WO2002027787A1 - Plaquette de montage de semi-conducteur, procede de fabrication associe, boitier de semi-conducteur comprenant cette plaquette et procede de fabrication de celui-ci - Google Patents
Plaquette de montage de semi-conducteur, procede de fabrication associe, boitier de semi-conducteur comprenant cette plaquette et procede de fabrication de celui-ci Download PDFInfo
- Publication number
- WO2002027787A1 WO2002027787A1 PCT/JP2001/008461 JP0108461W WO0227787A1 WO 2002027787 A1 WO2002027787 A1 WO 2002027787A1 JP 0108461 W JP0108461 W JP 0108461W WO 0227787 A1 WO0227787 A1 WO 0227787A1
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- WIPO (PCT)
- Prior art keywords
- semiconductor
- base material
- insulating base
- mounting
- semiconductor chip
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Description
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ç·åºæ¿ãšã®æ¥ç¶éšãæããã äŸãã°ã NIKKEI MATERIALS & TECHNOLOGY 94. 4ïŒ No, 140ïŒ pl 8- 19ã«ã¯ã ãã³ãä»ã ããªã€ãããã£ã«ã ãåå°äœãããã®è¡šé¢ã«æ¥çãã ããããšéãªãŒãç·ã«ãã é»æ°çæ¥ç¶ãå³ã£ãåŸã ãšããã·æš¹èãªã©ããããã£ã³ã°ããŠå°æ¢ããããã±äž ãžãé瀺ãããŠããã ãŸãã The Second VLSI Packaging Workshop o f Japan, 4
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Claims
1 . å¯ãšãæ§ã®çµ¶çžåºæãšé
ç·å°äœãšãåããåºæ¿ã§ãã£ãŠã åèšçµ¶çžåºæã é«é湿æ§ã§ããåå°äœæèŒçšåºæ¿ã
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2001290294A AU2001290294A1 (en) | 2000-09-27 | 2001-09-27 | Semiconductor mounting board, its manufacturing method, semiconductor package comprising this board, and its manufacturing method |
| JP2002531483A JP3852405B2 (ja) | 2000-09-27 | 2001-09-27 | åå°äœããã±ãŒãžã®è£œé æ¹æ³ |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-294347 | 2000-09-27 | ||
| JP2000294347 | 2000-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2002027787A1 true WO2002027787A1 (fr) | 2002-04-04 |
Family
ID=18776971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2001/008461 WO2002027787A1 (fr) | 2000-09-27 | 2001-09-27 | Plaquette de montage de semi-conducteur, procede de fabrication associe, boitier de semi-conducteur comprenant cette plaquette et procede de fabrication de celui-ci |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3852405B2 (ja) |
| AU (1) | AU2001290294A1 (ja) |
| WO (1) | WO2002027787A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109802A (ja) * | 2005-10-12 | 2007-04-26 | Nec Corp | é ç·åºæ¿åã³é ç·åºæ¿ãçšããåå°äœè£ 眮䞊ã³ã«ãã®è£œé æ¹æ³ |
| JP2012235167A (ja) * | 2009-01-30 | 2012-11-29 | Nitto Denko Corp | ãã€ã·ã³ã°ããŒãäžäœåãŠãšãè£é¢ä¿è·ãã£ã«ã |
| JP2012235168A (ja) * | 2009-01-30 | 2012-11-29 | Nitto Denko Corp | ãã€ã·ã³ã°ããŒãäžäœåãŠãšãè£é¢ä¿è·ãã£ã«ã |
| US8648476B2 (en) | 2009-01-30 | 2014-02-11 | Nitto Denko Corporation | Dicing tape-integrated wafer back surface protective film |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135247A (ja) * | 1996-07-31 | 1998-05-22 | Sharp Corp | åå°äœããã±âãžçšãããæ¯æåºæ¿ãåå°äœè£ 眮åã³åå°äœè£ 眮ã®è£œé æ³ |
| JP2000106372A (ja) * | 1998-09-29 | 2000-04-11 | Hitachi Chem Co Ltd | äž¡é¢æ¥çãã£ã«ã ãåå°äœæèŒçšææ©åºæ¿ããã³åå°äœè£ 眮 |
-
2001
- 2001-09-27 WO PCT/JP2001/008461 patent/WO2002027787A1/ja active Application Filing
- 2001-09-27 AU AU2001290294A patent/AU2001290294A1/en not_active Abandoned
- 2001-09-27 JP JP2002531483A patent/JP3852405B2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135247A (ja) * | 1996-07-31 | 1998-05-22 | Sharp Corp | åå°äœããã±âãžçšãããæ¯æåºæ¿ãåå°äœè£ 眮åã³åå°äœè£ 眮ã®è£œé æ³ |
| JP2000106372A (ja) * | 1998-09-29 | 2000-04-11 | Hitachi Chem Co Ltd | äž¡é¢æ¥çãã£ã«ã ãåå°äœæèŒçšææ©åºæ¿ããã³åå°äœè£ 眮 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109802A (ja) * | 2005-10-12 | 2007-04-26 | Nec Corp | é ç·åºæ¿åã³é ç·åºæ¿ãçšããåå°äœè£ 眮䞊ã³ã«ãã®è£œé æ¹æ³ |
| JP2012235167A (ja) * | 2009-01-30 | 2012-11-29 | Nitto Denko Corp | ãã€ã·ã³ã°ããŒãäžäœåãŠãšãè£é¢ä¿è·ãã£ã«ã |
| JP2012235168A (ja) * | 2009-01-30 | 2012-11-29 | Nitto Denko Corp | ãã€ã·ã³ã°ããŒãäžäœåãŠãšãè£é¢ä¿è·ãã£ã«ã |
| US8648476B2 (en) | 2009-01-30 | 2014-02-11 | Nitto Denko Corporation | Dicing tape-integrated wafer back surface protective film |
| US8766462B2 (en) | 2009-01-30 | 2014-07-01 | Nitto Denko Corporation | Dicing tape-integrated wafer back surface protective film |
| US8841780B2 (en) | 2009-01-30 | 2014-09-23 | Nitto Denko Corporation | Dicing tape-integrated wafer back surface protective film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2002027787A1 (ja) | 2004-02-05 |
| AU2001290294A1 (en) | 2002-04-08 |
| JP3852405B2 (ja) | 2006-11-29 |
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