WO2003028415A1 - Bauelementanordnung - Google Patents
Bauelementanordnung Download PDFInfo
- Publication number
- WO2003028415A1 WO2003028415A1 PCT/DE2002/002966 DE0202966W WO03028415A1 WO 2003028415 A1 WO2003028415 A1 WO 2003028415A1 DE 0202966 W DE0202966 W DE 0202966W WO 03028415 A1 WO03028415 A1 WO 03028415A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- auxiliary
- component
- printed circuit
- arrangement according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Definitions
- the invention relates to a component arrangement with an electrical component and a printed circuit board.
- Component arrangements of the type mentioned at the outset are known in which the electrical component is attached to the top of the printed circuit board.
- Such component arrangements are used, among other things, in mobile telephones.
- microwave ceramic filters in the form of duplexers come into consideration as electrical components.
- the known component arrangements have the disadvantage that the structural height of the component arrangement cannot easily be reduced due to the protrusion of the component on the upper side of the printed circuit board, as would be desirable in the course of the progressive miniaturization in the mobile radio sector.
- a reduction in the component protrusion of the component arrangement could be achieved by reducing the height of the electrical component.
- a reduction in the component height requires considerable development effort, which delays the production of marketable products, which is not desirable.
- the reduction in the component height in most cases means a deterioration in the electrical properties of the electrical component, in particular if microwave ceramic filters are used as the electrical component, which is likewise undesirable.
- the electrical properties of the electrical components are sensitive to changes in the geometry.
- the aim of the present invention is therefore to provide a component arrangement of the type mentioned, in which the Component protrusion on one side of the circuit board is reduced.
- the invention specifies a component arrangement which has a printed circuit board with an upper and a lower side.
- the circuit board also has a recess in which an electrical component is sunk.
- the electrical component is fastened on an auxiliary printed circuit board which is fastened on the printed circuit board.
- the auxiliary circuit board can be fastened on the underside of the circuit board.
- one or more spacer elements can be arranged between the auxiliary printed circuit board and the printed circuit board, which define the distance between the auxiliary printed circuit board and the printed circuit board and thus the degree of sinking of the component into the recess.
- Possible spacing elements are, for example, an annular element in which the component lies, or advantageously a plurality of shaped pieces made of solder, miniature printed circuit boards or also metallized ceramic bodies.
- Moldings made of solder have the advantage that when choosing a suitable metal alloy for the solder for an economically feasible soldering process according to the so-called "Reflow process" can be made suitable. Furthermore, fittings made of solder also have the advantage that they, either applied to the auxiliary printed circuit board or to the printed circuit board, are suitable for equipping the printed circuit board with the auxiliary printed circuit board in accordance with the surface mounting technique, with connection elements penetrating the printed circuit board being dispensed with.
- the circuit board can be equipped with the auxiliary circuit board using an auxiliary circuit board on which the electrical component is already attached.
- Miniature circuit boards with a dimension of, for example, l x l mm or metallized ceramic bodies have the advantage that the distance to be set between the auxiliary circuit board and the circuit board can be precisely defined from the outset by standardized elements that are accessible to mass production.
- ceramic components come into consideration which correspond, for example, to the common geometries (designs) 0603 or 0805.
- the invention can be carried out in such a way that the spacer elements mediate the electrical contact between connections of the component and the associated connection surfaces of the printed circuit board.
- the auxiliary printed circuit board has first connection surfaces which are in contact with connections of the component.
- the auxiliary circuit board has second connection surfaces which are in contact with connection surfaces of the circuit board. The first connection surfaces of the auxiliary circuit board are contacted with their second connection surfaces, for example by means of conductor tracks, in such a way that the connections of the component are electrically conductively connected to the associated connection surfaces of the circuit board.
- the second pads of the auxiliary circuit board coincide with the pads of the circuit board, so that the Electrical contact between the auxiliary circuit board and the circuit board can be realized by simply interposing at least on its surface electrically conductive contact elements.
- the electrical component only takes up a fraction of the area of the circuit board in most cases, one plate is sufficient for the auxiliary circuit board, the area of which is considerably smaller than the area of the circuit board.
- the thickness of the printed circuit board can also be made thinner with sufficient stability.
- the overall height of the component arrangement according to the invention can also be reduced in an advantageous manner. It is therefore advantageous if the auxiliary circuit board is thinner than the circuit board.
- further electrical components are arranged on the top and on the bottom of the circuit board.
- Such double-sided printed circuit boards are often used in the mobile radio sector.
- the component arrangement according to the invention can be used particularly advantageously here, since space is anyway required on the back of the printed circuit board for the further components located thereon, and the electrical component lowered on the front of the printed circuit board and thus on the back of the printed circuit board does not interfere any further. It is only necessary to keep the area of the recess on the back of the circuit board and the area which is necessary for fastening the auxiliary circuit board on the back of the circuit board free of further components. In this case, the overall height of the component arrangement as a whole can be reduced not only on one side of the printed circuit board by means of the invention.
- the auxiliary circuit board completely covers the recess in the circuit board and also has a supernatant.
- the electrical component hangs on the underside of the auxiliary printed circuit board, which in turn is held by the printed circuit board.
- the spacer elements can be arranged particularly advantageously between the protrusion of the auxiliary circuit board and an edge section of the circuit board, which is located on the side of the recess in the circuit board.
- the electrical component is fastened to the auxiliary circuit board by means of a solder which remains dimensionally stable at the temperatures of the reflow process to be used. This can prevent the electrical component from falling off the auxiliary circuit board when the auxiliary circuit board is soldered onto the circuit board.
- Fastening the electrical component by means of a solder on the auxiliary circuit board also has the advantage that both the mechanical fastening of the electrical component and the contacting of the connections of the component with the first connection surfaces of the auxiliary circuit board can take place in one step.
- a flexible circuit board can also be used as the circuit board. Steps can be formed in a flexible printed circuit board which make the use of spacers unnecessary when the flexible printed circuit board is mounted on the printed circuit board.
- the second connection areas of the auxiliary circuit board are connected directly to the connection areas of the circuit board. By means of the steps, the component protrusion of the electrical component over the printed circuit board can be adjusted by the height of the step.
- a flexible auxiliary circuit board therefore has the advantage that spacer elements can be dispensed with, which simplifies the construction of the component arrangement according to the invention.
- the flexibility of the auxiliary circuit board When selecting the flexibility of the auxiliary circuit board, care must be taken that the flexibility, that is, the elasticity of the circuit board, is sufficient to be able to deform it. Furthermore, the auxiliary printed circuit board must have sufficient strength that the molded-in steps are essentially retained and are not reduced too much in height by the weight of the component.
- the auxiliary circuit board can also be attached to the top of the circuit board.
- auxiliary circuit board has the shape of a U in cross section. Furthermore, the auxiliary circuit board has outward-pointing holding sections which are fastened to the circuit board.
- an electrically conductive shield can be arranged on the side of the component opposite the auxiliary printed circuit board.
- Such shielding can perform various functions. It can combine a component consisting of several partial components to form a mechanically stable whole. Furthermore, such a shield can serve for the electrical shielding of the component.
- the component mass is usually connected to the system ground located on the printed circuit board by means of the shielding.
- the shield covers the surface of the component at least partially flat.
- the shielding can be designed with an increased stiffness compared to the flexible printed circuit board, and can also be attached to the component and the printed circuit board in such a way that the component overhang of the component above the printed circuit board can be adjusted by means of the shielding. If necessary, the auxiliary printed circuit board is deformed by fastening the shielding, which is rigid relative to the auxiliary printed circuit board.
- a metallic sheet can be used as shielding.
- FIG. 1 shows an example of a component arrangement according to the invention shown upside down in a schematic cross section.
- Figure 2 shows the auxiliary circuit board of Figure 1 in plan view.
- FIG. 3 shows an example of another invention
- FIG. 4 shows an example of another invention
- FIG. 5 shows a top view of the second of the variants shown in FIG. 4.
- FIG. 1 shows a component arrangement with a printed circuit board 1 which has a recess 4.
- the circuit board 1 also has an upper side 2 and an underside 3.
- the recess 4 is dimensioned so that the electrical
- the electrical component 5 finds space in it.
- the electrical component 5 can be, for example, a microwave ceramic duplexer that can be used as a filter for PCS-CDMA. Filters of this type are used in particular in mobile radio applications.
- the aim of the invention is to reduce the protrusion U of the electrical component 5 on the upper side 2 of the printed circuit board 1.
- Connections 81, 82 are arranged on the upper side of the component 5, which can be, for example, metallized surfaces of a ceramic filter. These connections 81, 82 of the electrical component 5 are soldered to the first connection surfaces 72, 73 of an auxiliary printed circuit board 6 lying directly above them.
- the soldering is carried out by means of solder 14.
- the solder 14 can be a relatively temperature-stable solder, for example with a composition of tin and silver, which has a tin content of 96%. Such a solder melts above 230 ° C, which represents the short-term peak temperature for a normal reflow soldering process. This reflow soldering process can be used in the subsequent assembly of the auxiliary circuit board 6 on the circuit board 1.
- the high-melting solder 14 prevents the electrical component 5 from falling off the auxiliary circuit board 6.
- connection surfaces 72, 73 of the auxiliary circuit board 6 are electrically conductively connected to second connection surfaces 92, 93 of the auxiliary circuit board 6 by means of suitable conductor tracks (cf. FIG. 2).
- second connection surfaces 92, 93 of the auxiliary printed circuit board 6 lie directly over corresponding connection surfaces 101, 102 of the printed circuit board 1, with which they tels fittings made of solder, which act as spacers 70, are contacted.
- the height h of the spacer elements 70 determines the component protrusion U.
- the thickness d of the auxiliary printed circuit board 6 can be significantly smaller than the thickness D of the printed circuit board 1, since the auxiliary printed circuit board 6 has a substantially smaller area and thus a reduced printed circuit board thickness with a lower stability is sufficient.
- an auxiliary printed circuit board 6 provided with an electrical component 5 can be placed from above on the underside 3 of the printed circuit board 1, the spacer elements 70 being designed as shaped pieces made of solder. Then you can
- the electrical component 5 is arranged on the same side of the auxiliary circuit board 6 as the spacer elements 70.
- the auxiliary printed circuit board 6 completely covers the recess 4 and also has an overhang 12 which lies over an edge section 13 of the printed circuit board 1, which is located on the recess side of the printed circuit board 1.
- One or more spacer elements 70 can be arranged in a simple manner between the projection 12 and the edge section 13.
- the auxiliary circuit board 6 has first pads 71, 72, 73, 74, which are used in the case of a duplexer as connector 71 for the antenna, connector 72 for the receive channel, connector 73 for the transmit channel and finally connector 74 for the Dimensions.
- the first connection surfaces 71, 72, 73 of the auxiliary printed circuit board 6 are electrically separated from the ground connection 74 by metal-free surfaces 15.
- second connection surfaces 94 are provided on the auxiliary printed circuit board 6, on which the spacer elements 70 are placed.
- second contact surfaces 91, 92, 93 are provided for contacting the first connection surfaces 71, 72, 73 and are electrically contacted with the first connection surfaces 71, 72, 73.
- FIG. 3 shows a further component arrangement according to the invention, in which the auxiliary circuit board 6 is a flexible circuit board. Steps 16 are formed in the flexible printed circuit board, which define the component protrusion U of the component 5 above the printed circuit board 1. The component 5 is attached to the auxiliary circuit board 6 by means of solder 14.
- the steps 16 formed in the flexible auxiliary printed circuit board 6 make it possible to dispense with the spacer elements shown in FIG. 1, as a result of which the structure of the component arrangement can be simplified.
- the auxiliary printed circuit board 6 has a projection 12, with the aid of which the auxiliary printed circuit board 6 is fastened on the underside of the printed circuit board 1.
- a shield 18 is arranged on the side of the component 5 opposite the auxiliary printed circuit board 6.
- This shielding 18 can be, for example, a metal conductive sheet.
- a nickel silver sheet with a thickness of 0.15 mm can be considered.
- the shield 18 can be soldered to the component 5.
- the component 5 can also consist of several sub-components, which are then individually soldered to the shield 18 or fastened to the shield 18. As a result, the sub-components are held together and form the component 5.
- the shielding 18 has the function of shielding the electrical component 5.
- the shielding 18 can be used to connect the component mass to the system ground.
- the system mass is located on the printed circuit board 1.
- the flexible printed circuit board 6 can be made, for example, based on polyimide material with a thickness of 0.2 mm.
- the shielding 18 can be connected to a corresponding ground connection on the auxiliary circuit board 6 by means of a connecting wire 19 or a shape of the sheet 18 corresponding to the wire 19.
- reference numerals corresponding to FIG. 1 show elements corresponding to FIG. 1.
- FIG. 4 shows a further embodiment of the component arrangement according to the invention.
- the component 5 is sunk again in a recess 4 of the circuit board 1.
- the auxiliary printed circuit board 6 is designed as a flexible printed circuit board which is shaped in such a way that it has the shape of a trough, the trough having outwardly facing holding sections 17 which are fastened to the printed circuit board 1.
- the auxiliary printed circuit board 6 is a two-sided printed circuit board in which the first connection surfaces of the auxiliary printed circuit board 6, which serve for fastening and for contacting connections of the component 5, on a side of the auxiliary printed circuit board 6 opposite the second connection surfaces of the auxiliary printed circuit board 6 are arranged.
- the second connection surfaces of the auxiliary printed circuit board 6 serve to connect the auxiliary printed circuit board 6 to corresponding connections or connection surfaces of the printed circuit board 1 and they also serve to wire the component 5 to corresponding connections of the printed circuit board 1.
- the auxiliary printed circuit board 6 can be, for example, a two-sided printed circuit board based on polyimide.
- the through-plating through the polyimide material from top to bottom can be realized, for example, by riveting.
- a shielding 18 is arranged on the top of the component 5, which in the first variant has the shape of an angled sheet, the leg of the shielding 18 projecting downwards being soldered to the auxiliary circuit board 6 by means of solder 14.
- the shield 18 can be fastened to the component 5 as well as to the printed circuit board 1.
- the component projection U of the component 5 above the printed circuit board 1 is defined by the shielding 18 which is rigid relative to the auxiliary printed circuit board 6. At least parts of the shield 18 must protrude beyond the recess 4 for this purpose. This is done, as can be seen from FIG. 5, by providing the shielding 18 with projections 20 which are fastened on connection surfaces 101 of the printed circuit board 1.
- the mentioned connection surfaces 101 serve to connect the shield 18 to the system ground.
- FIG. 5 shows a plan view of the second variant of FIG. 4.
- the auxiliary circuit board 6 is shaped in such a way that the holding sections 17 have a reduced width, so that there is space for fastening at an edge section of the circuit board 1 directly adjacent to the recess 4 the extensions 20 of the shield 18 remains.
- shielding 18 Another function of the shielding 18 is a mechanical stabilization of the auxiliary printed circuit board 6, since the relatively rigid shielding 18, which can be a metal sheet, for example, provides mechanical stability by fastening the shielding 18 on the one hand on the electrical component 5 and on the other hand on the printed circuit board 1 the mechanical stability of the component arrangement is additionally increased.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02769870A EP1421834A1 (de) | 2001-08-31 | 2002-08-13 | Bauelementanordnung |
JP2003531775A JP2005504443A (ja) | 2001-08-31 | 2002-08-13 | 構成要素装置 |
US10/487,401 US20040203260A1 (en) | 2001-08-31 | 2002-08-13 | Component arrangement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10142655A DE10142655A1 (de) | 2001-08-31 | 2001-08-31 | Bauelementanordnung |
DE10142655.0 | 2001-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003028415A1 true WO2003028415A1 (de) | 2003-04-03 |
Family
ID=7697226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/002966 WO2003028415A1 (de) | 2001-08-31 | 2002-08-13 | Bauelementanordnung |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040203260A1 (de) |
EP (1) | EP1421834A1 (de) |
JP (1) | JP2005504443A (de) |
CN (1) | CN1550123A (de) |
DE (1) | DE10142655A1 (de) |
TW (1) | TW561798B (de) |
WO (1) | WO2003028415A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2008058782A1 (de) * | 2006-11-13 | 2008-05-22 | Robert Bosch Gmbh | Elektronische schaltungsanordnung mit mindestens einer flexiblen gedruckten schaltung und verfahren zu deren verbindung mit einer zweiten schaltung |
WO2012103969A1 (de) * | 2011-01-31 | 2012-08-09 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7171237B2 (en) * | 2001-05-31 | 2007-01-30 | Cts Corporation | Modular transceiver-modem with reduced profile antenna duplexer |
DE102006021023A1 (de) * | 2006-04-28 | 2007-10-31 | Würth Elektronik Rot am See GmbH & Co. KG | Baugruppenaufbau |
JP4850624B2 (ja) * | 2006-08-21 | 2012-01-11 | 京セラ株式会社 | 電子機器 |
JP2008067173A (ja) * | 2006-09-08 | 2008-03-21 | Yamaha Corp | マイクロフォンモジュール、その取付構造及び携帯電子機器 |
US7965520B2 (en) | 2007-01-22 | 2011-06-21 | Sony Ericsson Mobile Communications Ab | Electronic device with flip module having low height |
JP4609435B2 (ja) * | 2007-01-30 | 2011-01-12 | パナソニック株式会社 | 部品内蔵基板と、これを用いた電子機器、ならびにこれらに用いる製造方法 |
DE102007006462A1 (de) * | 2007-02-05 | 2008-08-14 | Siemens Ag | Elektronische Schaltungsanordnung mit einer ersten und zweiten Leiterplatte |
CN101803476A (zh) * | 2007-09-21 | 2010-08-11 | 松下电器产业株式会社 | 立体印刷布线板及其制造方法以及电子部件模块 |
JP5454681B2 (ja) * | 2010-05-26 | 2014-03-26 | 株式会社村田製作所 | モジュール基板およびその製造方法 |
US20120170230A1 (en) * | 2010-12-30 | 2012-07-05 | Research In Motion Limited | Combining printed circuit boards |
EP2473012A1 (de) * | 2010-12-30 | 2012-07-04 | Research In Motion Limited | Kombination von Leiterplatten |
CN102956574A (zh) * | 2011-08-25 | 2013-03-06 | 力成科技股份有限公司 | 小基板存储卡封装构造 |
US20130203274A1 (en) * | 2012-02-08 | 2013-08-08 | Harman Becker Automotive Systems Gmbh | Circuit board system |
EP2627160A1 (de) * | 2012-02-08 | 2013-08-14 | Harman Becker Automotive Systems GmbH | Leiterplattensystem |
CN104254202B (zh) * | 2013-06-28 | 2017-08-22 | 鹏鼎控股(深圳)股份有限公司 | 具有内埋电子元件的电路板及其制作方法 |
CN108513432B (zh) * | 2017-02-24 | 2021-06-29 | 泰连公司 | 电子元件组件和其组装方法 |
CN107257514B (zh) * | 2017-07-20 | 2024-01-05 | Oppo广东移动通信有限公司 | 麦克风组件和电子设备 |
CN109121293B (zh) * | 2018-09-30 | 2020-05-15 | 西安易朴通讯技术有限公司 | 印刷电路板组件及电子设备 |
CN112638030B (zh) * | 2020-12-30 | 2022-03-25 | 株洲菲斯罗克光电科技股份有限公司 | 模块电路板的制备方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
JPH06334298A (ja) * | 1993-05-27 | 1994-12-02 | Fujitsu Ltd | 表面実装部品の搭載構造 |
DE19535705A1 (de) * | 1995-09-26 | 1997-03-27 | Bosch Gmbh Robert | Doppelt kaschierte Leiterplatte mit mehreren Anschlußflächen |
JPH10321109A (ja) * | 1997-05-20 | 1998-12-04 | Harness Sogo Gijutsu Kenkyusho:Kk | リレーの実装構造 |
DE19816794A1 (de) * | 1998-04-16 | 1999-10-21 | Bosch Gmbh Robert | Leiterplattenverbund |
US5973932A (en) * | 1997-02-14 | 1999-10-26 | Pulse Engineering, Inc. | Soldered component bonding in a printed circuit assembly |
US6154371A (en) * | 1998-09-30 | 2000-11-28 | Cisco Technology, Inc. | Printed circuit board assembly and method |
EP1093326A2 (de) * | 1999-10-15 | 2001-04-18 | Japan Aviation Electronics Industry, Limited | Leiterplattenmodul |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH597638B5 (de) * | 1976-04-22 | 1978-04-14 | Hasler Ag | |
JPH02304958A (ja) * | 1989-05-19 | 1990-12-18 | Hitachi Ltd | 電子回路装置 |
FR2656494B1 (fr) * | 1989-12-21 | 1992-04-30 | Telemecanique | Dispositif de blindage et d'isolation d'une carte de circuit electronique. |
DE4237632A1 (de) * | 1992-11-07 | 1994-05-11 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5412538A (en) * | 1993-07-19 | 1995-05-02 | Cordata, Inc. | Space-saving memory module |
US5608262A (en) * | 1995-02-24 | 1997-03-04 | Lucent Technologies Inc. | Packaging multi-chip modules without wire-bond interconnection |
DE19701163C2 (de) * | 1997-01-15 | 2001-12-06 | Siemens Ag | Elektrische Schaltung insbesondere für eine Chipkarte |
JP4497683B2 (ja) * | 2000-09-11 | 2010-07-07 | ローム株式会社 | 集積回路装置 |
-
2001
- 2001-08-31 DE DE10142655A patent/DE10142655A1/de not_active Ceased
-
2002
- 2002-08-13 JP JP2003531775A patent/JP2005504443A/ja not_active Withdrawn
- 2002-08-13 EP EP02769870A patent/EP1421834A1/de not_active Withdrawn
- 2002-08-13 US US10/487,401 patent/US20040203260A1/en not_active Abandoned
- 2002-08-13 CN CNA028169131A patent/CN1550123A/zh active Pending
- 2002-08-13 WO PCT/DE2002/002966 patent/WO2003028415A1/de not_active Application Discontinuation
- 2002-08-21 TW TW091118889A patent/TW561798B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
JPH06334298A (ja) * | 1993-05-27 | 1994-12-02 | Fujitsu Ltd | 表面実装部品の搭載構造 |
DE19535705A1 (de) * | 1995-09-26 | 1997-03-27 | Bosch Gmbh Robert | Doppelt kaschierte Leiterplatte mit mehreren Anschlußflächen |
US5973932A (en) * | 1997-02-14 | 1999-10-26 | Pulse Engineering, Inc. | Soldered component bonding in a printed circuit assembly |
JPH10321109A (ja) * | 1997-05-20 | 1998-12-04 | Harness Sogo Gijutsu Kenkyusho:Kk | リレーの実装構造 |
DE19816794A1 (de) * | 1998-04-16 | 1999-10-21 | Bosch Gmbh Robert | Leiterplattenverbund |
US6154371A (en) * | 1998-09-30 | 2000-11-28 | Cisco Technology, Inc. | Printed circuit board assembly and method |
EP1093326A2 (de) * | 1999-10-15 | 2001-04-18 | Japan Aviation Electronics Industry, Limited | Leiterplattenmodul |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 03 28 April 1995 (1995-04-28) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008058782A1 (de) * | 2006-11-13 | 2008-05-22 | Robert Bosch Gmbh | Elektronische schaltungsanordnung mit mindestens einer flexiblen gedruckten schaltung und verfahren zu deren verbindung mit einer zweiten schaltung |
WO2012103969A1 (de) * | 2011-01-31 | 2012-08-09 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
Also Published As
Publication number | Publication date |
---|---|
CN1550123A (zh) | 2004-11-24 |
JP2005504443A (ja) | 2005-02-10 |
DE10142655A1 (de) | 2003-04-03 |
EP1421834A1 (de) | 2004-05-26 |
TW561798B (en) | 2003-11-11 |
US20040203260A1 (en) | 2004-10-14 |
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