AU2002214343A1 - Hot-melt adhesive for electronic components - Google Patents

Hot-melt adhesive for electronic components

Info

Publication number
AU2002214343A1
AU2002214343A1 AU2002214343A AU1434302A AU2002214343A1 AU 2002214343 A1 AU2002214343 A1 AU 2002214343A1 AU 2002214343 A AU2002214343 A AU 2002214343A AU 1434302 A AU1434302 A AU 1434302A AU 2002214343 A1 AU2002214343 A1 AU 2002214343A1
Authority
AU
Australia
Prior art keywords
hot
electronic components
melt adhesive
melt
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002214343A
Inventor
Il-Won An
Soon-Cheol Choi
Ha-Seung Jung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEONG IL CHEMICAL CO Ltd
Original Assignee
SEONG IL CHEMICAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEONG IL CHEMICAL CO Ltd filed Critical SEONG IL CHEMICAL CO Ltd
Publication of AU2002214343A1 publication Critical patent/AU2002214343A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/14—Copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
AU2002214343A 2000-10-27 2001-10-26 Hot-melt adhesive for electronic components Abandoned AU2002214343A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR0063380 2000-10-27
KR10-2000-0063380A KR100400876B1 (en) 2000-10-27 2000-10-27 hot-melt adhesive for electronic components
PCT/KR2001/001814 WO2002034856A1 (en) 2000-10-27 2001-10-26 Hot-melt adhesive for electronic components

Publications (1)

Publication Number Publication Date
AU2002214343A1 true AU2002214343A1 (en) 2002-05-06

Family

ID=19695710

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002214343A Abandoned AU2002214343A1 (en) 2000-10-27 2001-10-26 Hot-melt adhesive for electronic components

Country Status (3)

Country Link
KR (1) KR100400876B1 (en)
AU (1) AU2002214343A1 (en)
WO (1) WO2002034856A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030004493A (en) * 2001-07-05 2003-01-15 주식회사 단양솔텍 Composition of hot melt adhesive for binding the coil and core of a deflection york and method for manufacturing of hot melt adhesive using the same
KR20020075317A (en) * 2002-07-12 2002-10-04 부성폴리콤 주식회사 An adhesive material form of poly olefine
KR100657427B1 (en) * 2006-04-19 2006-12-14 주식회사 제알코 Composition for coating and sheet for processing hole of pcb using thereof
KR101354372B1 (en) 2007-07-31 2014-01-23 삼성전자주식회사 Reinforce for printed circuit board and integrated circuit package using the same
US8283400B2 (en) 2008-06-09 2012-10-09 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8431642B2 (en) 2008-06-09 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and articles made therefrom
US8242198B2 (en) 2008-06-09 2012-08-14 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8431643B2 (en) 2009-05-29 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and method of making thereof
KR101040292B1 (en) * 2009-06-19 2011-06-10 주식회사 엠엠테크 Etching method using hotmelt-zig for fixing substrate
KR101703894B1 (en) 2015-03-23 2017-02-14 주식회사 청하 Forming device and its forming method of built skin agent for car using hot melt film
CN104926972B (en) * 2015-06-10 2017-05-17 辽阳辽化奇达化工有限责任公司 Amorphous alpha-olefin copolymer and application thereof in preparation of non-woven fabric hot melt adhesive
US10101773B2 (en) 2016-04-08 2018-10-16 Microsoft Technology Licensing, Llc Non-woven material device covering
CN109562001A (en) * 2016-08-03 2019-04-02 H.B.富乐公司 Resilient attachment hot-melt adhesive composition and disposable absorbent article prepared therefrom
KR20240009197A (en) 2022-07-13 2024-01-22 (주)아셈스 Recycling Hot-melt film
KR20240009199A (en) 2022-07-13 2024-01-22 (주)아셈스 Electronic Coomponents using Hot-melt film
KR20240009198A (en) 2022-07-13 2024-01-22 (주)아셈스 Manufacture method of Recycling Hot-melt film
KR20240009618A (en) 2022-07-14 2024-01-23 (주)아셈스 Eco-Friendly Hot-melt film
KR20240009620A (en) 2022-07-14 2024-01-23 (주)아셈스 Automobile Headliner using Eco-Friendly Hot-melt film
KR20240009619A (en) 2022-07-14 2024-01-23 (주)아셈스 Manufacture method of Eco-Friendly Hot-melt film

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60120775A (en) * 1983-12-05 1985-06-28 Koito Mfg Co Ltd Hot-melt type sealing agent for lighting instrument
US4749739A (en) * 1986-11-25 1988-06-07 Eastman Kodak Company Low viscosity hot-melt adhesives
JPH03199282A (en) * 1989-12-27 1991-08-30 Mitsui Toatsu Chem Inc Hot-melt adhesive composition
US5441999A (en) * 1993-10-15 1995-08-15 Reichhold Chemicals, Inc. Hot melt adhesive
KR970004082B1 (en) * 1994-08-19 1997-03-25 현대전자산업 주식회사 Power saving circuit for display unit
KR100197797B1 (en) * 1996-06-24 1999-06-15 이봉주 Hotmelt resin for polypropylene foaming
KR100314881B1 (en) * 2000-06-24 2001-12-22 정하승 Polyolefin-based hot melt adhesive for deflection yoke

Also Published As

Publication number Publication date
KR20020032748A (en) 2002-05-04
WO2002034856A1 (en) 2002-05-02
KR100400876B1 (en) 2003-10-08

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