WO2003065442A1 - Structure d'agencement de dispositifs d'inspection - Google Patents

Structure d'agencement de dispositifs d'inspection Download PDF

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Publication number
WO2003065442A1
WO2003065442A1 PCT/JP2003/000844 JP0300844W WO03065442A1 WO 2003065442 A1 WO2003065442 A1 WO 2003065442A1 JP 0300844 W JP0300844 W JP 0300844W WO 03065442 A1 WO03065442 A1 WO 03065442A1
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WO
WIPO (PCT)
Prior art keywords
wafer
prober
rgv
inspection
cassette
Prior art date
Application number
PCT/JP2003/000844
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English (en)
Japanese (ja)
Inventor
Shuji Akiyama
Hiroki Hosaka
Original Assignee
Tokyo Electron Limited
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Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2003065442A1 publication Critical patent/WO2003065442A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

Definitions

  • an inspection device In an inspection process of an integrated circuit (hereinafter, referred to as “chip”) formed on a wafer-like substrate (hereinafter, simply referred to as “wafer”) used for manufacturing a semiconductor device, etc., an inspection device is used. The property is widely used.
  • this prober a plurality of devices are arranged at predetermined intervals, and wafer inspection is performed by each prober.
  • a probe usually has a loader chamber and a prober chamber, and inspects the electrical characteristics of a device formed on a wafer.
  • the loader chamber includes a cassette mounting section for mounting a cassette containing a plurality of (for example, 25) wafers, a wafer transfer mechanism for transferring wafers one by one from the cassette mounting section, and It has a alignment mechanism (hereinafter referred to as “sub chuck”) that performs alignment of wafers transferred through the wafer transfer mechanism.
  • the prober chamber cooperates with the mounting table (hereinafter, referred to as “main chuck”) that moves the wafer in X, ⁇ , ⁇ , and 0 directions on which the wafer is placed.
  • An alignment mechanism for aligning wafers by means of a wafer, a probe card placed above the main chuck, and a test head interposed between the probe card and the tester. Have. W
  • an operator places a cassette in which a plurality of wafers are stored (for example, in units of lots) on a cassette mounting portion of a loader room.
  • the prober is driven, and the wafer transport mechanism places wafers one by one from the cassette on the sub chuck.
  • the wafer is transferred to the main chuck in the prober chamber by the wafer transfer mechanism.
  • the wafer alignment is performed in cooperation with the main chuck and the alignment mechanism.
  • the electrical characteristics of the test object formed on the wafer are inspected. This inspection is performed by bringing the subject into electrical contact with the probe card.
  • the main index indexes the wafer, each time the electrical characteristics of each chip (or multiple chips) are inspected. By repeating this process, all the objects to be inspected are inspected. After the inspection of all the test objects is completed, the wafer is returned to the original position in the reproduction cassette by the wafer transfer mechanism. Similarly, the inspection of the next wafer is repeated as described above. When the inspection of all the wafers in the cassette is completed, the operator replaces the next cassette.
  • each prober In the inspection process, a plurality of probers are arranged, and each prober has an occupied area for maintenance work and the like. Therefore, there was a problem that the prober occupied a large area in the clean room and the space was insufficient. In addition, since a work area exists for each prober, even when performing maintenance work on adjacent inspection equipment, it is necessary to move to each work area and perform maintenance work, thereby improving work efficiency. Is evil There was a problem.
  • An object of the present invention is to solve at least one of the above problems.
  • an arrangement structure of an inspection apparatus capable of realizing a space saving of a clean room.
  • an arrangement structure of an inspection device capable of improving the operation efficiency of the operation or maintenance of the inspection device.
  • an inspection apparatus capable of correcting an object to be processed and reliably inspecting the object to be processed.
  • a system including a plurality of inspection devices.
  • a system based on the first aspect of the present invention includes the following (1) to
  • a plurality of inspection devices are arranged adjacent to each other, each of which has a side (opening / closing door of the device body) for operating the inspection devices, and each inspection device has an occupied area for maintenance work and the like. Provided Check out.
  • the above-mentioned system is provided with at least one common space and at least one pair of inspection devices arranged so as to sandwich the common space, and the inspection device has a side surface for operating the inspection device.
  • An inspection device arrangement structure having an operation side surface facing the common space.
  • the system includes an automatic transfer device, the inspection device includes a loader room, and the loader room is disposed to face the automatic transfer device.
  • the system has an automatic transfer device, the inspection device has a prober room, and the automatic transfer device has a function of directly loading a wafer into the prober room of the inspection device and a direct function from the prober room. It has a function to unload the wafer.
  • FIG. 1 is a configuration diagram showing an example of a wafer transport system provided with an inspection apparatus and an arrangement structure of the present invention.
  • FIG. 2 is a block diagram showing the configuration of the transport operation device in the system shown in FIG.
  • FIG. 3 is an explanatory diagram illustrating the lay-out of each component and its movement in the transport system shown in FIG.
  • FIG. 4 is a conceptual diagram showing a cross-sectional structure of the RGV transfer route shown in FIG.
  • FIG. 5A and 5B are views for explaining the transfer of a wafer between the prober and the RGB shown in FIG. 3, FIG. 5A is a plan view thereof, and FIG. 5B is a side view showing a main part thereof.
  • FIG. 6 is a view corresponding to FIG. 3 showing another example of the wafer transfer system.
  • FIG. 7 is a view corresponding to FIG. 5 showing a wafer transfer state using the wafer transfer system shown in FIG.
  • the present invention is applied to a system including a plurality of probe devices for inspecting electrical characteristics of a chip formed on a semiconductor wafer.
  • the present invention is applicable to a system for inspecting electrical characteristics of general electric equipment or electronic components and is not limited to the above-described probe device.
  • the inspection apparatus for example, a prober
  • the inspection apparatus is a single-wafer inspection apparatus that receives and inspects an object to be processed (for example, wafer) one by one.
  • a prober will be described as an example of this detection device.
  • the prober can receive wafers one by one from the wafer transfer system E shown in Figs. 1 and 3 and inspect them. Therefore, the wafer transport system E will be described first. This wafer transfer system As shown in FIG. 1 and FIG.
  • the host computer E (host computer 1 (MES)
  • MES Manufacturing Executions System
  • RUV rail guided vehicle
  • the host computer 1 is a computer with a built-in MES (Manufacturing Executions System) that manages the production of the entire semiconductor manufacturing plant including the inspection process of wafers (not shown). is there.
  • the prober 2 can be connected to the host computer 1 via SECS (Semiconductor Equipment Communication Standard) 1 line and is controlled by the host computer 1. Inspects the electrical characteristics of the wafer. Multiple probers 2 can be deployed.
  • the RGV 4 automatically transports wafers in cassettes, and can transfer wafers one by one according to the requirements of each prober 2.
  • a plurality of RGVs 4 can be provided, and can move in both directions according to the same orbit 3.
  • the transport operation device 5 can be connected to the host computer 1 via the SECS communication line, and can operate these RGVs 4 in cooperation with the host computer 1.
  • the transport operation device 5 is provided with an RCS (RGV Control System).
  • RCS RCS
  • Each component can be connected to a network via a communication line.
  • the moving area of the RGV 4 can be limited. Therefore, there is no need to provide an extra space in the moving area of the RGV 4 and space can be saved. it can.
  • the RGV 4 can be moved at a high speed.
  • the above-mentioned Proper 2 and RGV 4 are optically coupled parallel I / O (hereinafter, referred to as “PIO”) based on SEMI standards E 23 and E 84.
  • Communication interface (for example, 1 (Corresponding to 6-bit information processing). By performing PIO communication between the two, it is possible to accurately transfer wafers one by one.
  • the prober 2 is configured as a single-wafer type prober for receiving wafers one by one, that is, for individual wafers for inspection.
  • an RGV controller 6 can be connected to the transport operation device 5 via a SECS communication line. The RGV controller 6 can control the RGV 4 via wireless communication under the control of the transport operation device 5.
  • the interface and communication method of PIO communication can be configured, for example, according to the technology described in Japanese Patent Application Laid-Open No. 2002-217726.
  • the host computer 1 has a server and a controller (ES, Equipment Server, and Equipment Controller) 8 for managing and controlling the tester 7 connected to the prober 2. Can be connected via a communication line.
  • a stocker 9 that handles wafers in cassette units, a cassette transfer control device (MCS) 10 and its server 11 are connected to the host computer 1 via a SECS communication line.
  • the cassette transfer controller 10 includes an MCS (not shown) that manages and controls a lifter (not shown) and an overhead track traveling type vehicle (hereinafter, simply referred to as an “overhead transport vehicle”). Material Control System)) can be built. As shown in FIG.
  • the transport operation device 5 communicates with a user interface (hereinafter, referred to as a “user I / F”) 51 and the host computer 1.
  • the scheduler 54A can create an operation schedule for optimally operating a plurality of RGVs 4 and determine an optimal transport route.
  • the dispatcher 54B can allocate a plurality of RGVs 4 to the optimal transport route determined in the scheduler 54A.
  • the control unit 54 can manage commands such as a move command and a work command of the RGV 4.
  • the scheduler 54A and the dispatcher 54B function based on these commands.
  • Both the host I / F 52 and RGVI / F 53 can be configured as interfaces based on SEM1 standard E82.
  • the transfer operation device 5 has a simulation function, and can plan an optimal transfer path of the RGV 4 without actually moving the RGV 4.
  • the transfer information necessary for transfer such as the arrangement state and the number of arrangements of each of the prober 2 and RGV 4 is input from an input device (not shown), and the transfer operation device 5 is operated. Then, a command based on the transport information is input to the control unit 54 via the user I / F 51.
  • the control unit 54 cooperates with the host computer 1 and GYURA 54A automatically creates an RGV4 operation schedule according to the input command and searches for the optimal transport route. Thereafter, the disnotch notch 54B assigns each RGV 4 to a respective optimum transport path.
  • the RGV assignment is communicated to the RGV controller 6 via the RGVI / F53.
  • the wireless communication between the RGV controller 6 and the RGV 4 allows the RGV 4 to move along the optimal transport route.
  • FIG. 3 is a partially enlarged view of the object transfer system E shown in FIG. 1, and more specifically shows a portion directly related to the operation of the RGV 4.
  • the plurality of probers 2 can be arranged, for example, along two pairs of rails 3 which are arranged at intervals.
  • probers 2 can be arranged on both sides of each pair of rails 3, and in the area on the right side of the drawing, the probers 2 can be arranged only on one side of each pair of rails 3.
  • This rail may be a monorail. The optimal sequence of this prober can be adopted depending on the detection process.
  • a plurality of propellers can include a side surface 31 for operating the prober.
  • Probing arrangement in this system Can be provided with at least one common space (shaded area in Fig. 3) and at least one pair of propers 2 arranged across the common space.
  • the pair of propers can be arranged so that the operation side faces the common space.
  • the common space can be provided between the adjacently disposed propellers 2.
  • this common space is indicated by diagonal lines.
  • This shared space can be used as a work area OP for maintenance and operation of the prober 2.
  • the operator can perform maintenance on the prober 2 by opening the front door, and can also work on two adjacent probers 2 in the work area OP. For this reason, it is not necessary to move the work area when operating an adjacent prober, and the work efficiency can be improved.
  • Each prober may have an operation side 31 as an opening / closing door of the device body or a structure similar thereto, in which an operator or a machine performs operations such as maintenance and operation inside the prober.
  • the operation side surface 31 of the mouthpiece 2 used in the embodiment of the present invention can be provided on the side facing the work area OP.
  • the work of the two facing probers 2 can be performed from the work area OP. be able to.
  • a prober 2 having operation sides 31 on both sides of the prober 2 can be used.
  • Such a prober can be located on either side of the work area. Therefore, there is no need to prepare two types of probers, and the system configuration can be simplified.
  • the arrangement structure of the prober that can be operated from the work area OP is, for example, to arrange at least one pair of probers 2 whose components are configured in a mirror image relation with the work area OP interposed therebetween. You can also. With such a prober, you can work in almost the same way as operating the inside of two probers from the same direction. For example, when the operator performs maintenance, the operation for each prober can be performed in the same procedure, and erroneous operation can be prevented.
  • This work area OP can also be formed as a swirl area of a test head (not shown).
  • the stocker 9 has a mains force 91 for storing a large amount (for example, about 200) of cassettes C and an inspection with the propeller 2. Accordingly, it is composed of a minimum force 92 for storing a small amount (for example, about 20) of cassettes C taken out from the main force 91. Can be done. Both are communicated by the overhead track 12 and the cassette C is automatically transported between the miniature force 92 and the knife table 13 by the overhead transport. it can.
  • the main toe force 91 is located outside the arrangement area of the prober 2, and the minimum toe force 92 is disposed between the two pairs of rails 3. In Wear.
  • a buffer table 13 can be placed on the prono 2 side, and a cassette that is transported by an overhead transport vehicle can be temporarily placed. it can.
  • a card storage force 14 for storing a plurality of probe cards can be arranged.
  • the cassette C is configured so that it can be shared by wafers W having different diameters (for example, two types of 200 mm and 30 Omm).
  • a semiconductor manufacturing plant for example, several 10 propers 2 are arranged, and accordingly, two or more pairs of rails 3 can be provided. Accordingly, a plurality of stockers 9 can be arranged on each rail 3 according to the number of probers 2 installed.
  • a semiconductor manufacturing plant has a plurality of inspection contents, and the inspection contents may differ depending on the rail 3 line. In this case, after inspection of one line is completed, the wafer can be transported to the next line in cassette units by using a ceiling transport vehicle.
  • the RGV 4 travels in a clean air tunnel 15, so that the wafer transfer area is covered with a clean layer.
  • the clean air tunnel 15 includes a tunnel 151, an air filter 152 such as a ULPA filter provided on the ceiling of the tunnel 151, and a clean filter.
  • a circulation fan 153 for circulating the air in the air room into the tunnel 153 can be provided.
  • the inside of the tunnel 15 1 can be set so as to maintain the cleanliness of, for example, about class 10.
  • Tunnel 15 1 can be formed with a wafer transfer port 15 1 A between RGV 4 and PRO / C 2 You.
  • the probe force card can be transported to a predetermined prober by the RGV that transports the probe force, and can be replaced.
  • the RGV 4 is provided, for example, as shown in FIGS. 5A and 5B, at the RGV main body 41 and at the end on the RGV main body 41, and can accommodate 25 wafers W.
  • a buffer cassette 42 that can be tilted and driven, a turning mechanism 43 provided adjacent to the knocker cassette 42, and a two-stage structure with upper and lower parts provided in the turning mechanism 43, which can be bent and stretched.
  • Wafer transfer mechanism 44 with a flexible arm, a wafer matching sensor (not shown) attached to the wafer transfer mechanism 44, and a buffer cassette 42. And a protrusion preventing member (not shown) for preventing the protrusion.
  • the wafer transfer mechanism 44 has hands 44 1 and 42 attached to the tips of upper and lower arms, and is integrated with the turning mechanism 43 via a pole screw mechanism, for example, and moves up and down. Can be configured as possible.
  • the protrusion preventing member includes a stopper rod for engaging the groove formed in the opening of the buffer cassette 42 and a driving mechanism for engaging the stopper rod with the groove. You can have.
  • the groove at the opening of the buffer cassette can be provided, for example, at the center of the upper and lower frames.
  • the buffer cassette 42 of this RGV 4 is first The wafer W is received from the cassette C (see Fig. 3) placed in the table 13. At this time, the wafer transfer mechanism 44 repeatedly rotates and moves up and down. For example, the wafer W in the cassette C is transferred to the buffer cassette 42 using the upper node 44 1. Transport to The number of wafers may be any number up to the maximum capacity of the buffer cassette. For example, 25 wafers W can be transferred. Then, the RGV 4 moves to the predetermined position of the target propeller 2 along the rail 2 in a state where the wafer W is prevented from jumping out, and transfers the wafer W to the proper 2.
  • the lower node 4 42 unloads the inspected wafer W from the prober 2, and the upper hand 4 41 of the wafer transfer mechanism 44 is transferred from the buffer cassette 4 2 to the prober.
  • the inspected wafer unloaded from the prober 2 is loaded into the buffer cassette 42.
  • the buffer cassette is transported to a position before the cassette stored in the buffer table 13. Then, contrary to the above procedure, the wafer transfer mechanism 44 repeatedly rotates and moves up and down.
  • the upper hand 4 41 is used to adjust the inside of the knife cassette 42. Transfers wafer W into cassette C.
  • the prober 2 includes a loader room 21 and a prober room 22.
  • This loader room can be provided in the prober facing RGV4.
  • the loader chamber 21 has a transfer mechanism (hereinafter, referred to as an “adapter”) 23 for transferring one wafer W to and from the RGV 4 and a wafer between the adapter 23 and the propeller chamber 22.
  • Convey W When the wafer W is transferred to the prober chamber 22 by the wafer transfer mechanism 24 and the wafer transfer mechanism 24, the wafer is pre-aligned based on the orifice. It can be equipped with a positioning mechanism that can rotate in the reverse direction (hereinafter referred to as “sub chuck”) 25.
  • the sub chuck 25 detects an orifice by an orifice sensor (not shown) while rotating the wafer W, and performs alignment by using an optical character recognition device (not shown). OCR (not shown) reads the ID code attached to the wafer W to identify the wafer W to be inspected.
  • the wafer transfer mechanism 24 can have upper and lower two-handed hands 241, and the wafers W are held by vacuum suction by the respective hands 241, or by releasing the vacuum suction. Wafer W can be released.
  • the prober chamber 22 has a main mechanism 26, an alignment mechanism 27, and a probe card 28, which will be described later.
  • the main chuck 26 can move in the X and Y directions via the X and Y tables 29 and can move in the Z and 0 directions via a lifting mechanism and a 0 rotation mechanism (not shown).
  • the alignment mechanism 27 includes, for example, an alignment bridge 271, a CCD camera 272, and a pair of guide rails 273 as conventionally known.
  • the wafer W can be aligned with the probe card 28 in cooperation with the chuck 26.
  • the probe card 28 can have a plurality of probes 281, which can be formed on the wafer W on the S main chuck 26. It is in electrical contact with the formed test object and can be connected to a tester 7 (see FIG. 1) via a test head (not shown).
  • the shared space therebetween is set to the work area OP of the two probers. It can be done. Furthermore, the components of the two probers 2 facing each other (adapter 23, sub chuck 25, main chuck 26, test head, opening / closing door of the main unit, etc.) are mirror images of each other. In addition to establishing a relationship, a shared work area OP can be provided between these two probers 2. With such a configuration, the installation space for the prober can be significantly reduced as compared with the case where a work area is conventionally provided in each of the probers 2. In addition, the maintenance efficiency of the adjacent propeller 2 can be performed in one work area OP, so that work efficiency is improved. In addition, the swiveling space of the test head can be shared by the adjacent probers 2, so that the installation space can be reduced and the maintenance workability can be improved.
  • FIG. 6 shows a second embodiment of the present invention.
  • the automatic transfer device (RGV) 4 provided in the above system can directly load and unload a wafer into and from the prober chamber of the prober.
  • RGV 4 performs wafer loader and unloader functions be able to.
  • the loader chamber of the prober 2 shown in FIGS. 3 and 5A can be omitted as shown in FIG.
  • the loader and unloader functions of the transfer system prober can be deleted. With such a configuration, equipment costs can be reduced.
  • the same parts or corresponding parts as in the first embodiment will be described with the same reference numerals.
  • the transfer system E of the second embodiment is configured according to the first embodiment except that the RGV 4 has a loader and an unloader function as shown in FIG.
  • the two adjacent projectors 2 can be provided with components such as the main components 26 therein in a mirror image relationship, for example. Also, a common work area OP can be provided between the two probers.
  • the RGV 4 includes an RGV main body 41, a buffer cassette 42, a turning mechanism 43, a wafer transfer mechanism 44, and a posture adjusting mechanism 45. it can.
  • the knocker cassette 42 can be provided at the end on the RGV body 41 so as to be capable of being tilted and driven, and can accommodate, for example, 25 wafers W.
  • the turning mechanism 43 is arranged adjacent to the buffer cassette 42.
  • the wafer transport mechanism 44 is provided in the revolving mechanism 43 and has telescopic arms 441 and 442.
  • the posture adjusting mechanism 45 can be arranged adjacent to the wafer transfer mechanism 44.
  • the RGV 4 is under the control of the RGV controller 6, and directly transfers the wafer 26 and the wafer W of the propper 2 by the wafer transfer mechanism 44.
  • This RGV 4 uses the attitude adjustment mechanism 45. Except for this, the configuration is the same as that of the first embodiment.
  • the RGV 4 of the second embodiment can be configured according to the technology described in Japanese Patent Application Laid-Open No. 2002-313879. Accordingly, the details of the example of RGV4 are as described in the specification of Japanese Patent Application Laid-Open No. 2002-313879, and the outline thereof will be described below.
  • the attitude adjusting mechanism 45 includes a sub-checker 451 on which the wafer W is placed, and a plurality (two in FIG. 7) of offset sensors 452A for detecting the orifice of the wafer W. 452B and an OCR 453 for reading an ID symbol attached to each wafer W can be provided.
  • the sub chuck 45 1 is configured to be able to rotate forward and backward.
  • Each of the orientation sensors 452A and 4552B can detect orientation flats of wafers having different diameters when the sub chuck 451 rotates forward and backward.
  • a mating sensor (not shown) composed of a photoelectric sensor is attached to the wafer transfer mechanism 44, and the wafer W in the buffer cassette 42 is moved when the wafer transfer mechanism 44 moves up and down. Can be mapped.
  • the RGV 4 first maps the wafer W in the buffer force set 42 by the wafer transfer mechanism 44. Thereafter, the wafer W is loaded from the cassette C to the empty shelf of the buffer cassette 42 on the buffer table 13 provided for the storage force 9. The RGV 4 tilts the buffer cassette 42 after the transfer of the wafer W is completed. Then, the RGV 4 is transported by the transport operation device 5 to the target propeller 2 according to the transport route of the assigned rail 3.
  • the wafer The transfer mechanism 44 takes out the wafer W in the buffer cassette 42 with the upper hand 44 1. Thereafter, the wafer transfer mechanism 44 is rotated by 180 degrees by the rotation mechanism 43, the hand 44 is extended, and the wafer W is inserted into the posture alignment mechanism 45, and the sub chuck 45 1 Place on top.
  • the sub chuck 45 1 can fix the wafer W by suction.
  • the orificer sensors 45A and 45B detect the rotation trajectories of the wafer W and the orificer, respectively, while the sub chuck 451 rotates.
  • the RGV controller 6 obtains a deviation between the center of the wafer W and the center of the sub chuck 451, based on the rotation trajectories of the wafer W and the orientation flat.
  • the wafer transfer mechanism 44 corrects the deviation, and the wafer W is centered on the sub chuck 45 1.
  • the sub-chamber 451 rotates and reads the OCR 453 power SID code.
  • the orifice of the wafer W is directed in a predetermined direction.
  • the information read by the OCR 453 is notified to the transport operation device 5 via the RGV controller 6 by wireless communication.
  • the transport operation device 5 notifies the host computer 1 and the tester 7 of this information via the communication line.
  • the wafer transfer mechanism 44 is moved to the sub chuck 45 1 by the upper hand 4 41. Wafer W is pulled out from the alignment mechanism 45.
  • the upper hand 4 41 holding the wafer is rotated 90 degrees by the turning mechanism 43 and moved up and down by the elevating mechanism.
  • the upper hand 44 1 enters the propper 2, and places the wafer W on the main chuck 26. Arm with wafer released 4 4 1 leaves Propeller 2 internal force.
  • the main chuck 26 securely sucks and fixes the wafer W by a suction mechanism (not shown).
  • the RGV 4 When the RGV 4 receives the wafer W after the inspection from two probers, it uses the hand 4 42 below the wafer transfer mechanism 44.
  • the RGV 4 receives the wafer W from the main chuck 26 force of the prober 2 by the hand 4 42 below the wafer transfer mechanism 44.
  • the lower hand 4 42 stores the received wafers in the knocker cassette 4 2.
  • the wafer can be stored at a location within the buffer cassette 42 where the wafer was located prior to inspection. After collecting the inspected wafer, the next wafer W can be placed on the main chuck 26 by the upper hand 441, as described above.
  • the present invention is not limited to the above-described embodiment at all, and the design can be appropriately changed as needed.
  • the vacuum line is used as the main chuck suction mechanism, but an ejector may be used instead of the vacuum line.
  • the object to be processed is not limited to a wafer, but may be a substrate for a liquid crystal display.
  • a prober is arranged adjacently, a common space is provided therebetween, and the operation side of each prober is arranged facing the common space, so that a clean room can be saved. It is possible to provide a layout structure of the inspection apparatus which can realize the simplification and can improve the work efficiency such as maintenance. Further, according to the embodiment of the present invention, since the components of the prober facing each other across the common space are provided in a mirror image relationship with each other, the work procedure can be simplified and operation failure can be prevented. .
  • the configuration in which the RGV of the system has a function of directly loading a wafer into the prober chamber and a function of directly transporting the wafer from the prober chamber can be omitted. This makes the system simpler.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

La présente invention concerne une structure d'agencement de dispositifs d'inspection dans un système comportant une pluralité de dispositifs d'inspection (2), dans laquelle un espace commun (OP) est prévu entre les dispositifs d'inspection disposés de manière à être en regard les uns des autres, et des faces latérales (31) pour le fonctionnement des dispositifs d'inspection prévues sur la pluralité de dispositifs d'inspection sont disposées de manière à être tournées vers l'espace commun, grâce à quoi on peut réduire l'encombrement dans une salle blanche, et accroître l'efficacité des opérations telles que l'entretien.
PCT/JP2003/000844 2002-01-29 2003-01-29 Structure d'agencement de dispositifs d'inspection WO2003065442A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-20716 2002-01-29
JP2002020716A JP4104111B2 (ja) 2002-01-29 2002-01-29 被処理体の載置台及び被処理体の吸着方法

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US7202687B2 (en) * 2004-04-08 2007-04-10 Formfactor, Inc. Systems and methods for wireless semiconductor device testing
JP2007048828A (ja) * 2005-08-08 2007-02-22 Murata Mfg Co Ltd 板状体の変形処理装置及び該板状体の変形処理方法
JP4655272B2 (ja) * 2005-08-19 2011-03-23 株式会社安川電機 基板吸着装置とそれを用いた基板搬送装置
JP6086777B2 (ja) * 2013-03-25 2017-03-01 オリンパス株式会社 基板検査装置及び基板受け渡し方法
CN105765708B (zh) * 2013-09-26 2018-08-31 苏斯微技术光刻有限公司 用于吸取和保持晶片的卡盘
JP7471106B2 (ja) * 2020-02-28 2024-04-19 東京エレクトロン株式会社 部品運搬装置
JP7378318B2 (ja) 2020-02-28 2023-11-13 東京エレクトロン株式会社 部品交換方法

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US4789294A (en) * 1985-08-30 1988-12-06 Canon Kabushiki Kaisha Wafer handling apparatus and method
JPH10150064A (ja) * 1996-11-20 1998-06-02 Toshiba Mechatronics Kk 半導体樹脂封止装置及びその装置の設置方法、並びに設置システム

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US4789294A (en) * 1985-08-30 1988-12-06 Canon Kabushiki Kaisha Wafer handling apparatus and method
JPH10150064A (ja) * 1996-11-20 1998-06-02 Toshiba Mechatronics Kk 半導体樹脂封止装置及びその装置の設置方法、並びに設置システム

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