publication WO984,040. No. 91 and corresponding U.S. Patent Nos. 6,262,796, etc., and to the extent permitted by national law in the designated country or selected elected country specified in this international application. U.S. Patent Opening The description is incorporated herein by reference.
- the present invention is not limited to this, and an equal magnification or enlargement system may be used as the projection optical system. Either system or reflection system can be used. Further, when the same reduction system as in the above embodiment is used, the projection magnification 8 may be 15 or 1Z6, and in such a case, the size of the measurement mark and the reference mark is used. It is desirable to determine the position, arrangement, and the like according to the projection magnification.
- the illumination optical system composed of multiple lenses and the projection optical system PL are incorporated into the exposure apparatus body to perform optical adjustment, and the reticle stage RST and wafer stage WST, which are made up of many mechanical parts, are attached to the exposure apparatus body and wired.
- the exposure apparatus 100 according to the present embodiment can be manufactured by connecting the pipes and pipes and performing overall adjustment (electrical adjustment, operation check, etc.). It is desirable that the exposure apparatus be manufactured in a clean room where the temperature and cleanliness are controlled.
- FIG. 7 shows a flowchart of an example of manufacturing devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.).
- step 201 design step
- the function of the device and the performance design for example, circuit design of a semiconductor device, etc.
- the pattern for realizing the function is designed.
- step 202 mask manufacturing step
- step 203 wafer manufacturing step
- a wafer is manufactured using a material such as silicon.
- step 204 wafer processing step
- step 205 device assembling step
- This step 205 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.
- step 206 inspection step
- inspections such as an operation confirmation test and a durability test of the device created in step 205 are performed. After these steps, the device is completed and shipped.
- FIG. 8 shows a detailed flow example of the above step 204 in the semiconductor device.
- step 211 oxidation step
- step 2 12 CVD step
- step 2 13 electrode formation step
- step 2 14 ion implantation step
- steps 211 to 214 constitutes a pre-processing step in each stage of wafer processing, and is selected and executed according to a necessary process in each stage.
- Step 2 In each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, Step 2
- step 15 a photosensitive agent is applied to the wafer.
- step 2 16 exposure step
- the circuit pattern of the mask is transferred to the wafer by the exposure apparatus and the exposure method described above. Then Step 2
- step 17 development step
- step 218 etching step
- step 219 resist removing step
- the exposure apparatus and the exposure method of the above embodiment are used in the exposure step (step 2 16), so that the pattern of the reticle is accurately transferred onto the wafer. can do. As a result, the productivity (including yield) of highly integrated microdevices can be improved. Industrial applicability
- the position measurement method of the present invention is suitable for measuring position information of a moving body provided with a reflecting surface using a lightwave interference type length measuring device. Further, the position control method of the present invention is suitable for controlling the position of a moving object whose position information in one axis direction is measured using a lightwave interference type length measuring device. Further, the exposure method and the exposure apparatus of the present invention are suitable for transferring a pattern of a micro device on a photosensitive object. Further, the device manufacturing method of the present invention is suitable for producing micro devices.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2003252349A AU2003252349A1 (en) | 2002-07-31 | 2003-07-30 | Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method |
| JP2004524315A JPWO2004012245A1 (ja) | 2002-07-31 | 2003-07-30 | 位置計測方法、位置制御方法、露光方法及び露光装置、並びにデバイス製造方法 |
| US11/045,161 US20050151947A1 (en) | 2002-07-31 | 2005-01-31 | Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002223252 | 2002-07-31 | ||
| JP2002-223252 | 2002-07-31 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/045,161 Continuation US20050151947A1 (en) | 2002-07-31 | 2005-01-31 | Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004012245A1 true WO2004012245A1 (ja) | 2004-02-05 |
Family
ID=31184956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2003/009691 Ceased WO2004012245A1 (ja) | 2002-07-31 | 2003-07-30 | 位置計測方法、位置制御方法、露光方法及び露光装置、並びにデバイス製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2004012245A1 (ja) |
| KR (1) | KR20050025626A (ja) |
| AU (1) | AU2003252349A1 (ja) |
| WO (1) | WO2004012245A1 (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG107671A1 (en) * | 2002-09-06 | 2004-12-29 | Asml Holding Nv | Reticle focus measurement system and method using multiple interferometric beams |
| US6850330B2 (en) | 2002-09-06 | 2005-02-01 | Asml Holding N.V. | Reticle focus measurement system using multiple interferometric beams |
| JP2011145232A (ja) * | 2010-01-16 | 2011-07-28 | Canon Inc | 計測装置及び露光装置 |
| KR101525342B1 (ko) * | 2007-12-28 | 2015-06-10 | 가부시키가이샤 니콘 | 노광 장치, 이동체 구동 시스템, 패턴 형성 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| WO2017169455A1 (ja) * | 2016-03-28 | 2017-10-05 | 株式会社ブイ・テクノロジー | マスク製造装置及びマスク製造装置の制御方法 |
| JP2025079335A (ja) * | 2023-11-09 | 2025-05-21 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学検査デバイス |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100734648B1 (ko) * | 2005-12-28 | 2007-07-02 | 동부일렉트로닉스 주식회사 | 얼라인유닛을 구비한 반도체 노광장치 |
| EP2963498B8 (en) * | 2006-01-19 | 2017-07-26 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| EP2993688B1 (en) * | 2006-08-31 | 2017-04-05 | Nikon Corporation | Exposure method and apparatus, and device manufacturing method |
| EP3291010A1 (en) * | 2006-08-31 | 2018-03-07 | Nikon Corporation | Exposure apparatus and method, and device manufacturing method |
| JP5984459B2 (ja) * | 2012-03-30 | 2016-09-06 | キヤノン株式会社 | 露光装置、露光装置の制御方法及びデバイス製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09320924A (ja) * | 1996-05-27 | 1997-12-12 | Nikon Corp | 投影露光装置 |
| WO1999031462A1 (en) * | 1997-12-18 | 1999-06-24 | Nikon Corporation | Stage device and exposure apparatus |
| JPH11248419A (ja) * | 1998-03-06 | 1999-09-17 | Nikon Corp | 干渉計及びそれを備えた露光装置 |
| JP2001007003A (ja) * | 1999-06-23 | 2001-01-12 | Kyocera Corp | レ−ザ−干渉測長装置 |
| JP2003202204A (ja) * | 2002-01-07 | 2003-07-18 | Nikon Corp | 干渉計、露光装置、および露光方法 |
-
2003
- 2003-07-30 KR KR1020057001001A patent/KR20050025626A/ko not_active Withdrawn
- 2003-07-30 AU AU2003252349A patent/AU2003252349A1/en not_active Abandoned
- 2003-07-30 WO PCT/JP2003/009691 patent/WO2004012245A1/ja not_active Ceased
- 2003-07-30 JP JP2004524315A patent/JPWO2004012245A1/ja not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09320924A (ja) * | 1996-05-27 | 1997-12-12 | Nikon Corp | 投影露光装置 |
| WO1999031462A1 (en) * | 1997-12-18 | 1999-06-24 | Nikon Corporation | Stage device and exposure apparatus |
| JPH11248419A (ja) * | 1998-03-06 | 1999-09-17 | Nikon Corp | 干渉計及びそれを備えた露光装置 |
| JP2001007003A (ja) * | 1999-06-23 | 2001-01-12 | Kyocera Corp | レ−ザ−干渉測長装置 |
| JP2003202204A (ja) * | 2002-01-07 | 2003-07-18 | Nikon Corp | 干渉計、露光装置、および露光方法 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG107671A1 (en) * | 2002-09-06 | 2004-12-29 | Asml Holding Nv | Reticle focus measurement system and method using multiple interferometric beams |
| US6850330B2 (en) | 2002-09-06 | 2005-02-01 | Asml Holding N.V. | Reticle focus measurement system using multiple interferometric beams |
| US6934005B2 (en) | 2002-09-06 | 2005-08-23 | Asml Holding N.V. | Reticle focus measurement method using multiple interferometric beams |
| US7016051B2 (en) | 2002-09-06 | 2006-03-21 | Asml Holding N.V. | Reticle focus measurement system using multiple interferometric beams |
| KR101525342B1 (ko) * | 2007-12-28 | 2015-06-10 | 가부시키가이샤 니콘 | 노광 장치, 이동체 구동 시스템, 패턴 형성 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| JP2011145232A (ja) * | 2010-01-16 | 2011-07-28 | Canon Inc | 計測装置及び露光装置 |
| WO2017169455A1 (ja) * | 2016-03-28 | 2017-10-05 | 株式会社ブイ・テクノロジー | マスク製造装置及びマスク製造装置の制御方法 |
| JP2017181579A (ja) * | 2016-03-28 | 2017-10-05 | 株式会社ブイ・テクノロジー | マスク製造装置及びマスク製造装置の制御方法 |
| JP2025079335A (ja) * | 2023-11-09 | 2025-05-21 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学検査デバイス |
| JP7887466B2 (ja) | 2023-11-09 | 2026-07-09 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学検査デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2004012245A1 (ja) | 2005-11-24 |
| AU2003252349A1 (en) | 2004-02-16 |
| KR20050025626A (ko) | 2005-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6425148B2 (ja) | 露光装置及び露光方法、並びにデバイス製造方法 | |
| JP5071894B2 (ja) | ステージ装置、パターン形成装置、露光装置、ステージ駆動方法、露光方法、並びにデバイス製造方法 | |
| KR101444473B1 (ko) | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 | |
| EP3054354B1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
| US8208128B2 (en) | Position measuring system and position measuring method, Movable body apparatus, movable body drive method, exposure apparatus and exposure method, pattern forming apparatus, and device manufacturing method | |
| KR101555793B1 (ko) | 이동체 구동 시스템 및 이동체 구동 방법, 패턴 형성 장치 및 방법, 노광 장치 및 방법, 디바이스 제조 방법, 그리고 결정 방법 | |
| JP4345098B2 (ja) | 露光装置及び露光方法、並びにデバイス製造方法 | |
| JP5403263B2 (ja) | 移動体装置、露光装置及びパターン形成装置、並びにデバイス製造方法 | |
| JP5472331B2 (ja) | パターン形成方法及びパターン形成装置、並びにデバイス製造方法 | |
| US8125613B2 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
| JP2004072076A (ja) | 露光装置及びステージ装置、並びにデバイス製造方法 | |
| KR20010033118A (ko) | 스테이지 장치 및 노광장치 | |
| US20050151947A1 (en) | Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method | |
| JP2004014876A (ja) | 調整方法、空間像計測方法及び像面計測方法、並びに露光装置 | |
| JPWO2004012245A1 (ja) | 位置計測方法、位置制御方法、露光方法及び露光装置、並びにデバイス製造方法 | |
| JP2004241666A (ja) | 計測方法及び露光方法 | |
| JP2009016412A (ja) | 計測方法、設定方法及びパターン形成方法、並びに移動体駆動システム及びパターン形成装置 | |
| JP2013045815A (ja) | 露光方法及びデバイス製造方法 | |
| JP2006032807A (ja) | 露光装置及びデバイス製造方法 | |
| JPWO2005001913A1 (ja) | ステージ制御装置及び方法並びに露光装置及び方法 | |
| JP2006073798A (ja) | 位置決め装置及び露光装置 | |
| JP4120361B2 (ja) | 計測装置、ステージ装置、及び計測方法 | |
| JP2006120964A (ja) | 露光装置 | |
| HK1169177A (en) | Exposure method, exposure device, and device fabrication method | |
| JP2008160028A (ja) | 移動鏡の調整方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 2004524315 Country of ref document: JP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 1020057001001 Country of ref document: KR |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 11045161 Country of ref document: US |
|
| WWP | Wipo information: published in national office |
Ref document number: 1020057001001 Country of ref document: KR |
|
| 122 | Ep: pct application non-entry in european phase |