WO2002028979A1 - Matiere abrasive a base de cerium et procede de production de ladite matiere - Google Patents
Matiere abrasive a base de cerium et procede de production de ladite matiere Download PDFInfo
- Publication number
- WO2002028979A1 WO2002028979A1 PCT/JP2001/002987 JP0102987W WO0228979A1 WO 2002028979 A1 WO2002028979 A1 WO 2002028979A1 JP 0102987 W JP0102987 W JP 0102987W WO 0228979 A1 WO0228979 A1 WO 0228979A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- abrasive material
- based abrasive
- cerium based
- concentration
- particles
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/20—Compounds containing only rare earth metals as the metal element
- C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
- C01F17/224—Oxides or hydroxides of lanthanides
- C01F17/235—Cerium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Treatment Of Glass (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01919806A EP1243633A4 (en) | 2000-10-02 | 2001-04-06 | ABRASIVE CERIUM-BASED MATERIAL AND PROCESS FOR PRODUCING THE SAME |
JP2002503065A JP3960914B2 (ja) | 2000-10-02 | 2001-04-06 | セリウム系研摩材及びセリウム系研摩材の製造方法 |
AU2001246851A AU2001246851A1 (en) | 2000-10-02 | 2001-04-06 | Cerium based abrasive material and method for producing cerium based abrasive material |
US10/111,405 US6689178B2 (en) | 2000-10-02 | 2001-04-06 | Cerium based abrasive material and method for producing cerium based abrasive material |
KR10-2002-7006928A KR100480760B1 (ko) | 2000-10-02 | 2001-04-06 | 세륨계 연마재 및 세륨계 연마재의 제조방법 |
TW090122581A TWI281492B (en) | 2000-10-02 | 2001-09-12 | Cerium-oxide-based abrasive and method for producing the cerium-oxide-based abrasive |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-301791 | 2000-10-02 | ||
JP2000301624 | 2000-10-02 | ||
JP2000301791 | 2000-10-02 | ||
JP2000-301624 | 2000-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002028979A1 true WO2002028979A1 (fr) | 2002-04-11 |
Family
ID=26601321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/002987 WO2002028979A1 (fr) | 2000-10-02 | 2001-04-06 | Matiere abrasive a base de cerium et procede de production de ladite matiere |
Country Status (8)
Country | Link |
---|---|
US (1) | US6689178B2 (ja) |
EP (1) | EP1243633A4 (ja) |
JP (1) | JP3960914B2 (ja) |
KR (1) | KR100480760B1 (ja) |
CN (1) | CN1177012C (ja) |
AU (1) | AU2001246851A1 (ja) |
TW (1) | TWI281492B (ja) |
WO (1) | WO2002028979A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006032966A (ja) * | 2004-07-15 | 2006-02-02 | Samsung Electronics Co Ltd | 酸化セリウム研磨粒子及び該研磨粒子を含む組成物 |
KR101134596B1 (ko) | 2005-09-15 | 2012-04-09 | 삼성코닝정밀소재 주식회사 | 세륨계 연마재 슬러리 |
JP2023052035A (ja) * | 2017-10-31 | 2023-04-11 | Hoya株式会社 | 研磨液、ガラス基板の製造方法、及び、磁気ディスクの製造方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4002740B2 (ja) * | 2001-05-29 | 2007-11-07 | 三井金属鉱業株式会社 | セリウム系研摩材の製造方法 |
JP2006514601A (ja) * | 2002-06-07 | 2006-05-11 | ザイモジェネティクス インコーポレイティッド | ガンおよびその他の治療用途におけるil−21の使用方法 |
JP4248889B2 (ja) * | 2002-11-22 | 2009-04-02 | Agcセイミケミカル株式会社 | 研磨材粒子の品質評価方法、研磨方法及びガラス研磨用研磨材 |
US6863825B2 (en) | 2003-01-29 | 2005-03-08 | Union Oil Company Of California | Process for removing arsenic from aqueous streams |
US20100187178A1 (en) * | 2003-01-29 | 2010-07-29 | Molycorp Minerals, Llc | Process for removing and sequestering contaminants from aqueous streams |
KR100630691B1 (ko) * | 2004-07-15 | 2006-10-02 | 삼성전자주식회사 | 산화세륨 연마 입자 및 그 제조 방법과 cmp용 슬러리조성물 및 그 제조 방법과 이들을 이용한 기판 연마 방법 |
TWI273632B (en) | 2004-07-28 | 2007-02-11 | K C Tech Co Ltd | Polishing slurry, method of producing same, and method of polishing substrate |
KR100637403B1 (ko) | 2005-07-14 | 2006-10-23 | 주식회사 케이씨텍 | 연마 입자, 연마용 슬러리 및 이의 제조 방법 |
KR100641348B1 (ko) | 2005-06-03 | 2006-11-03 | 주식회사 케이씨텍 | Cmp용 슬러리와 이의 제조 방법 및 기판의 연마 방법 |
JP5237542B2 (ja) * | 2006-10-03 | 2013-07-17 | 三井金属鉱業株式会社 | 酸化セリウム系研摩材 |
US8066874B2 (en) * | 2006-12-28 | 2011-11-29 | Molycorp Minerals, Llc | Apparatus for treating a flow of an aqueous solution containing arsenic |
US20090107925A1 (en) * | 2007-10-31 | 2009-04-30 | Chevron U.S.A. Inc. | Apparatus and process for treating an aqueous solution containing biological contaminants |
US20090107919A1 (en) * | 2007-10-31 | 2009-04-30 | Chevron U.S.A. Inc. | Apparatus and process for treating an aqueous solution containing chemical contaminants |
US8349764B2 (en) | 2007-10-31 | 2013-01-08 | Molycorp Minerals, Llc | Composition for treating a fluid |
US8252087B2 (en) * | 2007-10-31 | 2012-08-28 | Molycorp Minerals, Llc | Process and apparatus for treating a gas containing a contaminant |
TW201038510A (en) * | 2009-03-16 | 2010-11-01 | Molycorp Minerals Llc | Porous and durable ceramic filter monolith coated with a rare earth for removing contaminates from water |
US20100258448A1 (en) * | 2009-04-09 | 2010-10-14 | Molycorp Minerals, Llc | Use of a rare earth for the removal of antimony and bismuth |
KR101105480B1 (ko) * | 2009-10-19 | 2012-01-13 | 주식회사 케이씨텍 | 화학적 기계적 연마용 슬러리의 제조 방법 및 그를 이용하여 제조된 화학적 기계적 연마용 슬러리 |
MX2012005351A (es) * | 2009-11-09 | 2012-11-23 | Molycorp Minerals Llc | Remocion de los colorantes con tierras raras. |
JP2011110637A (ja) * | 2009-11-25 | 2011-06-09 | Asahi Glass Co Ltd | 磁気ディスク用ガラス基板の製造方法 |
CN101899282A (zh) * | 2010-06-23 | 2010-12-01 | 山东理工大学 | 气雾化快凝磁性磨料制备方法 |
US9233863B2 (en) | 2011-04-13 | 2016-01-12 | Molycorp Minerals, Llc | Rare earth removal of hydrated and hydroxyl species |
CN102492393B (zh) * | 2011-11-17 | 2014-01-22 | 中冶宝钢技术服务有限公司 | 一种降低钢渣非金属磨料表面颗粒吸附物的方法 |
US9975787B2 (en) | 2014-03-07 | 2018-05-22 | Secure Natural Resources Llc | Removal of arsenic from aqueous streams with cerium (IV) oxide compositions |
WO2019049932A1 (ja) * | 2017-09-11 | 2019-03-14 | 昭和電工株式会社 | セリウム系研磨材用原料の製造方法、及びセリウム系研磨材の製造方法 |
CN114751438B (zh) * | 2022-04-28 | 2023-09-08 | 浙江奥首材料科技有限公司 | 一种氧化铝磨料、制备方法、用途及包含其的硅片研磨液和研磨方法 |
CN116727600B (zh) * | 2023-06-16 | 2024-01-26 | 广东万嘉精铸材料有限公司 | 一种精密铸造面层砂粉及其制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2267389A (en) * | 1992-05-26 | 1993-12-01 | Toshiba Kk | Polishing apparatus and method for planarizing layer on a semiconductor wafer |
JPH10106987A (ja) * | 1996-09-30 | 1998-04-24 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
US5772780A (en) * | 1994-09-30 | 1998-06-30 | Hitachi, Ltd. | Polishing agent and polishing method |
JPH10183103A (ja) * | 1996-12-25 | 1998-07-14 | Seimi Chem Co Ltd | セリウム系研磨材の製造方法 |
EP0939431A1 (en) * | 1996-09-30 | 1999-09-01 | Hitachi Chemical Co., Ltd. | Cerium oxide abrasive and method of abrading substrates |
JP2000160137A (ja) * | 1998-11-30 | 2000-06-13 | Hitachi Chem Co Ltd | 研磨剤及び基板の研磨法 |
JP2000173955A (ja) * | 1998-12-04 | 2000-06-23 | Hitachi Ltd | 半導体装置の製造方法及び平坦化加工装置 |
WO2000037578A1 (en) * | 1998-12-21 | 2000-06-29 | Showa Denko K. K. | Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
JP2000273443A (ja) * | 1999-03-23 | 2000-10-03 | Asahi Glass Co Ltd | ディスプレイ用ガラス基板の研磨用砥材、研磨方法および砥材の品質評価方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3131039A (en) * | 1961-10-12 | 1964-04-28 | Frederick C Nonamaker | Process for preparing a polishing compound |
FR2617153B1 (fr) * | 1987-06-26 | 1991-04-05 | Rhone Poulenc Chimie | Procede d'obtention d'un oxyde cerique et oxyde cerique a nouvelles caracteristiques morphologiques |
TW311905B (ja) * | 1994-07-11 | 1997-08-01 | Nissan Chemical Ind Ltd | |
US5962343A (en) * | 1996-07-30 | 1999-10-05 | Nissan Chemical Industries, Ltd. | Process for producing crystalline ceric oxide particles and abrasive |
SG72802A1 (en) * | 1997-04-28 | 2000-05-23 | Seimi Chem Kk | Polishing agent for semiconductor and method for its production |
US6063306A (en) * | 1998-06-26 | 2000-05-16 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrate |
JP3560484B2 (ja) * | 1998-08-05 | 2004-09-02 | 昭和電工株式会社 | Lsiデバイス研磨用研磨材組成物及び研磨方法 |
JP3624722B2 (ja) * | 1998-11-18 | 2005-03-02 | 本田技研工業株式会社 | メタノール改質触媒及びそれを用いたメタノール改質触媒装置 |
DE60031857T2 (de) * | 1999-06-18 | 2007-09-13 | Hitachi Chemical Co., Ltd. | Verwendung eines cmp schleifmittels |
US6454821B1 (en) * | 2000-06-21 | 2002-09-24 | Praxair S. T. Technology, Inc. | Polishing composition and method |
-
2001
- 2001-04-06 EP EP01919806A patent/EP1243633A4/en not_active Withdrawn
- 2001-04-06 AU AU2001246851A patent/AU2001246851A1/en not_active Abandoned
- 2001-04-06 KR KR10-2002-7006928A patent/KR100480760B1/ko active IP Right Grant
- 2001-04-06 CN CNB01803411XA patent/CN1177012C/zh not_active Expired - Lifetime
- 2001-04-06 US US10/111,405 patent/US6689178B2/en not_active Expired - Lifetime
- 2001-04-06 WO PCT/JP2001/002987 patent/WO2002028979A1/ja active IP Right Grant
- 2001-04-06 JP JP2002503065A patent/JP3960914B2/ja not_active Expired - Lifetime
- 2001-09-12 TW TW090122581A patent/TWI281492B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2267389A (en) * | 1992-05-26 | 1993-12-01 | Toshiba Kk | Polishing apparatus and method for planarizing layer on a semiconductor wafer |
US5772780A (en) * | 1994-09-30 | 1998-06-30 | Hitachi, Ltd. | Polishing agent and polishing method |
JPH10106987A (ja) * | 1996-09-30 | 1998-04-24 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
EP0939431A1 (en) * | 1996-09-30 | 1999-09-01 | Hitachi Chemical Co., Ltd. | Cerium oxide abrasive and method of abrading substrates |
JPH10183103A (ja) * | 1996-12-25 | 1998-07-14 | Seimi Chem Co Ltd | セリウム系研磨材の製造方法 |
JP2000160137A (ja) * | 1998-11-30 | 2000-06-13 | Hitachi Chem Co Ltd | 研磨剤及び基板の研磨法 |
JP2000173955A (ja) * | 1998-12-04 | 2000-06-23 | Hitachi Ltd | 半導体装置の製造方法及び平坦化加工装置 |
WO2000037578A1 (en) * | 1998-12-21 | 2000-06-29 | Showa Denko K. K. | Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
JP2000273443A (ja) * | 1999-03-23 | 2000-10-03 | Asahi Glass Co Ltd | ディスプレイ用ガラス基板の研磨用砥材、研磨方法および砥材の品質評価方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1243633A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006032966A (ja) * | 2004-07-15 | 2006-02-02 | Samsung Electronics Co Ltd | 酸化セリウム研磨粒子及び該研磨粒子を含む組成物 |
KR101134596B1 (ko) | 2005-09-15 | 2012-04-09 | 삼성코닝정밀소재 주식회사 | 세륨계 연마재 슬러리 |
JP2023052035A (ja) * | 2017-10-31 | 2023-04-11 | Hoya株式会社 | 研磨液、ガラス基板の製造方法、及び、磁気ディスクの製造方法 |
JP7547449B2 (ja) | 2017-10-31 | 2024-09-09 | Hoya株式会社 | 研磨液、ガラス基板の製造方法、及び、磁気ディスクの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20030000150A1 (en) | 2003-01-02 |
KR20020070296A (ko) | 2002-09-05 |
TWI281492B (en) | 2007-05-21 |
AU2001246851A1 (en) | 2002-04-15 |
CN1177012C (zh) | 2004-11-24 |
KR100480760B1 (ko) | 2005-04-07 |
US6689178B2 (en) | 2004-02-10 |
JP3960914B2 (ja) | 2007-08-15 |
JPWO2002028979A1 (ja) | 2004-02-12 |
CN1394229A (zh) | 2003-01-29 |
EP1243633A4 (en) | 2009-05-27 |
EP1243633A1 (en) | 2002-09-25 |
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