CN111341715A - Electronic device and manufacturing method thereof - Google Patents
Electronic device and manufacturing method thereof Download PDFInfo
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- CN111341715A CN111341715A CN201811558004.6A CN201811558004A CN111341715A CN 111341715 A CN111341715 A CN 111341715A CN 201811558004 A CN201811558004 A CN 201811558004A CN 111341715 A CN111341715 A CN 111341715A
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- flexible substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an electronic device and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: the flexible substrate is disposed on the carrier. The element layer is arranged on the flexible substrate. And performing a cutting procedure to form a cutting channel extending from the top surface of the flexible substrate to the upper surface of the carrier plate, wherein the cutting channel is located at the periphery of the flexible substrate. And performing a lifting procedure to lift the edge of the flexible substrate contacting the upper surface of the carrier plate from the cutting channel. And performing a water injection procedure to inject water from the lifted edge of the flexible substrate. And carrying out a release procedure to peel the flexible substrate from the upper surface of the carrier plate. The electronic device of the invention is provided with a flexible substrate and an element layer. The element layer is arranged on the top surface of the flexible substrate. The flexible substrate has a top surface and a bottom surface opposite to each other, side edges and a chamfer angle. The side edge is adjacent to the bottom surface, and the chamfer is located at the junction of the side edge and the bottom surface. The chamfer is between 10 and 80 degrees.
Description
Technical Field
The present disclosure relates to electronic devices and, particularly, to a flexible electronic device and a method for manufacturing the same.
Background
When manufacturing an electronic device with flexibility, first, a flexible substrate needs to be fixed on a carrier. Then, an electronic element layer is formed on the flexible substrate. Finally, the flexible substrate is peeled off from the carrier plate, and the electronic device is completed. However, when the flexible substrate is peeled off, the absorption force between the flexible substrate and the carrier may cause the flexible substrate not to be easily peeled off, and may even damage the electronic device layer. Moreover, although the stripping method by adding water for deaeration can effectively improve the capability of stripping the flexible substrate, the step is not automated at present, and the overall manufacturing time is easily increased. Therefore, how to improve the stripping process and increase the time efficiency of the stripping process has become one of the problems to be solved in the industry.
Disclosure of Invention
The invention provides an electronic device and a manufacturing method thereof, which have better manufacturing yield.
The method for manufacturing the electronic device comprises the following steps. The flexible substrate is disposed on the carrier. The element layer is arranged on the flexible substrate. And performing a cutting procedure to form a cutting channel extending from the top surface of the flexible substrate to the upper surface of the carrier plate, wherein the cutting channel is located at the periphery of the flexible substrate. And performing a lifting procedure to lift the edge of the flexible substrate contacting the upper surface of the carrier plate from the cutting channel. And performing a water injection procedure to inject water from the lifted edge of the flexible substrate. And carrying out a release procedure to peel the flexible substrate from the upper surface of the carrier plate.
In an embodiment of the present invention, the cutting process and the lift-off process are performed simultaneously.
In an embodiment of the present invention, the lift-off process and the water injection process are performed simultaneously.
In an embodiment of the invention, the cutting procedure includes laser cutting or mechanical cutting.
In an embodiment of the present invention, the lift-off procedure includes the steps of: providing a scraper knife part with a bevel edge or an arc concave edge; and contacting the scraper blade part with the edge of the flexible substrate, and scraping the scraper blade part into the flexible substrate by 1 mm to 5 mm to lift the edge.
In an embodiment of the invention, the water injection procedure includes injecting water into the lifted edge of the flexible substrate by the water injection part to form a continuous water wall.
In an embodiment of the invention, the water injection part includes a water injection syringe, a water injection nozzle, a water injection pipeline, or a combination thereof.
In an embodiment of the invention, the flexible substrate has a bottom surface and a side edge adjacent to the bottom surface, wherein the bottom surface and the side edge of the flexible substrate after the releasing process have a chamfer angle, and the chamfer angle is between 10 degrees and 80 degrees.
In an embodiment of the invention, the method of manufacturing the electronic device further includes attaching a support film on the top surface of the flexible substrate before performing the dicing process.
In an embodiment of the invention, the supporting film exposes a portion of the top surface of the flexible substrate, and the scribe line is spaced apart from the edge of the supporting film by at least 0.5 mm.
In an embodiment of the invention, the method for manufacturing the electronic device disposes the element layer on the flexible substrate before or after the cutting process.
The electronic device of the invention comprises a flexible substrate and an element layer. The element layer is arranged on the flexible substrate. The flexible substrate has a top surface and a bottom surface opposite to each other, side edges and a chamfer angle. The side edge is adjacent to the bottom surface, and the chamfer is located at the junction of the side edge and the bottom surface, wherein the chamfer is between 10 and 80 degrees.
In view of the above, in the manufacturing method of the electronic device of the present invention, the edge of the flexible substrate contacting the upper surface of the carrier is lifted from the cutting street through the lift-off process, and then the water injection process is performed to inject water from the lifted edge of the flexible substrate. Therefore, when the releasing procedure is carried out subsequently, the bonding force between the flexible substrate and the carrier plate can be reduced, and the flexible substrate can be quickly peeled from the upper surface of the carrier plate. Therefore, the manufacturing method of the electronic device has better manufacturing yield.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
Fig. 1A to fig. 1D are schematic cross-sectional views illustrating a method for manufacturing an electronic device according to an embodiment of the invention;
FIG. 2 is a perspective view of a lift-off mechanism and a water injection mechanism;
FIG. 3 is a schematic cross-sectional view illustrating a partial step of a method of fabricating an electronic device according to another embodiment of the invention;
fig. 4 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention.
Description of the reference numerals
10: an electronic device;
100: a flexible substrate;
102: a top surface;
104: a side edge;
106: a bottom surface;
108: chamfering;
110: a support film;
112: an edge;
120: an element layer;
200: a carrier plate;
210: an adhesive layer;
202: an upper surface;
300: a scraper section;
310: an arc-shaped concave cutting edge;
400: a water injection part;
500: a machine platform;
510: a lift-off mechanism;
520: a water injection mechanism;
a: an edge;
c: cutting a channel;
d: a distance;
k: a metal cutter;
w: and (3) water.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1A to fig. 1D are schematic cross-sectional views illustrating a method for manufacturing an electronic device according to an embodiment of the invention, in which the flexible substrate required for manufacturing the flexible electronic device is removed when the flexible electronic device is manufactured. First, referring to fig. 1A, the flexible substrate 100 is disposed on a carrier 200. The flexible substrate 100 is, for example, Polyimide (PI), Polyethylene Terephthalate (PET), Cyclic Olefin Polymer (COP), Polycarbonate (PC), polymethyl methacrylate (PMMA), Cyclic Olefin Copolymer (COC), Cellulose Triacetate (TAC), Polypropylene (PP), Polystyrene (PS), or other suitable flexible material, and the carrier 200 is, for example, glass, plastic, quartz, sapphire, synthetic resin, or other suitable flexible material, but the invention is not limited thereto. Furthermore, the upper surface 202 of the carrier 200 of the present embodiment is further provided with an adhesion layer 210, wherein the adhesion layer 210 surrounds the periphery of the upper surface 202 of the carrier 200, or can be disposed in other areas of the upper surface 202, and the flexible substrate 100 is adhered to the carrier 200 through the adhesion layer 210.
Next, referring to fig. 1A, in order to effectively protect the flexible substrate 100, a support film 110 is attached on the top surface 102 of the flexible substrate 100, wherein the support film 110 exposes a portion of the top surface 102 of the flexible substrate 100. Here, the support film 110 is, for example, an ultraviolet light film or a thermoplastic polyester film, and has a thicker and stiffer material characteristic than the flexible substrate 100, so that the purpose of protecting the flexible substrate 100 can be achieved, edge curling can be avoided, and the chance of contamination in subsequent manufacturing can be reduced. In other embodiments, the support film 110 may be attached after the device layer is formed on the flexible substrate 100.
Next, referring to fig. 1A, a cutting procedure is performed to form a cutting street C extending from the top surface 102 of the flexible substrate 100 to the upper surface 202 of the carrier 200, wherein the cutting street C is located at the periphery of the flexible substrate 100. Preferably, the scribe line C is spaced apart from the edge 112 of the support film 110 by a distance D, wherein the distance D is at least 0.5 mm. The cutting procedure is, for example, laser cutting or mechanical cutting, but the invention is not limited thereto. As shown in fig. 1A, the present embodiment is exemplified by mechanical cutting, wherein the mechanical cutting is, for example, a cutter with cutting capability, such as a water cutter, an ultrasonic cutter, a high pressure air cutter or a solid cutter made of a suitable material, but the present invention is not limited thereto, and for example, in the present embodiment, the flexible substrate 100 is cut by a metal cutter K, wherein the position of the lower cutter of the metal cutter K can be between the supporting film 110 and the adhesive layer 210.
Next, referring to fig. 1B, a lift-off procedure is performed to lift off the edge a of the flexible substrate 100 contacting the upper surface 202 of the carrier 200 from the scribe line C. More specifically, the lift-off procedure includes first providing the blade portion 300 with the arc-shaped concave edge 310. Then, the spatula portion 300 is contacted with the edge a of the flexible substrate 100, and is scooped in 1 mm to 5 mm to lift the edge a. That is, at least one edge a of the flexible substrate 100 in the scribe line C is lifted by the blade 300, but not limited thereto. Of course, the periphery of the flexible substrate 100 in the scribe line C may be lifted by the blade 300 to prepare for the subsequent peeling process. In short, the lift-off process can be regarded as a pre-strip step. Of course, in other embodiments not shown, the blade portion may have a beveled edge, and still fall within the intended scope of the invention.
Then, referring to fig. 1C, a water injection procedure is performed to inject water W from the lifted edge a of the flexible substrate 100, wherein the water W preferably has no conductivity so as not to be affected by the subsequent manufacturing. In the present embodiment, the water injection process includes injecting water W into at least one edge a of the flexible substrate 100, but not limited thereto, by the water injection part 400. The water injection part 400 may inject water W into the peripheral edge a of the flexible substrate 100, where the water injection part 400 moves around the periphery of the flexible substrate 100 while injecting water W, thereby forming a continuous water wall. Here, the water injection part 400 is, for example, a water injection syringe, a water injection head, a water injection line, or a combination thereof. The water W may be injected along the lifted edge a of the flexible substrate 100 to form a continuous water wall, thereby reducing the bonding force between the flexible substrate 100 and the carrier 200.
Finally, referring to fig. 1C and fig. 1D, a releasing procedure is performed to peel the flexible substrate 100 from the upper surface 202 of the carrier 200. Here, the release process may be Laser Lift-Off (LLO) or mechanical Lift-Off (MLO), for example, but the present invention is not limited thereto. As shown in fig. 1D, the flexible substrate 100 has a bottom surface 106 opposite to the top surface 102 and a side 104 connecting the bottom surface 106 and the top surface 102, wherein the bottom surface 106 and the side 104 have a chamfer 108. It should be noted that the side 104 of fig. 1D may have a slightly inclined surface due to tension during the lifting process, but the side 104 may have a substantially vertical surface under optimized conditions such as proper material matching or fine tuning of the spatula portion 300. In the present invention, the chamfer 108 is preferably between 10 degrees and 80 degrees, wherein the angle of the chamfer 108 can be derived from the angle cut by the scraper blade portion 300 or depending on the specifications of the cutting edge face thereof. Since the cutting edge of a conventional scraper is extremely thin, and the critical value of the cutting angle is less than 10 degrees after many times of experiments on the cutting angle, the utilization rate of the horizontal space of the scraper 300 is deteriorated. In addition, to achieve the "lift-off" effect, the theoretical cut-in angle must be less than 90 degrees, but too close to perpendicular cut-in will also result in poor lift-off effect. After many experiments of the cut-in angle, the cut-in angle critical value of 80 degrees (including less than 80 degrees) can achieve more effective lift-off. At this point, the flexible substrate 100 is peeled off from the upper surface 202 of the carrier 200.
It should be noted that, in order to improve the manufacturing efficiency, in another embodiment, the steps shown in fig. 1A and fig. 1B may be performed simultaneously by the design of the machine, that is, the cutting process and the lift-off process are performed simultaneously; alternatively, in another embodiment, referring to fig. 2, the steps of fig. 1B and fig. 1C are completed simultaneously by the lift-off mechanism 510 and the water injection mechanism 520 in the same machine 500, that is, the lift-off procedure and the water injection procedure are performed simultaneously.
It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
Fig. 3 is a schematic cross-sectional view illustrating a partial step of a method for manufacturing an electronic device according to another embodiment of the invention. Referring to fig. 1A and fig. 3, the steps of manufacturing the electronic device of the present embodiment are similar to those of the electronic device of fig. 1A, and the difference between the steps is: in this embodiment, the device layer 120 is disposed on the flexible substrate 100 before the dicing process is performed; alternatively, after the dicing process is performed, the device layer 120 is disposed on the flexible substrate 100. If the device layer 120 is already disposed on the flexible substrate 100 before the dicing process, the device layer 120 and the flexible substrate 100 are subjected to a subsequent dicing process, a lift-off process, a water injection process, and a release process simultaneously. If the device layer 120 is disposed on the flexible substrate 100 after the dicing process, the device layer 120 and the flexible substrate 100 perform a subsequent lift-off process, a water injection process, and a release process simultaneously.
Fig. 4 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention. Referring to fig. 4, the electronic device 10 of the present embodiment includes a flexible substrate 100 and a device layer 120. The flexible substrate 100 has a top surface 102 and a bottom surface 106 opposite to each other, side edges 104, and a chamfer 108. Side 104 connects top surface 102 and bottom surface 106 and is adjacent to bottom surface 106, and chamfer 108 is located at the intersection of side 104 and bottom surface 106. Preferably, the chamfer 108 is, for example, between 10 degrees and 80 degrees. The component layer 120 is disposed on the top surface 102 of the flexible substrate 100, wherein the component layer 120 is, for example, an Organic Light-Emitting Diode (OLED) layer, a Liquid Crystal Display (LCD) layer, a sensing component layer, or other suitable active or passive components, but not limited thereto.
In summary, in the manufacturing method of the electronic device of the present invention, the edge of the flexible substrate contacting the upper surface of the carrier is lifted from the scribe line through the lift-off process, and then the water injection process is performed to inject water from the lifted edge of the flexible substrate. Therefore, when the releasing procedure is carried out subsequently, the bonding force between the flexible substrate and the carrier plate can be reduced, and the flexible substrate can be quickly peeled from the upper surface of the carrier plate. In short, because there is a pre-peeling step, i.e. a lift-off process, the peeling time can be effectively reduced, and the yield of peeling off the flexible substrate in the subsequent peeling process can be increased. Therefore, the manufacturing method of the electronic device has better manufacturing yield.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (12)
1. A method of making an electronic device, comprising:
arranging a flexible substrate on a carrier plate;
arranging an element layer on the flexible substrate;
performing a cutting procedure to form a cutting channel extending from the top surface of the flexible substrate to the upper surface of the carrier plate, wherein the cutting channel is located at the periphery of the flexible substrate;
performing a lift-off procedure to lift the edge of the flexible substrate contacting the upper surface of the carrier from the scribe line;
performing a water injection procedure to inject water from the edge of the soft substrate which is lifted; and
and carrying out a release procedure to peel the flexible substrate from the upper surface of the carrier plate.
2. The method of claim 1, wherein the cutting process and the lifting process are performed simultaneously.
3. The method as claimed in claim 1, wherein the lift-off process and the water-filling process are performed simultaneously.
4. The method of claim 1, wherein the cutting procedure comprises laser cutting or mechanical cutting.
5. The method of claim 1, wherein the step of the lift-off procedure comprises:
providing a scraper knife part with a bevel edge or an arc concave edge; and
and contacting the scraper knife part with the edge of the flexible substrate, and shoveling the scraper knife part into the flexible substrate by 1 mm to 5 mm to lift the edge.
6. The method of claim 1, wherein the water injection procedure comprises injecting water into the edge of the flexible substrate with the water injection part lifted to form a continuous water wall.
7. The method of claim 6, wherein the water injection part comprises a water injection syringe, a water injection nozzle, a water injection pipeline, or a combination thereof.
8. The method of claim 1, wherein the flexible substrate has a bottom surface and a side adjacent to the bottom surface, wherein the bottom surface and the side of the flexible substrate after the releasing process have a chamfer angle, and the chamfer angle is between 10 degrees and 80 degrees.
9. The method of manufacturing an electronic device according to claim 1, further comprising:
before the cutting procedure, a support film is attached to the flexible substrate.
10. The method of claim 9, wherein the supporting film exposes a portion of the top surface of the flexible substrate, and the scribe line is spaced apart from an edge of the supporting film by at least 0.5 mm.
11. The method of claim 1, wherein the device layer is disposed on the flexible substrate before or after the dicing process.
12. An electronic device, comprising:
an element layer disposed on the top surface of the flexible substrate; and
the flexible substrate is provided with a bottom surface opposite to the top surface, a side edge and a chamfer angle, wherein the side edge is adjacent to the bottom surface, the chamfer angle is positioned at the junction of the side edge and the bottom surface, and the chamfer angle is between 10 and 80 degrees.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811558004.6A CN111341715B (en) | 2018-12-19 | 2018-12-19 | Electronic device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811558004.6A CN111341715B (en) | 2018-12-19 | 2018-12-19 | Electronic device and manufacturing method thereof |
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| CN111341715A true CN111341715A (en) | 2020-06-26 |
| CN111341715B CN111341715B (en) | 2022-11-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113967610A (en) * | 2021-10-13 | 2022-01-25 | 四川富乐德科技发展有限公司 | Technology for cleaning and removing ultra-thick copper film of anti-sticking plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102231359A (en) * | 2011-03-18 | 2011-11-02 | 长兴化学工业股份有限公司 | Method for manufacturing flexible element |
| CN102280371A (en) * | 2011-04-06 | 2011-12-14 | 友达光电股份有限公司 | Flexible electronic component and method for manufacturing the same |
| CN103384447A (en) * | 2013-06-26 | 2013-11-06 | 友达光电股份有限公司 | Flexible electronic device |
| CN103400792A (en) * | 2013-03-15 | 2013-11-20 | 友达光电股份有限公司 | Electronic device and method for manufacturing the same |
| JP2015145306A (en) * | 2014-02-04 | 2015-08-13 | 旭硝子株式会社 | Separation start part preparation method and separation start part preparation device of stacked body, and manufacturing method of electronic device |
| CN105789116A (en) * | 2015-01-08 | 2016-07-20 | 东友精细化工有限公司 | Manufacturing method of flexible substrate |
-
2018
- 2018-12-19 CN CN201811558004.6A patent/CN111341715B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102231359A (en) * | 2011-03-18 | 2011-11-02 | 长兴化学工业股份有限公司 | Method for manufacturing flexible element |
| CN102280371A (en) * | 2011-04-06 | 2011-12-14 | 友达光电股份有限公司 | Flexible electronic component and method for manufacturing the same |
| CN103400792A (en) * | 2013-03-15 | 2013-11-20 | 友达光电股份有限公司 | Electronic device and method for manufacturing the same |
| CN103384447A (en) * | 2013-06-26 | 2013-11-06 | 友达光电股份有限公司 | Flexible electronic device |
| JP2015145306A (en) * | 2014-02-04 | 2015-08-13 | 旭硝子株式会社 | Separation start part preparation method and separation start part preparation device of stacked body, and manufacturing method of electronic device |
| CN105789116A (en) * | 2015-01-08 | 2016-07-20 | 东友精细化工有限公司 | Manufacturing method of flexible substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113967610A (en) * | 2021-10-13 | 2022-01-25 | 四川富乐德科技发展有限公司 | Technology for cleaning and removing ultra-thick copper film of anti-sticking plate |
| CN113967610B (en) * | 2021-10-13 | 2023-03-14 | 四川富乐德科技发展有限公司 | Cleaning and removing technology for ultra-thick copper film of anti-sticking plate |
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| CN111341715B (en) | 2022-11-08 |
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