WO2002034856A1 - Adhesif thermofusible pour composants electroniques - Google Patents

Adhesif thermofusible pour composants electroniques Download PDF

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Publication number
WO2002034856A1
WO2002034856A1 PCT/KR2001/001814 KR0101814W WO0234856A1 WO 2002034856 A1 WO2002034856 A1 WO 2002034856A1 KR 0101814 W KR0101814 W KR 0101814W WO 0234856 A1 WO0234856 A1 WO 0234856A1
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WO
WIPO (PCT)
Prior art keywords
hot melt
weight
melt composition
electronic components
wax
Prior art date
Application number
PCT/KR2001/001814
Other languages
English (en)
Inventor
Ha-Seung Jung
Il-Won An
Soon-Cheol Choi
Original Assignee
Seong Il Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seong Il Chemical Co., Ltd. filed Critical Seong Il Chemical Co., Ltd.
Priority to AU2002214343A priority Critical patent/AU2002214343A1/en
Publication of WO2002034856A1 publication Critical patent/WO2002034856A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/14—Copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes

Definitions

  • the present invention relates to a hot melt composition for electronic components, more particularly, to a hot melt composition for adhering electronic components which is comprising about 10% to about 40% by weight of polyolepin based wax component, about 5% to about 15% by weight of polypropylene, about 10% to about 50% by weight of an butene-propylene copolymer, about 2% to about 40% by weight of dicyclopentadiene (DCPD), and about 0.1% to about 5% by weight ofpolybutene.
  • DCPD dicyclopentadiene
  • a hot melt adhesive is used as a non-solvent type adhesive which has a solid content of 100% at room temperature.
  • the hot melt adhesive is heated and molten for use, and it is adhered and applied to various matters to be adhered, and then it is followed by cooling to solidify it, by which the adhesive strength is revealed.
  • the hot melt adhesive has been used widely in packing, bookbinding or woodworking as well as electric home appliances. Since a hot melt adhesive is heated at high temperatures and molten, followed by cooling immediately after being applied, a continuous process is allowed. Also, since no volatile content is generated, applying thickness can be easily controlled and the applying can be achieved uniformly. Also, the hot melt adhesive has less risk of a fire.
  • the hot melt composition comprised three main components of a base polymer, a tackifying resin and a wax. In some cases, an antioxidant, a plasticizer, a flame retardant or the like may be further added.
  • Ethylene Vinyl Acetate (EVA) copolymer is the prime component of the hot melt composition, and polyamide, polyester, atactic polypropylene or the like have also been used as its main components. Additionally, rosin based resins, petroleum resins or the like used as the tackifier are mixed with the main components, and waxes, antioxidants, inorganic fillers, plasticizers or the like may be further added to mix with them.
  • the hot melt adhesives are provided in various forms such as pellet, block and so on, and a desired form is selected regarding to its usage or direction for use. If the temperature is lowered, the hot melt adhesive quickly adheres, that is, usually within one second, thereby allowing a continuous adhesion process. Even a liquid adhesive can be suitably applied to complicated targets such as vertical planes or downwardly sloping planes. Also, since the hot melt adhesive exhibits the maximum adhesion strength immediately after being cooled, it has an advantage that it can be used to materials that cannot be adhered by ordinary adhesives such as polyethylene or polypropylene.
  • the conventional hot melt adhesive is generally used to packaging, bookbinding, woodworking, electric or electronic fields.
  • the conventional hot melt adhesive cannot be easily applied to the electronic components since it has several problems of heat resistance, cold resistance, adhesive strength, flame retardancy, heat impact and so on.
  • the hot melt adhesive must have some preferable characteristics for mounting the electronic components on the printed circuit board (PCB).
  • the PCBs are manufactured by printing circuits which are applied cooper membrane onto the substrate of the sheet-epoxy type or the glass- epoxy type, and by removing remainder, and then many of integrated circuit (IC) or the like are mounted thereon. Therefore, the hot melt adhesive for applying electric or electronic components must have preferable electric characteristics.
  • the known hot melt compositions are mostly applied to various fields of paper or nonwoven industry and are widely used as adhesives of materials for automobile trim, they have not been satisfactory in terms of cold resistance, heat resistance. Accordingly, there has been an imperative need for development of new hot melt compositions with high-temperature heat resistance, and cold resistance, which are necessary properties for electric or electronic devices since a few technology had developed and only a few enterprises contain the technology.
  • hot melt compositions for electronics components developed adhesive which is comprising about 10% to 70% by weight of amorphous polypropylene, about 2% to 70% by weight of styrene-dien block copolymer as styrene-based thermoplastic elastomer, about 1% to 35% by weight of tackifier, and about 2% or below by weight of wax components (Refer to Korean patent publication number 96-8484), Since resistance at low and high temperature or the like by adding amorphous polypropylene into EVA-based hot melt composition may be improved (Refer to Japanese patent laid-open publication number 60-120775), the hot melt compositions using amorphous polypropylene have made intensive researches and developed. In the patent of 3M, since it uses amorphous polypropylene, and it add styrene-
  • the present inventors made intensive researches and developed a new hot melt composition for adhesion of electronic components or electric components.
  • the present inventors found that the developed hot melt composition had good cold resistance, heat resistance and resistance at low temperature as well as at high temperature, and finally completed the present invention.
  • the present invention provides a hot melt composition
  • a hot melt composition comprising of about 10% to about 40% by weight of polyolepin based wax component; about 5% to about 15% by weight of polypropylene; about 10% to about 50% by weight of an butene-propylene copolymer; about 2% to about 40% by weight of dicyclopentadiene (DCPD) resin; and about 0.1% to about 5% by weight of polybutene.
  • DCPD dicyclopentadiene
  • the polyolefin based wax component is polyethylene or polypropylene wax.
  • polyolefin based wax By using polyolefin based wax, heat resistance and melting viscosity are improved. If the wax component used is less than, it is difficult to control the melting viscosity, the workability is inferior, and a hanging loop phenomenon occurs. If the wax component used is greater than, the adhesive strength is reduced and the poor low temperature adhesion characteristic is resulted. It is more preferred that the polypropylene wax is about 5% to about 20% by weight, and the polyethylene wax is about 5% to about 20% by weight.
  • the polypropylene wax has a molecular weight of about 1,000 to about 5,000, and the polyethylene wax has a molecular weight of about 1,000 to about 3,000.
  • polyolefin based wax By using polyolefin based wax, a set time of compositions of the adhesive is improved, and by improving a characteristic of dealing the compositions by means of changing viscosity, the workability may be improved.
  • Polypropylene and butane-propylene copolymer as the base polymer which are included in the adhesive are added to allow a flexibility of the adhesive and to improve an adhesion strength, and it is preferred that the butane-propylene copolymer has a molecular weight of 1,000 to 50,000. If contents of the polypropylene and butane-propylene copolymer as the base polymer is greater than, the resultant composition becomes too soften so as to deteriorate its strength, and if less than, the resultant composition may be easily broken. It is preferred that the polypropylene is an atactic polypropylene, but a little of isotactic polypropylene or syndiotactic polypropylene may be included.
  • polybutene as another component of the hot melt invention, it improves overall characteristics of the hot melt compositions, and allows to provide tackifying, and provides essential insulating characteristic for being used in adhesive of electronic components or electric components.
  • DCPD resin In order to increasing compatibility of the components, DCPD resin is preferable used. It is preferred that the DCPD resin has a molecular weight of 1 ,000 to 50,000, which improves compatibility and adhesion.
  • additional ingredients such as a filler, a plasticizer, an anti-oxidant, a flame retardant and a colorant may be used in the hot melt component regarding to its characteristic and usage according to the present invention.
  • usable fillers include calcium carbonate and talcum
  • the plasticizer includes paraffin or naphtene based hydrocarbon oil
  • the flame retardant include halogens, phosphates and the like.
  • a process of preparing a hot melt composition is achieved by being molten and blending the above-mentioned components and preferable additional ingredients by means of the common process.
  • the wax components, polypropylene, base polymer, DCPD resin, and polybutene are sequentially provided to be molten enough, and then may be provided additional ingredients such as a filler, a plasticizer, an anti-oxidant, a flame retardant and a colorant.
  • additional ingredients such as a filler, a plasticizer, an anti-oxidant, a flame retardant and a colorant.
  • the resultant was cooled using a conveyer belt and manufactured as a chip-form hot melt composition.
  • hot melt compositions with various compositions within a range of above-mentioned compositions and compositions as Comparative Example, without including butane-propylene copolymer and polybutene are manufactured, and then characteristics such as viscosity, tensile strength at low and high temperature, and cold resistance are observed.
  • the hot melt compositions prepared were molten at about 180°C to about 220°C, applied to make test specimens and cooled to room temperature.
  • the prepared specimens were placed in constant temperature chambers maintained at temperatures of -40°C, allowed to taken out after 100 hours, and were observed by the naked eye whether occurrence of cracking or fiaking-off of the connected parts of the specimens or not.
  • hot melt composition in Comparative Examples without comprising butane-propylene copolymer and polybutene had cold resistance up to -27°C and exhibited cracking and flaking-off.
  • hot melt composition in Examples 1 to 7 according to the present invention did not occur cracking or flaking-off even at -40°C.
  • test specimens were heated at a dry oven maintained at about 80°C or about 25°C for about one hour. After one hour, the specimens were taken out and then pulled within 10 seconds by a push pull gauge at a tensile rate of 10 m /min to measure the maximum load until the test specimens were broken.
  • the hot melt composition according to the present invention exhibited a tensile adhesive strength of about 17 to about 20 kgf/cm 2 at 80 °C, compared to known hot melt compositions in Comparative Example exhibiting a tensile adhesive strength of about 9.3 kgf/cm 2 . Also, about 28 to about 33 kgf/cm 2 of a tensile adhesive strength at 25 °C was about 2 times better than, compared to known hot melt compositions in Comparative Example exhibiting a tensile adhesive strength of about 13.5 kgf/cm . Therefore, it was confirmed that the hot melt composition according to the present invention has an excellent characteristics in view of tensile adhesive strength at low temperature as well as at high temperature. Also, hot melt compositions are molten at about 180°C, and are calculated of 5350 -5850 cpa/180°C of viscosity at a 180°C, which are acceptable in the work.
  • the hot melt compositions according to the present invention may be preferable used to adhere device to a printed circuit board for electronic components, especially for monitors.
  • Example 1 (1) Preparation of hot melt composition
  • Example 2 ⁇ 7 (2) ⁇ (7) Preparation of hot melt composition
  • a hot melt chip was prepared in the same manner as in the above-mentioned Example 1 using different kinds of wax, base polymer, tackifying resin and polybutene. The components and contents of the respective compositions are listed in Table 1.
  • the hot melt compositions prepared in Examples were molten at about 180°C to about 220°C, applied to make test specimens which are connected PCB and Aluminum electrolytic condenser and cooled to room temperature.
  • the prepared specimens were placed in constant temperature chambers maintained at temperatures of -40°C, allowed to taken out after 100 hours, and were observed by the naked eye whether occurrence of cracking or flaking-off of the connected parts of the specimens or not.
  • hot melt composition composed of component materials listed in Table 2 are used as a comparative example.
  • hot melt composition in Comparative Examples which did not compose of butane-propylene copolymer and polybutene had cold resistance up to - 20°C and exhibited cracking and flaking-off at -30°C or below.
  • hot melt composition in Examples 1 to 7according to the present invention did not occur cracking or flaking-off even at ⁇ 40°C. Therefore, it was confirmed that the hot melt composition according to the present invention had so good cold resistance as to withstand at -40°C at a minimum. The results are listed in Table 3.
  • Hot melt composition in the Example 1 to 7 and in the Comparative Example 1 to 2 are molten at about 180°C to 220°C, and are calculated a viscosity at a 180°C (cps/180°C) by using viscometer, for example, Tokyo Keoki BL Type viscometer made in Japan. The results are shown in Table 4.
  • the hot melt composition in Example 1 to 7 according to the present invention was molten at about 180°C to about 220°C, applied to an adhesion surface of a prepared target to be coated within 5 seconds and allowed to stand at room temperature for about 1 hour.
  • the target was prepared by placing two specimens made of steel and each having a length of 100 ⁇ 0.5 mm and a width of 25 ⁇ 0.5 mm, such that one specimen lays over the other by 12.55 ⁇ 0.5 mm, and coating the hot melt adhesive therebetween. Thereafter, test specimens were heated at a dry oven maintained at about 80°C or about 25°C for about one hour. After one hour, the specimens were taken out and then pulled within 10 seconds by a push pull gauge at a tensile rate of 10 mm/min to measure the maximum load until the test specimens were broken. The measurement results are shown in Table 5.
  • the hot melt composition according to the present invention exhibited a tensile adhesive strength of about 17 to about 20 kgf/cm 2 at 80 °C, compared to known hot melt compositions in Comparative Example exhibiting a tensile adhesive strength of about 9.3 kgf/cm . Also, about 28 to about 33 kgf/cm of a tensile adhesive strength at 25 °C was about 2 times better than, compared to known hot melt compositions in Comparative Example exhibiting a tensile adhesive strength of about 13.5 kgf/cm 2 . Therefore, it was confirmed that the hot melt composition according to the present invention has an excellent characteristics in view of tensile adhesive strength at low temperature as well as at high temperature.
  • the hot melt composition according to the present invention has excellent adhesive strength, its cold resistance, heat resistance and heat impact strength. Accordingly, the hot melt composition according to the present invention may be effectively used in the electric/electronic field such as a connection electric/electronic components, for example, a connection some devices to printed circuit board, which are required cold resistance, heat resistance and resistance at a low temperature and at a high temperature or the like.
  • a connection electric/electronic components for example, a connection some devices to printed circuit board, which are required cold resistance, heat resistance and resistance at a low temperature and at a high temperature or the like.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une composition thermofusible pour composants électroniques, et plus particulièrement, une composition thermofusible utilisée pour faire adhérer des composants électroniques. Cette composition comprend environ 10 à 40 % en poids de cire polyoléofinique, environ 5 à 15 % en poids de polypropylène, environ 10 à 50 % en poids de copolymère de butène-propylène, environ 2 à 40 % en poids de dicyclopentadiène (DCPD), et environ de 0,1 à 5 % en poids de polybutène. La composition thermofusible de l'invention présente une excellente résistance à l'extension à basse température et à température élevée, nécessaire à la fabrication d'une carte de circuit imprimé pour composants électriques ou électroniques, en particulier des moniteurs. Elle possède une résistance au froid, une stabilité à température élevée, et une thermorésistance améliorées par rapport aux compositions thermofusibles classiques. De ce fait, on peut utiliser cette composition thermofusible pour fabriquer des composant électroniques.
PCT/KR2001/001814 2000-10-27 2001-10-26 Adhesif thermofusible pour composants electroniques WO2002034856A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002214343A AU2002214343A1 (en) 2000-10-27 2001-10-26 Hot-melt adhesive for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2000/63380 2000-10-27
KR10-2000-0063380A KR100400876B1 (ko) 2000-10-27 2000-10-27 전자부품용 핫멜트 조성물

Publications (1)

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WO2002034856A1 true WO2002034856A1 (fr) 2002-05-02

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Country Status (3)

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KR (1) KR100400876B1 (fr)
AU (1) AU2002214343A1 (fr)
WO (1) WO2002034856A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059384B2 (en) 2007-07-31 2011-11-15 Samsung Electronics Co., Ltd Printed circuit board reinforcement structure and integrated circuit package using the same
US8242198B2 (en) 2008-06-09 2012-08-14 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8283400B2 (en) 2008-06-09 2012-10-09 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8431643B2 (en) 2009-05-29 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and method of making thereof
US8431642B2 (en) 2008-06-09 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and articles made therefrom
CN104926972A (zh) * 2015-06-10 2015-09-23 辽阳辽化奇达化工有限责任公司 一种非晶态ɑ-烯烃共聚物及其在制备无纺布热熔胶中的应用
US10101773B2 (en) 2016-04-08 2018-10-16 Microsoft Technology Licensing, Llc Non-woven material device covering
CN109562001A (zh) * 2016-08-03 2019-04-02 H.B.富乐公司 弹性附接热熔融粘合剂组合物及由其制备的一次性吸收制品

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KR20020075317A (ko) * 2002-07-12 2002-10-04 부성폴리콤 주식회사 폴리 올레핀 형태의 열용융형 접착제 조성물
KR100657427B1 (ko) * 2006-04-19 2006-12-14 주식회사 제알코 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트
KR101040292B1 (ko) * 2009-06-19 2011-06-10 주식회사 엠엠테크 기판의 단면 박형화방법, 단면 박형화용 기판고정지그 및 이를 이용한 박형화시스템
KR101703894B1 (ko) 2015-03-23 2017-02-14 주식회사 청하 핫멜트 필름을 이용한 자동차 내장용 표피제 성형장치 및 이를 이용한 성형방법
KR20240009197A (ko) 2022-07-13 2024-01-22 (주)아셈스 재활용 핫멜트
KR20240009199A (ko) 2022-07-13 2024-01-22 (주)아셈스 재활용 핫멜트를 이용한 전자부품
KR20240009198A (ko) 2022-07-13 2024-01-22 (주)아셈스 재활용 핫멜트 제조방법
KR20240009619A (ko) 2022-07-14 2024-01-23 (주)아셈스 친환경 핫멜트 제조방법
KR20240009620A (ko) 2022-07-14 2024-01-23 (주)아셈스 친환경 핫멜트를 이용한 자동차 헤드라이너
KR20240009618A (ko) 2022-07-14 2024-01-23 (주)아셈스 친환경 핫멜트

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US4749739A (en) * 1986-11-25 1988-06-07 Eastman Kodak Company Low viscosity hot-melt adhesives
JPH03199282A (ja) * 1989-12-27 1991-08-30 Mitsui Toatsu Chem Inc ホットメルト接着剤組成物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059384B2 (en) 2007-07-31 2011-11-15 Samsung Electronics Co., Ltd Printed circuit board reinforcement structure and integrated circuit package using the same
US8242198B2 (en) 2008-06-09 2012-08-14 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8283400B2 (en) 2008-06-09 2012-10-09 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8431642B2 (en) 2008-06-09 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and articles made therefrom
US8431643B2 (en) 2009-05-29 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and method of making thereof
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