KR101040292B1 - Etching method using hotmelt-zig for fixing substrate - Google Patents

Abstract

The present invention relates to a cross-sectional etching or thinning method of a substrate using a substrate fixing jig for thinning the cross-section, specifically, the first step of fixing one side and the jig of the thinned substrate through the hot-melt, and the cross-section of the substrate to thin the hot melt Characterized by consisting of two steps to remove the jig to remove.

According to the present invention, in a cross-sectional etching or cross-sectional thinning operation of the substrate, a manufacturing process for easily fixing the substrate to the jig using a hot melt, and the jig and the substrate can be easily separated by removing the hot melt after the etching or thinning process By providing a, it is possible to significantly reduce the defect rate by improving the airtightness of the substrate and the jig in the thinning process of the substrate, and further improve the efficiency of the substrate thinning process by improving acid resistance and peelability.

Substrate etching, hot melt, jig

Description

Substrate thinning method of substrate, substrate fixing jig for thinning section and thinning system using same {Etching method using hotmelt-zig for fixing substrate}

The present invention relates to a technique for etching, patterning and thinning the cross section of a substrate.

Recently, in accordance with the development of the semiconductor and display equipment industries and the needs of consumers who want light and thin products, the development of a technology for thinning a display panel manufactured in a glass-bonded form is urgently required. In addition, more specifically, much attention has been paid to etching techniques for patterning fine patterns on a substrate.

That is, the thickness of the glass used for the substrate of the LCD, etc. is required to be ultra-thin in accordance with the flow of thinning of the equipment, this thinning technique is made through the etching of the display panel (Panel). The conventional technique for thinning a panel by using a conventional chemical etching method is a dip method, a spray method, and the like.

Particularly, in the case of the cross-sectional etching in which the end surface of the substrate is etched or slimmed (thinned) by supplying the etching solution from the outside of the large glass substrate, such as the spraying method, the process is generally performed as shown in FIG. 1.

First, a protective film 3 (tape, etc.) is formed on the substrate stage 1 to fix the substrate so that the substrate can be fixed in close contact with the substrate, and the substrate 2 is brought into close contact with the substrate. After that, the etching solution is supplied to one surface of the substrate through the etching module 4 to perform etching. However, this etching process is performed in a state in which the thickness of the substrate before the etching is a certain degree or more, and after the etching is finished with a very thin thickness, after the sealing material is removed and the tape is removed The functional film is damaged or the circuit on the back surface of the substrate is damaged. In addition, the method using such a tape also has a problem that the static electricity generated, the defect of the pattern is caused by the foreign matter remaining after the removal of the tape.

As an attempt to improve this, a method of fixing one surface of a substrate using a vacuum chuck has been proposed. However, as the size of the substrate increases, the size of the vacuum chuck also increases to maintain the vacuum continuously. This will cause a very difficult problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to easily fix a substrate to a jig by using hot melt, and to perform an etching or thinning process in a process of etching or slimming (thinning) a cross section of the substrate. After that, to remove the hot melt to provide a manufacturing process that can easily separate the jig and the substrate.

The present invention has been made to solve the above problems, the present invention is a step of fixing the surface and the jig of the substrate to be thinned through the hot melt; It is possible to provide a method for thinning the cross-section of the substrate, including; step 2 of separating the jig by removing the hot melt after thinning the cross-section of the substrate.

In addition, the jig used in the process is preferably used having a hot melt coating portion formed in a spaced apart structure of the inner frame and the outer frame. Specifically, the hot melt coating part formed on the jig is formed of a structure in which the inner frame and the outer frame are connected to at least one support part, and the separation space except the connection portion of the inner frame and the outer frame and the support part is penetrated. .

The hot melt used in the thinning method according to the invention is characterized in that it has a thermal reversibility.

The jig used in the above-described thinning process according to the present invention includes a hot melt coating part having a through structure in which an inner frame and an outer frame are spaced apart from each other; It comprises at least one support portion for connecting the inner frame and the outer frame.

In particular, the hot melt coating portion of the jig can be formed to be provided with at least one or more. More preferably, the width of the hot melt coating portion may be formed to 2 ~ 10mm.

In addition, the cross-sectional thinning process using the combination of the jig provided with the substrate and the hot melt coating unit according to the present invention can be implemented by modifying the etching solution supply module for supplying the etching solution in the upper or side portion of the substrate in various structures. . The etchant supply module can be utilized in various ways by incorporating a process using a jet nozzle, aberration type module, a top-down etchant supply module, and an etchant receiving part to deposit and etch.

According to the present invention, in a cross-sectional etching or cross-sectional thinning operation of the substrate, a manufacturing process for easily fixing the substrate to the jig using a hot melt, and the jig and the substrate can be easily separated by removing the hot melt after the etching or thinning process By improving the airtightness of the substrate and jig in the thinning process of the substrate, the defect rate can be significantly lowered, and the hot melt can improve the efficiency of the substrate thinning process by applying a specification that can ensure sufficient acid resistance and peelability. It has an effect.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention.

Referring to Figures 2a and 2b, Figure 2a shows a working state diagram for implementing a method of thinning the cross section of the substrate of the present invention. In the present invention, 'thinning' is a concept encompassing a process of etching a substrate, forming a thin substrate or patterning the substrate. The present invention basically describes the case where the substrate is etched in cross section as a preferred embodiment. In the present invention, in the step of thinning the substrate, in the step of etching or thinning the substrate, the substrate is easily fixed to the jig by using hot melt, and the jig and the substrate can be easily separated by removing the hot melt after the etching or thinning process. To make it possible.

In the present invention, the substrate 100 requiring cross-sectional etching is divided into a surface 100b which requires thinning such as etching or patterning and a surface 100a which should not be etched. Conventionally, the surface 100a, which should not be etched, is fixed by tape or supported by vacuum adsorption, and only one surface of the substrate is etched by spraying or ejecting the etching solution from the upper or front surface of the substrate. The airtightness with the fixing members such as tape is not perfect, the presence of residual material during peeling does not ensure the accuracy of etching, and the defect rate is remarkably increased. Yes is as described above. Therefore, the present invention implements a thinning system for fixing the substrate using a hot melt to solve this problem.

Specifically, the substrate 100 and the jig 200 are brought into close contact with each other, and a heated liquid hot melt is applied to the hot melt applying part 230 of the jig 200 in close contact with the substrate 100. As a result, the substrate 100 and the jig 200 are completely fixed. The hot melt used in this process refers to an adhesive material having a reversible reaction that becomes soluble by heating to form a gel state, and exhibits adhesive strength in the cooling process after application.

That is, when the jig is placed on the substrate and the heated liquid hot melt is applied, the hot melt cools and hardens, and the jig and the substrate are attached to each other in the process, and the cured hot melt is in a state of securing acid resistance and airtightness.

The etching solution is discharged from the front surface of the substrate or the upper surface of the substrate while the bonded substrate and the jig structure are erected, thereby reducing the thickness of the surface 100b that requires etching on the substrate.

After the thinning operation is completed, the hot melt applied to the substrate and the hot melt applied to the hot melt coating unit 230 are bonded to each other and integrated, so that the cured hot melt can be easily removed. The cured hot melt is hardened in an already hardened state in an etching process, and the hot melt has a property of being easily peeled off the jig. When the hot melt is removed, the substrate and the jig are easily separated.

In this very simple process, the airtightness between the substrate and the jig is perfectly maintained, thereby preventing the portion 100b of the substrate from being etched completely from the etching solution, and the problem of residual material due to the conventional tape attachment. Does not remain at all, enabling a very reliable process. In addition, since the removed hot melt is a reversible reaction material that can be used again in the process by heating again, the advantage of minimizing the loss of material costs is also realized.

As shown in FIG. 2B, the jig 200 basically includes an inner frame 210 and an outer frame 220, and the inner frame and the outer frame are spaced at a predetermined interval to form a hot melt coating part 230. It is preferable to. The hot melt coating unit 230 is formed in a structure through which spaced spaces penetrate, and the inner frame and the outer frame are preferably fixed to each other by at least one or more support units 240 to form a stable structure.

Referring to FIG. 2C, the support part 240 is a structure for stably maintaining the gap between the inner frame 210 and the outer frame 220 so that the spacing space (hot melt coating part) can be constantly maintained. It is preferable that at least one said support part is provided.

The support unit 240 is preferably formed integrally with the inner frame and the outer frame to perform the function of fixing the inner frame and the outer frame to maintain the separation space, otherwise the inner frame and the frame so as to adjust the length of the support itself It is also possible to form a fixing hole of the support in the outer frame, and to control the width of the separation space by varying the length of the support member fixed to the fixing hole as necessary. In addition, the support member itself may be formed in two stages so that the length of the support member itself can be adjusted by a screw thread.

Referring to FIG. 2D, the hot melt coating unit 230 has a through structure as a space between the inner frame and the outer frame, and has a structure in which at least one support part is disposed, and the hot melt 120 in the above-described process. When applied to the hot melt coating portion, the presence of the support 240 allows to serve as a fixing element to allow the hot melt to be placed stably. Of course, if the hot melt is cured and removed after the thinning process is finished, the hot melt can be naturally separated from the support. This is because when the hot melt is cured, the hot melt which has a certain hardness is excellent in the separability in which the hot melt is separated in series.

As an example of the hot melt used in the present invention, the hot melt may include a thermoplastic resin and a wax. The hot melt material is about 105 ° C. or less (eg, 30 to 105 ° C.). More preferably 100 ° C. or less (eg, 30 to 100 ° C.), most preferably 40 to 80 ° C. Examples of thermoplastic resins that can be used include polyethylene (PE); Polybutene; Polyolefin copolymers such as ethylene copolymers or modified polyolefin polymers such as ethylene / ethyl acrylate copolymer (EEA), ethylene / ethyl acrylate / maleic anhydride (ethylene / ethyl acrylate / maleic anhydride) copolymer (EEAMAH), ethylene / glycidyl methacrylate copolymer (EGMA, ethylene / glycidyl methacrylate copolymer), ethylene / methacrylic acid copolymer (EMAA, ethylene / methacrylic acid copolymer), ethylene / vinyl acetate Copolymers (EVA, ethylene / vinyl acetate copolymer) and ionomer resins (IONO); Thermoplastic elastomers such as butadiene elastomers (TPE-B), ester elastomers (TPE-E) and styrene / isoprene elastomers (TPE-SIS); Thermoplastic polyesters; Polyamide resins such as polyamide 12 copolymers; Polyurethanes; Polystyrene resins; Cellophane; Polyacrylonitrile; Acrylic resins such as methyl methacrylate; Polyvinyl chloride resins such as vinyl chloride / vinyl acetate copolymers. In addition, the hot melt according to the present invention may be used alone or in a mixture thereof.

The hot melt may include only the hot melt material, but it may contain other components (additives) within a range in which properties (meltability, peelability, etc.) do not decrease. Examples of such additives include tackifiers, plasticizers, softeners, fillers and antioxidants. The hot melt may be composed of a single layer, but may also have a multi-layered structure of two or more layers, each the same or different. That is, it is also possible to use the same material or different materials for the hot melt applied to the substrate and the hot melt applied to the hot melt coating part in the present thinning process.

Referring to FIG. 3, which illustrates another embodiment of the jig 200 used in the present invention, the jig according to the present invention may be formed so that at least one hot melt coating unit 230 may be formed. In other words, a plurality of structures may be formed inside the hot met coating part 230, and a plurality of structures connecting the hot melt coating part 250 to the support part 260 may be used to more fully adhere to the substrate and the jig. The advantage of being able to form can be realized. The width of the hot melt coating unit according to the present invention may be formed to 2 ~ 10mm. Of course, it is also possible to apply the width of the thinner according to the size of the target glass.

An example of implementing an etching system for implementing a thinning such as etching using a thinning system using a jig and a hot melt according to the present invention described above is as follows.

The thinning system may be formed by a structure including an etching solution supply module for discharging the etching solution from the front surface or the upper surface of the substrate while the structure fixed by the jig in close contact with the substrate and the hot melt is formed.

The etchant supply module has a structure of spraying the etchant from the front of the substrate by a spray method, or a structure of dropping the etchant from the top surface of the substrate in a free-falling manner, to form an etchant supply module in a combination of the two It is also possible. In particular, the bonding between the jig and the substrate via the hot melt according to the present invention is very easy in terms of hermeticity, and thus it is also applicable to the deposition method for depositing in an etchant.

Substrate protection film or tape for use when etching the surface that is unnecessary when etching the substrate by wet etching the substrate using the hot melt jig according to the present invention, which is used for the etching of the surface of a conventional substrate. It is possible to prevent damage to the functional film of the substrate and circuit damage of the substrate generated in the process of removing the sealing, etc. can be utilized to apply a variety of etching methods.

In particular, a preferred embodiment of the etching system using a jig using a hot melt according to the present invention will be described below.

4A and 4B, FIG. 4A illustrates a top-down etching solution supply module 300 or a substrate for vertically maintaining a substrate through a jig 200 according to the present invention and supplying an etching solution from an upper portion of the substrate 100. The etching system for performing the etching through the aberration-type etching solution supply module 400 for supplying the etching solution in the side of the.

As shown in the illustrated embodiment, the jig 100 according to the present invention is brought into close contact with the substrate by using a hot melt, and the etching system for etching the cross section of the substrate is formed of only the aberration type etching solution supply module 400 described above, or a top down etching solution supply module. It may be formed by only 300, or by combining them.

Unlike the etching solution supply module using the conventional injection nozzle, the aberration type etching module 400 is an etching solution supply module having a structure in which the injection nozzle is removed, and there is no fear of the injection nozzle being clogged. Can be formed by combining a plurality of modules, and the etching conditions such as the discharge angle and the discharge amount of the etching solution can be formed differently for each of a plurality of aberration type etching modules, thereby improving the efficiency of the etching operation. Will have

Referring to FIG. 4B, the aberration type etching module 400 is provided with an etching drum D having an etching solution therein and having an opening formed on an outer circumferential surface thereof. It comprises a rotating module (X) for discharging the etching liquid to the opening through the rotation. In particular, the rotation module (X) preferably comprises at least one unit rotation module having a rotary blade 410 formed on the rotating shaft 420 penetrating the inside of the etching drum (D).

Specifically, the etching drum D has an accommodating space therein for accommodating the etchant, and has an opening 430 in which a part of the outer circumferential surface is opened or the structure is entirely sealed. Therefore, the etching drum of the present invention can be configured in the shape of a hermetic structure in which an etching solution is accommodated and an opening is formed, and preferably, the cylindrical structure has a structure in which a predetermined portion is opened. In addition, the etching drum is supplied with an etching solution from the etching solution supply unit P for supplying the etching solution from the outside, and the etching solution circulation portion for circulating and recovering the etching solution used or overflowed from the etching drum D again to the etching solution supply unit P (not shown). C) more preferably.

The rotary blade 410 formed in the unit rotation module is rotated at a high speed by the axis, and discharges the etching liquid contained in the etching drum (D) through the opening 410. In this case, the etching liquid may move along the inner surface of the etching drum and be discharged to the first discharge surface 430a or vice versa through the second discharge surface 430b according to the rotational direction of the shaft. That is, the direction of discharge can be adjusted in the direction of rotation of the motor. That is, the aberration type etching module can adjust the discharge angle or the discharge direction by adjusting factors such as the arrangement of the etching drum, the width (angle) of the opening, the rotation direction of the rotary module, and the like. B It is also possible to adjust the supply amount of the etching liquid by adjusting the length or width of the rotary blade of the rotary module, the aberration type etching module according to the present invention has the advantage that can be constructed to the etching system according to the process conditions very efficiently do.

As another embodiment, the etching system according to the present invention may be constructed by using the downward etching solution supply module 300 illustrated in FIG. 4A as an etching supply module.

Top down etching solution supply module to discharge the etching solution from the upper portion of the substrate 100 fixed to the jig 100 according to the present invention to freely fall along the surface of the substrate, thereby thinning the substrate or forming a pattern (P) 300 can be formed.

The downward etching solution supply module 300 includes an etching solution accommodating part 310 and an etching liquid transmitting slit 320 formed on an upper surface of the etching solution accommodating part. In this case, a buffer partition wall 340 may be formed inside the etching solution accommodating part 310 to prevent a rapid increase in flow rate of the etching solution. A plurality of buffer holes 341 may be formed on the buffer partition wall. That is, when the etchant is supplied to the etchant receiving part 310 through the etchant input part 350, the etchant naturally fills up into the etchant accommodating part, and in this case, the buffer bulkhead 340 adjusts a sudden synergistic action of the etchant. The etchant is filled at one speed, and finally the etchant overflows through the etchant through slit 320 and moves to the lower guide portion 330 along the outer surface of the etchant containing portion. In this case, the etchant transmission slit may further include an induction groove 321 for inducing the flow of the etchant. The guide part 330 may be formed of two spaced blade blades, and the etching solution temporarily collected at the end of the guide part may freely fall off the etching solution E so as to flow along the surface of the substrate at the top of the substrate. .

The above-described top-down etching solution supply unit 300 can improve the uniformity of etching by eliminating problems such as clogging of the injection nozzle, formation and accumulation of sludge, and formation of fine scratches on the substrate, which are problems of etching using the injection nozzle. Will be.

Of course, the etching system according to the present invention may be formed in a structure that combines the above-described aberration-type etching solution supply module 400 and the downward etching solution supply module 300.

In another modified embodiment according to the present invention, as shown in FIG. 5, at least one or more aberration-type etching liquid supply modules 400 are disposed, and the etching of the structure having at least one spray nozzle 400 is provided thereto. It can also be implemented as a system.

Of course, in the etching system using the vacuum substrate jig according to the present invention, the etching solution supply module may be formed only by a structure in which a conventional spray nozzle is disposed on the upper side or the side of the substrate, and the spray type etching liquid composed of the spray nozzle on the upper portion of the substrate. It is also possible to form the supply module and to form the aberration type etching solution supply module described above or a combination structure as shown in FIG. 5 on the side of the substrate.

In addition, it may also be formed in a structure formed by adding the top-down etching solution supply module shown in Figure 4a to the embodiment of FIG.

As described above, the structure that implements the thinning by closely contacting the jig using the hot melt according to the present invention to the substrate, can be used in combination with a variety of etching solution supply module, in any case to ensure the airtightness of the jig and the substrate effective cross section As well as the etching can be implemented, there is an advantage that can easily remove the hot melt after etching to provide a reliable product.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

1 is a conceptual diagram of a method of etching a substrate according to the prior art.

2A to 2D show a method of thinning a substrate according to the present invention and the structure of a jig used therein.

Figure 3 shows another embodiment of the substrate holding jig according to the present invention.

4A or 4B illustrate various application examples of constructing an etching system using the structure of a substrate and a jig according to the present invention.

Claims (16)

Fixing a surface and a jig of the substrate to be thinned through a hot melt; After thinning the cross-section of the substrate to remove the hot melt 2 steps to separate the jig; The jig has a thin cross-section of the substrate characterized in that it comprises a hot melt coating formed in a spaced apart structure of the inner frame and the outer frame. delete The method according to claim 1, The hot melt coating part is connected to the inner frame and the outer frame at least one support, A method for thinning the cross-section of a substrate, wherein the space apart from the inner frame, the outer frame, and the connection part of the support part is formed to penetrate. The method of claim 3, The hot melt has a cross-sectional thinning method of the substrate, characterized in that the thermal reversibility. In the jig for fixing the substrate to be thinned, Hot melt coating portion of the penetrating structure is formed spaced apart from the inner frame; At least one support connecting the inner frame and the outer frame; Substrate thinning substrate fixing jig comprising a. The method according to claim 5, At least one hot melt coating portion is provided with a substrate fixing jig for thinning the cross section. The method according to claim 5 or 6, The width of the hot melt coating portion is fixed to the cross-section thinner substrate jig characterized in that formed in 2 ~ 10mm. A substrate fixing jig including a hot melt coating part having a through structure in which an inner frame and an outer frame are spaced apart from each other, and at least one support part connecting the inner frame and the outer frame; A substrate fixed to a hot melt applied to the hot melt coating part by bringing the substrate fixing jig into close contact with one surface thereof; An etchant supply module for supplying an etchant to the substrate; Cross-sectional thinning system of the substrate comprising a. The method according to claim 8, And the etching solution supply module further comprises an etching solution receiving portion capable of depositing a close contact between the substrate and the substrate fixing jig. The cross-sectional thinning system of claim 8, Including an etchant supply module for supplying an etchant from the side of the substrate, The etching solution supply module accommodates the etching solution therein, and an opening is formed in the outer circumferential surface thereof. Being an etching drum; and It is provided inside the etching drum and discharges the etching liquid to the opening through rotation. And a rotation module for rotating the cross-sectional thinning system of the substrate, characterized in that the aberration type etching solution supply module. The method according to claim 10, Wherein the rotary module is a cross-sectional thinning system of the substrate, characterized in that the rotary module includes at least one unit rotation module having a rotary blade formed on the rotating shaft passing through the inside of the etching drum. The method according to claim 10, At least one aberration-type etching solution supply module is provided, wherein any one or more of the selected rotation direction selected from among the thinner cross-sectional substrate system. The cross-sectional thinning system of claim 8, wherein Further comprising a top-down etching solution supply module for supplying the etching solution in the upper direction of the substrate, And the etching solution supply module is a top-down etching solution supply module for freely dropping along the surface of the substrate by discharging the etching solution from the upper portion of the substrate. The method of claim 13, wherein the downward etching solution supply module, A buffer partition wall having an etchant containing portion and an etchant buffer permeation hole formed in the etchant containing portion to prevent a sudden increase in flow rate of the etchant; An etching liquid transmitting slit formed on an upper surface of the etching liquid containing portion; and And a guide part for moving the etching liquid passing through the etching liquid transmitting slit to the upper surface of the substrate. The method according to any one of claims 10 to 12, The etching liquid supply module is a cross-sectional thinning system of the substrate, characterized in that a combination of a plurality of aberration type etching liquid supply module and the injection etching supply module. The method according to claim 8, And the etching solution supply module is a spray type etching solution supply module for spraying the etching solution through a spray nozzle in a vertical upper portion or a side portion of the substrate.

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