WO2002008774A1 - Probe driving method, and probe apparatus - Google Patents
Probe driving method, and probe apparatus Download PDFInfo
- Publication number
- WO2002008774A1 WO2002008774A1 PCT/JP2001/004875 JP0104875W WO0208774A1 WO 2002008774 A1 WO2002008774 A1 WO 2002008774A1 JP 0104875 W JP0104875 W JP 0104875W WO 0208774 A1 WO0208774 A1 WO 0208774A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- driving method
- sample
- height
- image
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q10/00—Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
- G01Q10/04—Fine scanning or positioning
- G01Q10/06—Circuits or algorithms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Radiology & Medical Imaging (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Sampling And Sample Adjustment (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/296,887 US6960765B2 (en) | 2000-07-24 | 2001-06-08 | Probe driving method, and probe apparatus |
EP01936933A EP1335209A4 (en) | 2000-07-24 | 2001-06-08 | PROBE GUIDE METHOD AND APPARATUS |
US11/201,222 US7301146B2 (en) | 2000-07-24 | 2005-08-11 | Probe driving method, and probe apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000222882A JP4408538B2 (ja) | 2000-07-24 | 2000-07-24 | プローブ装置 |
JP2000-222882 | 2000-07-24 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/201,222 Continuation US7301146B2 (en) | 2000-07-24 | 2005-08-11 | Probe driving method, and probe apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002008774A1 true WO2002008774A1 (en) | 2002-01-31 |
Family
ID=18717069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/004875 WO2002008774A1 (en) | 2000-07-24 | 2001-06-08 | Probe driving method, and probe apparatus |
Country Status (4)
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004048002A1 (en) * | 2002-11-26 | 2004-06-10 | S. C. Johnson & Son, Inc. | Atomizer with improved wire type atomizing element support and method of making same |
DE10320381A1 (de) * | 2003-05-06 | 2004-12-16 | Scorpion Technologies Ag | Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln |
US8710464B2 (en) | 2009-03-30 | 2014-04-29 | Hitachi High-Technologies Corporation | Specimen preparation device, and control method in specimen preparation device |
CN110286290A (zh) * | 2019-07-09 | 2019-09-27 | 江苏安方电力科技有限公司 | 一种变压器自动接线装置 |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6828566B2 (en) * | 1997-07-22 | 2004-12-07 | Hitachi Ltd | Method and apparatus for specimen fabrication |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
JP4178741B2 (ja) | 2000-11-02 | 2008-11-12 | 株式会社日立製作所 | 荷電粒子線装置および試料作製装置 |
DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
US6970634B2 (en) * | 2001-05-04 | 2005-11-29 | Cascade Microtech, Inc. | Fiber optic wafer probe |
AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
DE10220343B4 (de) * | 2002-05-07 | 2007-04-05 | Atg Test Systems Gmbh & Co. Kg Reicholzheim | Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
US20050205430A1 (en) * | 2003-11-26 | 2005-09-22 | Microfabrica Inc. | EFAB methods including controlled mask to substrate mating |
JP2007517231A (ja) | 2003-12-24 | 2007-06-28 | カスケード マイクロテック インコーポレイテッド | アクティブ・ウェハプローブ |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
JP4733959B2 (ja) * | 2003-12-24 | 2011-07-27 | 株式会社日立ハイテクノロジーズ | プローブ接触方法及び荷電粒子線装置 |
US7285778B2 (en) * | 2004-02-23 | 2007-10-23 | Zyvex Corporation | Probe current imaging |
US7326293B2 (en) | 2004-03-26 | 2008-02-05 | Zyvex Labs, Llc | Patterned atomic layer epitaxy |
JP5436527B2 (ja) * | 2004-08-25 | 2014-03-05 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
JP5001533B2 (ja) * | 2004-08-25 | 2012-08-15 | エスアイアイ・ナノテクノロジー株式会社 | プローブのアプローチ方法 |
KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
JP4627168B2 (ja) * | 2004-09-24 | 2011-02-09 | 日本電信電話株式会社 | 機能デバイスの作製方法および機能デバイス |
JP4842533B2 (ja) * | 2004-10-27 | 2011-12-21 | 株式会社日立ハイテクノロジーズ | 不良検査装置 |
WO2006050495A2 (en) * | 2004-11-03 | 2006-05-11 | Omniprobe, Inc. | Method and apparatus for the automated process of in-situ lift-out |
US7197110B2 (en) * | 2004-11-29 | 2007-03-27 | Motorola, Inc. | Method for determining chemical content of complex structures using X-ray microanalysis |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7665349B2 (en) * | 2005-04-12 | 2010-02-23 | Veeco Instruments Inc. | Method and apparatus for rapid automatic engagement of a probe |
JP2006308476A (ja) * | 2005-04-28 | 2006-11-09 | Tokyo Seimitsu Co Ltd | 表面粗さ/形状測定装置 |
JP4520905B2 (ja) * | 2005-06-10 | 2010-08-11 | 株式会社日立ハイテクノロジーズ | 解析装置、プローブの制御方法および解析システム |
JP2007018935A (ja) * | 2005-07-08 | 2007-01-25 | Hitachi High-Technologies Corp | プローブ付き顕微鏡及びプローブ接触方法 |
JP4794256B2 (ja) * | 2005-09-27 | 2011-10-19 | 株式会社東京精密 | プローバ、プローブ接触方法及びそのためのプログラム |
JP4520926B2 (ja) * | 2005-10-14 | 2010-08-11 | 株式会社日立ハイテクノロジーズ | 試料解析方法 |
US20090076682A1 (en) * | 2006-03-22 | 2009-03-19 | Gm Global Technology Operations, Inc. | Vehicle subsystem control method and apparatus |
US7712354B2 (en) * | 2006-06-06 | 2010-05-11 | Jeol Ltd. | Method and apparatus for controlling Z-position of probe |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
JP5138294B2 (ja) * | 2006-07-10 | 2013-02-06 | エフ イー アイ カンパニ | 試験片から微小サンプルを分離する方法 |
EP1879011B1 (en) * | 2006-07-10 | 2013-01-30 | Fei Company | Method for separating a minute sample from a work piece |
JP4307470B2 (ja) * | 2006-08-08 | 2009-08-05 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置、試料加工方法及び半導体検査装置 |
US7472585B2 (en) * | 2006-10-27 | 2009-01-06 | Agilent Technologies, Inc. | Method for rapid seeks to the measurement surface for a scanning probe microscope |
US7659509B2 (en) * | 2006-10-31 | 2010-02-09 | Agilent Technologies, Inc. | System for scanning probe microscope input device |
JP5002273B2 (ja) * | 2007-01-23 | 2012-08-15 | 日本電子株式会社 | 試料検査装置及び試料検査方法 |
US7786436B1 (en) * | 2006-12-22 | 2010-08-31 | Dcg Systems, Inc. | FIB based open via analysis and repair |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
JP5121619B2 (ja) * | 2008-07-31 | 2013-01-16 | エスアイアイ・ナノテクノロジー株式会社 | プローブ顕微鏡の探針位置合せ方法およびその方法により操作されるプローブ顕微鏡 |
JP5192313B2 (ja) * | 2008-08-14 | 2013-05-08 | 株式会社日立ハイテクノロジーズ | 接触検出装置および接触検出方法 |
US8111903B2 (en) * | 2008-09-26 | 2012-02-07 | International Business Machines Corporation | Inline low-damage automated failure analysis |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
JP5324534B2 (ja) * | 2010-07-29 | 2013-10-23 | 株式会社日立ハイテクノロジーズ | 検査方法及び装置 |
JP5044003B2 (ja) * | 2010-08-31 | 2012-10-10 | 日本電信電話株式会社 | プローブの作製方法およびプローブ、ならびに走査プローブ顕微鏡 |
JP5750883B2 (ja) * | 2010-12-21 | 2015-07-22 | 富士通株式会社 | プローブ装置及びプローブ測定方法 |
JP2013140840A (ja) * | 2011-12-28 | 2013-07-18 | Hitachi High-Technologies Corp | 試料観察装置 |
JP5887247B2 (ja) * | 2012-10-15 | 2016-03-16 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置および試料作製法 |
CN104377101B (zh) | 2013-08-14 | 2017-08-08 | Fei 公司 | 用于带电粒子束系统的电路探头 |
CN103983498A (zh) * | 2014-04-24 | 2014-08-13 | 江苏迈世达电子有限公司 | 一种用于线路板金相切片分析的微蚀液及其使用方法 |
EP3163283B1 (en) | 2014-06-30 | 2023-08-30 | Hitachi High-Tech Science Corporation | Automated sample-preparation device |
TW201616135A (zh) * | 2014-10-29 | 2016-05-01 | 力晶科技股份有限公司 | 縮小探針的針尖尺寸的方法及載台 |
JP6900026B2 (ja) * | 2017-03-27 | 2021-07-07 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
JP6913344B2 (ja) * | 2017-03-27 | 2021-08-04 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
JP7182951B2 (ja) * | 2018-08-27 | 2022-12-05 | 株式会社日本マイクロニクス | 検査装置及び検査方法 |
CN110987550A (zh) * | 2019-11-11 | 2020-04-10 | 嘉兴华才检测技术有限公司 | 一种食品加工检测箱 |
US11280749B1 (en) * | 2020-10-23 | 2022-03-22 | Applied Materials Israel Ltd. | Holes tilt angle measurement using FIB diagonal cut |
US20230258707A1 (en) * | 2022-02-14 | 2023-08-17 | Innovatum Instruments Inc. | Automated probe landing |
CN116168996B (zh) * | 2023-04-24 | 2023-06-27 | 合肥晶合集成电路股份有限公司 | 一种电子显微镜及其工作方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04150047A (ja) * | 1990-10-15 | 1992-05-22 | Seiko Epson Corp | ウエハプローバ |
JPH0541421A (ja) * | 1990-08-06 | 1993-02-19 | Tokyo Electron Ltd | 電気回路測定用探針の接触検知装置及びこの接触検知装置を用いた電気回路測定装置 |
JPH0552721A (ja) * | 1991-08-22 | 1993-03-02 | Hitachi Ltd | 試料の分離方法及びこの分離方法で得た分離試料の分析方法 |
JPH05114634A (ja) * | 1991-10-22 | 1993-05-07 | Sony Corp | 微小領域物性測定装置 |
JPH07333301A (ja) * | 1994-06-03 | 1995-12-22 | Brother Ind Ltd | 基板検査装置 |
JPH0837211A (ja) * | 1994-07-26 | 1996-02-06 | Hitachi Ltd | 半導体装置の検査装置 |
WO1999005506A1 (en) * | 1997-07-22 | 1999-02-04 | Hitachi, Ltd. | Method and apparatus for preparing samples |
JP2000147070A (ja) * | 1998-11-17 | 2000-05-26 | Hitachi Ltd | プローブ装置 |
JP2000171364A (ja) * | 1998-12-02 | 2000-06-23 | Hitachi Ltd | 試料作製装置 |
Family Cites Families (7)
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JPS57126056A (en) * | 1981-01-29 | 1982-08-05 | Akashi Seisakusho Co Ltd | Scanning-type electronic microscope which can display plural sample images simultaneously, and device similar to it |
US5656812A (en) * | 1995-07-21 | 1997-08-12 | Jeol Ltd. | Electron probe microanalyzer and X-ray analysis using same |
JPH09320505A (ja) * | 1996-03-29 | 1997-12-12 | Hitachi Ltd | 電子線式検査方法及びその装置並びに半導体の製造方法及びその製造ライン |
JP3577839B2 (ja) | 1996-06-04 | 2004-10-20 | 株式会社日立製作所 | 不良検査方法および装置 |
JP3002743B2 (ja) | 1996-07-23 | 2000-01-24 | 鹿島建設株式会社 | 浮基礎および浮基礎の空気バネ交換方法 |
US6583413B1 (en) * | 1999-09-01 | 2003-06-24 | Hitachi, Ltd. | Method of inspecting a circuit pattern and inspecting instrument |
EP1209737B2 (en) * | 2000-11-06 | 2014-04-30 | Hitachi, Ltd. | Method for specimen fabrication |
-
2000
- 2000-07-24 JP JP2000222882A patent/JP4408538B2/ja not_active Expired - Lifetime
-
2001
- 2001-06-08 EP EP11008933A patent/EP2423676A1/en not_active Withdrawn
- 2001-06-08 EP EP01936933A patent/EP1335209A4/en not_active Withdrawn
- 2001-06-08 US US10/296,887 patent/US6960765B2/en not_active Expired - Lifetime
- 2001-06-08 WO PCT/JP2001/004875 patent/WO2002008774A1/ja active Application Filing
-
2005
- 2005-08-11 US US11/201,222 patent/US7301146B2/en not_active Expired - Lifetime
Patent Citations (9)
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JPH0541421A (ja) * | 1990-08-06 | 1993-02-19 | Tokyo Electron Ltd | 電気回路測定用探針の接触検知装置及びこの接触検知装置を用いた電気回路測定装置 |
JPH04150047A (ja) * | 1990-10-15 | 1992-05-22 | Seiko Epson Corp | ウエハプローバ |
JPH0552721A (ja) * | 1991-08-22 | 1993-03-02 | Hitachi Ltd | 試料の分離方法及びこの分離方法で得た分離試料の分析方法 |
JPH05114634A (ja) * | 1991-10-22 | 1993-05-07 | Sony Corp | 微小領域物性測定装置 |
JPH07333301A (ja) * | 1994-06-03 | 1995-12-22 | Brother Ind Ltd | 基板検査装置 |
JPH0837211A (ja) * | 1994-07-26 | 1996-02-06 | Hitachi Ltd | 半導体装置の検査装置 |
WO1999005506A1 (en) * | 1997-07-22 | 1999-02-04 | Hitachi, Ltd. | Method and apparatus for preparing samples |
JP2000147070A (ja) * | 1998-11-17 | 2000-05-26 | Hitachi Ltd | プローブ装置 |
JP2000171364A (ja) * | 1998-12-02 | 2000-06-23 | Hitachi Ltd | 試料作製装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004048002A1 (en) * | 2002-11-26 | 2004-06-10 | S. C. Johnson & Son, Inc. | Atomizer with improved wire type atomizing element support and method of making same |
CN100371088C (zh) * | 2002-11-26 | 2008-02-27 | 约翰逊父子公司 | 具有改进的线型雾化元件支架的雾化器及其制造方法 |
DE10320381A1 (de) * | 2003-05-06 | 2004-12-16 | Scorpion Technologies Ag | Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln |
DE10320381B4 (de) * | 2003-05-06 | 2010-11-04 | Scorpion Technologies Ag | Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln |
US8710464B2 (en) | 2009-03-30 | 2014-04-29 | Hitachi High-Technologies Corporation | Specimen preparation device, and control method in specimen preparation device |
CN110286290A (zh) * | 2019-07-09 | 2019-09-27 | 江苏安方电力科技有限公司 | 一种变压器自动接线装置 |
Also Published As
Publication number | Publication date |
---|---|
US20030184332A1 (en) | 2003-10-02 |
US20050269511A1 (en) | 2005-12-08 |
EP1335209A4 (en) | 2009-08-26 |
JP4408538B2 (ja) | 2010-02-03 |
EP1335209A1 (en) | 2003-08-13 |
US7301146B2 (en) | 2007-11-27 |
US6960765B2 (en) | 2005-11-01 |
JP2002040107A (ja) | 2002-02-06 |
EP2423676A1 (en) | 2012-02-29 |
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