WO2002049096A1 - Dispositif inclinable de répulsion de fluide - Google Patents

Dispositif inclinable de répulsion de fluide Download PDF

Info

Publication number
WO2002049096A1
WO2002049096A1 PCT/JP2001/010764 JP0110764W WO0249096A1 WO 2002049096 A1 WO2002049096 A1 WO 2002049096A1 JP 0110764 W JP0110764 W JP 0110764W WO 0249096 A1 WO0249096 A1 WO 0249096A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
liquid
inclination
etching
fluid
Prior art date
Application number
PCT/JP2001/010764
Other languages
English (en)
Japanese (ja)
Inventor
Kyoji Shimoda
Hitoshi Tauchi
Original Assignee
Sumitomo Precision Products Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co., Ltd filed Critical Sumitomo Precision Products Co., Ltd
Publication of WO2002049096A1 publication Critical patent/WO2002049096A1/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions

Definitions

  • the present invention relates to a transport type substrate processing apparatus used for manufacturing a glass substrate for a liquid crystal display device and the like.
  • a processing liquid is supplied from the surface of the substrate by inclining the substrate. It relates to an inclined drainage device to be eliminated.
  • a glass substrate used for a liquid crystal display device is manufactured by repeatedly performing chemical treatments such as etching and separation on the surface of a glass substrate as a material.
  • the processing equipment is roughly divided into dry type and batch type, and the batch type is further divided into batch type and single wafer type. Furthermore, the single-wafer type is subdivided into a rotary type and a transport type such as a pallet transport.
  • the transport type has a basic configuration that supplies a processing liquid to the surface of the substrate while transporting the substrate in the horizontal direction. Due to its high efficiency, etching processing and separation processing are performed. Etc. are used.
  • a transfer type substrate processing apparatus used for the etching process a large number of spray nozzles arranged in a matrix form above the substrate transfer line inject the etching liquid and pass the substrate through the etching liquid. Thus, the etchant is supplied to the entire surface of the substrate. By this shower treatment, the surface of the substrate is selectively etched except for the portion where the masking material is applied.
  • the cleaning water sprayed from the same spray nozzle The surface of the board is cleaned, but the surface of the board is cleaned before cleaning, for the purpose of quickly stopping the etching process, suppressing the contamination of the cleaning water in the initial cleaning, and reducing the waste of the initial cleaning water.
  • the etchant remaining on top is physically removed.
  • the liquid draining devices there is a tilting type in which the substrate is temporarily stopped in the middle of the transfer and is tilted to the side so that the etching solution is removed from the surface to the side.
  • a substrate processing apparatus for separation processing chemical treatment, drainage, and washing are performed in the same manner.
  • the etching solution for A1 has a higher viscosity than the etching solution for Cr. Therefore, when the substrate is tilted by the tilting type liquid draining device after the etching, the liquid draining property is deteriorated. That is, since the surface tension of the etching solution for A1 is large, a large amount of the etching solution on the surface accumulates on the side edges even due to the inclination of the substrate, and when the substrate is returned to the horizontal posture, the etching solution reappears. It spreads on the surface.
  • An object of the present invention is to provide a tilting type liquid draining device capable of efficiently removing a processing liquid from its surface without increasing the tilt angle of a substrate even when the viscosity of the processing liquid is high.
  • an inclined type liquid draining apparatus of the present invention supplies a treatment liquid to a surface of a substrate while transporting the substrate in a horizontal direction, and treats the surface of the substrate.
  • a liquid removal device main body that removes the processing liquid from above the substrate by tilting the substrate, and is disposed downstream of the substrate in the tilt direction, and flows downstream in the tilt direction as the substrate tilts.
  • the processing liquid accumulated on the side edge portion due to the inclination of the substrate travels through a number of liquid contact members that abut or approach the side edge portion at a predetermined interval over the entire length thereof. Efficiently removed from the edges.
  • the liquid contact member makes line contact or point contact with the processing liquid staying at the side edge of the inclined substrate from the viewpoint of drainage, and specifically, a substantially vertical pin-shaped member is preferable.
  • a non-contact type in which the liquid contact member approaches the side of the inclined substrate is preferable.
  • the inclined type liquid draining apparatus of the present invention can be used with other etching liquids, and even with processing liquids other than etching, although there is a difference in the effect of the force which is particularly suitable for the highly viscous A1 etching liquid. It is valid.
  • FIG. 1 is a plan view of a transfer type substrate processing apparatus using an inclined liquid draining device according to one embodiment of the present invention
  • FIG. 2 is a plan view of the inclined liquid draining device
  • FIG. -It is an X-ray arrow diagram.
  • the transport type substrate processing apparatus using the inclined liquid draining apparatus performs an A1 etching process on a glass substrate 10 for a liquid crystal display device (hereinafter simply referred to as a substrate 10).
  • the substrate processing apparatus includes a first linear line A, a second line B connected to the first line A at right angles, and a first line A connected to the second line B at right angles.
  • a U-turn type layout that combines a third line C that is in parallel with the other is adopted.
  • the first line A is configured by linearly connecting a receiving section 1, a liquid blocking section 2, an etching section 3, and a liquid removing section 4.
  • the etching unit 3 includes a shower unit 31 for spraying A1 etching water on the surface of the substrate 10 from above. Further, the liquid draining unit 4 is equipped with the inclined liquid draining device 40 according to the present embodiment, and the configuration thereof will be described later in detail.
  • the second line B is a water washing unit 5, and the substrate 10 A shower unit 51 for spraying washing water from above is provided.
  • the third line C is configured by connecting the transfer device 6, the spin dryer 7, the transfer device 8, and the take-out section 9 in a straight line.
  • the first line A and the second line B are provided with a large number of transport rollers arranged at predetermined intervals in the transport direction to transport the substrate 10 in the longitudinal direction of the line.
  • Each transport roller is a horizontal roll perpendicular to the transport direction.
  • 2nd la A turning mechanism 52 for changing the traveling direction of the substrate 10 by 90 degrees is provided at the inlet B, that is, at the entrance of the washing unit 5.
  • a 1 The substrate 10 that has undergone the etching process is carried into the receiving unit 1 by the transfer device 11.
  • the substrate 10 is moved from the liquid blocking part 2 to the etching part 3 by the roller transport, and undergoes an etching process while passing therethrough.
  • the substrate 10 that has passed through the etching unit 3 is moved to the washing unit 5 through the inclined liquid draining device 40 in the liquid draining unit 4 by roller conveyance, and the traveling direction is changed by 90 degrees. Then, it is subjected to a water washing process while moving in the water washing unit 5.
  • the substrate 10 that has moved to the outlet of the rinsing section 5 is transferred from the rinsing section 5 to the spin dryer 7 by the transfer device 6.
  • the substrate 10, which has been dried by the spin dryer 7, is transported from the spin dryer 7 to the take-out unit 9 by the transfer device 8, and further carried out of the device by the transport device 11.
  • the inclined liquid draining device 40 includes a plurality of transport rollers 41 for transporting the substrate 10 in a horizontal direction, and a transport port—a roller 41.
  • the apparatus includes a liquid draining device main body 42 for tilting the upper substrate 10 to the side in the transport direction, and a liquid draining promoting means 43 provided on one side of the liquid draining device main body 42.
  • the transport rollers 41 are horizontal drive rollers arranged at predetermined intervals in the transport direction, and the substrate 10 is point-supported by large-diameter portions 41b provided at a plurality of positions on the drive shaft 41a.
  • the positioning of the substrate 10 in the width direction is performed by the flanges 41c on both sides.
  • the liquid removal device main body 42 includes a plurality of substrate support beams 42 a supporting the substrate 10 at a plurality of positions in the transport direction, and a plurality of substrate support beams 42 a laterally in the transport direction of the substrate 10.
  • a pair of lifting and lowering devices 4 2 b and 4 2 c have.
  • the plurality of substrate support beams 42a are beams perpendicular to the transport direction arranged in parallel between the transport ports 41, and include a plurality of connecting members 42d parallel to the transport direction of the substrate 10. It is integrated. In a horizontal state without inclination, the plurality of substrate support beams 42a are located slightly below the substrate transfer surface.
  • the pair of lifting devices 4 2b and 4 2c on both sides are motor type jacks here.
  • the plurality of substrate support beams 42a are synchronized and tilted.
  • the lifting / lowering device 42 a located on the downstream side in the tilt direction raises and lowers the support member 42 e that rotatably supports one end of the plurality of substrate support beams 42 a.
  • the upper surface of one end of the substrate support beam 42a is positioned slightly above the substrate transfer surface.
  • the lifting / lowering device 42c which is located on the upstream side in the tilt direction, moves the other end of the plurality of substrate support beams 42a through the lever 42f so that the upper surface of the other end is slightly above the substrate transfer surface.
  • the plurality of substrate support beams 42a are tilted toward one end side about a rotation fulcrum at one end by moving the substrate support beam 42a up to a predetermined position and then performing a predetermined upward stroke.
  • the substrate 10 on the transport roller 42a is transferred onto the substrate support beam 42a, and is inclined at a predetermined angle to the side in the transport direction.
  • the connecting member 42c is sufficiently below the conveying roller 41 so that the substrate supporting beam 42a does not interfere with the conveying roller 41 due to the inclination of the substrate supporting beam 42a.
  • a stopper 42 g is provided at one end of the substrate support beam 42 a to prevent lateral displacement due to the inclination of the substrate 10.
  • the liquid drainage promoting means 43 has a large number of contact members 43 a arranged at predetermined intervals in the direction of transport of the substrate 10.
  • a large number of contact members 4 3a are vertical round rod-shaped thin metal pins, each upper end of which is an upper horizontal support member 4 3a. 3b and each lower end is open as a free end.
  • the drainage promoting means 43 is provided.
  • the contact members 43a are basically arranged at an equal pitch. The pitch will be described in detail later, but a stopper provided on the substrate support beam 42a is provided.
  • the contact member 43a is omitted at the position where it interferes with 42g.
  • the substrate 10 having been subjected to the etching process in the etching unit 3 enters the liquid draining unit 4 and stops at a predetermined position on the liquid draining device main body 42.
  • the substrate support beam 42a of the draining device main body 42 is waiting in a horizontal posture below the substrate transfer surface.
  • the substrate 10 stops at a predetermined position on the liquid removal device main body 42 one end of the substrate support beam 42a rises slightly, and the other end rises significantly.
  • the substrate 10 is transferred onto the substrate support beam 42a from above the transport roller 41, and further tilts laterally at a predetermined angle.
  • the etchant remaining on the surface of the substrate 10 flows to the side, and the force removed from the surface of the substrate 10 .
  • the etchant has a high viscosity for A 1
  • the side edge of the substrate 10 on the downstream side in the inclination direction approaches the many contact members 4 3 a of the liquid drainage promotion means 43, The etching solution staying at the side edge comes into contact with many contact members 43a.
  • the etchant is efficiently removed from the side edge on the downstream side in the inclined direction along each contact member 43a. Therefore, the amount of the etching liquid remaining on the side edge is small.
  • the substrate supporting beam 42a returns to the original horizontal state. As a result, the substrate 10 is transferred from the substrate supporting beam 42 a to the transport opening 41, and is transported from the liquid draining unit 4 to the washing unit 5 by driving the transport roller 41 again. .
  • the liquid draining unit 4 since the liquid is efficiently drained by the tilting type liquid draining device 40 without increasing the tilt angle of the substrate 1Q, the extension of the liquid draining time is avoided. In addition, the increase in size of the equipment is avoided.
  • the rinsing section 5 the initial cleaning is performed on the substrate 10 and the initial rinsing water is discarded because the dirt is conspicuous. However, since the amount of the etchant brought into the rinsing section 5 decreases, the initial cleaning water is discarded. Decrease.
  • the inclination angle of the substrate 10 by the inclined liquid drainage device 40 is preferably 5 to 20 degrees, particularly preferably 8 to 15 degrees. If the angle of inclination is too small, the liquid will not be drained sufficiently.
  • the arrangement pitch of the contact members 43a is preferably 2 to 15 mm, particularly preferably 3 to 8 mm. If the pitch force is too small, it will cause liquid pooling, and if it is too large, it will be difficult for the liquid to be drained between adjacent contact members, and in any case, the drainage property will decrease.
  • the dimension of the contact member 43a is preferably 1 to 8 mm, particularly preferably 2 to 4 mm, in the outer diameter of the round bar. If the outer diameter is too small, machining becomes difficult. If the outer diameter is too large, the drainage property decreases due to an increase in the arrangement pitch. Industrial applicability
  • the inclined type liquid draining device of the present invention is arranged such that the side edge portion of the inclined substrate on the downstream side in the inclination direction is brought into contact with or approaching a large number of contact members arranged along the side edge portion.
  • the processing liquid can be efficiently drained from the surface without increasing the inclination angle of the substrate. Can be removed.
  • the load in the water washing following the drainage is reduced, and the water cost is reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne un dispositif inclinable de répulsion de fluide capable faire partir le fluide de traitement d'un substrat (10) par inclinaison du substrat (10). Le dispositif comprend, au-dessus d'un côté du corps (42) du dispositif de répulsion de fluide, un organe favorisant la répulsion du fluide (43) et permettant d'incliner le substrat (10) sur un galet introducteur (41) latéralement par rapport sens d'introduction. L'organe favorisant la séparation du fluide (43) comprend en outre un grand nombre d'éléments de contact (43a) disposés à intervalles définis selon le sens d'introduction du substrat (10). En l'occurrence, lorsque le substrat (10) s'incline latéralement d'un certain angle, les éléments de contact (43a) viennent toucher le fluide de traitement descendant près du rebord latéral du substrat par rapport au sens d'inclinaison, de façon à éliminer de la zone du rebord latéral le fluide de traitement. Il en résulte que le fluide de traitement peut facilement s'éliminer de la surface du substrat sans augmentation de l'angle d'inclinaison du substrat (10), même lorsque la viscosité du fluide de traitement est élevée.
PCT/JP2001/010764 2000-12-11 2001-12-07 Dispositif inclinable de répulsion de fluide WO2002049096A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000375978A JP3579348B2 (ja) 2000-12-11 2000-12-11 傾斜式液切り装置
JP2000-375978 2000-12-11

Publications (1)

Publication Number Publication Date
WO2002049096A1 true WO2002049096A1 (fr) 2002-06-20

Family

ID=18844904

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/010764 WO2002049096A1 (fr) 2000-12-11 2001-12-07 Dispositif inclinable de répulsion de fluide

Country Status (4)

Country Link
JP (1) JP3579348B2 (fr)
CN (1) CN1398428A (fr)
TW (1) TWI254341B (fr)
WO (1) WO2002049096A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013058546A (ja) * 2011-09-07 2013-03-28 Nippon Electric Glass Co Ltd 板ガラスの位置決め装置及びその位置決め方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100687499B1 (ko) * 2004-08-23 2007-02-27 세메스 주식회사 기판 이송 장치
CN101648649B (zh) * 2009-09-03 2012-10-10 东莞宏威数码机械有限公司 真空基片传送系统
JP2013219200A (ja) * 2012-04-09 2013-10-24 Disco Abrasive Syst Ltd 切削装置
CN104923535A (zh) * 2015-06-17 2015-09-23 高金建 一种玻璃清洗装置
CN107262437B (zh) * 2017-07-31 2019-12-06 京东方科技集团股份有限公司 一种清洗装置
CN109733885A (zh) * 2019-01-21 2019-05-10 彩虹(合肥)液晶玻璃有限公司 输送设备
CN112657921B (zh) * 2020-12-23 2023-01-31 上海集成电路研发中心有限公司 深孔和深沟槽的清洗装置及清洗方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11162924A (ja) * 1997-11-27 1999-06-18 Shibaura Mechatronics Corp エッチング処理装置および処理装置
JP2000031111A (ja) * 1998-07-13 2000-01-28 Toshiba Corp ウェットエッチング方法
JP2000188317A (ja) * 1998-12-22 2000-07-04 Dainippon Screen Mfg Co Ltd 基板姿勢変更装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11162924A (ja) * 1997-11-27 1999-06-18 Shibaura Mechatronics Corp エッチング処理装置および処理装置
JP2000031111A (ja) * 1998-07-13 2000-01-28 Toshiba Corp ウェットエッチング方法
JP2000188317A (ja) * 1998-12-22 2000-07-04 Dainippon Screen Mfg Co Ltd 基板姿勢変更装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013058546A (ja) * 2011-09-07 2013-03-28 Nippon Electric Glass Co Ltd 板ガラスの位置決め装置及びその位置決め方法

Also Published As

Publication number Publication date
TWI254341B (en) 2006-05-01
CN1398428A (zh) 2003-02-19
JP2002184832A (ja) 2002-06-28
JP3579348B2 (ja) 2004-10-20

Similar Documents

Publication Publication Date Title
JP4745040B2 (ja) 基板搬送装置及び基板処理装置
CN100470754C (zh) 基板的输送装置以及输送方法
JP2008159663A (ja) 基板処理装置
JP3579348B2 (ja) 傾斜式液切り装置
JP5288383B2 (ja) 塗布処理装置及び塗布処理方法
TW548697B (en) Substrate processing device
JP2000286320A (ja) 基板搬送装置
JP2002009041A (ja) ウェット処理装置
JP3550277B2 (ja) 基板処理装置
WO2002073672A1 (fr) Dispositif de traitement de substrat
JP3622842B2 (ja) 搬送式基板処理装置
JP3866856B2 (ja) 基板処理装置
JP2019162748A (ja) 版洗浄装置および版洗浄方法
JP2003133217A (ja) 基板処理装置
JP3901635B2 (ja) 板材の酸処理設備
JP2006131389A (ja) 基板処理装置及び平流し型基板搬送装置
JP3968038B2 (ja) 基板処理方法及び基板処理装置及び現像処理方法及び現像処理装置
JP3766968B2 (ja) 基板処理方法及び基板処理装置
JP3659526B2 (ja) 基板の液切り装置
WO2005048336A1 (fr) Dispositif d'evacuation de liquide
JPH11216430A (ja) 洗浄装置
KR102638100B1 (ko) 기판 처리 장치
JP2003092284A (ja) 基板処理装置
JP3600746B2 (ja) 基板処理装置
KR200233390Y1 (ko) 웨이퍼정렬장치

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN KR US

WWE Wipo information: entry into national phase

Ref document number: 018046843

Country of ref document: CN