WO2001023914A1 - Optical device with multilayer thin film and aligner with the device - Google Patents
Optical device with multilayer thin film and aligner with the device Download PDFInfo
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- WO2001023914A1 WO2001023914A1 PCT/JP2000/006817 JP0006817W WO0123914A1 WO 2001023914 A1 WO2001023914 A1 WO 2001023914A1 JP 0006817 W JP0006817 W JP 0006817W WO 0123914 A1 WO0123914 A1 WO 0123914A1
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- wavelength
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- film
- light
- refractive index
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/283—Interference filters designed for the ultraviolet
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Definitions
- the present invention relates to an optical element with a multilayer thin film and an exposure apparatus having the same.
- the present invention relates to an optical element such as a lens, a prism, and a reflector provided with a multilayer optical thin film on the surface, and an exposure apparatus including the optical element.
- optical thin films such as a reflection film and an antireflection film are applied to optical elements constituting an optical system such as a lens, a prism, and a reflection mirror.
- an anti-reflective coating is applied to reduce unwanted reflections, while a reflective coating is applied to the surface of the optical element to efficiently reflect incident light at the reflective coating surface.
- Such an optical thin film is generally manufactured by a dry process. Dry processes include vacuum deposition, sputtering, and chemical vapor deposition (CVD). For the dry process, see Joy George, Preparation of Thin Films (Marcel Dekker, Inc., New York, 19992) and Francois R. Flory, Thin Films for Optical Systems (Marcel Dekker, Inc. , New York, 1995).
- antireflection films are required to have low reflectance over a wide range of incident angles, and are required to have high reflectance and angular characteristics over a wide wavelength range.
- a multilayer film can be formed by combining a plurality of coating materials having different refractive indexes in order to meet these performance requirements.
- the optical performance of a multilayer film is improved as the difference between the refractive indices of the various coating materials used and the minimum refractive index of the various coating materials used are reduced. I have.
- N. A. should be increased or A should be shortened. .
- N.A. is made larger, the depth of focus becomes shorter, as can be seen from the equation of depth of focus.
- a reduction in the depth of focus of an optical element such as a projection lens has an effect on throughput. Therefore, in order to improve the resolution, it is more preferable to shorten the feed than to increase the NA.
- the exposure light is converted from g-line (436 nm) to i-line (365 nm), and further excimer laser light such as KrF (248 nm) and ArF (193 nm).
- the wavelength is being shortened.
- the reason is that many coating materials absorb light in this wavelength range and cause light loss. Since the coating materials that can be used in the ultraviolet region near 200 nm are extremely limited, as described above, the difference in the refractive index between the coating materials can be sufficiently increased, or various coating materials can be used.
- L a F 3, n d F 3 and G d F 3 are both a n approximately two 1.7 with respect to the wavelength 200 nm, which is co one coating material of the highest available refractive index.
- thin films can be produced by hydrolysis and polymerization of metal alkoxide solutions, ie, liquids, and this wet process is called a sol-gel process.
- S i ⁇ 2 , Z r ⁇ 2, H f 0 2) T i 0 2; a l 2 0 3 , etc. is not only due to the dry process Zorugerupurose Can also be manufactured by The method is described in, for example, Ian M. Thomas, Applied optics Vol. 26, No. 21 (1987) pp. 4688—4691 and Ian M. Thomas, SPIE Vol. 22 88 Sol Gel Optics [I [(1994) pp. 50-55.
- S i 0 2 film formed by Zorugerupurose scan S i 0 2 film colloids like S i suitable for production of 0 2 suspension Nigoeki usually by hydrolysis of silicon alkoxide in maternal alcohol as solvent Be prepared.
- the hydrolysis of tetraethyl silicate in ethanol can be represented, for example, by the following formula (3).
- the wet process such as the sol-gel process is performed at room temperature or below 150 ° C, because it may cause damage or deterioration of the substrate, as compared with the dry process. No additional steps are required It is possible to obtain a membrane of low packing density.
- Japanese Patent Application Laid-Open No. 10-319209 (corresponding US Pat. No. 5,993,898), the present inventors used a combination of an optical thin film formed by a wet process and a thin film formed by a dry process. A method for forming an anti-reflection film and a reflection film is disclosed.
- a low-refractive-index film which cannot be obtained by a normal dry-process film, can be formed by a wet process, and a high-refractive-index film can be formed by a dry process.
- a multilayer thin film having a low refractive index layer having a large refractive index difference and an extremely low refractive index can be formed.
- a thin film can be modeled as a structure in which a plurality of micropores are separated by a solid substance. Therefore, the relationship between the packing density of the film and the refractive index is as follows.
- n p is the refractive index of the material filling the micropores (eg air, water), n f and n. Is the actual refractive index (depending on the packing density) and the refractive index of the deposited solid material, respectively, and p is the filling rate of the film. Further, the filling rate is defined as follows.
- the total volume of the membrane is the sum of the volume of the solid portion of the membrane and the volume of the micropore portion of the membrane.
- a high packing density and a low packing density mean a high refractive index and a low refractive index, respectively.
- the filling factor can vary from 1 to about 0.5. Therefore, the refractive index can be changed from 1.45 to 1.22 in the visible range. As a result, it is possible to form a monolayer antireflection layer ⁇ etc. 0% reflectance on the optical glass using a wet process low packing density S i 0 2.
- this single-layer antireflection layer can reduce the reflectance to almost 0% at normal incidence, but has a problem that the reflectance increases at oblique incidence.
- the refractive index is as low as 1.22 in the visible region, and a low packing density and high purity Si are used.
- ammonia is added as a catalyst to the hydrolysis reaction of the above formula (3). By the catalytic action of ammonia, it is possible to prepare a suspension having high-purity and fine spherical SiO 2 particles.
- the suspension was coated on the surface of the substrate, by vaporizing the alcohol solvent at room temperature, the porous S i 0 2 film ing spherical S i 0 2 particles, that is, S i 0 2 film having a low packing density Can be made.
- the anti-reflection film made of the SiO 2 film having a low filling density has high laser durability as is well known. Therefore, this antireflection film is used for a high-power laser such as for nuclear fusion.
- This support 5 is described in Ian M. Thomas, Applied Optics Vol. 31, No. 28 (1992) pp. 61 45—61 49. Disclosure of the invention
- An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a multilayer optical thin film, particularly a multilayer antireflection film or a multilayer reflection film, which can be used in the ultraviolet region of 300 nm or less and has high performance.
- An object of the present invention is to provide an optical element such as a lens, a prism, and a reflecting mirror.
- a further object of the present invention is to provide a projection exposure apparatus provided with the above optical element. It is a further object of the present invention to provide an optical element having a multilayer antireflection film having a low reflectance over a wide range of incident angles and a small difference in reflection characteristics depending on the polarization direction.
- a further object of the present invention is to provide an optical element having a multilayer reflective film having a reflectance of 97% or more in both P-polarized light and s-polarized light over a wide wavelength range at oblique incidence.
- an object of the present invention is to provide an optical element with a multilayer thin film, which is used together with light in the ultraviolet region of 300 nm or less, particularly in the wavelength region of 250 nm or less and has a NA of ⁇ 0.80 or more.
- An object of the present invention is to provide a high-resolution exposure apparatus including an optical element. According to a first aspect of the present invention, there is provided an optical element,
- a multilayer optical thin film formed on the optical substrate An optical element is provided wherein at least one layer of the multilayer optical thin film has a refractive index of 1.35 or less for light having a wavelength of 250 nm or less.
- the optical element of the present invention has an extremely low refractive index of at least 1.35 or less for light having a wavelength of 250 nm or less of at least one layer constituting the multilayer optical thin film. For this reason, the difference in refractive index between a plurality of thin films can be made large.
- the optical element wavelength 250 nm or less of the light, for example, excimer - 248 nm which is an oscillation wavelength of The (K r F), 1 93 nm (A r F), 1 57 nm (F 2) , such as Even when used with short-wavelength light, it shows good values for optical properties such as reflectance (anti-reflection), polarization characteristics, and incident angle dependence.
- At least one layer of a multilayer optical thin film has a wavelength of 250 nm or less.
- the refractive index is preferably from 1.10 to 1.35 ⁇ especially, preferably from 1.15 to 1.25.
- At least one layer in the optical element of the present invention is formed using a wet process.
- the film by a sol-gel method because a thin film having a low filling rate, that is, a low refractive index can be obtained .
- At least one layer is made of alkaline earth metal fluoride or silicon fluoride. It is preferred, in particular, is formed on the optical element of M g F 2 layer is preferable.
- the present invention When used as an anti-reflection film, the anti-reflection film has an incident angle of 55 degrees or less and has a wavelength of 250 nm, such as 157 nm, 193 nm, or 248 nm.
- the reflectance for the following short-wavelength light is 0.5 or less, where the reflectance means the average value of the reflectance of s-polarized light and P-polarized light. Since an optical element such as a lens of A. ⁇ 0.80 has a high curvature, it is advantageous to form such an anti-reflection film on the surface of the optical element because it exhibits a low reflectance over a wide range of incident angles.
- the multilayer thin film applied to the optical element has an incident angle of 55 degrees or less and a wavelength of 157 nm, 193 nm, and 250 nm or less, such as 248 nm.
- the reflectance is 0.3% or less, particularly 0.2% or less for light having a wavelength of .
- the reflectance is 97% or more with respect to light having a wavelength of 193 nm.
- the optical element of the present invention is preferably used together with an ultraviolet light having a wavelength of 300 nm or less, preferably ⁇ 250 nm, more preferably 200 nm or less.
- the optical substrate of the element is preferably formed from fluorite or quartz glass.
- the optical element is typically a lens, a prism, a reflecting mirror, or the like, and in particular, a projection lens used in a projection exposure apparatus that performs exposure of a fine pattern using ultraviolet rays as described above, and in particular, a N.A. (Numerical aperture) ⁇ 0.80 is suitable for a projection lens.
- an apparatus for exposing a pattern image of a mask on a substrate comprising:
- An illumination optical system for illuminating the mask with vacuum ultraviolet light for illuminating the mask with vacuum ultraviolet light
- a projection optical system that includes an optical element and projects the pattern image of the mask onto a substrate; and a multilayer optical thin film formed on a surface of the optical element.
- an exposure apparatus wherein at least one layer of the multilayer optical thin film has a refractive index of 1.35 or less for light having a wavelength of 250 nm or less.
- An illumination optical system that includes an optical element and illuminates the mask with vacuum ultraviolet light; a projection optical system that projects a pattern image of the mask onto a substrate;
- An exposure apparatus wherein at least one layer of the multilayer optical thin film has a refractive index of 1.35 or less for light having a wavelength of 250 nm or less.
- the exposure apparatus according to the second and third aspects of the present invention is capable of exposing light having a wavelength of 250 nm or less.
- vacuum ultraviolet light especially light with a wavelength of 250 nm or less, was used as the light for exposure.
- the optical characteristics of the optical element such as reflection or antireflection, are good, and as a result, a fine mask pattern can be exposed on the substrate with high accuracy.
- the multilayer optical thin film is an anti-reflection film
- the anti-reflection film has an incident angle of 50 degrees or less and has a wavelength selected from the group consisting of wavelengths of 157 nm, 193 nm, and 248 nm.
- the reflectance is preferably 0.5% or less with respect to the light.
- the exposure apparatus of the third aspect further comprises a projection optical system having at least one projection lens, a multilayer optical thin film formed on the surface of the projection lens, and a wavelength of at least one layer of the multilayer optical thin film. It is desirable that the refractive index for light of nm or less is 1.35 or less.
- the optical element of the projection optical system can be a projection lens or a reflector.
- the projection optical system includes a reflector such as a mirror
- the multilayer thin film can function as a reflection film
- the projection optical system includes a projection lens
- the multilayer thin film can function as an anti-reflection film.
- the projection optical system usually includes a plurality of projection lenses
- the multilayer thin film according to the present invention is advantageously applied to a lens closest to the light exit side (wafer side).
- the exposure apparatus can be applied to any projection exposure apparatus such as a batch projection exposure apparatus, a scanning projection exposure apparatus, and a mirror projection exposure apparatus.
- FIG. 1 is a diagram showing a film configuration of the first embodiment of the present invention.
- FIG. 2 is a diagram showing a measurement result of an angular characteristic of the reflectance in the film configuration of the first example.
- FIG. 3 is a diagram showing a film configuration of the second embodiment of the present invention.
- FIG. 4 is a diagram showing a measurement result of an angular characteristic of the reflectance in the film configuration of the second embodiment.
- FIG. 5 is a diagram showing a film configuration of Comparative Example 1.
- FIG. 6 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of Comparative Example 1.
- FIG. 7 is a diagram showing a film configuration of the third embodiment of the present invention.
- FIG. 8 is a diagram showing a measurement result of an angular characteristic of the reflectance in the film configuration of the third example.
- FIG. 9 is a diagram showing a film configuration of the fourth embodiment of the present invention.
- FIG. 10 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of the fourth embodiment.
- FIG. 11 is a diagram showing a film configuration of Comparative Example 2.
- FIG. 12 is a diagram showing a measurement result of an angular characteristic of the reflectance in the film configuration of Comparative Example 2.
- FIG. 13 is a diagram showing a film configuration of a fifth embodiment of the present invention.
- FIG. 14 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of the fifth embodiment.
- FIG. 15 is a diagram showing a film configuration of the sixth embodiment of the present invention.
- FIG. 16 is a diagram showing a measurement result of an angular characteristic of the reflectance in the film configuration of the sixth example.
- FIG. 17 is a diagram showing a film configuration of Comparative Example 3.
- FIG. 18 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of Comparative Example 3.
- FIG. 19 is a view showing a film configuration of a seventh embodiment of the present invention.
- FIG. 20 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of the seventh embodiment.
- FIG. 21 is a diagram showing a film configuration of an eighth embodiment of the present invention.
- FIG. 22 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of the eighth embodiment.
- FIG. 23 is a diagram showing a film configuration of Comparative Example 4.
- FIG. 24 is a diagram showing the measurement results of the angle characteristics of the reflectance in the film configuration of Comparative Example 4.
- FIG. 25 is a diagram showing a film configuration of a ninth embodiment of the present invention.
- FIG. 26 is a diagram showing the measurement results of the spectral reflectance in the film configuration of the ninth embodiment.
- FIG. 27 is a diagram showing a film configuration of Comparative Example 5.
- FIG. 28 is a diagram showing the measurement results of the spectral reflectance of the film configuration of Comparative Example 5.
- FIG. 29 is a diagram showing a film configuration of the tenth embodiment of the present invention.
- FIG. 30 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of the tenth embodiment.
- FIG. 31 is a diagram showing a film configuration of the eleventh embodiment of the present invention.
- FIG. 32 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of the first example.
- FIG. 33 is a diagram showing a film configuration of Comparative Example 6.
- FIG. 34 is a diagram showing the measurement results of the angular characteristics of the reflectance in the film configuration of Comparative Example 6.
- FIG. 35 is a diagram showing a basic configuration of the exposure apparatus of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
- both a film formed by a wet process and a film formed by a dry process are used in combination.
- the multilayer optical thin film of the present invention is not particularly limited in functions such as antireflection, reflection, sharp cut, band pass, and polarization, but has an antireflection film having an antireflection function and a reflection function. It is preferably applied to a reflective film.
- the film of the wet process in particular but not limited to materials, and oxide Kei element (S i 0 2) film, alkaline earth fluorides of a metal such as magnesium fluoride (M g F 2) film better good
- M g F 2 film As the wet process, in the case of a silicon oxide (SiO 2 ) film, the above-mentioned sol-gel process by hydrolysis of a metal alkoxide solution is preferable.
- a magnesium fluoride (M g F 2) film is good preferable to use three types of reaction process shown below.
- any one or more methods selected from a spin coat method, a dive, a meniscus method, a spray coat method, and a printing method are used.
- the organic matter is removed by optional heating to form a film.
- the substrate material of the multilayer optical thin film of the optical element of the present invention is not particularly limited as long as it is optical glass, but in the case of a multilayer antireflection film using transmitted light, synthetic quartz glass, fluorite, or the like is used. preferable.
- the optical thin film of the present invention is preferably applied to optical elements using these materials, such as lenses, prisms, and filters. These optical elements improve the optical performance of an optical system incorporating the same, and The performance of an optical device having this optical system is improved.
- embodiments of the optical element with a multilayer optical thin film of the present invention and an exposure apparatus provided with the optical element will be described with reference to the drawings, but the present invention is not limited to these examples.
- Example 1 a six-layer antireflection film for KrF excimer laser light (wavelength: 248 nm) was manufactured. First to sixth thin films were formed on a synthetic quartz glass substrate 10. Table 1 and FIG. 1 show the film configuration and cross-sectional view of the antireflection film, respectively. The medium around the antireflection film is air. Synthetic quartz glass substrate 10 has a refractive index of 1.5 1 at 248 nm. The first layer 11 is a MgF 2 layer having a refractive index of 1.40 and an optical film thickness of 104 nm (0.42 times the design center wavelength A.) at a wavelength of 248 nm. refractive index 1 in the c second layer 1 2 formed at a wavelength of 248 nm light.
- the third layer 13 formed by the wet process has a refractive index of 2.28 and an optical film thickness of 21 nm (0.08 times the design center wavelength ⁇ ) at a wavelength of 248 nm.
- an optical film thickness 74 nm (design with Center wavelength.
- the fifth layer 15 is a two- layer Hf0 layer having a refractive index of 2.28 and a film thickness of 15 nm (0.06 times the design center wavelength) at a wavelength of 248 nm. Formed. Refractive index 1 in the sixth layer 1 6 wavelength 248 nm light. 1 6, a M g F 2 layer having an optical film thickness of 74 nm (0. 30 times the designed center wavelength lambda.), Wet process Formed. Where the design center wavelength ⁇ . Is a wavelength which is a reference for designing the film thickness. Here, 248 ⁇ m was selected. In FIG. 1, the layer with (W) indicates that it was formed by the wet method (the same applies to other figures). .
- the second layer and the sixth layer which is the uppermost layer, are formed by a wet process.
- M g F 2 thin film of wet process was performed by the formula hydrofluoric acid / magnesium acetate method shown in (6). Specifically, magnesium acetate was dissolved in methanol to prepare a solution, and then hydrofluoric acid was added dropwise to the solution so as to have a stoichiometric ratio to prepare a sol. Next, the sol solution was subjected to high-temperature heat treatment (organosamal treatment) in an autoclave under the conditions of a temperature of about 150 ° C. and a pressure of 150 kgf / cm 2 to ripen.
- organosamal treatment organosamal treatment
- the sol solution thus obtained was composed of methanol, magnesium fluoride fine particles, and trace amounts of H 20 derived from acetic acid and hydrofluoric acid as by-products. Then, the sol was spin-coated on the first layer and dried to form a second layer. The sixth layer was formed on the fifth layer in the same manner.
- First, third, dry processes used in the formation of a four and five layers are materials that form these layers in vacuo (A 1 2 0 3, H f 0 2, S i 0 2, Mg F 2) Each was heated and evaporated (EB evaporation) by electron beam irradiation to form a film.
- the reflection characteristics of the anti-reflection coating 1 thus obtained were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 248 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 2 shows the measurement results.
- Figure 2 also shows the average value of the reflectance for s-polarized light and p-polarized light.
- the antireflection film of the present invention has a relatively small number of layers of 6 layers, but has a reflectance of s-polarized light and p-polarized light in the range of an incident angle of 0 degree (normal incidence) to 56 degrees. Their average reflectance was less than 0.1%. That is, the difference in reflectance due to the difference in polarization direction is extremely small. Note that this good low-reflection and polarization-independent property is still retained at 60 degrees above 56 degrees.
- Example 2 a seven-layer antireflection film for KrF excimer laser light (wavelength: 248 nm) was manufactured.
- the film configuration is shown in Table 2, and the cross section of the film is shown in FIG. 3 on a synthetic quartz glass substrate (refractive index 1.51 at 2448 nm) 20.
- the medium is air.
- the first layer 21 is a dry process M having a refractive index of 1.40 at a wavelength of 248 nm and an optical film thickness of 1 ⁇ 3 nm (0.42 times the design center wavelength ⁇ ).
- having a second layer 2 2 is the refractive index 1 at a wavelength of 2 4 8 nm light.
- 1 6 the optical film thickness 1 9 nm (0.
- the design center wavelength ON. consists M g F 2 wet process
- the third layer 2 3 wavelength 2 Refractive index 2.28 at 48 nm of light consists H f 0 2 dry process having an optical film thickness of 2 1 nm (0. 08 times the designed center wavelength Hisashi.)
- Fourth layer 24 is a wavelength 248 refractive index 1 in nm of light. 73, it consists of a 1 2 0 3 dry process having an optical film thickness of 74 nm (0. 30 times the designed center wavelength e.)
- the fifth layer 25 is a wavelength 248 nm refractive index 2.28 at light consists H f 0 2 dry process having an optical film thickness of 1 6 nm (0.
- sixth layer 26 is a wavelength 248 nm refractive index 1 in the light. 1 6, consists Mg F 2 wet process having an optical film thickness of 6 9 nm (0. 28 times the designed center wavelength lambda.), and the seventh layer 27 is a wavelength 248 nm refractive index at the light 1.4 0 consists M g F 2 dry process having an optical film thickness of 3 nm (0. 0 1 times the designed center wavelength Hisashi.).
- the second layer and the sixth layer are formed by a wet process.
- the MgF 2 film was formed by a wet process by the hydrofluoric acid / magnesium acetate method as in Example 1.
- the EB evaporation method was used for the formation of the thin film in the dry process in the same manner as in Example 1. Table 2
- the reflection characteristics of the antireflection film thus obtained were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light at a wavelength of 248 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Fig. 4 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of 7 layers, but an incident angle of 0 degree (vertical incidence).
- the reflectance of s-polarized light and p-polarized light and the average reflectance thereof are 0.1% or less in the range of) 55 °, so that the difference in reflectance due to the difference in polarization is extremely small. This good low-reflection and polarization-independent property is maintained even at an incident angle of 60 degrees beyond 55 degrees.
- a seven-layer antireflection film for the same excimer laser light (wavelength: 248 nm) as in Example 1 was manufactured.
- the antireflection film has first to seventh layers on a synthetic quartz glass substrate 30 having a refractive index of 1.51 at a wavelength of 248 nm.
- Table 3 shows the film configuration and Fig. 5 shows the cross-sectional structure of the film.
- the medium is air.
- 73 consists of Alpha 1 2 0 3 having an optical film thickness of 79 nm (design center wavelength lambda.
- the second The layer 32 is composed of H f 0 2 having a refractive index of 2.28 at a wavelength of 248 nm and an optical film thickness of 78 nm (0.3 times the design center wavelength ⁇ .).
- refractive index 1 at a wavelength 248 nm of light. 73 comprises a 1 2 0 3 or we have an optical film thickness of 34 nm (0. 1 4 times the designed center wavelength lambda.)
- fourth layer 34 is a wavelength 248 refractive index 2.28 at nm light consists H f 0 2 having an optical film thickness of 1 6 nm (0. 06 times the designed center wavelength Hisashi.)
- fifth layer 35 is a wavelength
- the refractive index is 1.40
- the optical film thickness is 82 nm (design center wavelength ⁇ .
- a sixth layer 36 has a refractive index 1.73 at a wavelength of 248 nm light, an optical film thickness 73 nm (designed center wavelength e. Of 0.29 times) consist a 1 2 0 3, and the refractive index 1 in the seventh layer 37 is a wavelength 248 nm light.
- M g F having optical thickness 67 nm (designed center wavelength e. of 0.27 times) Consists of two .
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 248 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 6 shows the measurement results.
- the anti-reflection film of Comparative Example 1 is kept at 0.3% or less at the maximum in the range of the incident angle from 0 degree (normal incidence) to 50 degrees, but the incident angle is 20 degrees.
- the difference between the reflectances of s-polarized light and p-polarized light is not negligible in the range from 50 degrees to 50 degrees.
- the s-polarized light reflectance is about 0.3% and the p-polarized light reflectance is 0% near the incident angle of 40 degrees, and the reflectance difference due to the polarization difference is large. Furthermore, when the angle of incidence exceeds 50 degrees, the average reflectance sharply increases. At an angle of incidence of 60 degrees, not only does it reach about 1.6%, but the difference in reflectance due to the polarization difference cannot be ignored.
- the antireflection film manufactured in this example is applied to an optical element such as a lens component for an optical system. If this optical system is, for example, a projection lens for semiconductor exposure with N.A. of 0.8 or more, each of the lens components incorporated in this projection lens generally has an incident angle of up to about 60 degrees.
- the projection lens has a problem that a difference in reflectivity occurs due to a difference in the polarization direction, thereby changing optical characteristics. Further, there is a problem in that the amount of transmitted light and the amount of peripheral light are reduced due to reflection loss. These problems are exacerbated in optical systems with a large number of constituent lens parts. Therefore, when such an optical system is used, the influence of the reflectance due to the difference in the polarization direction must be considered in advance, and even if this is considered, the optical characteristics are not sufficient due to the reflection loss. this The problem occurs not only in the projection lens but also in any optical system having a large oblique incidence component among the optical elements incorporated in the exposure apparatus. For the above reasons, it is difficult to apply an optical element provided with this antireflection film to an optical system such as a projection lens with a NA of ⁇ 0.8. [Example 3]
- Example 3 a six-layer antireflection film for KrF excimer laser light (wavelength: 248 nm) is manufactured.
- the composition of the film is shown in Table 4, and the cross section of the film is shown on a fluorite substrate (refractive index 1.47 at 248 nm) 40 in FIG.
- the medium is air.
- the first layer 41 consists of a dry process MgF 2 having a refractive index of 1.40 and an optical film thickness of 106 nm (0.43 times the design center wavelength) at a wavelength of 248 nm.
- second layer 42 has a refractive index 1 at a wavelength of 24 8 nm light. 1 6, from M g F 2 wet process having an optical film thickness of 20 nm (0.
- the third layer 43 is composed of a dry process H f ⁇ 2 having a refractive index of 2.28 and an optical film thickness of 21 nm (0.08 times the design center wavelength) at a wavelength of 248 nm.
- fourth layer 44 has refractive Oriritsu 1 at a wavelength of 248 nm light.
- the a 1 2 0 3 of dry type process having an optical film thickness of 75 nm (0. 30 times the designed center wavelength lambda.) made
- fifth layer 45 has a refractive index 2.28 at a wavelength of 248 nm light from H f 0 2 dry process having an optical film thickness of 1 7 nm (0.
- the sixth layer 46 has an index of refraction of 1.16 at 248 nm light and an optical film. Consisting M g F 2 wet process having a 77 nm (0. 3 1 times the designed center wavelength A.). Here, the design center wavelength ⁇ 0 is 248 nm.
- the second layer and the sixth layer as the uppermost layer are formed by a wet process. The formation of the M g F 2 film by the wet process was performed by the hydrofluoric acid / magnesium acetate method in the same manner as in Example 1. The EB evaporation method was used for the formation of the thin film in the dry process in the same manner as in Example 1. Table 4
- the reflection characteristics of the antireflection film thus obtained were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 248 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Fig. 8 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of six layers, but reflects s-polarized light and p-polarized light in the range of incident angles from 0 degree (normal incidence) to 56 degrees.
- the reflectivities and their average reflectivities are less than 0.1%, so that the difference in reflectivity due to the difference in polarization is very small. This good low reflection and polarization-independent property is maintained even at an incident angle of more than 56 degrees and 60 degrees.
- Example 4 a seven-layer antireflection film for KrF excimer laser light (wavelength: 248 nm) is manufactured.
- the film configuration is shown in Table 5, and the cross section of the film is shown on a fluorite substrate (refractive index: 1.47 at 248 nm) 50 in FIG.
- the medium is air.
- the first layer 51 has a refractive index of 1.40 for light having a wavelength of 2448 nm and an optical thickness of 103 nm (0.42 times the design center wavelength). It consists g F 2, having the second layer 5 2 is the refractive index 1 in the wavelength 2 4 8 ⁇ light. 1 6, the optical film thickness 1 9 nm (0.
- the third layer 3 has a refractive index 2.2 8 at a wavelength 2 4 8 nm light, an optical film thickness 2 1 nm (the designed center wavelength lambda. of 0.0 8 Times) Consists H f 0 2 dry process having Bian 17, fourth layer 54 has refractive Oriritsu 1 at a wavelength of 248 nm light. 73, an optical film thickness 74 nm (designed center wavelength example.
- the design center wavelength ⁇ 0 is 248 nm.
- the second layer and the sixth layer are formed by a wet process.
- the MgF 2 film was formed by the wet process using the hydrofluoric acid / magnesium acetate method (this was performed in the same manner as in Example 1.
- the thin film was formed by the EB evaporation method in the same manner as in Example 1 in the dry process. Table 5
- the reflection characteristics of the antireflection film thus obtained were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 248 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- the measurement results are shown in FIG.
- the antireflection film of the present invention has a relatively small number of layers of seven layers, but has a reflectance of s-polarized light and p-polarized light in the range of an incident angle of 0 degree (normal incidence) to 56 degrees.
- their average reflectivity is less than 0.1%, so that the difference in reflectivity due to the difference in polarization is extremely small. This good
- the characteristic of low reflection and independent of the direction of polarization is still maintained at an incident angle of 60 degrees beyond 56 degrees.
- Comparative Example 2 a seven-layer antireflection film for the same excimer laser light (wavelength: 248 nm) as in Example 1 was produced.
- the structure of the film is shown in Table 6, and the cross section of the film is shown on a fluorite substrate (refractive index: 1.47 at 248 nm) 60 in FIG.
- the medium is air.
- Refractive index 1 in the first layer 61 is a wavelength 248 nm light.
- 73 consists of A 1 2 0 3 having an optical film thickness of 78 nm (0. 3 1 times the designed center wavelength man.)
- the second layer 62 is a wavelength 248 nm of the refractive index 2.28 at light consists H f ⁇ 2 having an optical film thickness of 82 nm (0.
- the third layer 53 is a wavelength 248 refractive index 1 in nm of light. 73, it consists of a 1 2 0 3 having an optical film thickness of 3 5 nm (0. 1 4 times the designed center wavelength lambda.)
- fourth layer 64 is a wavelength 248 nm It consists of H f ⁇ 2 with a refractive index of 2.28 and an optical thickness of 14 nm (0 ⁇ 06 times the design center wavelength ⁇ .)
- the fifth layer 65 is a light of wavelength 248 ⁇ m refractive index 1.
- 40 consists M g F 2 having an optical thickness 84 nm (0.
- the refractive index 1 in the sixth layer 66 is a wavelength 248 nm light.
- 73 consists a 1 2 0 3 having an optical film thickness of 74 nm (0. 30 times the designed center wavelength lambda.), and seventh layer 67 Refractive index 1 in the length 248 nm light.
- 40 consists of M g F 2 having an optical thickness 68 nm (0. 28 times the designed center wavelength lambda.). Enter the design center wavelength here. Is 248 nm as in Example 1. In this antireflection film, all of the seven layers were formed by a dry process using the EB vapor deposition method used in Example 1.
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 248 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Fig. 12 shows the measurement results.
- the anti-reflection film of Comparative Example 2 is maintained at a maximum of 0.6% or less in the range of the incident angle from 0 degree (normal incidence) to 50 degrees, but the incident angle is 2 degrees.
- the difference between the reflectance of s-polarized light and the reflectance of p-polarized light cannot be ignored from degrees to near 50 degrees.
- the s-polarized light reflectance is about 0.6% and the p-polarized light reflectance is 0.05% near an incident angle of 45 degrees, and the reflectance difference due to the polarization difference is large. Furthermore, when the angle of incidence exceeds 50 degrees, the average reflectance sharply increases. At an angle of incidence of 60 degrees, not only does it reach about 1.2%, but the difference in reflectance due to the polarization difference cannot be ignored.
- Such an antireflection film of Conventional Example 2 is applied to an optical element such as a lens component for an optical system. If this optical system is, for example, a projection lens for semiconductor exposure with N.A. of 0.8 or more, each of the lens components incorporated in this projection lens generally has an incident angle of up to about 60 degrees.
- the projection lens has a problem in that a difference in reflectance occurs due to a difference in polarization direction, thereby changing optical characteristics. Further, there is a problem in that the amount of transmitted light and the amount of peripheral light are reduced due to reflection loss. Due to these problems, it is difficult to apply the optical element provided with the antireflection film to an optical system such as a projection lens of N.A. ⁇ 0.8 based on the reason described in Comparative Example 1. .
- Example 5 a six-layer antireflection film for ArF excimer laser light (wavelength: 193 nm) was manufactured.
- the film configuration is shown in Table 7, and the cross section of the film is shown on a synthetic quartz glass substrate (refractive index 1.56 at 193 nm) 70 in FIG.
- the medium is air.
- the third layer 73 has a refractive index of 1.17 at a wavelength of 193 nm and an optical film thickness of 30 nm (0.16 times the design center wavelength ⁇ .). consists of two, the refractive index 1 in the fourth layer 74 is a wavelength 1 93 nm light. 54, S i 0 2 dry process having an optical film thickness of 84 nm (0. 44 times the designed center wavelength lambda.)
- the fifth layer 75 has a refractive index of 1.84 at a wavelength of 193 nm and an optical film thickness of 13 nm (0.07 times the design center wavelength ⁇ .).
- the refractive index at the sixth layer 76 is a wavelength 1 93 nm light 1.1 7, optical Consisting M g F 2 wet process having a thickness 53 nm (0. 27 times the designed center wavelength lambda.). Here, 193 nm was selected as the design center wavelength ⁇ 0 .
- the third layer and the sixth layer as the uppermost layer are formed by a wet process.
- the formation of the M g F 2 film by the wet process was performed by the hydrofluoric acid / magnesium acetate method as in Example 1.
- the thin film was formed by the dry process using the EB evaporation method as in Example 1.
- the antireflection film of the present invention has a relatively small number of layers of six layers, but has a reflectance of s-polarized light and p-polarized light in the range of an incident angle of 0 degree (normal incidence) to 54 degrees. In addition, their average reflectance is less than 0.2%, so that the difference in reflectance due to the difference in polarization is extremely small. This good low-reflection and polarization-independent property is retained even at an incident angle of 60 degrees beyond 54 degrees.
- Example 6 a seven-layer antireflection film was manufactured for A “F excimer laser light (wavelength: 193 nm).
- the film configuration is shown in Table 8, and the cross section of the film is shown in FIG.
- the substrate (refractive index 1.56 at 193 nm) is shown on 80.
- the medium is air
- the first layer 81 has a refractive index of 1.84 at a wavelength of 193 nm and an optical thickness of 75 nm consist a "I 2 0 3 dry process with a (design in mind wavelength lambda 0. 39 times.), the second layer 82 has a refractive index 1 at a wavelength of 1 93 nm light. 54, an optical film thickness consist S i 0 2 dry process with 44 nm (designed center wavelength input.
- the refractive index in the third layer 83 is a wavelength 1 9 3 nm light 1.1 7
- optical film consists M g F 2 wet process having a thickness 33 nm (0. 1 7 times the designed center wavelength lambda.)
- fourth layer 84 the refractive index 1 at a wavelength of 1 93 nm of light.
- the optical film Dry type with a thickness of 80 nm (0.4 times the design center wavelength ⁇ ) It consists S i 0 2 process, refractive Oriritsu 1 in the fifth layer 8 5 Wavelength 1 93 nm light.
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 193 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 16 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of seven layers, but has a reflectance of s-polarized light and p-polarized light in the range of an incident angle of 0 degree (normal incidence) to 54 degrees.
- their average reflectance is 0.2% or less, so that the difference in reflectance due to the difference in polarization direction is extremely small. This good low-reflection and polarization-independent property is retained even at an incident angle of 60 ° beyond 54 °.
- Comparative Example 3 a six-layer antireflection film for the same excimer laser light (wavelength: 193 nm) was shown.
- the film configuration is shown in Table 9 and the cross section of the film is shown on a synthetic quartz glass substrate (refractive index 1.56 at 193 nm) 90 in FIG.
- the medium is air.
- Refractive index 1 in the first layer 9 1 Wavelength 1 93 nm light. 84, consists of Alpha 1 2 0 3 having an optical film thickness of 79 nm (design center wave length lambda. Of 0.41 times), the The two layers 92 have a refractive index of 1.54 and an optical film thickness of 76 nm (0.39 times the design central wavelength A.) at a wavelength of 193 nm.
- the refractive index 1 in the third layer 93 is a wavelength 1 93 nm of light having. 84, A 1 2 having an optical film thickness of 76 nm (0. 39 times the designed center wavelength Hisashi.) 0 3 consists, fourth layer 94 has a refractive index 1 at a wavelength of 1 93 nm light. 54, it consists of S i 0 2 having an optical film thickness of 52 nm (0. 27 times the designed center wavelength Hisashi.) , the refractive index 1 in the fifth layer 95 is a wavelength 1 93 eta m light. 84, the a 1 2 0 3 dry process having an optical film thickness of 54 nm (0.
- sixth layer 96 has a refractive index 1 at a wavelength of 1 93 nm light. 54, consisting of S i 0 2 having an optical film thickness of 49 nm (0. 25 times the designed center wavelength lambda.). Design center wavelength. Selected 193 nm. All six layers of this antireflection film were formed by a dry process using the EB vapor deposition method used in Example 1.
- the reflection characteristics of the antireflection film thus obtained were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 193 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 18 shows the measurement results.
- the anti-reflection coating of Comparative Example 3 has an incident angle of 3 5 Above that degree, the reflection of s-polarized light becomes significantly larger. At an incident angle of 50 degrees or more, the reflection of p-polarized light becomes extremely large. At an incident angle of 55 degrees or more, it exceeds the reflection of s-polarized light and reaches 3% at an incident angle of 58 degrees.
- the antireflection film manufactured in this example is applied to an optical element such as a lens component for an optical system. If this optical system is a projection lens for semiconductor exposure with N.A. Generally, light having an incident angle of up to about 60 degrees is incident on each of the lens components incorporated in the lens so that it cannot be ignored. Based on the reason explained in Comparative Example 1, it is difficult to apply the optical element provided with the antireflection film to an optical system such as a projection lens with NA ⁇ 0.8.
- Example 7 a six-layer antireflection film for ArF excimer laser light (wavelength: 193 nm) was manufactured.
- the film configuration is shown in Table 10, and the cross section of the film is shown on FIG. 19 on a fluorite substrate (refractive index: 1.50 at 193 nm) 100.
- the medium is air.
- Refractive index 1 in the first layer 1 01 Wavelength 1 93 nm light.
- the A 1 2 ⁇ 3 dry process having an optical film thickness of 78 nm (0. 41 times the designed center wave length A.
- the second layer 102 has a refractive index of 1.54 at a wavelength of 193 nm and an optical thickness of 41 nm (0.21 times the design center wavelength).
- the refractive index in the third layer 1 03 wavelength 1 93 nm light 1.
- M wet process having an optical film thickness of 32 nm (0. 1 7 times the designed center wavelength lambda.) consists g F 2
- fourth layer 1 04 is the refractive index 1 in the light of the wavelength 1 93 ⁇ m. 54
- a dry process having an optical film thickness of 82 nm (0. 43 times the designed center wavelength lambda.) consist S i 0
- the fifth layer 1 05 is manually refractive index 1 in the wavelength 1 93 nm light.
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 193 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 20 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of six layers, but has a reflectance of s-polarized light and p-polarized light in the range of an incident angle of 0 degree (normal incidence) to 53 degrees. Their average reflectance is less than 0.2%, so the difference in reflectance due to the difference in polarization is very small. This good low-reflection and polarization-independent property is retained even at an incident angle of more than 54 degrees and 60 degrees.
- Example 8 a seven-layer antireflection film for ArF excimer laser light (wavelength: 193 nm) was manufactured.
- the film configuration is shown in Table 8 and the cross section of the film is shown on a fluorite substrate (refractive index: 1.50 at 1993 nm) 110 in FIG.
- the medium is air.
- Refractive index at the first layer 1 1 1
- a 1 2 0 3 dry process having an optical film thickness of 78 nm (designed center wavelength input. 0.4 1 times)
- the second layer 112 has a refractive index of 1.54 for light having a wavelength of 193 nm and an optical film thickness of 40 nm (0.21 times the design center wavelength ⁇ ).
- the refractive index 1 in the third layer 1 1 3 wavelengths 1 9 3 nm light. 1 7 an optical film thickness 35 nm (designed center wavelength lambda. of 0.1 It consists M g F 2 wet process with 8-fold), the refractive index in the fourth layer 1 1 4 wavelength 1 93 nm light 1.54, optical film thickness 78 nm (designed center wavelength lambda. 0 . consists S i 0 2 dry process with 41-fold), the fifth layer 1 1 5 hands refractive index to the wavelength 1 93 nm light 1. 84 optical thickness 1 8 nm (design center wavelength Hisashi.
- an optical film thickness 3 It consists of a dry process S i ⁇ 2 with nm (0.02 times the design center wavelength ⁇ ).
- the design center wavelength ⁇ 0 was selected to be 193 nm.
- the third layer and the sixth layer are formed by a wet process.
- the formation of the MgF 2 film by the wet process was performed by the hydrofluoric acid / magnesium acetate method in the same manner as in Example 1.
- the EB evaporation method was used for the formation of the thin film in the dry process in the same manner as in Example 1. Table 11
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 193 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 22 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of seven layers, but has a reflectance of s-polarized light and p-polarized light within an incident angle of 0 degree (normal incidence) to 52 degrees. Their average reflectance is 0.2% or less, so that the difference in reflectance due to the difference in polarization is extremely small. This good low-reflection and polarization-independent property is maintained even at an incident angle of more than 52 degrees and 60 degrees.
- Comparative Example 4 a six-layer antireflection film for excimer laser light (wavelength 193 nm) was manufactured.
- the film configuration is shown in Table 12, and the cross section of the film is shown on FIG. 23 on a fluorite substrate (refractive index: 1.50 at 193 nm).
- the medium is air.
- Refractive index 1 in the first layer 1 2 1 Wavelength 1 93 nm light.
- 84 consists of A l 2 ⁇ 3 having an optical film thickness of 82 nm (designed center wavelength input.
- the second layer 122 is composed of S i ⁇ ⁇ 2 having a refractive index of 1.54 at a wavelength of 193 nm and an optical film thickness of 72 nm (0.38 times the design center wavelength ⁇ ).
- 1 23 is a refractive index 1 at a wavelength of 1 93 nm light.
- 84 consists of a 1 2 0 3 having an optical film thickness of 77 nm (0. 40 times the designed center wavelength lambda.), fourth layer 1 24 refractive index 1 at a wavelength of 1 93 nm of light.
- 54 consists of S i 0 2 having an optical film thickness of 5 1 nm (0.
- 84 consists of a 1 2 0 3 having an optical film thickness of 55 nm (0. 2 8 times the designed center wavelength lambda.), and sixth layer 1 26 refractive index 1 at a wavelength of 1 93 nm of light. 54, consisting of S i 0 2 having an optical film thickness of 48 nm (0. 2 5 times the designed center wavelength lambda.).
- the design center wavelength ⁇ . Selected 193 nm. All six layers of this antireflection film were formed by a dry process using the EB vapor deposition method used in Example 1.
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 193 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 24 shows the measurement results.
- the antireflection film of Comparative Example 4 has a reflection of 0.5% or less in the range of an incident angle of 0 degree (normal incidence) to 35 degrees, but has an incident angle of 35 degrees or more. Then, the reflection of s-polarized light is remarkable ⁇ greater.
- the antireflection film manufactured in this example is applied to an optical element such as a lens component for an optical system. If this optical system is, for example, a projection lens for semiconductor exposure in which N.A. is 0.8 or more, each of the lens components incorporated in this projection lens generally receives light having an incident angle of up to about 60 degrees. Incident to the extent that it cannot be ignored. Therefore, based on the reason described in Comparative Example 1, it is difficult to apply the optical element provided with the antireflection film to an optical system such as a projection lens with NA ⁇ 0.8.
- a reflective film is manufactured.
- This reflection film is for the ArF excimer laser light (wavelength 193 nm).
- the film configuration is shown in Table 13 and the cross section of the film is shown in Fig. 25 in a synthetic quartz glass substrate (refractive index 1.56 at 193 nm). Shown on 1 30 above.
- the medium is air.
- This film configuration is generally abbreviated as substrate / (LH) 20.
- the formation of the M g F 2 film by a wet process was performed by the hydrofluoric acid / magnesium acetate method as in Example 1.
- the reflective film unlike the anti-reflective film, it is rarely used at a wide range of incident angles.Therefore, the incident angle was kept constant at 45 degrees, while the reflectance was observed by varying the wavelength of the incident light. .
- the measurement results of the spectral reflectance of this reflective film at an incident angle of 45 degrees are shown in Fig. 26 as the reflectance when s-polarized light is incident, the reflectance when p-polarized light is incident, and their average reflectance. Indicated. From FIG. 26, it can be seen that the reflection film of the present invention has a reflectance of 97% or more.
- Bands range from ⁇ 190 nm to 226 nm for s-polarized light, from ⁇ 190 nm to 204 nm for p-polarized light, and from ⁇ 190 nm to 206 nm for average And extremely high.
- the wavelength band showing high reflectivity for p-polarized light is as wide as 14 nm or more.
- the reflectance in the wavelength range of 190 nm or less is not specified due to the wavelength range of the measurement data, the wavelength range showing a high reflectance of 97% or more is actually much larger than 14 nm. It is expected to be wide.
- a reflective film for the ArF excimer laser light (wavelength: 193 nm) is manufactured.
- the film configuration is shown in Table 14 and the cross section of the film is shown on FIG. 27 on a synthetic quartz glass substrate (refractive index 1.56 at 193 °) 180.
- the medium is air.
- Reflective film of the present invention, M g F 2 film having a low refractive index formed by a dry process (hereinafter, is the abbreviated L) and, a high refractive index formed by a dry process A "I 2 0 3 film (hereinafter , H) are repeatedly laminated in this order as 181, 182, 183,..., 218, 219, 220 on a 40-layer substrate.
- This film configuration is generally substrate / (LH) Abbreviated as 20.
- the reflective film of the present invention has a wavelength band with a reflectance of 97% or more in the range from 190 nm or less to s-polarized light to 215 nm, and from 193 nm to p-polarized light.
- the wavelength range is up to 203 nm, and the average is from 191 nm to 206 nm.
- the wavelength band is narrower than that of the reflective film of Example 9 for all of them, but especially for p-polarized light.
- the area showing high reflectivity is as narrow as 1 O nm.
- Example 10 a six-layer antireflection film for F 2 excimer laser light (wavelength: 157 nm) was manufactured.
- the structure of the film is shown in Table 15, and the cross section of the film is shown in FIG. 29 on a fluorite substrate (refractive index 1.56 at 157 °) 230.
- the medium is nitrogen.
- the first layer 2 3 1 has a refractive index of 1.80 at a wavelength of 157 nm and an optical film thickness of 68 nm (0.35 times the design center wavelength ⁇ .) From the dry process L a F 3. become, the refractive index 1 in the second layer 232 is wavelength 1 57 nm light. 48, M g F 2 dry process having an optical film thickness of 25 nm (0.
- the third layer 233 has a refractive index of 1.22 at a wavelength of 157 nm and an optical thickness of 63 nm (0.32 times the design center wavelength ⁇ ) of ⁇ 9 F in a wet process. consists of two, the refractive index 1 in the fourth layer 234 wavelength 1 57 nm light. 48, M g F a dry process having an optical film thickness of 5 2 nm (0. 27 times the designed center wavelength lambda.) consists of two, fifth layer 235 hand refractive index 1 in the light of the wavelength 1 57 nm. 80, L a F 3 dry process having an optical film thickness of 8 nm (0.
- the sixth layer 236 has a refractive index of 1.22 at a wavelength of 157 nm and is optically Consisting M g F 2 wet process having a thickness 42 nm (0. 2 2 times the designed center wavelength lambda.).
- the design center wavelength ⁇ . Is the wavelength that is the reference for the design film thickness, and was selected here as 157 nm.
- the third layer and the sixth layer as the uppermost layer are formed by a wet process. In the dry process, the EB evaporation method was used as in Example 1. Table 15
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light having a wavelength of 157 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Fig. 30 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of six layers, but has a reflectance of s-polarized light and p-polarized light within an incident angle range of 0 degree (normal incidence) to 56 degrees. Their average reflectance is less than 0.2%, so the difference in reflectance due to the difference in polarization is very small. This good low-reflection and polarization-independent property is maintained even at an incident angle of 60 degrees beyond 56 degrees.
- Example 11 a seven-layer antireflection film for ArF excimer laser light (wavelength: 157 nm) was manufactured.
- the film composition is shown in Table 16 and the cross section of the film is shown in FIG. 31 on a fluorite substrate (ref. 1.56 with 157
- the medium is nitrogen.
- the first layer 241 is composed of a dry process L a F 3 having a refractive index of 1.80 at a wavelength of 157 nm and an optical thickness of 68 nm (0.35 times the design center wavelength).
- the refractive index 1 in the second layer 242 is wavelength 1 57 nm light. 48, from M g F 2 dry process having an optical film thickness of 24 nm (0.
- the third layer 243 has a refractive index of 1.22 at a wavelength of 157 nm and an optical film thickness of 62 nm (0.3 of the design center wavelength ⁇ ). It consists M g F 2 wet process having a 2-fold), the refractive index 1 in the fourth layer 244 Wavelength 1 57 nm light. 48, an optical film thickness 50 nm (designed center wavelength lambda. Of 0.26 consists M g F 2 dry process having a double), the fifth layer 245 is manually refractive index 1 in the light of the wavelength 1 57 nm. 80, the optical film thickness 1 0 nm (the designed center wavelength lambda.
- the refractive index in the sixth layer 246 wavelength 1 57 nm light 1.22
- optical film thickness 38 nm designed center wavelength lambda. 0. 1 9-fold
- refractive index 1 in the seventh layer 247 is wavelength 1 57 nm light.
- an optical film thickness 0 3 nm (the designed center wavelength lambda. of . consisting M g F 2 dry flop opening processes with 02-fold).
- the design center wavelength ⁇ 0 was selected to be 157 nm.
- the third layer and the sixth layer are formed by a wet process.
- the deposition of the MgF 2 thin film in the wet process was performed by the hydrofluoric acid / magnesium acetate method in the same manner as in Example 1.
- the EB evaporation method was used for the thin film formation in the dry process in the same manner as in Example 1.
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light at a wavelength of 157 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 32 shows the measurement results.
- the antireflection film of the present invention has a relatively small number of layers of 7 layers, but has an incident angle of 0 degree (vertical
- the reflectance of s-polarized light and p-polarized light and the average reflectance thereof are 0.2% or less in the range of -56 degrees (direct incidence). Therefore, the difference in reflectance due to the difference in polarization is extremely small. This good low-reflection and polarization-independent property is maintained even at an incident angle of 60 degrees beyond 56 degrees.
- a six-layer antireflection film for excimer laser light (wavelength: 157 nm) was manufactured.
- the film configuration is shown in Table 17 and the cross section of the film is shown in FIG. 33 on a fluorite substrate (refractive index 1.56 at 157 nm) 250.
- the medium is nitrogen.
- the first layer 251 is composed of L a F 3 having a refractive index of 1.80 at a wavelength of 157 nm and an optical thickness of 72 nm (0.37 times the design center wavelength ⁇ ), and the second layer.
- 252 hand refractive index 1 in the light of the wavelength 1 57 nm. 48, consists of M g F 2 that have a optical film thickness 55 nm (0.
- the third layer 2 53 Is composed of L a F 3 having a refractive index of 1.80 at a wavelength of 157 nm and an optical thickness of 72 nm (0.37 times the design center wavelength).
- the fourth layer 254 has a wavelength of 1 nm. refractive index 1 at 57 nm of light. 48, consists of M g F 2 having an optical thickness 44 nm (0.
- the fifth layer 255 of the wavelength 1 57 nm light Is composed of L a F 3 having a refractive index of 1.80 and an optical film thickness of 44 nm (0.23 times the design center wavelength ⁇ )
- the sixth layer 256 is bent by light having a wavelength of 157 nm.
- the reflection characteristics of the thus-obtained antireflection film were examined as follows.
- the antireflection film was irradiated with s-polarized light and p-polarized light at a wavelength of 157 nm at various incident angles, and the change in reflectance with respect to the incident angle was measured.
- Figure 34 shows the measurement results.
- the anti-reflection film of Comparative Example 6 has a reflection of less than 0.5% in the range of an incident angle of 0 degree (normal incidence) to 40 degrees, but has an incident angle of 3%.
- the difference between the antireflection characteristics of s and p polarized light becomes larger than at around 0 degrees.
- the reflection of p-polarized light exceeds 0.5% at an incident angle of 50 degrees or more, exceeds the reflection of s-polarized light at an incident angle of 53 degrees or more, and reaches 3% at an incident angle of 59 degrees.
- the antireflection film manufactured in this example is applied to an optical element such as a lens component for an optical system.
- this optical system is, for example, a projection lens for semiconductor exposure in which NA is 0.8 or more
- each of the lens components incorporated in the projection lens generally has an incident angle of up to about 60 degrees. Light is incident to the extent that it cannot be ignored.
- the antireflection films manufactured in Examples 1 to 8, 10 and 11 are effective for use in the ultraviolet region of 300 nm or less, the total number of layers is small, and the reflectance is low. It shows differences in characteristics, wide angle characteristics, and small polarization characteristics. Further, the reflection film manufactured in Example 9 shows high reflectance characteristics and a wide high reflectance wavelength range in a wavelength range of 300 nm or less.
- FIG. 35 shows a scanning projection exposure apparatus for exposing a wafer 1801 (total W), which has been coated by a photo resist 1701, with an image of a reticle R pattern.
- FIG. 2 is a conceptual diagram of 2000, in which the optical elements manufactured in Examples 1 to 11 are applied to this exposure apparatus.
- the projection exposure apparatus of the present invention comprises at least a reticle stage 1201 that can hold a reticle R (mask) and can move in a direction parallel to the surface of the reticle R, Substrate) Wafer stage 1301, which can move W in a direction parallel to the wafer surface while holding W on surface 1301a, and illumination for irradiating reticle R (mask) with vacuum ultraviolet light
- the projection optical system 1500 is arranged between the reticle R and the wafer W such that the surface P 1 on which the reticle R is arranged becomes an object plane and the surface p 2 of the wafer W becomes an image plane.
- the illumination optical system 111 includes an alignment optical system 110 for performing relative positioning between the reticle R and the wafer W.
- the reticle exchange system 1200 exchanges and transports the reticle R set in the reticle stage 1201.
- the reticle exchange system 1200 includes a reticle stage driver (not shown) for moving the reticle stage 1201, and the stage control system 1
- Reference numeral 300 includes a wafer stage driver (not shown) for moving the wafer stage 1301.
- the main control system 1400 controls the reticle stage driver and the wafer stage driver via the stage control system 1300 to drive the reticle stage and the wafer stage to move synchronously with the exposure light.
- the projection optical system 1500 further includes an alignment optical system 1601.
- the exposure apparatus 2000 it is possible to use an optical element in which a multilayer film including the MgF 2 film manufactured in the above embodiment is coated.
- the optical lenses 1900 of the illumination optical system 1101 and the projection lens 1100 of the projection optical system 1500 Elements can be used.
- the projection optical system 1500 Usually, a plurality of projection lenses 1100 are arranged in the projection optical system 1500.
- the light exit side that is, the wafer W (the lens at the closest position is a lens according to the present invention.
- the projection lens may be provided with a multilayer film only on the light incident surface, or the entire lens may be provided with a multilayer film.
- Various optical elements such as a relay lens, a beam splitter, a condenser lens, a beam expander, and a reflecting mirror are used, but the present invention can be applied to any of the elements.
- the present invention is not limited to this, and a step-and-repeat type projection exposure apparatus (so-called stepper), a mirror projection aligner, and a proximity type exposure
- the optical element with a reflective film manufactured in Example 10 is applied to, for example, a reflector used in an exposure apparatus having a reflective or catadioptric projection optical system.
- the projection exposure apparatus and the optical elements used therein are disclosed in U.S. Pat. No. 5,835,275, and these documents can be used to the extent permitted by the national laws of the designated country.
- the optical element of the present invention can be used for various devices other than the exposure device, for example, a spectroscope, a laser repair device, various inspection devices, sensors, and the like. Industrial availability
- the multilayer film of the optical element according to the present invention has a film exhibiting a very low refractive index of 1.35 or less, particularly 1,20 or less in a vacuum ultraviolet region of 250 nm or less.
- the refractive index difference between the low refractive index film and the low refractive index film can be increased, and the refractive index of the low refractive index film can be reduced.
- An optical element having a reflective film having a high reflectance wavelength range, and an exposure apparatus using the optical element can be obtained. Therefore, the present invention is extremely useful especially for an exposure apparatus using an optical element of N.A. ⁇ 0.8 in order to realize exposure of an ultrafine pattern using photolithography.
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- General Engineering & Computer Science (AREA)
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- Surface Treatment Of Optical Elements (AREA)
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Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU74516/00A AU7451600A (en) | 1999-09-30 | 2000-10-02 | Optical device with multilayer thin film and aligner with the device |
JP2001527246A JP3509804B2 (ja) | 1999-09-30 | 2000-10-02 | 多層薄膜付き光学素子及びそれを備える露光装置 |
US09/856,971 US6574039B1 (en) | 1999-09-30 | 2000-10-02 | Optical element with multilayer thin film and exposure apparatus with the element |
EP00963020A EP1152263A4 (en) | 1999-09-30 | 2000-10-02 | OPTICAL DEVICE WITH THIN MULTI-LAYER SYSTEM AND THEIR USE FOR ALIGNMENT |
KR1020017006626A KR20010086056A (ko) | 1999-09-30 | 2000-10-02 | 다층 박막을 갖는 광학소자 및 그것을 구비한 노광장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11/278416 | 1999-09-30 | ||
JP27841699 | 1999-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001023914A1 true WO2001023914A1 (en) | 2001-04-05 |
Family
ID=17597047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/006817 WO2001023914A1 (en) | 1999-09-30 | 2000-10-02 | Optical device with multilayer thin film and aligner with the device |
Country Status (6)
Country | Link |
---|---|
US (1) | US6574039B1 (ja) |
EP (1) | EP1152263A4 (ja) |
JP (1) | JP3509804B2 (ja) |
KR (1) | KR20010086056A (ja) |
AU (1) | AU7451600A (ja) |
WO (1) | WO2001023914A1 (ja) |
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Also Published As
Publication number | Publication date |
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AU7451600A (en) | 2001-04-30 |
EP1152263A4 (en) | 2003-08-20 |
EP1152263A1 (en) | 2001-11-07 |
JP3509804B2 (ja) | 2004-03-22 |
US6574039B1 (en) | 2003-06-03 |
KR20010086056A (ko) | 2001-09-07 |
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