AU2000265533A1 - An led in the shape of cup with a curved surface and planar bottom - Google Patents

An led in the shape of cup with a curved surface and planar bottom

Info

Publication number
AU2000265533A1
AU2000265533A1 AU2000265533A AU6553300A AU2000265533A1 AU 2000265533 A1 AU2000265533 A1 AU 2000265533A1 AU 2000265533 A AU2000265533 A AU 2000265533A AU 6553300 A AU6553300 A AU 6553300A AU 2000265533 A1 AU2000265533 A1 AU 2000265533A1
Authority
AU
Australia
Prior art keywords
cup
led
shape
curved surface
planar bottom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000265533A
Inventor
Tsung-Wen Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2000265533A1 publication Critical patent/AU2000265533A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
AU2000265533A 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom Abandoned AU2000265533A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNB001132105A CN1173416C (en) 2000-01-10 2000-01-10 Circular arc flat-bottom cupped light emitting diode manufacturing method
CN00113210 2000-01-10
PCT/CN2000/000223 WO2001052330A1 (en) 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom

Publications (1)

Publication Number Publication Date
AU2000265533A1 true AU2000265533A1 (en) 2001-07-24

Family

ID=4583017

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000265533A Abandoned AU2000265533A1 (en) 2000-01-10 2000-08-04 An led in the shape of cup with a curved surface and planar bottom

Country Status (3)

Country Link
CN (1) CN1173416C (en)
AU (1) AU2000265533A1 (en)
WO (1) WO2001052330A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514413B2 (en) * 2003-04-14 2010-07-28 豊田合成株式会社 LED lamp and manufacturing method thereof
CN100342558C (en) * 2004-08-11 2007-10-10 深圳市瑞丰光电子有限公司 Ceramic package light-emitting diode an dits package method
CN100447303C (en) * 2004-09-29 2008-12-31 李家顺 Method for direct forming tool die by multiple etchig and apparatus thereof
CN101030611B (en) * 2006-03-05 2010-05-12 浙江古越龙山电子科技发展有限公司 Large-power light-emitting diodes gluing process
WO2008046241A1 (en) * 2006-10-11 2008-04-24 Tsungwen Chan A structure of backlight plate having embedded leds and a method of fabricating the same
CN102222752A (en) * 2010-04-15 2011-10-19 珠海市力丰光电实业有限公司 Light emitting diode and manufacturing method thereof
CN102438410A (en) * 2011-11-18 2012-05-02 博罗县精汇电子科技有限公司 Manufacturing method of FPC (flexible printed circuit) surface-mounted component
CN103539343A (en) * 2012-07-09 2014-01-29 三和科技有限公司 Mixed machining method for colored glass
CN103311410A (en) * 2013-06-13 2013-09-18 苏州金科信汇光电科技有限公司 Integrated LED with high thermal conductivity and high breakdown voltage
CN104916762A (en) * 2015-07-07 2015-09-16 宏齐光电子(深圳)有限公司 White-light LED area source and preparation method thereof
CN109392256A (en) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 A kind of half heavy copper hole wiring board preventing residual copper and its manufacturing method
CN110112077A (en) * 2019-05-15 2019-08-09 扬州虹扬科技发展有限公司 A kind of production technology of rectifier diode core
CN111081843B (en) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot device
CN111081844B (en) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot production line
CN117119708A (en) * 2023-09-07 2023-11-24 泗阳群鑫电子有限公司 Method for manufacturing surface-mounted diode, capacitor and resistor by using circuit board as carrier

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module.
JP3244872B2 (en) * 1993-06-30 2002-01-07 キヤノン株式会社 Exposure apparatus and device manufacturing method using the same

Also Published As

Publication number Publication date
CN1173416C (en) 2004-10-27
WO2001052330A1 (en) 2001-07-19
CN1304186A (en) 2001-07-18

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