WO2001052330A1 - Procede de fabrication de diodes electroluminescentes concaves, a fond plat et en arc de cercle - Google Patents

Procede de fabrication de diodes electroluminescentes concaves, a fond plat et en arc de cercle Download PDF

Info

Publication number
WO2001052330A1
WO2001052330A1 PCT/CN2000/000223 CN0000223W WO0152330A1 WO 2001052330 A1 WO2001052330 A1 WO 2001052330A1 CN 0000223 W CN0000223 W CN 0000223W WO 0152330 A1 WO0152330 A1 WO 0152330A1
Authority
WO
WIPO (PCT)
Prior art keywords
concave cup
light
emitting diode
manufacturing
baking
Prior art date
Application number
PCT/CN2000/000223
Other languages
English (en)
Chinese (zh)
Inventor
Tsung-Wen Chan
Original Assignee
Chan Tsung Wen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chan Tsung Wen filed Critical Chan Tsung Wen
Priority to AU2000265533A priority Critical patent/AU2000265533A1/en
Publication of WO2001052330A1 publication Critical patent/WO2001052330A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

  • the invention relates to a method for manufacturing a light-emitting diode with an arc-shaped flat-bottomed concave cup, in particular to a surface-adhesive light-emitting diode product, a dot matrix light-emitting diode product, a seven-segment display light-emitting diode product, a light-emitting diode backlight board series product, Manufacturing method of light-emitting diodes with arc-shaped flat-bottomed concave cups in the fields of automobile interior lighting and brake light series products, traffic sign light series products and outdoor full-color kanban series products.
  • LED is the abbreviation of Low Emitting Diode (hereinafter abbreviated as LED).
  • the actual LED is shown in Figure 1.
  • LED 1 is connected to the aluminum bracket 11 with conductive wires.
  • the aluminum bracket 11 passes through the printed circuit board 12 and is soldered to the other side of the printed circuit board 12 using solder 13.
  • the aluminum bracket 11 is also subject to uneven light sources due to eccentricity when it is manufactured, and the most fatal flaw of this structure is that it is not easy to dissipate heat. Because the operating temperature of the LED has an absolute relationship with its brightness Therefore, whether the heat dissipation is good or not becomes an important basis for judging the quality of the LED.
  • the purpose of the present invention is to provide a method for manufacturing an LED with an arc-shaped flat-bottomed concave cup.
  • the LED with an arc-shaped flat-bottomed concave cup produced by the method of the present invention has good heat dissipation performance, and the uniformity of light emission can be within 1: 1.1;
  • the printed circuit board has smooth and flat electroplating. When the LED is made into a lamp body, it takes a short time and has a low cost, and can avoid the high temperature damage of the tin furnace when it is held on the printed circuit board.
  • Different color crystal grains can be implanted in the concave cup to greatly improve the mixed light color and brightness, and can be made into SMD surface-adhesive parts; the manufacturing method of the present invention can be widely applied to the production of various LED products.
  • the technical scheme of the present invention is as follows:
  • the method for manufacturing the LED of the circular-arc flat-bottomed concave cup of the present invention includes two stages: The first stage is the manufacturing process of the concave cup printed circuit board, and the printed circuit board is placed in the CNC (that is, computer digital control: Compiled by Computerized Numerical Control, hereafter abbreviated as CNC) drilling machine, and using a special milling cutter to drill a circular flat-bottomed concave cup at a speed of 1 2 0 0 to 2 5 0 0 (the depth needs to be set), and After the drilling of other circuits is completed, the inside of the concave cup is completely polished by a sandblasting machine, and then copper ion plating is performed (the same as the general printed circuit board through-holes).
  • CNC computer digital control: Compiled by Computerized Numerical Control, hereafter abbreviated as CNC
  • CNC Computerized Numerical Control
  • the first stage can be completed;
  • the second stage is the manufacturing process of the concave cup LED.
  • the concave cup printed circuit board made according to the above process is then dispensed, After solidification, baking, connection, product testing, potting and baking processes, a concave cup type LED can be made.
  • the LED manufacturing method of the circular-arc flat-bottomed concave cup of the present invention includes the following steps:
  • guide hole covering covering the conductive hole with conductive agent
  • electroplated metal electroplated soft nickel for L ED solid crystal wire bonding
  • electroplated metal electroplated soft gold to prevent surface oxidation
  • baking baking the solder resist ink to dryness
  • Packaging packed in a vacuum packaging machine
  • Preparation materials LED die; (2 8) solid crystal: the position of the crystal grain is fixed by a computer automatic solid crystal machine;
  • baking baking solid crystals
  • the concave cup printed circuit board used in the present invention may adopt F R4, F R 5, C EM-1, C EM-3 or 94 V 0.
  • the ink exposure is performed by using a UV lamp tube of about 5 kilowatts for about 8-10 seconds.
  • the metal used for the electroplating is soft nickel of 1 2 5 U or more.
  • the step (1 4) is used for electroplating with soft gold of 1 to 2 U or more.
  • the active sodium used for deinking has a tablet alkali purity of about 95%.
  • the ink exposure is performed by using a UV lamp tube of about 7 kilowatts for about 8-10 seconds.
  • the ink setting is performed by baking at about 150 ° C for about 60 minutes.
  • the high current is 150 D C V / 2 M ohm
  • the low current is 5 D C V / 100 M ohm.
  • the step (26) of preparing the LED die used for the material is 9 mils to 14 mils.
  • the solidification is completed by baking at about 150 ° C for about 2 hours.
  • the impact test is performed with a current of about 100 mA.
  • the baking is performed at about 120 ° C for about 8 hours.
  • the present invention has the following advantages:
  • the flatness is good: the bottom and the periphery of the concave cup are in the shape of an arc bowl, and the arc reflection wall is flat and smooth, so that the light source can be forwarded all and evenly.
  • the printed circuit board produced by the invention has the characteristics of flatness, smooth plating, and good heat dissipation.
  • the flatness of the printed circuit board and the smooth surface of the concave cup plating can be used as a light source to guide light forward and For reflection.
  • the light-emitting die can be directly connected to the concave cup printed circuit board and dried by glue, so that the light-emitting body can be quickly dissipated directly by the copper foil on the printed circuit board.
  • Time is resistant to instantaneous high current, not easy to generate heat, uniform brightness, high stability, no outsourced processing (welding), cost reduction, large capacity increase, etc.
  • the LKD of the present invention When the LKD of the present invention is made into a lamp body, it takes a short time and has a low cost, and can avoid the high temperature damage of the tin furnace when soldering to the printed circuit board.
  • the manufacturing method of the present invention has extremely wide application fields and can be widely applied to the production of various LED products.
  • LED products such as: surface-adhesive light-emitting diode products, dot matrix light-emitting diode products, seven-segment display light-emitting diode products, LCD backlight products, automotive interior lighting and brake light products, traffic sign light products, and outdoor full-color Kanban products .
  • FIG. 1 is a physical schematic diagram of an existing LED
  • FIG. 2 is a schematic diagram of the arc-shaped flat-bottomed concave cup type LED of the present invention
  • FIG. 3 is a manufacturing flow chart of the arc-bottomed concave cup printed circuit board of the present invention.
  • FIG. 4 is a schematic diagram of the arc-bottomed concave cup printed circuit board of the present invention.
  • Fig. 5 is a flow chart of manufacturing a concave cup type LED according to the present invention.
  • FIG. 6 is a physical diagram of the concave cup type LED according to the present invention.
  • FIG. 7 is a schematic diagram of an optical path of the concave-cup type L E D unsealed glue
  • FIG. 8 is a schematic diagram of the light path after the concave cup type LED is sealed.
  • the concave cup LED 2 of the present invention is a CNC drilling machine on a printed circuit board, and a special milling cutter is used to drill a circle with an R angle from 1 2 0 0 to 2 5 0 0 0
  • the arc-bottomed concave cup 2 1 1 and the crystal grains 2 2 are set in the arc-shaped flat-bottomed concave cup 2 1 1.
  • the copper foil on the circuit board 21 is connected, and finally encapsulated on the epoxy resin glue 2 3.
  • the concave cup of the present invention directly dissipates heat from a printed circuit board, and has extremely low contact thermal resistance, so it has a long-term resistance to instantaneous large current, is not easy to generate heat, uniform brightness, high stability, no outsourced processing (tough connection), cost reduction and productivity A lot of advantages.
  • the general L E D operating temperature calculation method is as follows:
  • the speed of an electronic square pulse is set to 1 Oms (milliseconds);
  • the constant current conduction condition is 2 OmA (milliampere), and it is continuously lit for 30 minutes;
  • the printed circuit board of the present invention can control R (arc angle), and the concave cup technology can meet international certification standards through experimental data and practical application of production and life testing.
  • the manufacturing method of the present invention includes two stages. Referring to FIG. 3, the steps are as follows:
  • Preparation material 3 1:
  • the printed circuit board can be FR 4, F R 5, C EM 1, C EM—3 or 94 V 0;
  • the second drilling 33 using CNC drilling to half drill the position of the concave cup (the front guide hole is referred to as the blind hole);
  • Sandblasting 3 5 Smooth the periphery and bottom of the concave cup of the printed circuit board
  • electroplating 37 -secondary copper electroplating
  • negative film making 38 making a brown negative film
  • Vacuum pressing 3 9 Use dry line ink (wet printing ink cannot be used);
  • Ink exposure 40 Expose for about 8-10 seconds with about 5 kW UV lamp;
  • Circuit development 4 1 After the development with soda ash is completed, wash with pure water;
  • Electroplated metal 4 3 Electroplated soft nickel above 1 2 5 U, for arched LE D solid crystal wire bonding;
  • electroplated metal 44 electroplating of soft gold over 1-2 U to prevent surface oxidation
  • Quality inspection 4 7 (Remove quality inspection) Can repair broken and short circuit manually;
  • Coating 4 8 (Liguide) solder mask (usually required for both the front and back);
  • Ink exposure 50 Expose for about 8-10 seconds with a UV lamp (UV lamp) of about 7 kW;
  • Forming 54 C N C milling cutter or punch forming
  • Packaging 5 5 Packing with vacuum packaging machine
  • a concave cup printed circuit board for a concave cup type KD can be produced.
  • a plurality of concave cups 2 1 1 and copper foil 2 4 are opened on the completed concave cup printed circuit board 2 1. And the number and size of the concave cups 2 1 1 can be used as needed;
  • the size and depth of the concave cup can be controlled and set as required:
  • the second stage can be performed, see FIG. 5.
  • the steps are as follows: (1) Prepare the material 6 1: L E D grains 9 mils to 14 mils;
  • Solid crystal 6 3 Fix the position of the crystal grain by the computer automatic solid crystal machine; (4) Copy 64: bake at about 150 ° C for about 2 hours to complete the solidification; (5) wire 6 5: sinter the positive and negative electrodes with an automatic wire making machine to make them conductive;
  • Product testing test 6 6 Shock test with a current of about 100 m A;
  • Baking 6 8 Baking at about 120 ° C for about 8 hours is completed.
  • a multi-purpose concave cup L E D can be produced.
  • the light emitting die 2 2 is fixed on the printed circuit board 21 of the concave cup, and the positive and negative electrodes on the die 22 are connected by using a wire bonding technology Go to the upper copper foil 24, and finally seal with epoxy glue 23 to complete.
  • the concave cup LED when the concave cup LED is not sealed with epoxy resin, the light source emitted by the crystal grain 2 2 will have the characteristics of flatness, smooth plating and good heat dissipation due to the curved concave cup 2 1 1.
  • a light path 7 is created which focuses light forward. '
  • the light path 7 generated by the light-emitting die 22 can be uniformly presented on the raised colloid.

Abstract

L'invention concerne un procédé de fabrication de diodes électroluminescentes concaves, à fond plat et en arc de cercle consistant premièrement à fabriquer la carte de circuit imprimés sous forme concave en l'insérant dans une perforatrice. A cet effet, on façonne la carte pour lui conférer une forme concave à fond plat en arc de cercle à l'aide d'une fraise spécifique à une vitesse de rotation comprise entre 12000 et 25000 tours/minute, et après perforation des orifices sur la carte et polissage de la partie intérieure en forme concave par le biais d'une machine à jet de sable, on la galvanise avec des ions de cuivre, la métallise au nickel et la plaque d'or. Le procédé consiste deuxièmement à fabriquer des diodes électroluminescentes sous forme concave. Après avoir collé, fixé une puce, cuit, soudé, testé, injecté un adhésif et effectué à nouveau une cuisson, on obtient une diode concave. La diode ainsi obtenue fait preuve de bonnes performances, trouve des débouchés en termes de commerce et un large éventail d'applications.
PCT/CN2000/000223 2000-01-10 2000-08-04 Procede de fabrication de diodes electroluminescentes concaves, a fond plat et en arc de cercle WO2001052330A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2000265533A AU2000265533A1 (en) 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB001132105A CN1173416C (zh) 2000-01-10 2000-01-10 圆弧平底凹杯之发光二极管的制作方法
CN00113210.5 2000-01-10

Publications (1)

Publication Number Publication Date
WO2001052330A1 true WO2001052330A1 (fr) 2001-07-19

Family

ID=4583017

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2000/000223 WO2001052330A1 (fr) 2000-01-10 2000-08-04 Procede de fabrication de diodes electroluminescentes concaves, a fond plat et en arc de cercle

Country Status (3)

Country Link
CN (1) CN1173416C (fr)
AU (1) AU2000265533A1 (fr)
WO (1) WO2001052330A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103311410A (zh) * 2013-06-13 2013-09-18 苏州金科信汇光电科技有限公司 一种高导热高击穿电压集成式led
CN103539343A (zh) * 2012-07-09 2014-01-29 三和科技有限公司 一种混合加工有色玻璃的方法
CN109392256A (zh) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 一种防止残铜的半沉铜孔线路板及其制造方法
CN110112077A (zh) * 2019-05-15 2019-08-09 扬州虹扬科技发展有限公司 一种整流二极管管芯的生产工艺
CN117119708A (zh) * 2023-09-07 2023-11-24 泗阳群鑫电子有限公司 用线路板为载体制造贴片二极管、电容器及电阻的方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514413B2 (ja) * 2003-04-14 2010-07-28 豊田合成株式会社 Ｌｅｄランプ及びその製造方法
CN100342558C (zh) * 2004-08-11 2007-10-10 深圳市瑞丰光电子有限公司 陶瓷封装发光二极管的封装方法
CN100447303C (zh) * 2004-09-29 2008-12-31 李家顺 复蚀刻直接成形刀模的方法及其装置
CN101030611B (zh) * 2006-03-05 2010-05-12 浙江古越龙山电子科技发展有限公司 大功率发光二极管点胶工艺
WO2008046241A1 (fr) * 2006-10-11 2008-04-24 Tsungwen Chan Structure de plaque de rétroéclairage comportant des diodes électroluminescentes incorporées et son procédé de fabrication
CN102222752A (zh) * 2010-04-15 2011-10-19 珠海市力丰光电实业有限公司 发光二极管及其制造方法
CN102438410A (zh) * 2011-11-18 2012-05-02 博罗县精汇电子科技有限公司 一种fpc贴装元器件的制造方法
CN104916762A (zh) * 2015-07-07 2015-09-16 宏齐光电子(深圳)有限公司 一种白光led面光源及其制备方法
CN111081843B (zh) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 一种直线式曲面光源生产机器人装置
CN111081844B (zh) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 一种直线式曲面光源生产机器人生产线

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A2 (fr) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. Module de diodes électroluminescentes et méthode pour sa fabrication
JPH0722352A (ja) * 1993-06-30 1995-01-24 Canon Inc 露光装置とこれを用いたデバイス製造方法
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
EP0632511A2 (fr) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. Module de diodes électroluminescentes et méthode pour sa fabrication
JPH0722352A (ja) * 1993-06-30 1995-01-24 Canon Inc 露光装置とこれを用いたデバイス製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103539343A (zh) * 2012-07-09 2014-01-29 三和科技有限公司 一种混合加工有色玻璃的方法
CN103311410A (zh) * 2013-06-13 2013-09-18 苏州金科信汇光电科技有限公司 一种高导热高击穿电压集成式led
CN109392256A (zh) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 一种防止残铜的半沉铜孔线路板及其制造方法
CN110112077A (zh) * 2019-05-15 2019-08-09 扬州虹扬科技发展有限公司 一种整流二极管管芯的生产工艺
CN117119708A (zh) * 2023-09-07 2023-11-24 泗阳群鑫电子有限公司 用线路板为载体制造贴片二极管、电容器及电阻的方法

Also Published As

Publication number Publication date
AU2000265533A1 (en) 2001-07-24
CN1173416C (zh) 2004-10-27
CN1304186A (zh) 2001-07-18

Similar Documents

Publication Publication Date Title
WO2001052330A1 (fr) Procede de fabrication de diodes electroluminescentes concaves, a fond plat et en arc de cercle
US9018667B2 (en) Semiconductor chip assembly with post/base heat spreader and dual adhesives
JP4307094B2 (ja) Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
CN103748700B (zh) 用于led封装的带有凹坑和通孔的基板
US8076182B2 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
US6225139B1 (en) Manufacturing method of an led of a type of round concave cup with a flat bottom
US8193556B2 (en) Semiconductor chip assembly with post/base heat spreader and cavity in post
US8207553B2 (en) Semiconductor chip assembly with base heat spreader and cavity in base
US20100059786A1 (en) Semiconductor chip assembly with post/base heat spreader and substrate
JP2010103126A (ja) バックライトユニット
JP2008042158A (ja) Ｓｍｌ型発光ダイオードランプ用素子およびその製造方法
CN102983125B (zh) Led封装、其制作方法及包含其的led系统
US8415703B2 (en) Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
CN107785474A (zh) 发光二极管元件装置与其制作方法
WO2019148934A1 (fr) Appareil d'éclairage, cordon de del en ligne et procédé de fabrication
US20120175664A1 (en) Lighting device and method for forming the same
CN206758464U (zh) 一种基于陶瓷基板的led封装光源
WO2017067149A1 (fr) Ampoule à del et son procédé de fabrication
TW488085B (en) Manufacturing method of arc and flat-bottomed concave-cup LED
JP2005317951A (ja) 発光ダイオード組立体の組立方法および発光ダイオード組立体
CN208400847U (zh) 一种八脚大功率封装灯珠
CN206419687U (zh) 一种新型led灯
CN207162424U (zh) 车辆用照明装置及车辆用灯具
CN220551803U (zh) Uv led灯具及其铜基板模组
CN211654854U (zh) 一种车灯芯片封装的陶瓷基板

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP