WO2002075905A1 - Unite d'armature, moteur, plateau, appareil d'exposition, et procede de fabrication d'appareil correspondant - Google Patents

Unite d'armature, moteur, plateau, appareil d'exposition, et procede de fabrication d'appareil correspondant Download PDF

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Publication number
WO2002075905A1
WO2002075905A1 PCT/JP2002/002304 JP0202304W WO02075905A1 WO 2002075905 A1 WO2002075905 A1 WO 2002075905A1 JP 0202304 W JP0202304 W JP 0202304W WO 02075905 A1 WO02075905 A1 WO 02075905A1
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WO
WIPO (PCT)
Prior art keywords
armature unit
conductive material
unit
laminated portion
housing
Prior art date
Application number
PCT/JP2002/002304
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English (en)
Japanese (ja)
Inventor
Toshihisa Tanaka
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO2002075905A1 publication Critical patent/WO2002075905A1/fr

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70758Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K5/00Casings; Enclosures; Supports
    • H02K5/04Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/20Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium
    • H02K5/203Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium specially adapted for liquids, e.g. cooling jackets
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K41/00Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02Linear motors; Sectional motors
    • H02K41/03Synchronous motors; Motors moving step by step; Reluctance motors

Definitions

  • the present invention relates to an armature unit, a motor, a stage apparatus, an exposure apparatus, and a method for manufacturing a device having a mechanism for cooling a coil, and particularly to a method for use under a condition where positioning accuracy is severe as in semiconductor manufacturing technology.
  • an armature unit equipped with a cooling mechanism has been known as an armature unit.
  • This cooling mechanism is a mechanism used to forcibly cool the coil of the armature unit when the motor operates. By forcibly cooling the coil using a cooling mechanism, even if more current is supplied, the temperature rise during motor operation can be suppressed, and the propulsive power of the motor can be increased.
  • the linear motor 100 shown in FIG. 20 is a moving magnet type, and a magnet is provided along an armature unit 101 fixed to a pace (neither is shown) of a stage device.
  • the unit 102 is configured to move linearly.
  • a plurality of magnets (magnetizing bodies) 104 are fixed to the magnet unit 102 inside the yoke 103.
  • the magnet unit 102 forms a magnetic field having a periodic magnetic flux density distribution along the direction in which the magnets 104 are arranged.
  • a plurality of coils 106 are fixed inside the cooling jacket 105.
  • a flow path 107 for a cooling medium is formed between the cooling jacket 105 and the coil 106.
  • the cooling medium is kept constant in the flow path 107 of the armature unit 101. Flow rate and pressure. Therefore, the coil 106 to which the current is supplied is forcibly cooled by the cooling medium. As a result, even if more current is supplied, the temperature rise during the operation of the linear motor 100 can be suppressed, and the propulsive power of the motor can be increased.
  • FIG. 21 is a sectional view taken along line AA of FIG.
  • the mover (magnet unit 102) of the linear motor 100 has a large braking force (viscous resistance force) in the direction opposite to the moving direction. Is added, and the moving speed of the mover (magnet unit 102) fluctuates (decreases) .- Therefore, it is desirable that the eddy current Ia generated in the cooling jacket 105 be as small as possible.
  • the eddy current la is proportional to the electrical conductivity of the cooling jacket 105 and the transfer speed V and the magnetic flux density B of the magnet unit 102.
  • the viscous drag force applied to the magnet unit 102 is It is proportional to the eddy current Ia, the magnetic flux density B, and the area receiving the magnetic flux.
  • the decrease in the moving speed of the mover (magnet unit 102) described above can be reduced to some extent by increasing the current supplied to the coil 106 of the armature unit 101 to supplement the propulsion force. Can be avoided.
  • the ripple component of the propulsion force (the component in which the propulsion force fluctuates depending on the position of the mover) increases as the current supplied to the coil 106 increases, that is, the vibration of the linear motor 100 increases. Another problem arises.
  • the cooling jacket 105 be composed of only an insulating material (for example, Japanese Patent Application Laid-Open No. H10-127355). According to this configuration, the eddy current Ia does not occur in the cooling jacket 105 during operation. However, if this linear motor is incorporated into a device (eg, an exposure device) that uses high-energy light (eg, ultraviolet light), the cooling jacket 105 is exposed to high-energy light and deteriorates. There was a problem that it was easy to do. In addition, since the entire cooling jacket 105 is formed only of an insulating material such as ceramics, there is a problem that the cooling jacket becomes expensive.
  • a device eg, an exposure device
  • high-energy light eg, ultraviolet light
  • the above problem also occurs in the moving coil type linear motor.
  • the problem is not limited to linear motors, but is a common problem for all motors that have a coil cooling mechanism in the armature unit. Disclosure of the invention
  • An object of the present invention is to reduce the amount of eddy current generated in a casing (cooling jacket) that covers a coil, and to reduce the cost of an armature unit, a motor, a stage device, An object of the present invention is to provide an exposure apparatus and a device manufacturing method.
  • the armature unit of the present invention includes a coil and a housing that houses the coil inside. Further, a portion of the above-mentioned housing that receives a magnetic field from an external magnetic body is a light-resistant non-conductive material.
  • the portion of the housing that receives the magnetic field is non-conductive, so that even if the magnetic field received from the external magnetic field changes with time, the overall eddy current in the housing will change. Can be suppressed very small. Furthermore, since at least a part of the part of the housing that receives the magnetic field has light resistance, the housing does not deteriorate even if the armature unit is exposed to high-energy light.
  • the portion of the housing that receives the magnetic field is a laminated portion in which a plurality of different materials are laminated in the direction of the magnetic field. Further, the above-mentioned laminated portion is a light-resistant material exposed to the outside and a non-magnetic non-conductive material adjacent to the inside of the light-resistant material.
  • a motor according to the present invention includes the armature unit described above, and a magnet unit having a magnet and capable of relatively moving between the armature unit.
  • the stator or the mover is constituted by the armature unit, and the mover or the stator is constituted by the magnet unit.
  • the amount of eddy current generated in the armature unit housing can be kept very small, so that the viscous resistance applied to the mover can be made very small. Also, since the viscous resistance applied to the mover is very small, the current supplied to the coil of the armature unit can be reduced. As a result, the vibration of the mover is reduced.
  • the above-described motor is used as a driving unit of the stage unit. In this stage device, since the vibration of the mover constituting the motor is small, precise positioning control with respect to the stage portion is possible, and the overall performance of the stage device is enhanced.
  • An exposure apparatus is an exposure apparatus that forms a predetermined pattern on a substrate, and includes the stage device described above. In this exposure apparatus, precise positioning control with respect to the stage is possible, so that the overall function of the exposure apparatus is enhanced.
  • the manufacturing method of the present invention includes a step of transferring a circuit pattern of a reticle onto a wafer coated with a photosensitive agent using the above-described exposure apparatus when manufacturing a device on which a predetermined pattern is formed. Things. According to this manufacturing method, a highly accurate device can be manufactured efficiently.
  • FIG. 1 is an external perspective view of a linear motor 10 (moving magnet type) according to the first embodiment.
  • FIG. 2 is a cross-sectional view of the linear motor 10 taken along line AA.
  • FIG. 3 is a cross-sectional view taken along the line B-.B of the linear motor 10.
  • FIG. 4 is a diagram showing a magnetic field curve in the y direction by the magnet unit 12
  • FIG. 5 is a diagram showing a deformation curve of the cooling jacket 32 of the armature unit 11.
  • FIG. 6 is a diagram showing the relationship between the thickness (optimum thickness) of the laminated portion 32 a of the cooling jacket 32 and the pressure of the cooling medium.
  • FIG. 7 is a cross-sectional view showing a member configuration when the cooling jacket 32 is actually assembled.
  • FIG. 8 is a diagram illustrating eddy current and viscous resistance generated when the linear motor 10 is operated.
  • FIG. 9 is a sectional view showing another configuration of the cooling jacket 32.
  • FIG. 10 is a diagram illustrating a modification of the outer frame portion 32 b of the cooling jacket 32.
  • FIG. 11 is a cross-sectional view showing another member configuration when the cooling jacket 32 is actually assembled.
  • FIG. 12 is a cross-sectional view showing another member configuration when the cooling jacket 32 is actually assembled.
  • FIG. 13 is a cross-sectional view showing another member configuration when the cooling jacket 32 is actually assembled.
  • FIGS. 14A and 14B are an external perspective view (a) and a front view (b) of the linear motor 0 (moving coil type) of the second embodiment.
  • FIG. 15 is a cross-sectional view showing a configuration in which a ceramic plate 72 is provided in a portion where the cooling jackets 32 and 71 receive the magnetic field.
  • FIG. 16 is a perspective view showing a stage device 600 to which the linear motor 10 is applied.
  • FIG. 17 is a view showing the overall configuration of an exposure apparatus 700 using a linear motor 10 for the reticle stage 75.
  • FIG. 18 is a diagram showing a semiconductor device manufacturing process using the exposure apparatus according to the present invention.
  • FIG. 19 is a diagram showing a more specific manufacturing process of a semiconductor device using the exposure apparatus according to the present invention.
  • FIG. 20 is a cross-sectional view showing a configuration of a conventional linear motor 100.
  • FIG. 21 is a diagram for explaining an eddy current and a viscous resistance generated when the conventional linear motor 100 is operated.
  • the linear motor 10 of the first embodiment is a moving magnet type, and as shown in FIG. 1, a stator armature unit 11 and a mover magnet unit 12 (magnetizer unit) It is composed of
  • the armature unit 11 has an elongated thin plate shape, and is fixed to the base of the stage device (both are not shown) at both ends 11a and 11b.
  • the longitudinal direction of the armature unit 11 is defined as the X direction
  • the width direction is defined as the y direction
  • the direction perpendicular to the xy direction is defined as the z direction.
  • the magnet unit 12 has a cylindrical outer shape and a rectangular hollow portion into which the armature unit 11 is inserted.
  • the magnet unit 12 is movable in the X direction along the armature unit 11.
  • a movable stage (not shown) that moves with respect to the base of the stage device is fixed to the magnet unit 12.
  • FIG. 2 is a sectional view taken along line AA of FIG. Figure 3 is a BB cross section.
  • the magnet unit 12 includes a plurality of permanent magnets 21 (magnetizing bodies) and a yoke 22.
  • Each of the permanent magnets 21 has a slender outer shape, and the longitudinal direction is aligned with the y direction.
  • the plurality of permanent magnets 21 are divided into two rows, the different poles are arranged along the X direction in a direction facing each other, and are fixed inside the yoke 22.
  • the magnet unit 12 forms a magnetic field having a periodic magnetic flux density distribution along the X direction (the arrangement direction of the permanent magnets 21). Further, the magnetic field formed by the magnet unit 12 is substantially constant in the y direction (the longitudinal direction of the permanent magnet 21) as shown in the magnetic field curve of FIG.
  • the vertical axis in Fig. 4 represents the relative strength of the magnetic field, and the horizontal axis represents the position in the y direction.
  • the armature unit 11 includes a plurality of coils 31 and a cooling jacket 32.
  • the plurality of coils 31 are arranged along the X direction. Further, the plurality of coils 31 are electrically connected in a certain relationship, and are divided into two or more groups. The coils 31 of each group are connected in series. And each group Is supplied with an alternating current having a predetermined phase.
  • the cooling jacket 32 is a housing that houses the plurality of coils 31 therein (details of the structure and the material will be described later).
  • a flow path 33 for a cooling medium (for example, Florinato (trade name)) is formed between the cooling jacket 32 and the coil 31.
  • the cooling jacket 32 has, at both ends (11a, 11b) shown in FIG. 1, an inlet 34 for taking in the cooling medium and a port for discharging the cooling medium to the outside.
  • An outlet 35 is provided.
  • a mechanism for adjusting the temperature, the flow rate, and the pressure of the cooling medium is connected between the inlet 34 and the outlet 35 via a pipe.
  • the cooling medium introduced from the inlet 34 of the cooling jacket 32 flows through the flow path 33 of the armature unit 11 at a constant flow rate and pressure.
  • the cooling medium flowing through the flow path 33 absorbs the heat released from the coil 31 by energization and is heated, and is discharged from the outlet 35 of the cooling jacket 32.
  • the coil 31 to which the alternating current is supplied is forcibly cooled by the cooling medium.
  • the temperature rise during the operation of the linear motor 10 can be suppressed, and the propulsive power of the motor can be increased.
  • the pressure of the cooling medium flowing through the flow path 33 is set within a range of 50 kPa to 60 kPa. For this reason, the cooling jacket 32 is in a state of expanding outward as shown by the deformation curve in FIG.
  • the vertical axis in FIG. 5 represents the amount of deformation, and the horizontal axis represents the position in the y direction.
  • the linear motor 10 becomes inoperable or the linear motor 10 is damaged or deformed.
  • the distance t from the permanent magnet 2 1 is the cooling jacket 3 2 Is set to be larger than the maximum deformation amount ⁇ zi.
  • the cooling jacket 32 is made up of a laminated portion 3 2a in which two different materials 41, 42 are laminated in the thickness direction, and a single material. And an outer frame portion 32b.
  • the thickness direction of the cooling jacket 32 is substantially parallel to the direction of the magnetic field formed by the magnet unit 12.
  • the size of the laminated portion 32a is substantially equal to the movable range of the permanent magnet 21 of the magnet unit 12 when the linear motor 10 is operated. That is, the laminated portion 32 a is provided in a range where the cooling jacket 32 receives the magnetic field from the permanent magnet 21 of the magnet unit 12 when the linear motor 10 is operated.
  • the laminated portion 32a has a rectangular shape elongated in the X direction.
  • the range which receives a magnetic field means all the parts which receive a magnetic field, or a part.
  • the width of the laminated portion 32 a in the y direction is determined by the magnetic field strength in the y direction (FIG. 4) formed by the permanent magnet 21 of the magnet unit 12. It is determined to be equal to the distance D 2 of the position y have y 2 becomes extent.
  • the width in the X direction of the laminated portion 32a may be determined in the same manner. In this case, the laminated portion 32 a is provided in a range where the permanent magnet 21 of the magnet unit 12 receives a magnetic field of a predetermined value (70% of the peak value) or more from the operating range of the magnet unit 12. Will be.
  • the material 41 (first material) that is exposed to the outside of the laminated portion 32a is austenitic stainless steel.
  • Austenitic stainless steel (hereinafter referred to as SUS material) is a non-magnetic metal material with excellent light resistance, low electrical and thermal conductivity, high Young's modulus (longitudinal modulus) and high rigidity. It has the characteristic of being hard to mackerel.
  • CFRP carbon fiber reinforced plastic
  • the material of the outer frame portion 32b is a SUS material, like the material 41 of the laminated portion 32a described above. Note that aluminum may be used as the material of the outer frame portion 32b.
  • the outside of the cooling jacket 32 is covered with SUS material, and CFRP is arranged inside the SUS material only in the part that receives a magnetic field of a predetermined value (70% of the peak value) or more from the permanent magnet 21. Will be.
  • the cooling jacket 32 is in an expanded state. (Maximum deformation AzJ.
  • the thickness t 2 of the laminated portion 32 a and the maximum deformation ⁇ z! It is desirable to minimize the sum t B with. This is because the gap loss between the coil 31 of the armature unit 11 and the permanent magnet 21 of the magnet unit 12 can be reduced.
  • the thickness t of the laminated portion 32a is determined.
  • the maximum deformation ⁇ zi t Obtains B is the thickness t 2 such that the minimum value as the optimum thickness, to form a laminated portion 32 a on the basis of this optimal thickness.
  • the thickness 2 of the laminated section 32a is about 1.6 mm, and the sum of the above is obtained.
  • t B becomes the minimum value, and the characteristics of the linear motor 10 can be improved.
  • the thickness distribution of the two types of materials 41 and 42 constituting the laminated portion 32a is determined as follows.
  • the thickness of the outer material 41 is determined in consideration of the amount of eddy current generated inside the material 41 (SUS material) when the linear motor 10 is operated. It is desirable to thin as 1 / 3-1 / 6 of the thickness t 2 of the laminate unit 32 a. In the present embodiment, for example, when the thickness 2 of the laminated portion 32a is 1.6 mm, the outer material 41 (SUS material) is 0.3 mm.
  • the thickness of the inner material 42 (CFRP), since that can be set freely at minute intervals (0. lmm ⁇ 0.15 mm extent), the laminated portion 32 a of the thickness t 2 (e.g. 1.6 mm) of the outer side It is set to the value obtained by subtracting the thickness (for example, 0.3 mm) of the material 41 (SUS material).
  • the thickness of the outer frame portion 32b (SUS material) is set to be substantially the same as the thickness 12 (for example, 1.6 mm) of the above-described laminated portion 32a.
  • FIG. 7 is a perspective view showing only the cooling jacket 32 in the BB cross-sectional view of FIG.
  • the cooling jacket 32 includes an outer frame member 52 having a rectangular opening 51 having the same shape and size (see FIG. 1) as the above-described laminated portion 32a, and a laminated member having a shape and size matching the rectangular opening 51. 53, and a reinforcing member 54 elongated in the X direction provided to reinforce the joint between the outer frame member 52 and the laminated member 53.
  • the laminated member 53 has a CFRP plate 5 having the same shape and size as the rectangular opening 51. 5 and a SUS plate 56 slightly larger than the rectangular opening 51.
  • the CFRP plate 55 is a thin CFRP plate, and the plate thickness is the same as the material 42 of the above-described laminated portion 32a (for example, 1.3 mm).
  • the SUS plate 56 is a thin plate of SUS 316 or the like, and has the same thickness as the material 41 of the above-described laminated portion 32a (for example, 0.3 mm).
  • the SUS plate 56 is exposed to the outside, and the CFRP plate 55 is disposed adjacent to the inside of the SUS plate 56.
  • the SUS plate 56 and the CFRP plate 5 5 are joined by an adhesive (adhesive part 61), it is integrated into a laminated member 53 0
  • the other members (the outer frame member 52 and the reinforcing member 54) constituting the cooling jacket 32 are all thin plates such as SUS316.
  • the thickness of the outer frame member 52 is the same as that of the outer frame portion 32b (for example, 1.6 mm).
  • the plate thickness of the reinforcing member 54 is the same as the SUS plate 56 of the laminated member 53 described above (for example, 0.3 mm).
  • Laser welding and an adhesive are used to join the outer frame member 52, the laminated member 53, and the reinforcing member 54 together to form the cooling jacket 32. That is, the outer frame member 52 and the laminated member 53 (SUS plate 56) are joined using laser welding (welded portion 62). Further, the laminated member 53 (CFRP plate 55) and the reinforcing member 54 are joined by an adhesive (adhesive portion 63). Further, the reinforcing member 54 and the outer frame member 52 are joined using laser welding (welded portion 64).
  • the distance D 3 from the CFRP plate 55 to the welded portion 62, 64 of the laminated member 53 is set to about 2 mm, heat generated during the laser welding is prevented from transmitting to the CFRP plate 55.
  • the outside of the cooling jacket 32 is entirely covered with the SUS material, and only the portion receiving the magnetic field of a predetermined value (70% of the peak value) or more from the permanent magnet 21 is used.
  • CFRP is arranged inside the SUS material.
  • the outer material 41 (the SUS plate 56) can be made thinner by the material 42 (the CFRP plate 55) inside the cooling jacket 32.
  • the generation amount of the eddy current Ib can be kept very small.
  • the outer material 41 SUS plate 56
  • the laminated portion 32a laminated member 53
  • the amount of eddy current Ib is reduced as in the conventional case.
  • the laminated member 53) can be reduced to 1 / m of that when the whole is made of only metal material (eddy current la in Fig. 18).
  • the viscous resistance force F 2 exerted on the magnet Yunidzuto 12 of the movable element is also very small. If the amount of the eddy currents lb generated in the cooling jacket 32 is a conventional 1 / m, the viscous resistance force F 2 is also conventional (FIG. 17, can be reduced to 1 / m of the viscous drag force F in Figure 18.
  • the current supplied to the coil 31 of the armature unit 11 can be reduced.
  • the ripple component of the propulsion force is reduced, and the vibration of the linear motor 10 can be suppressed to a small value.
  • the current supplied to the coil 31 of the armature unit 11 can be reduced, the power consumption of the linear motor 10 can be reduced and the amount of heat generated itself can be reduced.
  • the portion of the cooling jacket 32 that receives a magnetic field of a predetermined value (70% of the peak value) or more from the permanent magnet 21 has a double structure, and is made of a non-conductive material.
  • 42 (CFRP plate 55) is made of a material with excellent light resistance 41 (SUS Because it is covered with the plate 56), it does not deteriorate even when exposed to high-energy rays (eg, ultraviolet rays).
  • the cooling Jakedzuto 3 2 of the laminate 3 2 a width (FIG. 5) is narrower than the width D 4 of the permanent magnet 2 1 itself ( Figure 4). Therefore, both ends 21 a and 21 b of the permanent magnet 21 near the outer frame 32 b of the cooling jacket 32, that is, the portion of the thick SUS material (for example, 1.6 mm). I have. However, near both ends 21 a and 21 b of the permanent magnet 21, the magnetic field is less than 70% of the peak value, and the viscous drag force F 2 proportional to the square of the magnetic field and the area of the magnetic field, The smallness of the center position y. With less than half of, the increase in overall viscous drag can be neglected.
  • the laminated portion 32a of the cooling jacket 32 can move the permanent magnet 21 of the mover.
  • the part (outer frame part 32 b) provided in the range and adjacent to the laminated part 32 a is made of SUS material or aluminum material (FIG. 1).
  • the permanent magnet 2 1 of the movable element shall be always in opposite to the cooling jacket 3 2 of the laminate 3 2 a, receives a very small viscous resistance force F 2 Mr. or There is no.
  • the permanent magnet 21 of the mover may move in the X direction beyond the normal movement range (laminated portion 32a) due to a malfunction of the linear motor 10 or the like.
  • the portion (outer frame portion 32b) adjacent to the laminated portion 32a is made of a conductive material such as SUS or aluminum. Due to the configuration, a very large viscous drag force is applied (brake is applied) to the mover that has exceeded the normal movement range (laminated section 32a) during the above malfunction.
  • the conductive material adjacent to the laminated portion 32a in the X direction (the moving direction of the mover) (The outer frame part 3 2 b) will function as a braking part for the mover.
  • the moving speed of the mover drops sharply and stops. Therefore, it is possible to reduce damage to the linear motor 10 due to malfunction or the like.
  • the size of the laminated portion 32a in the X direction is determined by changing the size of the mover (permanent of the magnet unit 12) during normal operation. Having described the example in which substantially equal to the moving range of the magnet 2 1), as shown in FIG. 9 (a), a narrow range delta chi 2 to limit than the moving range of the normal operation of the movable element (permanent magnet 2 1) Then, the laminated portion 32a may be provided.
  • Laminating unit 3 2 a range delta chi 2 of, for example, be set to a range that moves the mover to the 'normal operation (permanent magnet 2 1) is a constant speed (maximum speed Vmax in FIG. 9 (b)) the vertical axis of the can c Figure. 9 (b) represents the moving speed of the movable element, the horizontal axis represents the position in the X direction.
  • the outer Azusa portion 3 2 b is in the range delta X 3 the mover (the permanent magnet 2 1) is decelerated or accelerated, provided extend to delta chi 4.
  • the mover in normal operation faces the laminated portion 32a when moving at a constant speed (Vmax), and the outer frame portion 32b when decelerating or accelerating. Will be opposed. While facing the stacking unit 3 2 a, the movable element (permanent magnet 2 1), a very small viscous drag force (F 2) only applied.
  • viscous resistance force (F 2) is greater than the viscous resistance force resulting in added, in this case Since the speed of the mover is slow, the viscous drag does not increase so much.
  • the range delta chi 5 which during normal operation of the movable element (permanent magnet 2 1) is located outside of the mobile available-extent delta chi i, the delta chi 6, the outer frame portion Highly conductive material 36 may be provided in the space between 32b.
  • the Riniamo evening 1 0 of the first embodiment described above, the cooling jacket 3 2 of the outer frame portion 3 2 b thick laminated portion 3 2 a thickness 1 2 (e.g. 1. 6 mm) and the same degree As shown in Fig. 10, although the laminated portion 3 2a and the portion 3 2c of the adjacent outer frame portion 3 2b in the y direction are made thicker than the laminated portion 32 as shown in FIG. good. Sa ⁇ t ( t 3 - 1 2 ) between the portion 32 c thickness 1 3 of the adjacent lamination portion 32 a in the y direction as the stacking portion 32 the thickness t 2 of a the deformation curve of the cooling Jakedzuto 32 ( based on FIG.
  • the overall rigidity of the cooling jacket 32 can be increased.
  • the maximum deformation ⁇ zi (FIG. 5) of the cooling jacket 32 is reduced, so that the gap loss between the coil 31 of the armature unit 11 and the permanent magnet 21 of the magnet unit 12 can be reduced.
  • the characteristics of the linear motor are improved.
  • a portion of the outer frame portion 32b adjacent to the stacked portion 32a in the X direction may be thicker than the stacked portion 32a.
  • the function as the above-mentioned braking section is enhanced, and the magnet unit 12 of the mover is reliably stopped in the event of a malfunction of the linear modulator 10. It can be done.
  • the reinforcing member 54 (FIG. 7) is used as a member configuration when the cooling jacket 32 is actually assembled, but the reinforcing member 54 may be omitted. it can.
  • the rectangular opening 51 of the outer frame member 52 and the CFRP plate 55 of the laminated member 53 are inclined at an angle of 30 degrees, and the 3113 plate 56 of the laminated member 53 is the inclined portion of the CFRP plate 55. Folded along. Then, the outer frame member 52 and the laminated member 53 (SUS plate 56) are joined by laser welding (welded portion 65), so that the cooling jacket 32 is integrated.
  • the rectangular opening 51 of the outer frame member 52 and the CFRP plate 55 of the laminated member 53 do not have to be inclined.
  • the SUS plate 56 of the laminated member 53 is bent inwardly in a U shape along the CFRP plate 55. Then, the outer frame member 52 and the laminated member 53 (SUS plate 56) are joined together by laser welding (welded portion 66), whereby they are integrated as the cooling jacket 32.
  • the outer frame member 52 is formed by one laser welding. And the laminated member 53 (SUS plate 56). Further, there is an advantage that the member configuration of FIG. 11 is stronger in pulling than the member configuration of FIG.
  • a thin metal plating film 57 of about several tens of micrometers may be provided on the outer surface of the CFRP plate 55.
  • the bonding between the laminated member 53 and the outer frame member 52 is performed using an adhesive (adhesive portion 59). Screwing may be used together with the bonding portion 59.
  • a material for example, a dielectric multilayer film
  • a material for example, a dielectric multilayer film
  • ⁇ ⁇ 0 2, ⁇ 0 2, ⁇ a high refractive index dielectric film, such as 2 0 3
  • a low refractive index dielectric film such as S i0 2, Mg F 2 is, It is conceivable to use a known ultraviolet reflective film in which a plurality of layers are alternately laminated.
  • the linear motor 70 of the second embodiment is a moving coil type, and as shown in FIG. 14, a magnet unit 110 fixed to the base 602 (FIG. 16) of the stage device 600 by the support 116, The armature unit 120 is fixed to the movable stage 607.
  • an armature unit 120 having a T-shaped cross section is slidably fitted into a recess 110A of a magnet unit 110 having a U-shaped cross section.
  • a large number of permanent magnets (magnetizing bodies) 112 are arranged on the wall surface.
  • the armature unit 120 includes a coil (not shown) and a cooling jacket 71 that covers the coil.
  • the coil is electrically connected to a drive circuit (not shown) of the stage device 600 (FIG. 16) via wiring (not shown).
  • a channel for a cooling medium is formed between the cooling jacket 71 of the armature unit 12Q and the coil.
  • the cooling medium from the temperature control device 200 (Fig. 17) Thereby, the coil housed inside the cooling jacket 71 is cooled.
  • the cooling jacket 71 includes a laminated portion 71a in which two different materials are laminated in the thickness direction (direction of the magnetic field), and an outer frame portion 7 lb made of one material.
  • the laminated section 7 la is provided in a range where the cooling jacket 71 receives a magnetic field from the permanent magnet 112 of the magnet unit 110 when the linear motor 70 operates.
  • the laminated portion 7la has a rectangular shape elongated in the X direction (the direction of movement of the armature unit 120), and is provided to extend from one end 71c to the other end 71d of the cooling jacket 71.
  • the moving coil type linear motor 70 when the armature unit 120 of the mover moves in the X direction with respect to the magnet unit 110 of the stator, cooling of the mover (armature unit 120) is performed. Since the amount of eddy current generated in the jacket 71 is very small, the viscous resistance force applied to the mover (the armature unit 120) is also very small.
  • a material having excellent light resistance SUS material
  • CFRP non-conductive material
  • the permanent magnet is used as the magnetic flux generating means (magnetizing body).
  • an electromagnet or the like may be used instead.
  • the laminated portions 32a and 71a of the cooling jackets 32 and 71 have a double structure (SUS material on the outside and CFRP on the inside). It may be a double structure. In this case, it is preferable to attach a SUS material also to the inside of CFRP (non-conductive material) of the laminated portions 32a and 71a.
  • the SUS material is used as the material 41 outside the laminated portions 32a and 71a.
  • a non-magnetic conductive material such as a metal material
  • CFRP is used as the material 42 inside the laminated portions 32a 3 71a.
  • non-conductive materials sintered materials such as ceramics may be used. it can.
  • the cooling jackets 32 and 71 are provided with the laminated portions 32 a and 71 a in a range where the cooling jackets 32 and 71 receive a magnetic field from the permanent magnets 21 and 1 12 of the magnet units 12 and 110.
  • the present invention is not limited to this configuration.
  • a single ceramic layer 72 may be provided instead of the laminated portions 32a and 71a.
  • the bonding between the ceramic plate 72 and the outer frame member 52 is performed using an adhesive (adhesive portion 73). Since the ceramic material is a non-conductive material having excellent light resistance, the same effect as the above-described configuration having the laminated portions 32a and 71a can be obtained.
  • the ceramic material is expensive, but the place where the ceramic plate 72 is provided is limited to a part of the cooling jacket (32, 71) (the range receiving the magnetic field). There is also an effect that 1) can be configured at low cost. Note that a glass plate can be used instead of the ceramic plate 72.
  • the laminated portions 32a and 71a are provided only in portions where the cooling jackets 32 and 71 receive the magnetic field. However, the cooling jackets 32 and 71 are entirely formed in the laminated portions 32a and 71a. You may comprise.
  • linear motors 10 and 70 that generate a linear driving force (propulsion force) have been described.
  • a rotary motor that generates a driving force (torque) in a rotational direction a voice motor, and the like.
  • the present invention can be applied to various types of motors provided with a cooling mechanism for coils of an armature unit, such as an evening or a so-called “E-type” electromagnet unit.
  • the third embodiment relates to a stage device 600 using the linear motor 10 of the first embodiment as a driving unit.
  • the use of the stage device 600 is not limited.
  • the stage device 600 is incorporated in an exposure device used for manufacturing a semiconductor device, a liquid crystal display device, or the like, and is used to transfer a pattern formed on a mask (not shown).
  • Substrate Used as a means of moving W.
  • the stage device 600 has two axes X—Y of the X axis and the Y axis.
  • Y is the main component.
  • a sample stage (not shown) is arranged on the Y stage 600Y, and a wafer (substrate) W is mounted on this sample stage via a wafer holder (not shown).
  • An irradiation unit (not shown) is arranged above the wafer W, and a resist (not shown) applied in advance on the wafer W by exposure light irradiated from the irradiation unit through a mask (both not shown). ), The circuit pattern on the mask is transferred.
  • the amounts of movement of the X stage 600X and the Y stage 600Y in the stage device 600 are, respectively, moving mirrors 605X and 605Y fixed to the X-direction end and the Y-direction end of the sample stage.
  • the measurement is performed by a laser interferometer (not shown) fixed to the pace section 602.
  • a main controller (not shown) controls the movement of the wafer (substrate) W on the sample stage (not shown) to a desired position on the base 602.
  • the X stage 600X of the stage device 600 is driven on the pace part 602 in the X direction by two linear motors 10X and 10X.
  • the two linear motors 10X and 10X have the same configuration as the linear motor 10 (FIG. 1) of the above-described first embodiment, and a detailed description thereof will be omitted. .
  • the armature units 11, 11, which are the stators of the two linear motors 10X, 10X, are both fixed on the base 602 at the mounting portions 1 16, 1 16, and are the magnet units that are the movers. 12, 12 are fixed to the X stage 600 X via fixing plates 607, 607, respectively.
  • the two linear motors 1OX and 10X have a very small amount of eddy current generated in the cooling jackets 32 and 32 when the movers (magnet units 12 and 12) move.
  • the viscous drag force and vibration applied to the surface are very small.
  • the Y stage 600Y of the stage device 600 is driven on the base 602 in the Y direction by one linear motor 10Y.
  • the linear motor 10Y has the same structure as the linear motor 10 (FIG. 1) of the first embodiment described above, and a detailed description thereof will be omitted.
  • An armature unit 11 as a stator of the linear motor 10Y is fixed to an X stage 600X, and a magnet unit 12 as a mover is fixed to a ⁇ stage 600 ⁇ .
  • the amount of eddy current generated in the cooling jacket 32 when the mover (magnet unit 12) moves is extremely small, so that viscous resistance and vibration applied to the mover (magnet unit 12) are very small. Small.
  • the temperature of the cooling medium is controlled by a temperature control device 200 (FIG. 17).
  • the armature units 11, 11, and 11, which are stators, and the temperature controller 200 (FIG. 17) are connected by a supply pipe 221 and a discharge pipe 222 (FIG. 17).
  • the vibration of the mover (magnet unit 12) constituting the linear motor 1 OX, 1 OX, 10 ° is very small, the X stage 600 ° and the ⁇ stage 600 ⁇ Precise positioning control becomes possible, and the movement of the wafer (substrate) W on the sample table (not shown) to the desired position on the base 602 can be controlled with high accuracy.
  • the linear motor 10 (FIG. 1) of the above-described first embodiment is used as a driving means of the reticle (mask) stage 750 of the exposure apparatus 700 shown in FIG.
  • the linear motor 10 of the first embodiment is incorporated in a reticle stage 750.
  • the exposure apparatus 700 is a so-called step 'and' scan exposure type scanning exposure apparatus.
  • the exposure apparatus 700 includes an illumination system 71, a stage movable section 751 for holding a reticle (photomask) R, a projection optical system PL, and a Plate)
  • the illumination system 710 irradiates the exposure light emitted from the light source unit to the rectangular (or arc-shaped) illumination area I A R on the reticle R with uniform illuminance.
  • the stage movable portion 751 is moved on a reticle pace (not shown) at a predetermined scanning speed along a guide rail (not shown).
  • a reticle R is fixed on the upper surface of the stage movable section 751, for example, by vacuum suction.
  • An exposure light passage hole (not shown) is formed below the reticle R of the stage movable section 751.
  • the moving position of the stage movable portion 715 is detected by the reflecting mirror 715 and the reticle laser interferometer 716, and the stage control system 719 determines the detected moving position of the stage movable portion 715.
  • the stage movable section 751 is driven in accordance with an instruction from the main controller 720 based on the control.
  • the projection optical system PL is a reduction optical system, and is disposed below the reticle stage 750.
  • the direction of the optical axis AX (coincident with the optical axis IX of the illumination optical system) is defined as the Z-axis direction.
  • a refracting optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis AX direction so as to have a telecentric optical arrangement is used.
  • a reduced image (partially inverted image) of the circuit pattern in the illumination area IAR of the reticle R is applied to the illumination area IAR on the wafer W. It is formed in the conjugate exposure area IA.
  • the stage device 800 drives the table 818 in a two-dimensional direction in the XY plane using the plane motor 870 as a driving means.
  • the stage device 800 is composed of a base portion 8 21, a table 8 18 lifted above the upper surface of the pace portion 8 21 through a clearance of about several / zm, and a table 8 18 It has a plane mode 8 7 0 to move 1 8.
  • the table 8 18 has a surface (substrate) W on its upper surface during the exposure processing, for example, vacuum suction.
  • a moving mirror 827 is fixed to the table 818, and a laser beam is irradiated from the wafer interferometer 831 to detect the moving position of the table 818 in the XY plane. It has become so.
  • -Information on the movement position obtained at this time is sent to the main control device 720 through the stage control system 719. Then, the stage control system 7 19 operates the plane motor 8 7 0 according to the instruction from the main control unit 7 2 0 based on this information, and moves the table 8 8 to the desired position in the XY plane. Move to position.
  • the table 8 18 is supported on the upper surface of a mover (not shown) constituting the plane motor 870 at three different points by a support mechanism (not shown). Not only can it be driven in the ⁇ and ⁇ directions, but it can also be tilted with respect to the XY plane or ⁇ ⁇ in the axial direction (upward).
  • the plane model 870 has a known configuration, and the other description of the plane model 870 is omitted.
  • reference numeral 821 denotes a pace portion, and a cooling medium for preventing a rise in temperature due to heat generated therein is provided by a supply pipe 221, a discharge pipe 222, and a temperature control device 20. It is circulated by the action of 0.
  • exposure processing is generally performed in the following procedure.
  • reticle R and wafer W are loaded, and then reticle alignment, baseline measurement, alignment measurement, and the like are performed.
  • the main controller 720 issues a command to the stage control system 719 based on the position information of the reticle R by the reticle interferometer 716 and the position information of the wafer W by the wafer interferometer 831.
  • the reticle R and the wafer W are moved synchronously by the linear motor 10 and the plane motor 870 of the reticle stage 750, and a desired scanning exposure is performed.
  • the table 818 is stepped by one shot area, and the next shot is processed. Scan exposure is performed on the cut area. The stepping and the scanning exposure are sequentially repeated, and a required number of shot patterns are transferred onto the wafer W.
  • the reticle stage 75 current is appropriately supplied to the coils constituting the stator (the armature unit 11) of the linear motor 10, and the amount of movement is controlled.
  • the reticle stage 7500 of the exposure apparatus 700 has a high cooling efficiency for the linear motor 10 and can precisely control the moving amount.
  • the manufacture of a semiconductor device using the above-described stage apparatus 600 of the third embodiment and the exposure apparatus 700 of the fourth embodiment is generally performed according to the procedures shown in FIGS.
  • the semiconductor device a step of designing the function and performance of the device, a step of manufacturing a reticle based on this design step, a step of manufacturing a wafer from a silicon material, and the exposure apparatus of the fourth embodiment described above.
  • the wafer is manufactured through a step of transferring a reticle pattern to a wafer by means of 0, a device assembling step (including a dicing step, a bonding step, and a package step), an inspection step, and the like.
  • Figure 18 shows a flow chart of an example of manufacturing devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.).
  • semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.
  • step 1001 design step
  • the function and performance of the device are designed (for example, the circuit design of a semiconductor device), and the pattern design to realize the function is performed. Do.
  • step 1002 mask manufacturing step
  • a mask (reticle) on which the designed circuit pattern is formed is manufactured.
  • step 1003 wafer manufacturing step
  • a wafer is manufactured using a material such as silicon.
  • step 1004 wafer processing step
  • step 1005 wafer assembly step
  • step 1005 The device is assembled using the wafer processed in step 4.
  • This step 1005 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.
  • step 106 inspection step
  • inspections such as an operation confirmation test and a durability test of the device manufactured in step 105 are performed. After these steps, the device is completed and shipped.
  • FIG. 19 shows an example of the detailed flow of the step 104 in the case of a semiconductor device.
  • step 101 oxidation step
  • step 1102 CVD step
  • step 103 electrode formation step
  • step 104 ion implantation step
  • ions are implanted into the wafer.
  • steps 101 to 114 constitute a pre-processing step in each stage of wafer processing, and are selected and executed according to necessary processing in each stage.
  • the post-processing step is executed as follows.
  • step 1015 resist forming step
  • step 106 exposure step
  • step 110 etching step
  • the linear motor 10 of the present invention is a scanning type exposure apparatus that exposes a mask pattern by synchronously moving a mask and a substrate, other than the exposure apparatus described in the embodiment (for example, US Pat. No. 5, 473, 410). Monkey
  • stage apparatus using the linear motor 10 of the present invention exposes a mask pattern while keeping the mask and the substrate stationary, and sequentially moves the substrate in steps.
  • stage of a step-and-repeat type exposure apparatus It can also be applied as a device.
  • the linear motor 10 of the present invention can also be applied as a driving means of a proximity exposure apparatus that exposes a mask pattern by bringing a mask and a substrate into close contact without using a projection optical system.
  • the exposure apparatus using the linear motor 10 of the present invention is not limited to an exposure apparatus for manufacturing semiconductors.
  • the linear motor 10 of the present invention can be applied to an exposure apparatus for a liquid crystal that exposes a liquid crystal display element pattern to a square glass plate and an exposure apparatus for manufacturing a thin-film magnetic head.
  • the light source of the exposure apparatus includes g-line (436 nm), [line (365 nm), KrF excimer laser (248 nm), and ArF excimer laser. (1 9 3 nm), not only the F 2 laser (1 5 7 nm), it is possible that uses charged particle beams such as X-ray or electron beam.
  • charged particle beams such as X-ray or electron beam.
  • a thermionic emission type lanthanum hexaboride (L a B 6 ) or tantalum (T a) can be used as the electron gun.
  • a configuration using a mask may be used, or a configuration may be used in which a pattern is directly formed on a substrate without using a mask.
  • the projection optical system the case of using the far ultraviolet rays such as an excimer laser using a material which transmits far ultraviolet rays such as quartz and fluorite as glass material, when using the F 2 laser or X-ray catadioptric
  • the reticle is of a reflective type
  • an electron optical system composed of an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is in a vacuum state.
  • magnification of the projection optical system of the exposure apparatus to which the linear motor of the present invention is applied as a driving means may be not only a reduction system but also an equal magnification and an enlargement system.
  • linear motor 10 of the present invention when used for the wafer stage and the reticle stage, an air-floating type open mouth-to-rents force using air pairing or rear force is used. Either of the magnetic levitation type using Kutanska may be used.
  • the stage to which the linear motor of the present invention is applied is not limited to a type that moves along a guide, but may be a guideless type that does not require a guide.
  • the invention proposed in Japanese Patent Application Laid-Open No. Hei 8-166475 is utilized to mechanically use the frame member and the floor side. (Earth).
  • the invention proposed in Japanese Patent Application Laid-Open No. H08-330224 is used to mechanically move the reticle stage to the floor side using a frame member. (Earth).
  • the exposure apparatus to which the linear motor according to the present invention described above is applied includes various kinds of subsystems including the respective components listed in the claims, and is provided with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to keep.
  • the process of assembling the exposure apparatus from various subsystems includes the mechanical connection, wiring connection of electric circuits, and piping connection of pneumatic circuits among the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. '
  • a non-conductive material having light resistance is provided in a portion for receiving a magnetic field from the outside in a cooling housing for accommodating a coil of the armature unit (for example, by exposing the light-resistant material to the outside, A non-magnetic, non-conductive material is placed adjacent to the inside)
  • a cooling housing for accommodating a coil of the armature unit (for example, by exposing the light-resistant material to the outside, A non-magnetic, non-conductive material is placed adjacent to the inside)
  • the viscous resistance force (braking force) applied to the armature during the operation can be extremely reduced, and the vibration of the armature can be reduced by the amount of current supplied to the coil of the armature unit. .
  • stage device using the above-mentioned motor as a driving means of the stage portion, precise positioning control with respect to the stage portion can be performed, so that the stage device as a whole has a high function.
  • stage apparatus as a reticle stage or a wafer stage
  • precise positioning control with respect to the stage can be performed, so that the function of the exposure apparatus can be enhanced.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Linear Motors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne une unité d'armature peu onéreuse qui permet de réduire la quantité de courants de Foucault produite dans une enceinte (chemise de refroidissement) recouvrant des bobines, difficile à détériorer même en exposition à un faisceau lumineux haute énergie. L'invention concerne également un moteur, un plateau, un appareil d'exposition et un procédé de fabrication d'appareil correspondant. Des conduits d'écoulement (33) d'agent de refroidissement sont prévus entre les bobines (31) de l'unité d'armature et l'enceinte (32) recouvrant les bobines. Les parties de l'enceinte qui reçoivent le champ magnétique de la part d'un corps magnétisant externe sont en matériau non conducteur à l'épreuve des rayonnements (32a).
PCT/JP2002/002304 2001-03-15 2002-03-12 Unite d'armature, moteur, plateau, appareil d'exposition, et procede de fabrication d'appareil correspondant WO2002075905A1 (fr)

Applications Claiming Priority (2)

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JP2001074336A JP2002272087A (ja) 2001-03-15 2001-03-15 電機子ユニット、モータ、ステージ装置、露光装置、および、デバイスの製造方法
JP2001-074336 2001-03-15

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Publication number Priority date Publication date Assignee Title
EP1465013B1 (fr) * 2003-03-11 2009-08-12 ASML Netherlands B.V. Appareil lithographique et procédé pour la production d'un dispositif
EP1457826A1 (fr) * 2003-03-11 2004-09-15 ASML Netherlands B.V. Appareil lithographique et procédé pour la production d'un dispositif
JP4415567B2 (ja) 2003-05-20 2010-02-17 株式会社安川電機 リニアモータ電機子およびこれを用いたリニアモータ
US7456527B2 (en) * 2004-03-04 2008-11-25 Asml Netherlands B.V. Moveable object carrier, lithographic apparatus comprising the moveable object carrier and device manufacturing method
JP5388853B2 (ja) * 2007-08-31 2014-01-15 Thk株式会社 リニアステッピングモータ
KR101308317B1 (ko) * 2013-03-19 2013-10-04 장석호 분할 코일체를 갖는 코일판과 분할 자석을 갖는 왕복 이동형 자석판을 이용한 발전겸용 전동장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6339456A (ja) * 1986-08-04 1988-02-19 Amada Co Ltd リニアパルスモ−タ
JPH0384385U (fr) * 1989-12-19 1991-08-27
JPH05275755A (ja) * 1992-03-25 1993-10-22 Toshiba Corp クライオスタット
US6084319A (en) * 1996-10-16 2000-07-04 Canon Kabushiki Kaisha Linear motor, and stage device and exposure apparatus provided with the same
JP2001231246A (ja) * 2000-02-18 2001-08-24 Yaskawa Electric Corp キャンド・リニアモータ
JP2002010618A (ja) * 2000-06-16 2002-01-11 Canon Inc リニアモータ、及びこれを有するステージ装置、露光装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6339456A (ja) * 1986-08-04 1988-02-19 Amada Co Ltd リニアパルスモ−タ
JPH0384385U (fr) * 1989-12-19 1991-08-27
JPH05275755A (ja) * 1992-03-25 1993-10-22 Toshiba Corp クライオスタット
US6084319A (en) * 1996-10-16 2000-07-04 Canon Kabushiki Kaisha Linear motor, and stage device and exposure apparatus provided with the same
JP2001231246A (ja) * 2000-02-18 2001-08-24 Yaskawa Electric Corp キャンド・リニアモータ
JP2002010618A (ja) * 2000-06-16 2002-01-11 Canon Inc リニアモータ、及びこれを有するステージ装置、露光装置

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