WO2002081142A1 - Procede d'usinage de materiau translucide par faisceau laser et materiau translucide usine - Google Patents

Procede d'usinage de materiau translucide par faisceau laser et materiau translucide usine Download PDF

Info

Publication number
WO2002081142A1
WO2002081142A1 PCT/JP2002/003302 JP0203302W WO02081142A1 WO 2002081142 A1 WO2002081142 A1 WO 2002081142A1 JP 0203302 W JP0203302 W JP 0203302W WO 02081142 A1 WO02081142 A1 WO 02081142A1
Authority
WO
WIPO (PCT)
Prior art keywords
translucent material
hole
laser beam
light
absorbing layer
Prior art date
Application number
PCT/JP2002/003302
Other languages
English (en)
French (fr)
Inventor
Jun Wang
Original Assignee
Taiyo Yuden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co., Ltd. filed Critical Taiyo Yuden Co., Ltd.
Priority to JP2002579165A priority Critical patent/JPWO2002081142A1/ja
Priority to US10/415,148 priority patent/US20040013951A1/en
Publication of WO2002081142A1 publication Critical patent/WO2002081142A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/006—Re-forming shaped glass by fusing, e.g. for flame sealing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/0086—Heating devices specially adapted for re-forming shaped glass articles in general, e.g. burners
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2002/003302 2001-04-02 2002-04-02 Procede d'usinage de materiau translucide par faisceau laser et materiau translucide usine WO2002081142A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002579165A JPWO2002081142A1 (ja) 2001-04-02 2002-04-02 レーザー光による透光材の加工方法及び透光材加工物
US10/415,148 US20040013951A1 (en) 2001-04-02 2002-04-02 Method for machining translucent material by laser beam and machined translucent material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-103369 2001-04-02
JP2001103369 2001-04-02

Publications (1)

Publication Number Publication Date
WO2002081142A1 true WO2002081142A1 (fr) 2002-10-17

Family

ID=18956440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/003302 WO2002081142A1 (fr) 2001-04-02 2002-04-02 Procede d'usinage de materiau translucide par faisceau laser et materiau translucide usine

Country Status (4)

Country Link
US (1) US20040013951A1 (ja)
JP (1) JPWO2002081142A1 (ja)
CN (1) CN100443241C (ja)
WO (1) WO2002081142A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013081947A (ja) * 2011-10-06 2013-05-09 Disco Corp 半導体基板のアブレーション加工方法
JP2013081957A (ja) * 2011-10-06 2013-05-09 Disco Corp パシベーション膜が積層された基板のアブレーション加工方法
JP2013082565A (ja) * 2011-10-06 2013-05-09 Disco Corp ガラス基板のアブレーション加工方法
JP2014004628A (ja) * 2012-06-01 2014-01-16 Laser System:Kk レーザー加工方法
KR101409419B1 (ko) 2012-05-17 2014-06-19 주식회사 포스코 방향성 전기강판의 자구 미세화 방법
JP2016508069A (ja) * 2012-11-29 2016-03-17 コーニング インコーポレイテッド 基板をレーザー穿孔するための犠牲カバー層およびその方法
JP2016078038A (ja) * 2014-10-10 2016-05-16 日立化成株式会社 積層体への貫通孔の形成方法
JP2018035067A (ja) * 2015-10-01 2018-03-08 旭硝子株式会社 パルスレーザを用いてガラス基板に孔を形成する方法、および孔を有するガラス基板を製造する方法
JP2019206460A (ja) * 2018-05-30 2019-12-05 Ａｇｃ株式会社 レーザを用いて孔を有するガラス基板を製造する方法
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
JP2022530352A (ja) * 2019-04-17 2022-06-29 アルセロールミタル レーザ金属堆積によるコーティングされた金属基材の製造方法
JP2022530353A (ja) * 2019-04-17 2022-06-29 アルセロールミタル レーザ溶接によるアセンブリの製造方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593543B2 (en) * 2000-07-20 2003-07-15 David Benderly Gemstone marking system and method
WO2006100202A1 (de) * 2005-03-23 2006-09-28 Technische Universität Ilmenau Verfahren zur laser-mikrostrukturierung eines materials unter verwendung einer mit reflexions- und absorptionseigenschaften bestimmten schwellintensität aufweisenden schutzschicht
HU227254B1 (en) * 2006-05-26 2010-12-28 Univ Szegedi Method of indirect working transparent materials by pulsed laser
US20080047940A1 (en) * 2006-08-28 2008-02-28 Xinghua Li Article with multiple surface depressions and method for making the same
JP4877513B2 (ja) * 2007-03-14 2012-02-15 戸田工業株式会社 ボンド磁石用フェライト粒子粉末、ボンド磁石用樹脂組成物ならびにそれらを用いた成型体
JP2008244361A (ja) * 2007-03-28 2008-10-09 Hitachi Via Mechanics Ltd プリント基板のレーザ加工方法
KR20110121605A (ko) * 2009-02-02 2011-11-07 아사히 가라스 가부시키가이샤 반도체 디바이스 부재용 유리 기판 및 반도체 디바이스 부재용 유리 기판의 제조 방법
CN102284796B (zh) * 2011-06-07 2015-03-11 大族激光科技产业集团股份有限公司 在盖膜上加工窗口的方法
CN103011171B (zh) * 2011-09-28 2014-10-22 深圳市木森科技有限公司 玻璃加工方法
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
CN102531371A (zh) * 2011-12-19 2012-07-04 深圳市木森科技有限公司 一种激光切割玻璃的方法
CN102615426B (zh) * 2012-04-18 2015-02-11 机械工业第三设计研究院 一种用于镁合金激光焊接的新型焊接方法
CN103964683B (zh) * 2014-04-17 2016-01-27 京东方科技集团股份有限公司 一种基板母板及其切割方法
CN104923925B (zh) * 2015-05-12 2017-11-17 中国科学院微电子研究所 一种降低激光热效应的玻璃通孔制作方法
CN106808091B (zh) * 2015-11-27 2018-12-07 南京魔迪多维数码科技有限公司 针对二维和三维脆性材料基板进行加工的激光系统
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
CN107871717B (zh) * 2016-09-23 2020-09-25 东芝存储器株式会社 半导体装置及其制造方法
CN106799548B (zh) * 2017-02-06 2019-04-26 京东方科技集团股份有限公司 保护膜、激光切割的方法
WO2018169927A1 (en) * 2017-03-14 2018-09-20 Protochips, Inc. Electrical devices with edge slits for mounting sample
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10919794B2 (en) 2017-12-04 2021-02-16 General Atomics Method of cutting glass using a laser
CN110919196B (zh) * 2019-12-17 2022-02-01 大连海事大学 一种玻璃管内表面微织构激光刻蚀方法
CN111548023B (zh) * 2020-05-12 2022-06-17 大连交通大学 一种利用红光纳秒激光对玻璃表面微细加工的方法

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JPH02225347A (ja) * 1989-02-28 1990-09-07 Mitsutoyo Corp ガラスのマーキング方法
JPH067982A (ja) * 1992-04-15 1994-01-18 Nitto Denko Corp レーザー加工装置
JPH106046A (ja) * 1996-06-24 1998-01-13 Mitsui Petrochem Ind Ltd フォト・アブレーション加工法
US6037103A (en) * 1996-12-11 2000-03-14 Nitto Denko Corporation Method for forming hole in printed board
JP2000162418A (ja) * 1998-11-25 2000-06-16 Sharp Corp 光学部品及びその加工方法
JP2000301372A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp 透明材料のレーザ加工方法
EP1164113A1 (en) * 2000-06-12 2001-12-19 Matsushita Electric Industrial Co., Ltd. Method of laser machining glass substrate and method of fabricating high-frequency circuit
JP2002028799A (ja) * 2000-07-10 2002-01-29 Seiko Epson Corp レーザによる微細加工方法

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FR2297143A1 (fr) * 1975-01-09 1976-08-06 Anvar Procede de realisation de microgravures par faisceau laser
JPH0222534A (ja) * 1988-07-11 1990-01-25 Fujitsu Ltd 粒子測定装置
JPH02166447A (ja) * 1988-12-20 1990-06-27 Fujitsu Ltd 露光用マスクおよびその製造方法
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate

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JPS52111097A (en) * 1976-03-13 1977-09-17 Toshiba Corp Laser processing method
JPS63215394A (ja) * 1987-03-02 1988-09-07 Mitsubishi Electric Corp 基板の加工方法
JPH02225347A (ja) * 1989-02-28 1990-09-07 Mitsutoyo Corp ガラスのマーキング方法
JPH067982A (ja) * 1992-04-15 1994-01-18 Nitto Denko Corp レーザー加工装置
JPH106046A (ja) * 1996-06-24 1998-01-13 Mitsui Petrochem Ind Ltd フォト・アブレーション加工法
US6037103A (en) * 1996-12-11 2000-03-14 Nitto Denko Corporation Method for forming hole in printed board
JP2000162418A (ja) * 1998-11-25 2000-06-16 Sharp Corp 光学部品及びその加工方法
JP2000301372A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp 透明材料のレーザ加工方法
EP1164113A1 (en) * 2000-06-12 2001-12-19 Matsushita Electric Industrial Co., Ltd. Method of laser machining glass substrate and method of fabricating high-frequency circuit
JP2002028799A (ja) * 2000-07-10 2002-01-29 Seiko Epson Corp レーザによる微細加工方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013081957A (ja) * 2011-10-06 2013-05-09 Disco Corp パシベーション膜が積層された基板のアブレーション加工方法
JP2013082565A (ja) * 2011-10-06 2013-05-09 Disco Corp ガラス基板のアブレーション加工方法
JP2013081947A (ja) * 2011-10-06 2013-05-09 Disco Corp 半導体基板のアブレーション加工方法
KR101409419B1 (ko) 2012-05-17 2014-06-19 주식회사 포스코 방향성 전기강판의 자구 미세화 방법
JP2014004628A (ja) * 2012-06-01 2014-01-16 Laser System:Kk レーザー加工方法
JP2016508069A (ja) * 2012-11-29 2016-03-17 コーニング インコーポレイテッド 基板をレーザー穿孔するための犠牲カバー層およびその方法
JP2016078038A (ja) * 2014-10-10 2016-05-16 日立化成株式会社 積層体への貫通孔の形成方法
JP2018035067A (ja) * 2015-10-01 2018-03-08 旭硝子株式会社 パルスレーザを用いてガラス基板に孔を形成する方法、および孔を有するガラス基板を製造する方法
US10442720B2 (en) 2015-10-01 2019-10-15 AGC Inc. Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7091846B2 (ja) 2018-05-30 2022-06-28 Ａｇｃ株式会社 レーザを用いて孔を有するガラス基板を製造する方法
JP2019206460A (ja) * 2018-05-30 2019-12-05 Ａｇｃ株式会社 レーザを用いて孔を有するガラス基板を製造する方法
JP2022530352A (ja) * 2019-04-17 2022-06-29 アルセロールミタル レーザ金属堆積によるコーティングされた金属基材の製造方法
JP2022530353A (ja) * 2019-04-17 2022-06-29 アルセロールミタル レーザ溶接によるアセンブリの製造方法
JP7362771B2 (ja) 2019-04-17 2023-10-17 アルセロールミタル レーザ金属堆積によるコーティングされた金属基材の製造方法
JP7362772B2 (ja) 2019-04-17 2023-10-17 アルセロールミタル レーザ溶接によるアセンブリの製造方法

Also Published As

Publication number Publication date
JPWO2002081142A1 (ja) 2004-07-29
CN100443241C (zh) 2008-12-17
CN1610597A (zh) 2005-04-27
US20040013951A1 (en) 2004-01-22

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