WO2002063659A1 - Dispositif de traitement de substrats - Google Patents

Dispositif de traitement de substrats Download PDF

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Publication number
WO2002063659A1
WO2002063659A1 PCT/EP2002/000613 EP0200613W WO02063659A1 WO 2002063659 A1 WO2002063659 A1 WO 2002063659A1 EP 0200613 W EP0200613 W EP 0200613W WO 02063659 A1 WO02063659 A1 WO 02063659A1
Authority
WO
WIPO (PCT)
Prior art keywords
treatment
substrate
substrates
movement
transport
Prior art date
Application number
PCT/EP2002/000613
Other languages
German (de)
English (en)
Inventor
Ulrich Speh
Klaus-Dieter Fanta
Jens Schneider
Original Assignee
Mattson Wet Products Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Wet Products Gmbh filed Critical Mattson Wet Products Gmbh
Publication of WO2002063659A1 publication Critical patent/WO2002063659A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Definitions

  • the present invention relates to a device for treating substrates, in particular semiconductor wafers, with at least two separate treatment stations.
  • the present invention has for its object to provide a device for treating substrates, in particular semiconductor wafers, with at least two separate treatment stations, which is compact and manages with a reduced footprint.
  • this object is achieved in that the treatment stations are arranged in a corner and at least one transport unit is provided between the treatment stations for transporting the wafers in a corner.
  • the treatment stations are arranged in a corner and at least one transport unit is provided between the treatment stations for transporting the wafers in a corner.
  • At least one rinsing unit is provided between the treatment stations, which preferably has at least one fluid nozzle directed towards the substrates.
  • the rinsing unit enables residues from the previous treatment, such as a chemical, to be rinsed off, and on the other hand it enables the substrates to be kept moist between two wet treatment processes and thus combines the drying of treatment liquids.
  • a single, stationary handling device is provided for loading and unloading the device, which can access the loading and unloading ends of the device due to the corner arrangement of the treatment stations.
  • At least one treatment station has at least one treatment container, which is arranged in a gas atmosphere and contains a treatment fluid, with at least two openings located below a treatment fluid surface for linear passage of the substrates in order to continuously treat the substrates during the linear movement through the treatment containers enable. Since the feed-through openings lie under a treatment fluid surface, they are treated on both sides with the treatment fluid.
  • the treatment container preferably has a width in the feedthrough direction of the substrates that is smaller than the diameter of the substrates by to enable suitable transport units in front of and behind the treatment container to move the substrates through the treatment container without having to reach into the treatment container, which could lead to contamination of the transport units and subsequent substrates.
  • the width of the treatment container in the direction of movement of the substrate is preferably smaller than half the diameter of the substrate, so that the substrate can be moved through the treatment container at least up to half with a transport unit located in front of the treatment container, thereby enabling a treatment unit behind the treatment container to be moved.
  • second transport unit lying behind can reach behind the substrate behind half of the substrate.
  • At least two treatment containers are provided which follow one another essentially directly, the common width of which in the direction of movement of the substrate is smaller than the diameter of the substrate, which means that the substrates in the above manner, can be moved through two treatment containers without the transport units having to engage in one of the treatment containers.
  • This arrangement is particularly suitable for wet chemical treatment in a first treatment container and a rinsing treatment in the second treatment container, so that the substrates have already been rinsed before they come into contact with the transport unit located behind the treatment containers.
  • a first transport device arranged in the direction of movement of the substrate in front of the treatment container for partially moving the substrate through the treatment container and a second transport device arranged in the direction of movement behind the treatment container are provided for receiving the substrates and for pulling them through the treatment container.
  • These push-pull devices move a substrate through a treatment container without one of the transport devices in the treatment container must intervene. This prevents contamination of the treatment container by the transport devices. In addition, contamination of the substrate or premature contact of the substrate with a treatment fluid adhering to the transport device is prevented.
  • the second transport device has at least one front substrate gripper and one rear side gripper in order to pick up the substrate between them and to guide them safely.
  • Two rear side grippers are advantageously provided in order to ensure good three-point mounting of the substrate.
  • the rear side grippers advantageously grip the substrate behind its largest diameter transversely to its direction of movement.
  • a common drive device for the first transport device and at least the rear side grippers of the second transport device is preferably provided.
  • the front substrate gripper of the second transport device can be selected as a passive gripper that is moved by the movement of the substrate.
  • at least the rear side grippers of the second transport device can be coupled to and uncoupled from a common drive device in order to enable a synchronized drive.
  • the treatment container has a partial area offset in relation to its edge areas in the direction of movement of the substrate.
  • the first transport device In the case of a staggered partial area on an input side of the treatment container, it is possible for the first transport device to move closer to the second transport device. If the partial area is offset on the exit side, it is possible that the rear side grippers in particular grip the substrate earlier.
  • the treatment container preferably has an arrow shape in the plane of the substrate. To achieve a homogeneous treatment of the substrate the treatment container preferably has a uniform width in the direction of movement of the substrate.
  • the treatment container has a treatment fluid inlet below the openings and an overflow above the openings, which allow treatment fluid to be continuously passed through the process container. This prevents increased contamination concentrations in certain areas of the treatment container, in particular in the linear passage area of the substrates. Furthermore, changes in the concentration of the treatment fluid (consumption during the treatment) are compensated, which ensures an improved and more homogeneous treatment of the substrates.
  • the height of the overflow is preferably adjustable in order to be able to adapt the treatment fluid level within the treatment container to the properties of the treatment fluid used. If different treatment fluids were used, different pressure ratios would result at the openings below the surface of the treatment fluid at the same fluid level, which could lead to treatment fluid flowing out of the openings. These pressure ratios can be set via the height-adjustable overflow to prevent the treatment fluid from flowing out through the opening.
  • a device for generating a negative pressure is advantageously provided in a space formed above the treatment fluid surface in the treatment container in order to be able to adjust the pressure conditions at the openings and thereby prevent treatment fluid from escaping from the openings.
  • a drying chamber surrounding an outlet opening of the treatment container is preferably provided with a device for introducing a fluid that reduces the surface tension of the treatment fluid.
  • different treatment fluids are advantageously provided in the separate treatment stations.
  • at least two treatment stations are furthermore arranged linearly with respect to one another and at least one third treatment station is arranged at a corner to the others.
  • the device is particularly suitable for the treatment of individual semiconductor wafers.
  • Figure 1 is a schematic plan view of a first embodiment of a treatment device according to the invention.
  • Figure 2 is a schematic plan view of a treatment device according to an alternative embodiment
  • Figure 3 is a perspective view of the treatment device according to the invention.
  • Figure 4 is a schematic perspective view of a treatment station according to the present invention.
  • Figure 5 is a sectional view through the treatment station according to the present invention.
  • FIG. 1 shows a device 1 for treating substrates 2 with first and second treatment stations 4, 5.
  • the treatment stations 4, 5 are attached to a common housing 7 in such a way that the treatment stations 4, 5 are arranged in a corner.
  • the treatment stations 4, 5, which are described in more detail below with reference to FIGS. 4 and 5, are treatment stations in which the substrates 2 are guided linearly through a treatment container in a horizontal position.
  • provided linear transport units provided between the treatment stations 4, 5 there is also a transport unit, not shown in FIG. 1, for transporting the substrates 2 over a corner.
  • the treatment stations 4, 5 each have two adjacent treatment containers 9, 10, 11, 12, of which the front 9, 11 in the direction of movement of the substrates each contains a chemical treatment fluid, while the rear 10, 12 in the direction of movement contains a rinsing fluid, such as, for example contains deionized water (DI water).
  • the treatment containers 9 to 12 each have a rectangular shape.
  • Figure 2 shows an alternative embodiment of a treatment device 1.
  • the same reference numerals as in Figure 1 are used, provided the same or similar elements are described.
  • the treatment device 1 according to FIG. 2 also has treatment stations 4, 5 which are arranged in a corner in a common housing 7.
  • the treatment station 4 has a single treatment container 15 which, as can be seen in the plan view, has a central part offset in relation to the side parts in the direction of movement of the substrates.
  • the input side of the treatment container 1 has the same contour as the output side, so that a treatment container with a constant width in the direction of movement of the substrates 2 is formed. Due to the offset middle part, the treatment container has an arrow shape.
  • the treatment station 5 has two treatment containers 16, 17 which, like the treatment container 15, have an arrow shape.
  • the combined width of the treatment containers 16, 17 in the direction of movement of the substrates corresponds in the west to the width of the treatment container 15 and is smaller than the diameter of the substrates 2.
  • a stationary handling device 20 is also provided.
  • the handling device 20 has three articulated joints arms 22, 23, 24.
  • the arm 22 is rotatably attached to a main body 26 of the handling device 20 and is rotatable about a fulcrum A.
  • Suitable drive and control means for the handling device 20 are arranged in the main body 26.
  • the arm 23 connects the arms 22 and 24 in an articulated manner, and a suitable gripping mechanism, such as, for example, a vacuum gripper for gripping the substrates 2, is provided at the free end of the arm 24.
  • the handling device 20 is arranged such that it is arranged at the same distance from a loading end 28 and an unloading end 29 of the device 1. Thus, the handling device 20 can be used by swiveling around the pivot point A both for loading and unloading the device 1 without being moved.
  • FIG. 3 shows a perspective view of a treatment device 1 according to the present invention.
  • the same reference numerals are used in FIG. 3 insofar as the same or similar elements are designated.
  • the treatment device 1 has treatment stations 4, 5, which are arranged in a corner on a housing 7, such as a cabinet, in which feed and discharge lines for the treatment stations and drive means for transport units are arranged in a known manner.
  • a housing 7, such as a cabinet
  • the treatment container 30 is mounted directly on the housing 7, while the treatment container 32 is mounted above the housing 7 at a suitable angle 34.
  • the treatment containers 30, 32 are arranged in different levels.
  • a transfer unit 36 is provided which can move the substrates 2 in terms of height.
  • the transfer unit 36 also serves to receive the substrates 2 from a first linear transport unit, not shown, and to transfer them to a second linear transport unit, not shown, the first linear transport unit being arranged between the treatment station 4 and the transfer station 36, and the second linear transport unit is arranged between the transfer station 36 and the treatment station 5.
  • the treatment stations 4, 5 according to FIG. 3 are arranged on different levels, this height offset is not necessary. It is also not necessary to provide two linear transport units and one transfer unit 36. Rather, a single transport unit could be provided which is suitable for conveying the substrates 2 from the first treatment station 4 to the second treatment station 4 in a corner. Between the treatment stations 4, 5 there is a rinsing device with at least one fluid nozzle directed towards the substrates, which, for example, injects DI water onto one or both of the surfaces of the substrates in order to rinse them.
  • the treatment station has a base 102, as well as a treatment container 103 and a transport device 104 attached to it.
  • the base 102 has side walls 107, 108, end walls 109, 110 and a base 111 to form a substantially rectangular box which is open at the top.
  • the treatment container 103 is suitably attached approximately centrally in the longitudinal direction of the side walls.
  • the treatment tank 103 divides the base into an input side part 114 and an output side part 115.
  • the side walls 107, 108 on the input side are higher than on the output side.
  • the side walls 107, 108 each have a recess facing their other side wall on their input edges, to form a support surface 118 and a lateral guide surface 119.
  • a semiconductor wafer 2 can, for example, on the Support surface 118 are stored, wherein it is laterally fixed by the lateral guide surfaces 119.
  • the treatment device 103 is best shown in FIG. 5.
  • the treatment device 103 has a process container 122 with an overflow container.
  • the process container 122 is filled with treatment fluid 125. which flows into the overflow tank 123 via an overflow edge 127.
  • the process container 122 has an inlet opening 129 and an outlet opening 130 opposite the inlet opening below the overflow edge 127 and thus below the treatment fluid level.
  • a support surface 132 is provided on the side walls of the process container 122, not shown, which lies at the same height as the support surface 118 of the base 102. The support surface 132 serves to guide the wafer 2 along the edges as it moves through the process container 122.
  • a drying chamber 135 is provided on an outlet side of the process container 122, in which a drying fluid is applied to the wafer 2 guided through the process container 122 via nozzles 137, 138.
  • the drying fluid is preferably a fluid which reduces the surface tension of the treatment fluid, as a result of which drying takes place in accordance with the Marangoni effect. Further details of the treatment device 103 are described in German patent application no. 199 34 300.4, which goes back to the same applicant and has not been published previously and is entitled "Device for treating substrates", which is thus made the subject of the present invention in order to avoid repetitions.
  • a push mechanism 140 is provided in the area of the input area 114 of the base 102, which together with a pull mechanism 142 forms the transport device in the area of the output side part 115 of the base 102.
  • the push mechanism 140 has a slide 144 which is connected via a suitable connecting element 145 to a guide and drive unit 146 fastened to the side wall 108 of the base 102.
  • the connector 145 is in two Rails 148, 149 of the guide and drive unit 146 are guided and are moved in a suitable, not shown manner in the direction of the treatment device 103 and away from it.
  • the pulling mechanism 142 has two opposite side grippers 152, 153 and a front gripper, which cannot be seen in FIG. 4.
  • the front gripper is relatively movable in the longitudinal direction relative to the side grippers 152, 153.
  • the side grippers 152, 153 can be moved laterally in a suitable manner in order to be able to move out of the movement path of the wafer 2 and to grip it laterally after the passage of the largest diameter transversely to the direction of movement of the wafer 2.
  • the side grippers 152 and 153 grip the wafer 2 in a side region from above and from below. This makes it possible to fix the wafer by means of the two side grippers alone without an additional front gripper. With the additional provision of the front gripper, however, it is also possible that the side grippers 152, 153 and the front gripper do not guide the wafer 2 above and below, but rather only define a support edge on which the wafer rests. Providing the three grippers would still ensure a secure hold.
  • a wafer 2 is placed on the support 118 of the side walls 107, 108 of the base 102.
  • the slide 144 is then brought into contact with the wafer 2 and pushes it in the direction of the treatment device 103. Then the slide 144 pushes the wafer 2 into the treatment device 103, where it is guided on the support surfaces 132 in the process container 122. A leading end of the wafer 2 engages with and is picked up by the front gripper.
  • the lateral grippers 152, 153 are moved out of the movement path of the wafer 2 by a lateral movement.
  • the slide 144 pushes the wafer 2 through the treatment device 103 until the slide 144 is just in front of the treatment device 103. Before the slide 144 enters the treatment device 103, it is stopped. At this time, however, the side grippers 152, 153 have moved in contact with the wafer 2 and have gripped the wafer 2 behind its largest diameter transversely to its direction of movement and are now pulling the wafer through the treatment device 103. The pulling movement by the side grippers 152, 153 is synchronized with the pushing movement of the slide 144 in such a way that the wafer 2 is moved uniformly through the treatment device 103. As soon as the wafer 2 is gripped by the side grippers 152, 153, the slide 144 is moved back so that a new wafer 2 can be deposited.
  • FIGS. 1 and 2 have a rectangular shape in the direction of movement of the substrates, it can of course also be that in the figures. 2 and 3 have the arrow shape shown, which enables a closer approach of the thrust unit to the traction unit. It is also possible to arrange two treatment containers directly adjacent to one another, as indicated in FIGS. 1 and 2. It should be noted that the treatment containers in the direction of movement of the wafer 2 have a combined width that is smaller is than the diameter of the wafer 2 and preferably smaller than half the diameter of the wafer in order to ensure a transfer between the pushing unit and the pulling unit without one of the two units having to engage in one of the treatment containers.
  • the device was previously described on the basis of preferred exemplary embodiments, it is not restricted to the specifically illustrated exemplary embodiments. In particular, combinations of the features of the different exemplary embodiments are possible.
  • different transport units are possible between the treatment stations.
  • a different movement mechanism can also be provided for the movement of the substrates through the treatment containers.
  • the treatment stations shown with treatment containers filled with treatment fluid brush cleaning stations, spin dryers, coating stations, etc. or a combination of these stations can be used, for example, the substrates preferably being treated individually in all treatment stations and kept in a constant orientation.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif permettant le traitement de substrats, notamment de tranches de semi-conducteur, ledit dispositif comprenant au moins deux stations de traitement séparées qui sont disposées à l'équerre l'une par rapport à l'autre, et au moins une unité de transport située entre les stations de traitement et servant à transporter les tranches de semi-conducteur à l'équerre.
PCT/EP2002/000613 2001-01-24 2002-01-23 Dispositif de traitement de substrats WO2002063659A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10103111.4 2001-01-24
DE2001103111 DE10103111A1 (de) 2001-01-24 2001-01-24 Vorrichtung zum Behandeln von Substraten

Publications (1)

Publication Number Publication Date
WO2002063659A1 true WO2002063659A1 (fr) 2002-08-15

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ID=7671580

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/000613 WO2002063659A1 (fr) 2001-01-24 2002-01-23 Dispositif de traitement de substrats

Country Status (2)

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DE (1) DE10103111A1 (fr)
WO (1) WO2002063659A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107393853A (zh) * 2017-06-23 2017-11-24 上海集成电路研发中心有限公司 一种后置型设备前端装载模块

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7446073B2 (ja) * 2019-09-27 2024-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN111634687B (zh) * 2020-06-04 2021-08-10 无锡亚电智能装备有限公司 一种晶圆篮清洗设备进料机构及进料方法
CN111703836B (zh) * 2020-06-16 2022-06-14 上海明略人工智能(集团)有限公司 清洗设备

Citations (6)

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Publication number Priority date Publication date Assignee Title
US4693777A (en) * 1984-11-30 1987-09-15 Kabushiki Kaisha Toshiba Apparatus for producing semiconductor devices
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
EP0817246A2 (fr) * 1996-06-24 1998-01-07 Interuniversitair Microelektronica Centrum Vzw Appareil et méthode pour le nettoyage humide ou le gravure d'un substrat plat
US5846328A (en) * 1995-03-30 1998-12-08 Anelva Corporation In-line film deposition system
JPH1144877A (ja) * 1997-07-24 1999-02-16 Nec Kagoshima Ltd 基板洗浄装置
DE19934301A1 (de) * 1999-07-21 2001-02-01 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Transportieren eines Halbleiterwafers durch einen Behandlungsbehälter

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DE19642852A1 (de) * 1996-10-17 1998-04-23 Leybold Systems Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate
DE19830162A1 (de) * 1998-07-06 2000-01-20 Steag Electronic Systems Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten
DE19921246C2 (de) * 1999-05-07 2003-06-12 Infineon Technologies Ag Anlage zur Fertigung von Halbleiterprodukten
DE19934300C2 (de) * 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4693777A (en) * 1984-11-30 1987-09-15 Kabushiki Kaisha Toshiba Apparatus for producing semiconductor devices
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US5846328A (en) * 1995-03-30 1998-12-08 Anelva Corporation In-line film deposition system
EP0817246A2 (fr) * 1996-06-24 1998-01-07 Interuniversitair Microelektronica Centrum Vzw Appareil et méthode pour le nettoyage humide ou le gravure d'un substrat plat
JPH1144877A (ja) * 1997-07-24 1999-02-16 Nec Kagoshima Ltd 基板洗浄装置
DE19934301A1 (de) * 1999-07-21 2001-02-01 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Transportieren eines Halbleiterwafers durch einen Behandlungsbehälter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107393853A (zh) * 2017-06-23 2017-11-24 上海集成电路研发中心有限公司 一种后置型设备前端装载模块
CN107393853B (zh) * 2017-06-23 2019-12-13 上海集成电路研发中心有限公司 一种后置型设备前端装载模块

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