AU2001246851A1 - Cerium based abrasive material and method for producing cerium based abrasive material - Google Patents

Cerium based abrasive material and method for producing cerium based abrasive material

Info

Publication number
AU2001246851A1
AU2001246851A1 AU2001246851A AU4685101A AU2001246851A1 AU 2001246851 A1 AU2001246851 A1 AU 2001246851A1 AU 2001246851 A AU2001246851 A AU 2001246851A AU 4685101 A AU4685101 A AU 4685101A AU 2001246851 A1 AU2001246851 A1 AU 2001246851A1
Authority
AU
Australia
Prior art keywords
abrasive material
based abrasive
cerium based
producing
cerium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001246851A
Inventor
Terunori Ito
Naoyoshi Mochizuki
Yoshitsugu Uchino
Hidehiko Yamasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of AU2001246851A1 publication Critical patent/AU2001246851A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
AU2001246851A 2000-10-02 2001-04-06 Cerium based abrasive material and method for producing cerium based abrasive material Abandoned AU2001246851A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000301624 2000-10-02
JP2000-301624 2000-10-02
JP2000301791 2000-10-02
JP2000-301791 2000-10-02
PCT/JP2001/002987 WO2002028979A1 (en) 2000-10-02 2001-04-06 Cerium based abrasive material and method for producing cerium based abrasive material

Publications (1)

Publication Number Publication Date
AU2001246851A1 true AU2001246851A1 (en) 2002-04-15

Family

ID=26601321

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001246851A Abandoned AU2001246851A1 (en) 2000-10-02 2001-04-06 Cerium based abrasive material and method for producing cerium based abrasive material

Country Status (8)

Country Link
US (1) US6689178B2 (en)
EP (1) EP1243633A4 (en)
JP (1) JP3960914B2 (en)
KR (1) KR100480760B1 (en)
CN (1) CN1177012C (en)
AU (1) AU2001246851A1 (en)
TW (1) TWI281492B (en)
WO (1) WO2002028979A1 (en)

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* Cited by examiner, † Cited by third party
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JP4002740B2 (en) * 2001-05-29 2007-11-07 三井金属鉱業株式会社 Method for producing cerium-based abrasive
EP1531850B1 (en) * 2002-06-07 2012-02-22 ZymoGenetics, Inc. Use of IL-21 and monoclonal antibody for treating solid cancers
JP4248889B2 (en) * 2002-11-22 2009-04-02 Ａｇｃセイミケミカル株式会社 Abrasive particle quality evaluation method, polishing method and abrasive for polishing glass
US20100187178A1 (en) * 2003-01-29 2010-07-29 Molycorp Minerals, Llc Process for removing and sequestering contaminants from aqueous streams
US6863825B2 (en) 2003-01-29 2005-03-08 Union Oil Company Of California Process for removing arsenic from aqueous streams
JP4951218B2 (en) * 2004-07-15 2012-06-13 三星電子株式会社 Cerium oxide abrasive particles and composition comprising the abrasive particles
KR100630691B1 (en) * 2004-07-15 2006-10-02 삼성전자주식회사 Cerium oxide polishing particles, slurry for CMP, methods for preparing the same, and methods for polishing substrate
TWI273632B (en) 2004-07-28 2007-02-11 K C Tech Co Ltd Polishing slurry, method of producing same, and method of polishing substrate
KR100637403B1 (en) 2005-07-14 2006-10-23 주식회사 케이씨텍 Abrasive particles, slurry for polishing and method of manufacturing the same
KR100641348B1 (en) 2005-06-03 2006-11-03 주식회사 케이씨텍 Slurry for cmp and method of fabricating the same and method of polishing substrate
KR101134596B1 (en) 2005-09-15 2012-04-09 삼성코닝정밀소재 주식회사 Ceruim-based abrasive slurry
JP5237542B2 (en) * 2006-10-03 2013-07-17 三井金属鉱業株式会社 Cerium oxide abrasive
US8066874B2 (en) * 2006-12-28 2011-11-29 Molycorp Minerals, Llc Apparatus for treating a flow of an aqueous solution containing arsenic
US20090107919A1 (en) * 2007-10-31 2009-04-30 Chevron U.S.A. Inc. Apparatus and process for treating an aqueous solution containing chemical contaminants
US20090107925A1 (en) * 2007-10-31 2009-04-30 Chevron U.S.A. Inc. Apparatus and process for treating an aqueous solution containing biological contaminants
US8252087B2 (en) * 2007-10-31 2012-08-28 Molycorp Minerals, Llc Process and apparatus for treating a gas containing a contaminant
US8349764B2 (en) 2007-10-31 2013-01-08 Molycorp Minerals, Llc Composition for treating a fluid
TW201038510A (en) * 2009-03-16 2010-11-01 Molycorp Minerals Llc Porous and durable ceramic filter monolith coated with a rare earth for removing contaminates from water
PE20121145A1 (en) * 2009-04-09 2012-08-30 Molycorp Minerals Llc PROCESS FOR THE REMOVAL OF ONE OR MORE CONTAMINANTS FROM AN ELECTRO-REFINING SOLUTION USING RARE EARTH METALS
KR101105480B1 (en) * 2009-10-19 2012-01-13 주식회사 케이씨텍 Method of manufacturing slurry for chemical mechanical polishing and slurry for chemical mechanical polishing using the same
MX2012005351A (en) * 2009-11-09 2012-11-23 Molycorp Minerals Llc Rare earth removal of colorants.
JP2011110637A (en) * 2009-11-25 2011-06-09 Asahi Glass Co Ltd Method for manufacturing glass substrate for magnetic disk
CN101899282A (en) * 2010-06-23 2010-12-01 山东理工大学 Preparation method of pneumatic atomizing rapid condensation magnetic abrasive material
US9233863B2 (en) 2011-04-13 2016-01-12 Molycorp Minerals, Llc Rare earth removal of hydrated and hydroxyl species
CN102492393B (en) * 2011-11-17 2014-01-22 中冶宝钢技术服务有限公司 Method for reducing granular adsorbates on surface of steel slag non-metal abrasive
MX370462B (en) 2014-03-07 2019-12-13 Secure Natural Resources Llc Cerium (iv) oxide with exceptional arsenic removal properties.
JP6839767B2 (en) * 2017-09-11 2021-03-10 昭和電工株式会社 Method for manufacturing raw materials for cerium-based abrasives, and method for manufacturing cerium-based abrasives
CN114751438B (en) * 2022-04-28 2023-09-08 浙江奥首材料科技有限公司 Alumina abrasive, preparation method, application, silicon wafer grinding fluid containing alumina abrasive and grinding method
CN116727600B (en) * 2023-06-16 2024-01-26 广东万嘉精铸材料有限公司 Precision casting surface sand powder and preparation method thereof

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US3131039A (en) * 1961-10-12 1964-04-28 Frederick C Nonamaker Process for preparing a polishing compound
FR2617153B1 (en) * 1987-06-26 1991-04-05 Rhone Poulenc Chimie PROCESS FOR OBTAINING CERIC OXIDE AND CERIC OXIDE WITH NEW MORPHOLOGICAL CHARACTERISTICS
US5445996A (en) 1992-05-26 1995-08-29 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor device having a amorphous layer
TW311905B (en) * 1994-07-11 1997-08-01 Nissan Chemical Ind Ltd
TW274625B (en) * 1994-09-30 1996-04-21 Hitachi Seisakusyo Kk
US5962343A (en) * 1996-07-30 1999-10-05 Nissan Chemical Industries, Ltd. Process for producing crystalline ceric oxide particles and abrasive
JPH10106987A (en) * 1996-09-30 1998-04-24 Hitachi Chem Co Ltd Cerium oxide abrasive agent and polishing method of substrate
CN1245471C (en) * 1996-09-30 2006-03-15 日立化成工业株式会社 Cerium oxide abrasive and method of polishing substrates
JP3602670B2 (en) 1996-12-25 2004-12-15 セイミケミカル株式会社 Manufacturing method of cerium-based abrasive
TW365563B (en) * 1997-04-28 1999-08-01 Seimi Chem Kk Polishing agent for semiconductor and method for its production
US6063306A (en) * 1998-06-26 2000-05-16 Cabot Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrate
JP3560484B2 (en) * 1998-08-05 2004-09-02 昭和電工株式会社 Abrasive composition for polishing LSI devices and polishing method
JP3624722B2 (en) * 1998-11-18 2005-03-02 本田技研工業株式会社 Methanol reforming catalyst and methanol reforming catalyst apparatus using the same
JP2000160137A (en) 1998-11-30 2000-06-13 Hitachi Chem Co Ltd Polishing agent and polishing process using the same
JP3728950B2 (en) 1998-12-04 2005-12-21 株式会社日立製作所 Semiconductor device manufacturing method and planarization apparatus
JP3983949B2 (en) * 1998-12-21 2007-09-26 昭和電工株式会社 Polishing cerium oxide slurry, its production method and polishing method
JP2000273443A (en) 1999-03-23 2000-10-03 Asahi Glass Co Ltd Abrasive material for polishing glass substrate for display, polishing and evaluation of quality of abrasive material
KR20050118314A (en) * 1999-06-18 2005-12-16 히다치 가세고교 가부시끼가이샤 Cmp abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive
US6454821B1 (en) * 2000-06-21 2002-09-24 Praxair S. T. Technology, Inc. Polishing composition and method

Also Published As

Publication number Publication date
KR100480760B1 (en) 2005-04-07
CN1394229A (en) 2003-01-29
CN1177012C (en) 2004-11-24
JP3960914B2 (en) 2007-08-15
EP1243633A1 (en) 2002-09-25
KR20020070296A (en) 2002-09-05
JPWO2002028979A1 (en) 2004-02-12
EP1243633A4 (en) 2009-05-27
TWI281492B (en) 2007-05-21
US6689178B2 (en) 2004-02-10
US20030000150A1 (en) 2003-01-02
WO2002028979A1 (en) 2002-04-11

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