WO2008046241A1 - Structure de plaque de rétroéclairage comportant des diodes électroluminescentes incorporées et son procédé de fabrication - Google Patents

Structure de plaque de rétroéclairage comportant des diodes électroluminescentes incorporées et son procédé de fabrication Download PDF

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Publication number
WO2008046241A1
WO2008046241A1 PCT/CN2006/002657 CN2006002657W WO2008046241A1 WO 2008046241 A1 WO2008046241 A1 WO 2008046241A1 CN 2006002657 W CN2006002657 W CN 2006002657W WO 2008046241 A1 WO2008046241 A1 WO 2008046241A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
arc
circuit board
printed circuit
shaped concave
Prior art date
Application number
PCT/CN2006/002657
Other languages
English (en)
Chinese (zh)
Inventor
Tsungwen Chan
Original Assignee
Tsungwen Chan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsungwen Chan filed Critical Tsungwen Chan
Priority to PCT/CN2006/002657 priority Critical patent/WO2008046241A1/fr
Publication of WO2008046241A1 publication Critical patent/WO2008046241A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board

Definitions

  • the present invention relates to an electronic light emitting display device and a method of fabricating the same. Background technique
  • the current LCD backlight board is mainly based on white light CCFL (cold cathode fluorescent tube).
  • CCFL cold cathode fluorescent tube
  • the CCFL is placed behind the LCD, and then the light is projected onto the light guide plate, the diffusion sheet, the brightness enhancement sheet, and then projected on the LCD to make the LCD. The picture on it is revealed.
  • the required CCFL and its driver circuit must be increased.
  • multiple CCFLs must be serial/parallel.
  • CCFL has the following disadvantages:
  • CCFL brightness is uneven, even if multiple CCFLs are connected in series/parallel, the brightness that can be obtained within the LCD's size range is still uneven, especially for large-size LCDs.
  • CCFL has a short life span. When the temperature is 4000 ⁇ 6000 hours, the brightness decay will start, and it is not easy to replace, which will greatly shorten the service life of the LCD.
  • CCFL color saturation of CCFL is insufficient, and its color temperature is about 4800K. Therefore, only the color gamut specified by NTSC is about 80%, especially for red light, which can not meet the high-spec color requirements, such as facing In the environment of instrument measurement and the performance of specific colors, it is obvious that the color is missing;
  • the CCFL is more power-hungry and contains harmful substances “mercury” during production. This is undoubtedly an injury to environmental protection. Therefore, the Kyoto reservation book is scheduled to be banned from July 1, 2006. Therefore, the use of other backlight sources is an inevitable trend in the development of LCDs.
  • LED Light Emitting Diode
  • LED has been used on small-size LCD screens for a period of time, such as mobile phones and PDAs.
  • the brightness of LEDs has been greatly improved, coupled with light weight, sturdiness and long life.
  • the boot response is faster, so it has become the target of many large-size LCDs.
  • LEDs are used as a source of LCD backlights.
  • the LEDs are mounted on the LCD side or on both sides.
  • the LED light source is projected on the LCD to make the image on the LCD appear.
  • the light of the general LED is not uniformly scattered, but is concentrated in a small range, so that an area of the LCD that projects the light of the LED is particularly bright, but the brightness of the bright area can be seen around the bright area, and the color is not uniform.
  • the improvement is to place the LED behind the LCD backlight and increase the brightness of the LED so that the light is evenly projected onto the LCD.
  • the brightness of an LCD backlight panel using LEDs depends on the power of the LEDs, and when the brightness of the LEDs increases, relatively higher heat is generated.
  • the conventional LCD backlight panel cannot perform the full function of the LED due to its poor heat dissipation method, especially the high-brightness white LED, which causes the quality of the entire LCD backlight panel to be degraded, and is prone to overheating damage.
  • the LED light-emitting die in the processing method of the conventional LCD backlight panel, the LED light-emitting die must be soldered on the circuit board, which is not only difficult to process, but also has a low yield, and is susceptible to thermal damage to the circuit board, thereby damaging the entire LCD backlight panel.
  • a filter, a diffusion sheet and a light guide sheet are disposed between the LCD and the LED light-emitting crystal, so that the light guide sheet guides the light source and is evenly distributed, and then the diffusion sheet The light is evenly dispersed, and the color light of the deviation is filtered by a filter.
  • any of the foregoing LCD devices cannot be replaced individually when the components of some of the backlights are damaged, and must be replaced as a whole, which is costly.
  • LCD waste products also increase the burden of environmental protection.
  • the inventor of the present invention conceived a solution to overcome the problems of high-power L ED heating failure and brightness attenuation with a special heat dissipation mechanism, and further simplifies the process and increases the productivity. After long-term research and development and experiments, the system can be successfully developed.
  • the backlight structure having the implanted L ED and the manufacturing method thereof are completed. Summary of the invention
  • the main object of the present invention is to provide a backlight board structure with an implantable L ED and a manufacturing method thereof, which can greatly reduce the probability of failure due to heat through a special heat dissipation mechanism, so as to improve the qualification of a large size L CD. Rate and brightness.
  • Another object of the present invention is to provide a backlight panel structure having an implantable L E D and a method of fabricating the same, which simplifies the overall structure of the product without requiring cumbersome processing, thereby improving throughput and product quality.
  • Another object of the present invention is to provide a backlight board structure with an implantable LED and a manufacturing method thereof, which can be produced by using a small module, so that when a single component is damaged, the damaged part can be directly replaced. , making maintenance of large-size L CDs simple and feasible.
  • a next object of the present invention is to provide a backlight panel structure having an implantable L ED and a method of fabricating the same, which simplifies the manufacturing process, and has no processing or waste such as soldering, and meets environmental protection requirements.
  • a backlight board structure having an implantable LED and a manufacturing method thereof which can achieve the foregoing objects, and include a printed circuit board, which can be provided with a plurality of arc-shaped concave cups, and is disposed on the printed circuit board There is a circuit required for the backlight board; the surface of the printed circuit board and the arc-shaped concave cup is sputtered with a layer of nano gold, and the heat conduction of the LCD backlight is improved by the good conductivity and thermal conductivity of the nano gold layer.
  • the capacity is greatly increased; in each of the arc-shaped concave cups, L ED luminescent crystals are implanted.
  • the L ED luminescent crystal grains can be fused and integrated in the arc-shaped concave shape.
  • the wire is then extended to the circuit board; and the LED illuminating die is covered with phosphor glue, which is made up of a proper proportion of phosphor
  • the mixture is made of a mixture of silica gel, which can assist the LED illuminating crystal grains to emit high brightness and uniform white light; and the surface of the arc-shaped concave cup and the surrounding printed circuit board is coated with a light transmitting layer, and the transparent layer can be Transparent silica gel is used to protect the wires in the arc-shaped concave cup while scattering the light of the L ED luminescent crystal grains.
  • FIG. 1 is a perspective view of a backlight panel structure with an implantable LED of the present invention
  • Figure 1A is an enlarged view of a portion of the LED of Figure 1;
  • FIG. 2 is a cross-sectional view showing the structure of the backlight panel having the implantable LED
  • FIG. 3 is a schematic diagram of heat dissipation of the backlight panel structure with the implantable LED
  • FIG. 5 is a view showing a combination of the backlight panel structure with the implantable LED
  • FIG. 6 is a view showing another embodiment of the backlight panel structure with the implantable LED
  • FIG. 7 is a view showing a combination of the backlight panel structure of FIG. 6;
  • FIG. 8 is a temperature change diagram of the present invention applied to a 32-inch LCD backlight panel for 8 hours;
  • FIG. 8 A to H are diagrams of an 8-hour temperature change at different positions of FIG. 8;
  • the present invention provides an implantable LED.
  • a backlight structure on the printed circuit board 2, a plurality of LEDs 3 (light emitting diodes) are disposed, and the formed LCD backlight 1 is disposed behind the LCD (not shown), through a plurality of LEDs 3 Luminescence is projected on the LCD to achieve the desired color and brightness.
  • the LED 3 unit includes an arc-shaped concave cup 31 disposed on the printed circuit board 2, and the printed circuit board 2 is provided with a circuit required for the backlight board; the printed circuit board 2 and the circular concave cup 31 Surface, a full layer of nano-gold 4 is sputtered. Since nano-gold 4 has good electrical and thermal conductivity, it can improve the heat dissipation capability of the printed circuit board 2; in the above-mentioned arc-shaped concave cup 31, There is an LED light-emitting die 32. Due to the arrangement of the nano gold 4, the LED light-emitting die 32 is fixed on the nano-gold 4 layer of the arc-shaped concave cup 31 by high-frequency fusion, and the wire 33 extends to both sides.
  • the white LED 3 is disposed on the surface of the arc-shaped concave cup 31 and the surrounding printed circuit board 2, and is further covered with a light-transmitting layer 35.
  • the light-transmitting layer 35 is transparent silica gel for protecting the circular-shaped concave cup 51.
  • the inner wire 33 scatters the light of the LED light-emitting die 52 at the same time. In this way, since the desired high-brightness white light can be obtained by the present invention, it is only necessary to provide a diffusion sheet between the LCD and the LCD backlight panel, and the filter structure and the light guide sheet structure of the conventional structure are not required, and the product structure is greatly simplified.
  • the heat dissipation effect of the present invention is as shown in FIG. 3, wherein a part of the heat generated by the LED light-emitting die 32 can be directly removed from the bottom of the nano gold 4 and the printed circuit board 2, and upward.
  • the arc-shaped concave cup 31 With the heat of the side, the arc-shaped concave cup 31 generates a vortex-like heat convection phenomenon, so that most of the heat will pass through the eddy-like path and the nano-recessed cup 31 Gold 4 creates more exposure and is then excluded by nanogold 4 and printed circuit board 2. Therefore, the present invention can be produced more commonly
  • the structure has a more pronounced cooling effect.
  • the foregoing manufacturing method of the present invention is as shown in FIG. 4, and includes:
  • the arc-shaped concave cup 31 is formed on the printed circuit board 2, and the related circuit is disposed; b. the printed circuit board 2 and the circular concave cup 31 are completely sputtered with nano gold 4;
  • the LED light-emitting die 32 is implanted and fixed on the surface of the nano-gold 4 of the arc-shaped concave cup 31 with a high frequency, and the wire 33 is disposed;
  • the LCD backlight panel 1 of the present invention is configured as a small module, and can take a suitable size of the printed circuit board 2 to fabricate a small LCD backlight panel 1, and then according to the required LCD size, a plurality of small The LCD backlight panel 1 is combined with a large LCD backlight panel 1, which increases the productivity of the LCD production and improves the yield.
  • the LEDs 3 of the LCD backlight 1 are arranged in a parallel array. Of course, as shown in FIG. 6 and FIG. 7, the LEDs 3 of the LCD backlight 1 are arranged in an interlaced array to provide different visual perceptions.
  • the invention completed by this invention can achieve the high-brightness and low-heating effect of the patent purpose, and the detailed temperature change thereof is shown in the respective figures of FIG. 8 to FIG. 8H, and the inventors have completed the structure of the 32-inch LCD backlight panel 10 of the structure of the present invention.
  • the temperature detection points of N1 ⁇ N8 are set, and the room temperature detection point N9 of the comparison is inferred from the actual position.
  • the temperature is above the temperature detection point, and the temperature should be higher than the temperature detection below. Point, and regardless of the temperature detection point, the traditional LCD usually reaches or exceeds 100 ⁇ . Therefore, the traditional LCD is strictly forbidden to disassemble the outer casing.
  • the temperature is significantly lower than that of the conventional design, even at the highest temperature, at 50 °C.
  • the invention can be used for a long period of time with high brightness, and can still maintain a long life, which is an excellent invention that is rare.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente invention concerne une structure de plaque de rétroéclairage (1) comportant des diodes électroluminescentes incorporées et son procédé de fabrication. La structure comporte une carte de circuit imprimé (2) qui peut comprendre une pluralité de coupelles concaves en arc de cercle (31) et un circuit correspondant qui y est installé ; une couche d'or (4) d'épaisseur d'un nanomètre étant déposée par pulvérisation cathodique sur des surfaces de la carte de circuit imprimé et une pluralité de coupelles concaves en arc de cercle (31) ; un puce de diodes électroluminescentes (32) étant implantée dans chacune des coupelles concaves en arc de cercle (31) ; et la puce de diodes électroluminescentes (32) étant fixée au centre de la coupelle concave en arc de cercle (31) ; la puce à diodes électroluminescentes (32) étant recouverte par un composé de moulage à base de phosphore (37) réalisé en phosphore et en gel de silice ; chacune de la pluralité de coupelles concaves en arc de cercle (31) et sa carte de circuit imprimé voisine (2) étant recouvertes par une couche transparente (38) formée d'un gel de silice transparent.
PCT/CN2006/002657 2006-10-11 2006-10-11 Structure de plaque de rétroéclairage comportant des diodes électroluminescentes incorporées et son procédé de fabrication WO2008046241A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/002657 WO2008046241A1 (fr) 2006-10-11 2006-10-11 Structure de plaque de rétroéclairage comportant des diodes électroluminescentes incorporées et son procédé de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/002657 WO2008046241A1 (fr) 2006-10-11 2006-10-11 Structure de plaque de rétroéclairage comportant des diodes électroluminescentes incorporées et son procédé de fabrication

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Publication Number Publication Date
WO2008046241A1 true WO2008046241A1 (fr) 2008-04-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103851358A (zh) * 2012-11-29 2014-06-11 蔡留保 一种改进的led灯

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0206176A2 (fr) * 1985-06-28 1986-12-30 Takiron Co. Ltd. Matrice à guides optiques pour une enseigne lumineuse à matrice de points
CN1304186A (zh) * 2000-01-10 2001-07-18 詹宗文 圆弧平底凹杯之发光二极管的制作方法
CN2586251Y (zh) * 2002-12-04 2003-11-12 银河光电股份有限公司 白光发光二极管的封装结构
US6969189B2 (en) * 2003-05-12 2005-11-29 Au Optronics Corp. LED backlight module
US20060186431A1 (en) * 2005-02-18 2006-08-24 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
US7097337B2 (en) * 2004-05-27 2006-08-29 Samsung Electro-Mechanics Co., Ltd. Vertical light emitting type backlight module
CN2821871Y (zh) * 2005-03-28 2006-09-27 优佰利股份有限公司 具有发光二极管的光源模板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0206176A2 (fr) * 1985-06-28 1986-12-30 Takiron Co. Ltd. Matrice à guides optiques pour une enseigne lumineuse à matrice de points
CN1304186A (zh) * 2000-01-10 2001-07-18 詹宗文 圆弧平底凹杯之发光二极管的制作方法
CN2586251Y (zh) * 2002-12-04 2003-11-12 银河光电股份有限公司 白光发光二极管的封装结构
US6969189B2 (en) * 2003-05-12 2005-11-29 Au Optronics Corp. LED backlight module
US7097337B2 (en) * 2004-05-27 2006-08-29 Samsung Electro-Mechanics Co., Ltd. Vertical light emitting type backlight module
US20060186431A1 (en) * 2005-02-18 2006-08-24 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
CN2821871Y (zh) * 2005-03-28 2006-09-27 优佰利股份有限公司 具有发光二极管的光源模板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103851358A (zh) * 2012-11-29 2014-06-11 蔡留保 一种改进的led灯

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