WO2001052330A1 - An led in the shape of cup with a curved surface and planar bottom - Google Patents

An led in the shape of cup with a curved surface and planar bottom Download PDF

Info

Publication number
WO2001052330A1
WO2001052330A1 PCT/CN2000/000223 CN0000223W WO0152330A1 WO 2001052330 A1 WO2001052330 A1 WO 2001052330A1 CN 0000223 W CN0000223 W CN 0000223W WO 0152330 A1 WO0152330 A1 WO 0152330A1
Authority
WO
WIPO (PCT)
Prior art keywords
concave cup
light
emitting diode
manufacturing
baking
Prior art date
Application number
PCT/CN2000/000223
Other languages
French (fr)
Chinese (zh)
Inventor
Tsung-Wen Chan
Original Assignee
Chan Tsung Wen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chan Tsung Wen filed Critical Chan Tsung Wen
Priority to AU2000265533A priority Critical patent/AU2000265533A1/en
Publication of WO2001052330A1 publication Critical patent/WO2001052330A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

  • the invention relates to a method for manufacturing a light-emitting diode with an arc-shaped flat-bottomed concave cup, in particular to a surface-adhesive light-emitting diode product, a dot matrix light-emitting diode product, a seven-segment display light-emitting diode product, a light-emitting diode backlight board series product, Manufacturing method of light-emitting diodes with arc-shaped flat-bottomed concave cups in the fields of automobile interior lighting and brake light series products, traffic sign light series products and outdoor full-color kanban series products.
  • LED is the abbreviation of Low Emitting Diode (hereinafter abbreviated as LED).
  • the actual LED is shown in Figure 1.
  • LED 1 is connected to the aluminum bracket 11 with conductive wires.
  • the aluminum bracket 11 passes through the printed circuit board 12 and is soldered to the other side of the printed circuit board 12 using solder 13.
  • the aluminum bracket 11 is also subject to uneven light sources due to eccentricity when it is manufactured, and the most fatal flaw of this structure is that it is not easy to dissipate heat. Because the operating temperature of the LED has an absolute relationship with its brightness Therefore, whether the heat dissipation is good or not becomes an important basis for judging the quality of the LED.
  • the purpose of the present invention is to provide a method for manufacturing an LED with an arc-shaped flat-bottomed concave cup.
  • the LED with an arc-shaped flat-bottomed concave cup produced by the method of the present invention has good heat dissipation performance, and the uniformity of light emission can be within 1: 1.1;
  • the printed circuit board has smooth and flat electroplating. When the LED is made into a lamp body, it takes a short time and has a low cost, and can avoid the high temperature damage of the tin furnace when it is held on the printed circuit board.
  • Different color crystal grains can be implanted in the concave cup to greatly improve the mixed light color and brightness, and can be made into SMD surface-adhesive parts; the manufacturing method of the present invention can be widely applied to the production of various LED products.
  • the technical scheme of the present invention is as follows:
  • the method for manufacturing the LED of the circular-arc flat-bottomed concave cup of the present invention includes two stages: The first stage is the manufacturing process of the concave cup printed circuit board, and the printed circuit board is placed in the CNC (that is, computer digital control: Compiled by Computerized Numerical Control, hereafter abbreviated as CNC) drilling machine, and using a special milling cutter to drill a circular flat-bottomed concave cup at a speed of 1 2 0 0 to 2 5 0 0 (the depth needs to be set), and After the drilling of other circuits is completed, the inside of the concave cup is completely polished by a sandblasting machine, and then copper ion plating is performed (the same as the general printed circuit board through-holes).
  • CNC computer digital control: Compiled by Computerized Numerical Control, hereafter abbreviated as CNC
  • CNC Computerized Numerical Control
  • the first stage can be completed;
  • the second stage is the manufacturing process of the concave cup LED.
  • the concave cup printed circuit board made according to the above process is then dispensed, After solidification, baking, connection, product testing, potting and baking processes, a concave cup type LED can be made.
  • the LED manufacturing method of the circular-arc flat-bottomed concave cup of the present invention includes the following steps:
  • guide hole covering covering the conductive hole with conductive agent
  • electroplated metal electroplated soft nickel for L ED solid crystal wire bonding
  • electroplated metal electroplated soft gold to prevent surface oxidation
  • baking baking the solder resist ink to dryness
  • Packaging packed in a vacuum packaging machine
  • Preparation materials LED die; (2 8) solid crystal: the position of the crystal grain is fixed by a computer automatic solid crystal machine;
  • baking baking solid crystals
  • the concave cup printed circuit board used in the present invention may adopt F R4, F R 5, C EM-1, C EM-3 or 94 V 0.
  • the ink exposure is performed by using a UV lamp tube of about 5 kilowatts for about 8-10 seconds.
  • the metal used for the electroplating is soft nickel of 1 2 5 U or more.
  • the step (1 4) is used for electroplating with soft gold of 1 to 2 U or more.
  • the active sodium used for deinking has a tablet alkali purity of about 95%.
  • the ink exposure is performed by using a UV lamp tube of about 7 kilowatts for about 8-10 seconds.
  • the ink setting is performed by baking at about 150 ° C for about 60 minutes.
  • the high current is 150 D C V / 2 M ohm
  • the low current is 5 D C V / 100 M ohm.
  • the step (26) of preparing the LED die used for the material is 9 mils to 14 mils.
  • the solidification is completed by baking at about 150 ° C for about 2 hours.
  • the impact test is performed with a current of about 100 mA.
  • the baking is performed at about 120 ° C for about 8 hours.
  • the present invention has the following advantages:
  • the flatness is good: the bottom and the periphery of the concave cup are in the shape of an arc bowl, and the arc reflection wall is flat and smooth, so that the light source can be forwarded all and evenly.
  • the printed circuit board produced by the invention has the characteristics of flatness, smooth plating, and good heat dissipation.
  • the flatness of the printed circuit board and the smooth surface of the concave cup plating can be used as a light source to guide light forward and For reflection.
  • the light-emitting die can be directly connected to the concave cup printed circuit board and dried by glue, so that the light-emitting body can be quickly dissipated directly by the copper foil on the printed circuit board.
  • Time is resistant to instantaneous high current, not easy to generate heat, uniform brightness, high stability, no outsourced processing (welding), cost reduction, large capacity increase, etc.
  • the LKD of the present invention When the LKD of the present invention is made into a lamp body, it takes a short time and has a low cost, and can avoid the high temperature damage of the tin furnace when soldering to the printed circuit board.
  • the manufacturing method of the present invention has extremely wide application fields and can be widely applied to the production of various LED products.
  • LED products such as: surface-adhesive light-emitting diode products, dot matrix light-emitting diode products, seven-segment display light-emitting diode products, LCD backlight products, automotive interior lighting and brake light products, traffic sign light products, and outdoor full-color Kanban products .
  • FIG. 1 is a physical schematic diagram of an existing LED
  • FIG. 2 is a schematic diagram of the arc-shaped flat-bottomed concave cup type LED of the present invention
  • FIG. 3 is a manufacturing flow chart of the arc-bottomed concave cup printed circuit board of the present invention.
  • FIG. 4 is a schematic diagram of the arc-bottomed concave cup printed circuit board of the present invention.
  • Fig. 5 is a flow chart of manufacturing a concave cup type LED according to the present invention.
  • FIG. 6 is a physical diagram of the concave cup type LED according to the present invention.
  • FIG. 7 is a schematic diagram of an optical path of the concave-cup type L E D unsealed glue
  • FIG. 8 is a schematic diagram of the light path after the concave cup type LED is sealed.
  • the concave cup LED 2 of the present invention is a CNC drilling machine on a printed circuit board, and a special milling cutter is used to drill a circle with an R angle from 1 2 0 0 to 2 5 0 0 0
  • the arc-bottomed concave cup 2 1 1 and the crystal grains 2 2 are set in the arc-shaped flat-bottomed concave cup 2 1 1.
  • the copper foil on the circuit board 21 is connected, and finally encapsulated on the epoxy resin glue 2 3.
  • the concave cup of the present invention directly dissipates heat from a printed circuit board, and has extremely low contact thermal resistance, so it has a long-term resistance to instantaneous large current, is not easy to generate heat, uniform brightness, high stability, no outsourced processing (tough connection), cost reduction and productivity A lot of advantages.
  • the general L E D operating temperature calculation method is as follows:
  • the speed of an electronic square pulse is set to 1 Oms (milliseconds);
  • the constant current conduction condition is 2 OmA (milliampere), and it is continuously lit for 30 minutes;
  • the printed circuit board of the present invention can control R (arc angle), and the concave cup technology can meet international certification standards through experimental data and practical application of production and life testing.
  • the manufacturing method of the present invention includes two stages. Referring to FIG. 3, the steps are as follows:
  • Preparation material 3 1:
  • the printed circuit board can be FR 4, F R 5, C EM 1, C EM—3 or 94 V 0;
  • the second drilling 33 using CNC drilling to half drill the position of the concave cup (the front guide hole is referred to as the blind hole);
  • Sandblasting 3 5 Smooth the periphery and bottom of the concave cup of the printed circuit board
  • electroplating 37 -secondary copper electroplating
  • negative film making 38 making a brown negative film
  • Vacuum pressing 3 9 Use dry line ink (wet printing ink cannot be used);
  • Ink exposure 40 Expose for about 8-10 seconds with about 5 kW UV lamp;
  • Circuit development 4 1 After the development with soda ash is completed, wash with pure water;
  • Electroplated metal 4 3 Electroplated soft nickel above 1 2 5 U, for arched LE D solid crystal wire bonding;
  • electroplated metal 44 electroplating of soft gold over 1-2 U to prevent surface oxidation
  • Quality inspection 4 7 (Remove quality inspection) Can repair broken and short circuit manually;
  • Coating 4 8 (Liguide) solder mask (usually required for both the front and back);
  • Ink exposure 50 Expose for about 8-10 seconds with a UV lamp (UV lamp) of about 7 kW;
  • Forming 54 C N C milling cutter or punch forming
  • Packaging 5 5 Packing with vacuum packaging machine
  • a concave cup printed circuit board for a concave cup type KD can be produced.
  • a plurality of concave cups 2 1 1 and copper foil 2 4 are opened on the completed concave cup printed circuit board 2 1. And the number and size of the concave cups 2 1 1 can be used as needed;
  • the size and depth of the concave cup can be controlled and set as required:
  • the second stage can be performed, see FIG. 5.
  • the steps are as follows: (1) Prepare the material 6 1: L E D grains 9 mils to 14 mils;
  • Solid crystal 6 3 Fix the position of the crystal grain by the computer automatic solid crystal machine; (4) Copy 64: bake at about 150 ° C for about 2 hours to complete the solidification; (5) wire 6 5: sinter the positive and negative electrodes with an automatic wire making machine to make them conductive;
  • Product testing test 6 6 Shock test with a current of about 100 m A;
  • Baking 6 8 Baking at about 120 ° C for about 8 hours is completed.
  • a multi-purpose concave cup L E D can be produced.
  • the light emitting die 2 2 is fixed on the printed circuit board 21 of the concave cup, and the positive and negative electrodes on the die 22 are connected by using a wire bonding technology Go to the upper copper foil 24, and finally seal with epoxy glue 23 to complete.
  • the concave cup LED when the concave cup LED is not sealed with epoxy resin, the light source emitted by the crystal grain 2 2 will have the characteristics of flatness, smooth plating and good heat dissipation due to the curved concave cup 2 1 1.
  • a light path 7 is created which focuses light forward. '
  • the light path 7 generated by the light-emitting die 22 can be uniformly presented on the raised colloid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

A method for manufacturing a light emitting diode in the shape of cup with a curved surface and planar bottom comprises two stages: in first stage, to produce a printed circuit board in the shape of cup, a printed circuit board is placed in a drill and is drilled to a cup shape with a curved surface and planar bottom using a particular mill at 12000-25000 rpm, after the drilling of other circuit hole is completed, the interior of the cup is fully polished using a sandblast device, and then is plated with copper ion, then is plated nickel and gold; in second stage, to produce an LED in the form of cup, the printed circuit board produced thus is applied glue, then a chip is fixed on the printed circuit board, and then baking, bonding, testing, injecting glue and baking are performed successively, thereby forming an LED with the shape of cup. The LED manufactured according to the present invention shows good performances, commerciality and many uses.

Description

圆弧平底凹杯的发光二极管制作方法 本发明所属技术领域  Manufacturing method of light-emitting diode with circular flat bottom concave cup
本发明涉及一种圆弧平底凹杯的发光二极管制作方法， 特别是关于一种能运用 于表面粘着发光二极管产品、 点矩阵发光二极管产品、 七段显示发光二极管产品、 发光二极管背光板系列产品、 汽车内部照明及刹车灯系列产品、 交通标志灯系列产 品及户外全彩看板系列产品等领域的圆弧平底凹杯的发光二极管制作方法。  The invention relates to a method for manufacturing a light-emitting diode with an arc-shaped flat-bottomed concave cup, in particular to a surface-adhesive light-emitting diode product, a dot matrix light-emitting diode product, a seven-segment display light-emitting diode product, a light-emitting diode backlight board series product, Manufacturing method of light-emitting diodes with arc-shaped flat-bottomed concave cups in the fields of automobile interior lighting and brake light series products, traffic sign light series products and outdoor full-color kanban series products.
现有技术 current technology
LED是发光二极管（Low Emitting Diode)的英文缩写（以下均简写为 LED), 现有的 L E D的实体如图 1所示， 其中的 L E D 1是以导通线材连接于铝质支架 1 1上， 该铝质支架 1 1穿过印刷电路板 1 2， 并利用焊锡 1 3将其焊接于印刷电 路板 1 2的另外一面。 这种结构的 L E D, 其铝质支架 1 1在制作时， 也会因偏心 导致光源不均的困扰， 而且这种结构最致命的缺陷在于不易散热， 由于 L E D的工 作温度与其亮度有绝对的关系， 因此， 散热是否良好便成为判断 L E D好坏的重要 依据。  LED is the abbreviation of Low Emitting Diode (hereinafter abbreviated as LED). The actual LED is shown in Figure 1. Among them, LED 1 is connected to the aluminum bracket 11 with conductive wires. The aluminum bracket 11 passes through the printed circuit board 12 and is soldered to the other side of the printed circuit board 12 using solder 13. In the LED structure of this structure, the aluminum bracket 11 is also subject to uneven light sources due to eccentricity when it is manufactured, and the most fatal flaw of this structure is that it is not easy to dissipate heat. Because the operating temperature of the LED has an absolute relationship with its brightness Therefore, whether the heat dissipation is good or not becomes an important basis for judging the quality of the LED.
本发明的目的 Object of the invention
本发明的目的在于提供一种圆弧平底凹杯的 L E D制作方法， 利用本发明的方 法生产的圆弧平底凹杯形的 L E D, 具有良好的散热性能， 发光均匀性可达 1 :1.1 以内； 其印刷电路板的电镀光滑而平坦； 其 LED制作成灯体时， 耗时短、 成本低， 并可避免捍接于印刷电路板时下锡炉的高温破坏； 依照本发明的制作方法， 在同一 凹杯内可植入不同颜色的晶粒， 以大幅度提高其混光颜色及亮度， 并可制作成 S MD表面粘着式零件； 本发明的制作方法可广泛适用于生产各种 L E D产品。 本发明的技术方案  The purpose of the present invention is to provide a method for manufacturing an LED with an arc-shaped flat-bottomed concave cup. The LED with an arc-shaped flat-bottomed concave cup produced by the method of the present invention has good heat dissipation performance, and the uniformity of light emission can be within 1: 1.1; The printed circuit board has smooth and flat electroplating. When the LED is made into a lamp body, it takes a short time and has a low cost, and can avoid the high temperature damage of the tin furnace when it is held on the printed circuit board. According to the manufacturing method of the present invention, Different color crystal grains can be implanted in the concave cup to greatly improve the mixed light color and brightness, and can be made into SMD surface-adhesive parts; the manufacturing method of the present invention can be widely applied to the production of various LED products. Technical solution of the present invention
本发明的技术方案如下： 本发明的圆弧平底凹杯的 L E D制作方法包括两个阶 段： 第一阶段为凹杯印刷电路板制作过程， 将印刷电路板置入 CNC (亦即电脑数 字控制： Computerized Numerical Control 的编写， 以下均简写为 CNC) 钻孔机， 并利用特殊铣刀以 1 2 0 0 0至 2 5 0 0 0转钻出圆弧平底凹杯 （需设定深浅度）， 与其它电路钻孔完成后以喷砂机将凹杯内部完全抛光后， 再做铜离子电镀 （与一般 印刷电路板电镀贯穿导电孔相同） 完成后镀镍、 镀金即可完成第一阶段； 而第二阶 段为凹杯式 L E D制作过程， 将按上述过程制成的凹杯印刷电路板， 再经过点胶、 固晶、 烘拷、 连线、 品检测试、 灌胶及烘烤流程后， 即可制成凹杯式 L ED。 本发明的圆弧平底凹杯的 LED制作方法， 包括以下步骤： The technical scheme of the present invention is as follows: The method for manufacturing the LED of the circular-arc flat-bottomed concave cup of the present invention includes two stages: The first stage is the manufacturing process of the concave cup printed circuit board, and the printed circuit board is placed in the CNC (that is, computer digital control: Compiled by Computerized Numerical Control, hereafter abbreviated as CNC) drilling machine, and using a special milling cutter to drill a circular flat-bottomed concave cup at a speed of 1 2 0 0 to 2 5 0 0 (the depth needs to be set), and After the drilling of other circuits is completed, the inside of the concave cup is completely polished by a sandblasting machine, and then copper ion plating is performed (the same as the general printed circuit board through-holes). After the nickel plating and gold plating are completed, the first stage can be completed; The second stage is the manufacturing process of the concave cup LED. The concave cup printed circuit board made according to the above process is then dispensed, After solidification, baking, connection, product testing, potting and baking processes, a concave cup type LED can be made. The LED manufacturing method of the circular-arc flat-bottomed concave cup of the present invention includes the following steps:
( I ) 准备材料： 为一可印刷用电路板；  (I) Preparation materials: a printed circuit board;
( 2 ) 第一次钻孔： 利用 C N C钻孔将所有导通孔全钻透；  (2) the first drilling: all through holes are drilled through using C N C drilling;
( 3 ) 第二次钻孔： 利用 C N C钻孔将凹杯位置半钻透；  (3) the second drilling: the position of the recessed cup is partially drilled by using C N C drilling;
( 4 ) 第三次钻孔： 利用特殊铣刀配合 C N C钻孔将凹杯成型； (4) the third drilling: forming a concave cup with a special milling cutter in conjunction with C N C drilling;
( 5 ) 喷砂： 将印刷电路板凹杯四周及底部打平整； (5) Sand blasting: smooth the periphery and bottom of the concave cup of the printed circuit board;
( 6 ) 导孔被覆： 于导孔匹覆导电药剂；  (6) guide hole covering: covering the conductive hole with conductive agent;
( ) 电镀： 一次铜电镀；  () Plating: once copper plating;
( 8 ) 底片制作： 制作棕色底片；  (8) negative film making: making a brown negative film;
( 9 ) 真空压模： 利用干式线路油墨；  (9) Vacuum stamping: using dry line ink;
( 1 0 ) 油墨曝光： 利用紫外灯管曝光；  (1 0) ink exposure: exposure using a UV lamp;
( I I ) 电路显象： 利用纯碱显影完成后， 以纯水清洗；  (I I) circuit development: after development with soda ash is completed, wash with pure water;
( 1 2 ) 电镀： 二次铜电镀；  (1 2) electroplating: secondary copper electroplating;
( 1 3 ) 电镀金属： 电镀软镍， 供 L ED固晶打线之用；  (1 3) electroplated metal: electroplated soft nickel for L ED solid crystal wire bonding;
( 1 4 ) 电镀金属： 电镀软金， 以防止表面氧化；  (1 4) electroplated metal: electroplated soft gold to prevent surface oxidation;
( 1 5 ) 去墨： 以活性钠去除蚀刻部分油墨；  (1 5) deinking: removing the etched part of the ink with active sodium;
( 1 6 ) 蚀刻： 以氯化氨蚀刻掉不要的部分；  (1 6) Etching: etching away unnecessary parts with ammonia chloride;
( 1 7 ) 品检： 修复断、 短路；  (1 7) Quality inspection: repair broken and short circuit;
( 1 8 ) 覆膜： 防焊漆；  (1 8) coating: solder resist paint;
( 1 9 ) 烘烤： 将防焊油墨烘烤干；  (1 9) baking: baking the solder resist ink to dryness;
( 2 0 ) 油墨曝光： 利用紫外灯管曝光；  (2 0) ink exposure: exposure using a UV lamp;
( 2 1 ) 油墨显象： 以纯碱显影完， 用纯水清洗；  (2 1) ink development: after developing with soda ash, washing with pure water;
( 2 2 ) 油墨定型： 烘烤定型；  (2 2) ink setting: baking setting;
( 2 3 ) 品检测试： 以高、 低电流测试；  (2 3) Product testing test: High and low current test;
( 24 ) 成型： CNC铣刀或冲模成型；  (24) forming: CNC milling cutter or die forming;
( 2 5 ) 包装： 以真空包装机包装；  (2 5) Packaging: packed in a vacuum packaging machine;
由上述步骤即可制作出凹杯式 L E D所用的凹杯印刷电路板；  Through the above steps, a concave cup printed circuit board for a concave cup L E D can be manufactured;
( 2 6 ) 准备材料： L E D晶粒； ( 2 8 ) 固晶： 以电脑自动固晶机固定晶粒位置； (2 6) Preparation materials: LED die; (2 8) solid crystal: the position of the crystal grain is fixed by a computer automatic solid crystal machine;
( 2 9 ) 烘烤： 烘烤固晶；  (2 9) baking: baking solid crystals;
( 3 0 ) 连线： 以自动打线机烧结正、 负极使之导通；  (3 0) wiring: sintering the positive and negative electrodes with an automatic wire making machine to make them conductive;
( 3 1 ) 品检测试： 以电流冲击测试；  (3 1) Product inspection test: current impact test;
( 3 2 ) 灌胶： 以环氧树脂灌注入灌胶模粒中再置入 L ED;  (3 2) potting: pouring epoxy resin into potting mold pellets and then placing L ED;
( 3 3 ) 拱烤： 烘烤完成；  (3 3) arch roasting: baking is completed;
由上述步骤即可制作成凹杯式 L E D。  From the above steps, a concave cup L E D can be produced.
本发明所用的凹杯印刷电路板， 可采用 F R4、 F R 5、 C EM- 1 , C EM 一 3或 94 V 0等均可。  The concave cup printed circuit board used in the present invention may adopt F R4, F R 5, C EM-1, C EM-3 or 94 V 0.
在上述本发明的制作过程中：  In the above-mentioned manufacturing process of the present invention:
所述的步骤 （ 1 0 ) 的油墨曝光， 是利用约 5千瓦的紫外灯管曝光约 8— 1 0 秒。  In the step (10), the ink exposure is performed by using a UV lamp tube of about 5 kilowatts for about 8-10 seconds.
所述的步骤 （ 1 3 ) 电镀所用金属为 1 2 5 U以上的软镍。  In the step (1 3), the metal used for the electroplating is soft nickel of 1 2 5 U or more.
所述的步骤 （ 1 4 ) 电镀所用的金属为 1一 2 U以上的软金。  The step (1 4) is used for electroplating with soft gold of 1 to 2 U or more.
所述的步骤 （ 1 5 ) 去墨所使用的活性钠， 其片碱纯度约 9 5 %。  In the step (15), the active sodium used for deinking has a tablet alkali purity of about 95%.
所述的步骤 （ 2 0 ) 的油墨曝光， 是利用约 7千瓦的紫外灯管曝光约 8— 1 0 秒。  In the step (20), the ink exposure is performed by using a UV lamp tube of about 7 kilowatts for about 8-10 seconds.
所述的步骤 （ 2 2 ) 油墨定型， 是以摄氏约 1 5 0度烘烤约 6 0分钟。  In the step (2), the ink setting is performed by baking at about 150 ° C for about 60 minutes.
所述的步骤 （ 2 3 ) 品检测试， 所用的测试高电流为 1 5 0 D C V / 2 M欧姆， 而低电流则为 5 D C V / 1 0 0 M欧姆。  In the step (23), the high current is 150 D C V / 2 M ohm, and the low current is 5 D C V / 100 M ohm.
所述的步骤 （ 2 6 ) 准备材料所用的 LED晶粒， 为 9密尔至 1 4密尔。  The step (26) of preparing the LED die used for the material is 9 mils to 14 mils.
所述的步骤 （ 2 9 ) 的烘烤， 是以摄氏约 1 5 0度烘烤约 2小时， 方可完成固 晶。  In the step (29), the solidification is completed by baking at about 150 ° C for about 2 hours.
所述的步骤 （ 3 1 ) 的品检测试， 是以约 1 0 0 mA的电流作冲击试验。  In the product testing test in the step (31), the impact test is performed with a current of about 100 mA.
所述的步骤 （ 3 3 ) 的烘烤， 是以摄氏约 1 2 0度烘烤约 8小时。  In the step (3), the baking is performed at about 120 ° C for about 8 hours.
本发明与现有技术相比具有的优点 Advantages of the present invention compared with the prior art
本发明与现有技术相比有以下优点：  Compared with the prior art, the present invention has the following advantages:
一、 平坦性好： 凹杯底部及四周为圆弧碗状， 其圆弧反射壁平坦光滑， 使得光 源可全部且均匀地向前。 利用本发明制作的印刷电路板具有平坦、 电镀光滑以及良 好的散热等特性， 该印刷电路板的平坦性及凹杯电镀光滑面可作为光源往前导光及 反射之用。 First, the flatness is good: the bottom and the periphery of the concave cup are in the shape of an arc bowl, and the arc reflection wall is flat and smooth, so that the light source can be forwarded all and evenly. The printed circuit board produced by the invention has the characteristics of flatness, smooth plating, and good heat dissipation. The flatness of the printed circuit board and the smooth surface of the concave cup plating can be used as a light source to guide light forward and For reflection.
二、 散热性好： 可将发光晶粒直接连接于凹杯印刷电路板上， 并加以点胶烤干， 使其发光体可直接由印刷电路板上铜箔快速散热， 故具有散热快、 长时间耐瞬间大 电流、 不易发热、 亮度均勾、 安定性高、 无委外加工 （焊接）、 降低成本、 产能大量 提升等优点。  2. Good heat dissipation: The light-emitting die can be directly connected to the concave cup printed circuit board and dried by glue, so that the light-emitting body can be quickly dissipated directly by the copper foil on the printed circuit board. Time is resistant to instantaneous high current, not easy to generate heat, uniform brightness, high stability, no outsourced processing (welding), cost reduction, large capacity increase, etc.
三、 发光性好： 其顶端圆弧封胶， 其折射放大尺寸精准放大倍率一致， 发光均 匀性可达 1： 1 . 1以内， 而现有技术最佳只能达到 1 : 1 . 3。  3. Good luminosity: its top arc sealant has the same refractive magnification and accurate magnification, uniform luminous uniformity can be within 1: 1, and the best available technology can only reach 1: 1.
四、 混光性好： 因同一凹杯内可植入不同颜色的晶粒， 故其混光颜色及亮度均 可大幅提升， 并可制成 S M D表面粘着式零件。  4. Good light mixing: Because different color crystals can be implanted in the same concave cup, the light mixing color and brightness can be greatly improved, and it can be made into SMD surface-adhesive parts.
五、 本发明的 L K D制作成灯体时， 耗时短、 成本低， 并可避免焊接于印刷电 路板时下锡炉的高温破坏。  5. When the LKD of the present invention is made into a lamp body, it takes a short time and has a low cost, and can avoid the high temperature damage of the tin furnace when soldering to the printed circuit board.
六、 经济性好： 依照本发明可缩短制作过程， 降低成本， 增强竞争优势。  6. Good economy: According to the present invention, the production process can be shortened, costs can be reduced, and competitive advantages can be enhanced.
七、 本发明的制作方法应用领域极为广泛， 可广泛适用于生产各种 L E D产品。 如： 表面粘着发光二极管产品、 点矩阵发光二极管产品、 七段显示发光二极管产品、 L C D背光板系列产品、 汽车内部照明及刹车灯系列产品、 交通标志灯系列产品及 户外全彩看板系列产品等领域。  7. The manufacturing method of the present invention has extremely wide application fields and can be widely applied to the production of various LED products. Such as: surface-adhesive light-emitting diode products, dot matrix light-emitting diode products, seven-segment display light-emitting diode products, LCD backlight products, automotive interior lighting and brake light products, traffic sign light products, and outdoor full-color Kanban products .
附图说明 BRIEF DESCRIPTION OF THE DRAWINGS
以下结合附图和实施例进一步说明本发明的内容以及所能达成的功效， 其中： 图 1是现有的 L E D的实体示意图；  The content of the present invention and the effects that can be achieved are further described below with reference to the accompanying drawings and embodiments, wherein: FIG. 1 is a physical schematic diagram of an existing LED;
图 2是本发明的圆弧平底凹杯式 L E D的实体示意图；  FIG. 2 is a schematic diagram of the arc-shaped flat-bottomed concave cup type LED of the present invention;
图 3是本发明的圆弧平底凹杯印刷电路板的制作流程图；  FIG. 3 is a manufacturing flow chart of the arc-bottomed concave cup printed circuit board of the present invention; FIG.
图 4是本发明的圆弧平底凹杯印刷电路板的实体示意图；  FIG. 4 is a schematic diagram of the arc-bottomed concave cup printed circuit board of the present invention;
图 5是本发明的凹杯式 L E D的制作流程图。  Fig. 5 is a flow chart of manufacturing a concave cup type LED according to the present invention.
图 6是本发明凹杯式 L E D制作完成后的实体示意图；  FIG. 6 is a physical diagram of the concave cup type LED according to the present invention;
图 7是该凹杯式 L E D未封胶的光路示意图；  FIG. 7 is a schematic diagram of an optical path of the concave-cup type L E D unsealed glue; FIG.
图 8是该凹杯式 L E D封胶后的光路示意图。  FIG. 8 is a schematic diagram of the light path after the concave cup type LED is sealed.
实施例  Examples
如图 2所示， 本发明凹杯式 L E D 2是于印刷电路板上以 C N C电脑钻孔机、 并利用特殊铣刀以 1 2 0 0 0至 2 5 0 0 0转钻出具 R角的圆弧平底凹杯 2 1 1， 并将晶粒 2 2设置于圆弧平底凹杯 2 1 1中， 再利用打线技术将晶粒 2 2与印刷电 路板 2 1上的铜箔介接， 最后再以环氧树脂胶 2 3封装于上。 本发明的凹杯直接以 印刷电路板散热， 接触热阻极低， 所以具有长时间耐瞬间大电流、 不易发热、 亮度 均匀、 安定性高、 无委外加工 （悍接）、 降低成本、 产能大量提升等优点。 As shown in FIG. 2, the concave cup LED 2 of the present invention is a CNC drilling machine on a printed circuit board, and a special milling cutter is used to drill a circle with an R angle from 1 2 0 0 to 2 5 0 0 0 The arc-bottomed concave cup 2 1 1 and the crystal grains 2 2 are set in the arc-shaped flat-bottomed concave cup 2 1 1. The copper foil on the circuit board 21 is connected, and finally encapsulated on the epoxy resin glue 2 3. The concave cup of the present invention directly dissipates heat from a printed circuit board, and has extremely low contact thermal resistance, so it has a long-term resistance to instantaneous large current, is not easy to generate heat, uniform brightness, high stability, no outsourced processing (tough connection), cost reduction and productivity A lot of advantages.
一般 L E D操作温度核算方式如下：  The general L E D operating temperature calculation method is as follows:
1、 以一电子方形脉波速度定为 1 Oms (毫秒）；  1. The speed of an electronic square pulse is set to 1 Oms (milliseconds);
2、 以定电流导通条件为 2 OmA (毫安培） 持续点亮 3 0分钟；  2. The constant current conduction condition is 2 OmA (milliampere), and it is continuously lit for 30 minutes;
3、 举例以 L E D饱和电压 VF= 2.1 V， 经 2 OmA电流持续点亮 3 0分钟后 VF= 1.9 2 V, ( 2.1 V— 1.1 9 V) = 0.1 8 V；  3. For example, take the L E D saturation voltage VF = 2.1 V, and continue to light for 30 minutes after the current of 2 OmA VF = 1.9 2 V, (2.1 V-1.1 9 V) = 0.1 8 V;
4、 0.1 8 V / 2mA= 9 0 °C  4.0.1 8 V / 2mA = 9 0 ° C
5、 总和热量： 9 0 °C / ( 2 0 mAX 1.9 2 V) = 2 34 3 °C /W  5. Total heat: 9 0 ° C / (2 0 mAX 1.9 2 V) = 2 34 3 ° C / W
6、 L E D在常温下工作温度每下降 1 0 Ό， 亮度提高 9 %。  6. For every 10 ° C drop in the operating temperature of L E D at normal temperature, the brightness will increase by 9%.
下表为本发明凹杯式 L E D与其它 L E D的热阻的比较表：  The following table is a comparison table of the thermal resistance of the concave cup L E D and other L E D of the present invention:
Figure imgf000007_0001
本发明的印刷电路板可控制 R (圆弧角）， 凹杯技术经实验数据及实际运用生产 及寿命测试均能达到国际认证标准。
Figure imgf000007_0001
The printed circuit board of the present invention can control R (arc angle), and the concave cup technology can meet international certification standards through experimental data and practical application of production and life testing.
本发明的制作方法包括两个阶段， 参阅图 3， 其步骤流程如下所述：  The manufacturing method of the present invention includes two stages. Referring to FIG. 3, the steps are as follows:
( 1 ) 准备材 3 1： 印刷电路板采用 FR 4、 F R 5、 C EM 1、 C EM— 3 或 94 V 0均可；  (1) Preparation material 3: 1: The printed circuit board can be FR 4, F R 5, C EM 1, C EM—3 or 94 V 0;
( 2 ) 第一次钻孔 3 2： 利用 C N C钻孔将所有导通孔全钻透；  (2) First drilling 3 2: Drill all through holes through C N C drilling;
( 3 )第二次钻孔 3 3： 利用 C N C钻孔将凹杯位置半钻透（前导孔简称盲孔）; (3) the second drilling 33: using CNC drilling to half drill the position of the concave cup (the front guide hole is referred to as the blind hole);
( 4 ) 第三次钻孔 34： 利用特殊铣刀配合 C N C钻孔将凹杯成型； (4) the third drilling 34: forming a concave cup by using a special milling cutter in conjunction with C N C drilling;
( 5 ) 喷砂 3 5: 将印刷电路板凹杯四周及底部打平整；  (5) Sandblasting 3 5: Smooth the periphery and bottom of the concave cup of the printed circuit board;
( 6 ) 导孔被覆 3 6： 于导孔匹覆 （ P H T ) 导电药剂；  (6) Covering of the via hole 3 6: Covering the via hole (P H T) with conductive agent;
( 7 ) 电镀 3 7: —次铜电镀； ( 8 ) 底片制作 3 8： 制作棕色底片； (7) electroplating 37:-secondary copper electroplating; (8) negative film making 38: making a brown negative film;
( 9 ) 真空压摸 3 9： 利用干式线路油墨 （湿式印刷油墨无法使用）；  (9) Vacuum pressing 3 9: Use dry line ink (wet printing ink cannot be used);
( 1 0 ) 油墨曝光 4 0： 利用约 5千瓦紫外灯管曝光约 8— 1 0秒；  (1 0) Ink exposure 40: Expose for about 8-10 seconds with about 5 kW UV lamp;
( 1 1 ) 电路显象 4 1： 利用纯碱显影完成后， 以纯水清洗；  (1 1) Circuit development 4 1: After the development with soda ash is completed, wash with pure water;
( 1 2 ) 电镀 4 2 : 二次铜电镀； (1 2) electroplating 4 2 : secondary copper electroplating;
( 1 3 ) 电镀金属 4 3： 电镀 1 2 5 U以上的软镍， 拱 LE D固晶打线之用； (1 3) Electroplated metal 4 3: Electroplated soft nickel above 1 2 5 U, for arched LE D solid crystal wire bonding;
( 1 4 ) 电镀金属 44: 电镀 1一 2 U以上的软金， 以防止表面氧化； (1 4) electroplated metal 44: electroplating of soft gold over 1-2 U to prevent surface oxidation;
( 1 5 ) 去墨 4 5： 以活性钠去除蚀刻部分油墨， 活性钠的片碱纯度约 9 5 %; ( 1 6 ) 蚀刻 4 6： 以氯化氨蚀刻掉不要的部分；  (1 5) Deinking 4 5: The etching part of the ink is removed with active sodium, and the purity of the alkali of the active sodium is about 95%; (1 6) Etching 4 6: the unnecessary part is etched with ammonia chloride
( 1 7 ) 品检 4 7： (删修品检） 可手工修复断、 短路；  (1 7) Quality inspection 4 7: (Remove quality inspection) Can repair broken and short circuit manually;
( 1 8 ) 覆膜 4 8： (Liguide) 防焊漆 （通常正'反面都需要）；  (1 8) Coating 4 8: (Liguide) solder mask (usually required for both the front and back);
( 1 9 ) 烘拷 4 9： 将防焊油墨烘拷干；  (1 9) drying 4 9: drying the solder resist ink;
( 2 0 ) 油墨曝光 5 0： 利用约 7千瓦紫外灯管 （UV灯管） 曝光约 8— 1 0 秒；  (2 0) Ink exposure 50: Expose for about 8-10 seconds with a UV lamp (UV lamp) of about 7 kW;
( 2 1 ) 油墨显象 5 1： 以纯碱显影完， 用纯水清洗；  (2 1) Ink development 5 1: After developing with soda ash, wash with pure water;
( 2 2 ) 油墨定型 5 2： 以约摄氏 1 5 0度烘烤约 6 0分钟；  (2 2) Ink setting 5 2: Bake at about 150 ° C for about 60 minutes;
( 2 3 ) 品检测试 5 3： 以低电流 5 D C V / 1 0 0 M欧姆及高电流 1 5 0 D C V / 2 M欧姆测试。  (2 3) Product test 5 3: Test with low current 5 D C V / 100 M ohm and high current 1 50 D C V / 2 M ohm.
( 24 ) 成型 54： C N C铣刀或冲摸成型；  (24) Forming 54: C N C milling cutter or punch forming;
( 2 5 ) 包装 5 5： 以真空包装机包装；  (2 5) Packaging 5 5: Packing with vacuum packaging machine;
由上述步骤即可制作出凹杯式 L KD所用的凹杯印刷电路板； 如图 4所示， 完 成后的凹杯印刷电路板 2 1上开设有许多凹杯 2 1 1及铜箔 2 4 , 且该凹杯 2 1 1 的数量和大小都可视需要使用；  Through the above steps, a concave cup printed circuit board for a concave cup type KD can be produced. As shown in FIG. 4, a plurality of concave cups 2 1 1 and copper foil 2 4 are opened on the completed concave cup printed circuit board 2 1. And the number and size of the concave cups 2 1 1 can be used as needed;
该凹杯大小深浅都可按需要控制设定：  The size and depth of the concave cup can be controlled and set as required:
大小： 0.8 mm至 5 mm (—般支架式 LED LAMP所不能及）；  Size: 0.8 mm to 5 mm (unmatched by conventional bracket LED LAMP);
深度： 0.8 mm至 2 mm (—般支架式 L E D LAMP所不能及）。  Depth: 0.8 mm to 2 mm (unlike conventional bracket L E D LAMP).
当凹杯印刷电路板完成后， 即可进行第二阶段， 参阅图 5。 其步骤如下所述： ( 1 ) 准备材料 6 1 : L E D晶粒 9密尔至 1 4密尔皆可；  After the concave cup printed circuit board is completed, the second stage can be performed, see FIG. 5. The steps are as follows: (1) Prepare the material 6 1: L E D grains 9 mils to 14 mils;
( 2 ) 点胶 6 2: 以自动定量点胶机点上银胶；  (2) Dispensing 6 2: Apply silver glue with automatic quantitative dispenser;
( 3 ) 固晶 6 3: 以电脑自动固晶机固定晶粒位置； ( 4 ) 供拷 64： 以摄氏约 1 5 0度烘烤约 2小时即固晶完成； ( 5 ) 连线 6 5： 以自动打线机烧结正、 负极使之导通； (3) Solid crystal 6 3: Fix the position of the crystal grain by the computer automatic solid crystal machine; (4) Copy 64: bake at about 150 ° C for about 2 hours to complete the solidification; (5) wire 6 5: sinter the positive and negative electrodes with an automatic wire making machine to make them conductive;
( 6 ) 品检测试 6 6: 以约 1 0 0 m A电流冲击测试；  (6) Product testing test 6 6: Shock test with a current of about 100 m A;
( 7 ) 灌胶 67： 以环氧树脂灌注入灌胶摸粒中再置入 L E D；  (7) Pouring glue 67: pouring epoxy resin into the moulding granules and then placing L E D;
( 8 ) 烘烤 6 8 : 以摄氏约 1 2 0度烘烤约 8小时后即完成。 (8) Baking 6 8 : Baking at about 120 ° C for about 8 hours is completed.
由上述步骤即可制作成多用途凹杯式 L E D。 如图 6所示， 制作完成后的凹杯 式 L E D, 是在凹杯印刷电路板 2 1上， 固定发光晶粒 2 2 , 并利用打线技术， 将 晶粒 2 2上的正、 负极连接至上铜箔 24上， 最后再封上环氧树脂胶 2 3即可完成。  From the above steps, a multi-purpose concave cup L E D can be produced. As shown in FIG. 6, after the fabrication of the concave cup LED, the light emitting die 2 2 is fixed on the printed circuit board 21 of the concave cup, and the positive and negative electrodes on the die 22 are connected by using a wire bonding technology Go to the upper copper foil 24, and finally seal with epoxy glue 23 to complete.
如图 7所示， 在凹杯式 L E D未封上环氧树脂胶时由晶粒 2 2所发出的光源， 会因弧形凹杯 2 1 1具有的平坦、 电镀光滑以及良好散热等特性， 产生一聚光向前 的光路 7。 '  As shown in FIG. 7, when the concave cup LED is not sealed with epoxy resin, the light source emitted by the crystal grain 2 2 will have the characteristics of flatness, smooth plating and good heat dissipation due to the curved concave cup 2 1 1. A light path 7 is created which focuses light forward. '
如图 8所示， 在利用环氧树脂胶封装凹杯式 L E D后， 由发光晶粒 2 2所产生 的光路 7, 将可均勾地呈现于隆起的胶体上。  As shown in FIG. 8, after the concave cup type LED is encapsulated with epoxy resin, the light path 7 generated by the light-emitting die 22 can be uniformly presented on the raised colloid.

Claims

权 利 要 求 Rights request
1、 一种圆弧平底凹杯的发光二极管制作方法， 其特征在于， 包括以下步骤:1. A method for manufacturing a light-emitting diode with an arc-shaped flat-bottomed concave cup, which comprises the following steps:
( 1 ) 准备材料： 为一可印刷电路板； (1) Preparation materials: a printable circuit board;
( 2 ) 第一次钻孔： 利用电脑数字控制钻孔将所有导通孔全钻透；  (2) The first drilling: use the computer numerically controlled drilling to fully drill all through holes;
( 3 ) 第二次钻孔： 利用电脑数字控制钻孔将凹杯位置半钻透；  (3) the second drilling: the position of the concave cup is half-drilled by using the computer numerically controlled drilling;
( 4 ) 第三次钻孔： 利用特殊铣刀配合电脑数字控制钻孔将凹杯成型; (4) the third drilling: using a special milling cutter with computer numerical control drilling to form the concave cup;
( 5 ) 喷砂： 将印刷电路板凹杯四周及底部打平整； (5) Sand blasting: smooth the periphery and bottom of the concave cup of the printed circuit board;
( 6 ) 导孔被覆： 于导孔匹覆导电药剂；  (6) guide hole covering: covering the conductive hole with conductive agent;
( 7 ) 电镀： 一次铜电镀；  (7) electroplating: primary copper electroplating;
( 8 ) 底片制作： 制作棕色底片；  (8) negative film making: making a brown negative film;
( 9 ) 真空压模： 利用干式线路油墨；  (9) Vacuum stamping: using dry line ink;
( 1 0 ) 油墨曝光： 利用紫外灯管曝光；  (1 0) ink exposure: exposure using a UV lamp;
( 1 1 ) 电路显象： 利用纯碱显影完成后， 以纯水清洗；  (1 1) circuit development: after development with soda ash is completed, wash with pure water;
( 1 2 ) 电镀： 二次铜电镀；  (1 2) electroplating: secondary copper electroplating;
( 1 3 ) 电镀金属： 电镀软镍， 供发光二极管固晶打线之用；  (1 3) electroplated metal: electroplated soft nickel for the solid-state wiring of light-emitting diodes;
( 1 4 ) 电镀金属： 电镀软金， 以防止表面氧化；  (1 4) electroplated metal: electroplated soft gold to prevent surface oxidation;
( 1 5 ) 去墨： 以活性钠去除蚀刻部分油墨；  (1 5) deinking: removing the etched part of the ink with active sodium;
( 1 6 ) 蚀刻： 以氯化氨蚀刻掉不要的部分；  (1 6) Etching: etching away unnecessary parts with ammonia chloride;
( 1 7 ) 品检： 修复断、 短路；  (1 7) Quality inspection: repair broken and short circuit;
( 1 8 ) 覆膜： 防悍漆；  (1 8) coating: anti-hard paint;
( 1 9 ) 烘烤： 将防焊油墨烘烤干；  (1 9) baking: baking the solder resist ink to dryness;
( 2 0 ) 油墨曝光： 利用紫外灯管曝光；  (2 0) ink exposure: exposure using a UV lamp;
( 2 1 ) 油墨显象： 以纯碱显影完， 用纯水清洗；  (2 1) ink development: after developing with soda ash, washing with pure water;
( 2 2 ) 油墨定型： 烘烤定型；  (2 2) ink setting: baking setting;
( 2 3 ) 品检测试： 以高、 低电流测试；  (2 3) Product testing test: High and low current test;
( 2 4 ) 成型： 电脑数字控制铣刀或冲模成型；  (2 4) forming: computer-controlled milling cutter or die forming;
( 2 5 ) 包装： 以真空包装机包装；  (2 5) Packaging: packed in a vacuum packaging machine;
由上述步骤即可制作出凹杯式发光二极管所用的凹杯印刷电路板; From the above steps, a concave cup printed circuit board for a concave cup type light emitting diode can be produced ;
( 2 6 ) 准备材料： 发光二极管晶粒； ( 2 7 ) 点胶： 以自动定量点胶机点上银胶； (2 6) Preparation materials: LED chip; (2 7) Dispensing: apply silver glue with automatic quantitative dispensing machine;
( 2 8 ) 固晶： 以电脑自动固晶机固定晶粒位置；  (2 8) solid crystal: the position of the crystal grain is fixed by a computer automatic solid crystal machine;
( 2 9 ) 烘烤： 烧烤固晶；  (2 9) baking: roasting solid crystal;
( 3 0 ) 连线： 以自动打线机烧结正、 负极使之导通；  (3 0) wiring: sintering the positive and negative electrodes with an automatic wire making machine to make them conductive;
( 3 1 ) 品检测试： 以电流冲击测试；  (3 1) Product inspection test: current impact test;
( 3 2 ) 灌胶： 以环氧树脂灌注入灌胶模粒中再置入发光二极管；  (3 2) potting: pouring epoxy resin into potting mold pellets and then placing light emitting diodes;
( 3 3 ) 烘烤： 烘烤完成；  (3 3) baking: baking is completed;
由上述步骤即可制作成凹杯式发光二极管。  Through the above steps, a concave cup type light emitting diode can be manufactured.
2. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于, 所述的凹杯印刷电路板为 F R 4、 F R 5、 C EM- 1 , C EM— 3或 9 4 V 0。  2. The method for manufacturing a light-emitting diode with an arc-bottomed concave cup according to claim 1, wherein the printed circuit board of the concave cup is FR 4, FR 5, C EM-1, C EM-3 or 9 4 V 0.
3. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于， 所述的步骤 （ 1 0 ) 的油墨曝光， 是利用约 5千瓦的紫外灯管曝光约 8— 1 0秒。  3. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, characterized in that the ink exposure in the step (10) is to expose about 8-1 with a UV lamp tube of about 5 kW. 0 seconds.
4. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于， 所述的步骤 （ 1 3 ) 电镀所用金属为 1 2 5 U以上的软镍。  4. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, characterized in that, in the step (13), the metal used for the electroplating is soft nickel of 1 2 5 U or more.
5. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其^^征在于， 所述的步骤 （ 1 4 ) 电镀所用的金属为 1 一 2 U以上的软金。  5. The method for manufacturing a light-emitting diode with an arc-shaped flat-bottomed concave cup according to claim 1, characterized in that, in the step (14), the metal used for the electroplating is soft gold of 1 to 2 U or more.
6. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于， 所述的步骤 （ 1 5 ) 去墨所使用的活性钠， 其片碱纯度约 9 5 %。  6. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, wherein in the step (15), the active sodium used for deinking has a purity of about 95%.
7. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于， 所述的步骤 （ 2 0 ) 的油墨曝光， 是利用约 7千瓦的紫外灯管曝光约 8— 1 0秒。  7. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, wherein the ink exposure in the step (20) is about 8-1 using a UV lamp tube of about 7 kilowatts. 0 seconds.
8. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于， 所述的步骤 （ 2 2 ) 油墨定型， 是以摄氏约 1 5 0度烘烤约 6 0分钟。  8. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, wherein, in the step (2), the ink setting is performed by baking at about 150 degrees Celsius for about 60 minutes.
9. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在于， 所述的步骤 （ 2 3 ) 品检测试， 所用的测试高电流为 1 5 0 D C V / M欧姆， 而低 电流则为 5 D C V / 1 0 0 M欧姆。  9. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, wherein in the step (23) of the product testing test, the test high current is 150 DCV / M ohm, The low current is 5 DCV / 100 M ohm.
1 0. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在 于， 所述的步骤 （ 2 6 ) 准备材料所用的发光二极管晶粒， 为 9密尔至 1 4密尔。  10. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, wherein in the step (26), the light-emitting diode crystal grains used for preparing the material are 9 mils to 14 mils. Seoul.
1 1、 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在 于， 所述的步骤 （ 2 9 ) 的烘烤， 是以摄氏约 1 5 0度烘烤约 2小时， 方可完成固 晶。 11. The method for manufacturing a light-emitting diode with an arc-shaped flat-bottomed concave cup according to claim 1, wherein the baking in the step (29) is performed at about 150 ° C for about 2 hours. To complete the solid crystal.
1 2. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在 于， 所述的步骤 （ 3 1 ) 的品检测试， 是以约 1 0 0 mA的电流作冲击试验。 12. The method for manufacturing a light-emitting diode with an arc-bottomed concave cup according to claim 1, characterized in that, in the step (3 1), the product testing test is an impact test with a current of about 100 mA. .
1 3. 根据权利要求 1所述的圆弧平底凹杯的发光二极管制作方法， 其特征在 于， 所述的步骤 （ 33 ) 的烘烤， 是以摄氏约 1 2 0度烘烤约 8小时。  1 3. The method for manufacturing a light-emitting diode with a circular-arc flat-bottomed concave cup according to claim 1, wherein the baking in the step (33) is about 8 hours at about 120 degrees Celsius.
PCT/CN2000/000223 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom WO2001052330A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2000265533A AU2000265533A1 (en) 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB001132105A CN1173416C (en) 2000-01-10 2000-01-10 Circular arc flat-bottom cupped light emitting diode manufacturing method
CN00113210.5 2000-01-10

Publications (1)

Publication Number Publication Date
WO2001052330A1 true WO2001052330A1 (en) 2001-07-19

Family

ID=4583017

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2000/000223 WO2001052330A1 (en) 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom

Country Status (3)

Country Link
CN (1) CN1173416C (en)
AU (1) AU2000265533A1 (en)
WO (1) WO2001052330A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103311410A (en) * 2013-06-13 2013-09-18 苏州金科信汇光电科技有限公司 Integrated LED with high thermal conductivity and high breakdown voltage
CN103539343A (en) * 2012-07-09 2014-01-29 三和科技有限公司 Mixed machining method for colored glass
CN109392256A (en) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 A kind of half heavy copper hole wiring board preventing residual copper and its manufacturing method
CN110112077A (en) * 2019-05-15 2019-08-09 扬州虹扬科技发展有限公司 A kind of production technology of rectifier diode core
CN117119708A (en) * 2023-09-07 2023-11-24 泗阳群鑫电子有限公司 Method for manufacturing surface-mounted diode, capacitor and resistor by using circuit board as carrier

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514413B2 (en) * 2003-04-14 2010-07-28 豊田合成株式会社 LED lamp and manufacturing method thereof
CN100342558C (en) * 2004-08-11 2007-10-10 深圳市瑞丰光电子有限公司 Ceramic package light-emitting diode an dits package method
CN100447303C (en) * 2004-09-29 2008-12-31 李家顺 Method for direct forming tool die by multiple etchig and apparatus thereof
CN101030611B (en) * 2006-03-05 2010-05-12 浙江古越龙山电子科技发展有限公司 Large-power light-emitting diodes gluing process
WO2008046241A1 (en) * 2006-10-11 2008-04-24 Tsungwen Chan A structure of backlight plate having embedded leds and a method of fabricating the same
CN102222752A (en) * 2010-04-15 2011-10-19 珠海市力丰光电实业有限公司 Light emitting diode and manufacturing method thereof
CN102438410A (en) * 2011-11-18 2012-05-02 博罗县精汇电子科技有限公司 Manufacturing method of FPC (flexible printed circuit) surface-mounted component
CN104916762A (en) * 2015-07-07 2015-09-16 宏齐光电子(深圳)有限公司 White-light LED area source and preparation method thereof
CN111081844B (en) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot production line
CN111081843B (en) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A2 (en) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
JPH0722352A (en) * 1993-06-30 1995-01-24 Canon Inc Aligner and manufacture of device by use of same
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
EP0632511A2 (en) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
JPH0722352A (en) * 1993-06-30 1995-01-24 Canon Inc Aligner and manufacture of device by use of same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103539343A (en) * 2012-07-09 2014-01-29 三和科技有限公司 Mixed machining method for colored glass
CN103311410A (en) * 2013-06-13 2013-09-18 苏州金科信汇光电科技有限公司 Integrated LED with high thermal conductivity and high breakdown voltage
CN109392256A (en) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 A kind of half heavy copper hole wiring board preventing residual copper and its manufacturing method
CN110112077A (en) * 2019-05-15 2019-08-09 扬州虹扬科技发展有限公司 A kind of production technology of rectifier diode core
CN117119708A (en) * 2023-09-07 2023-11-24 泗阳群鑫电子有限公司 Method for manufacturing surface-mounted diode, capacitor and resistor by using circuit board as carrier

Also Published As

Publication number Publication date
CN1304186A (en) 2001-07-18
CN1173416C (en) 2004-10-27
AU2000265533A1 (en) 2001-07-24

Similar Documents

Publication Publication Date Title
WO2001052330A1 (en) An led in the shape of cup with a curved surface and planar bottom
US9018667B2 (en) Semiconductor chip assembly with post/base heat spreader and dual adhesives
JP4307094B2 (en) LED light source, LED illumination device, and LED display device
CN103748700B (en) For LED encapsulation with pit and the substrate of through hole
US8076182B2 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
US6225139B1 (en) Manufacturing method of an led of a type of round concave cup with a flat bottom
US8193556B2 (en) Semiconductor chip assembly with post/base heat spreader and cavity in post
US8207553B2 (en) Semiconductor chip assembly with base heat spreader and cavity in base
US20100059786A1 (en) Semiconductor chip assembly with post/base heat spreader and substrate
JP2010103126A (en) Backlight unit
JP2008042158A (en) Element for sml type light-emitting diode lamp and manufacturing method thereof
US8415703B2 (en) Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
CN107785474A (en) Light-emitting diode device and its preparation method
WO2019148934A1 (en) Lighting fixture, in-line led bead, and manufacturing method
US20120175664A1 (en) Lighting device and method for forming the same
CN206758464U (en) A kind of LED packaged light sources based on ceramic substrate
CN103094464A (en) High thermal conductivity baseboard, light emitting diode with the same and manufacturing method
WO2017067149A1 (en) Led bulb and method for manufacturing same
TW488085B (en) Manufacturing method of arc and flat-bottomed concave-cup LED
JP2005317951A (en) Light emitting diode assembly and method for assembling the same
CN208400847U (en) A kind of high-power encapsulation lamp bead of octal
CN206419687U (en) A kind of Novel LED light
CN207162424U (en) Vehicular illumination device and lamps apparatus for vehicle
CN220551803U (en) UV LED lamp and copper substrate module thereof
CN211654854U (en) Ceramic substrate for packaging car lamp chip

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP