WO2000065619A1 - Elektromagnetisches relais und verfahren zu dessen herstellung - Google Patents
Elektromagnetisches relais und verfahren zu dessen herstellung Download PDFInfo
- Publication number
- WO2000065619A1 WO2000065619A1 PCT/EP2000/003574 EP0003574W WO0065619A1 WO 2000065619 A1 WO2000065619 A1 WO 2000065619A1 EP 0003574 W EP0003574 W EP 0003574W WO 0065619 A1 WO0065619 A1 WO 0065619A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- armature
- plastic
- printed circuit
- relay
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
- H01H50/041—Details concerning assembly of relays
- H01H50/043—Details particular to miniaturised relays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/58—Electric connections to or between contacts; Terminals
- H01H2001/5888—Terminals of surface mounted devices [SMD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/021—Bases; Casings; Covers structurally combining a relay and an electronic component, e.g. varistor, RC circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H51/00—Electromagnetic relays
- H01H51/22—Polarised relays
- H01H51/2272—Polarised relays comprising rockable armature, rocking movement around central axis parallel to the main plane of the armature
- H01H51/2281—Contacts rigidly combined with armature
Definitions
- the invention relates to an electromagnetic relay, which has a magnet system, an armature, a contact spring, movable and fixed contacts and relay connections.
- the fixed contacts are welded onto stamped metal strips that are overmolded with plastic.
- the relay connections are formed from these punched strips by bending, sealed with potting compound, cut to length and angled as an SMD connection.
- Punched profile strips which are overmolded with thermoplastic plastic, serve to fasten the anchor spring. To realize the position of the fastening point, the profile strips are bent at several points before or after the extrusion coating.
- the conventional relays have the disadvantage that the bending operations and the welding operations reach their limits with regard to the permissible deviations from the nominal dimensions for the production of miniaturized relays. With the progressive miniaturization of the relays, the dimensions of the contacts have to be manufactured with ever greater accuracy.
- the aim of the present invention is therefore to provide a relay in which bending and welding operations can be dispensed with with regard to the relay connections and the fixed contacts.
- This goal is achieved according to the invention by a relay according to claim 1.
- Advantageous embodiments of the invention and a method for producing the invention can be found in the further claims.
- the invention consists in an electromagnetic relay with a coil, a core, an armature, a contact spring attached to the armature, a movable contact attached to the contact spring and a base element, in which a fixed contact cooperating with the movable contact is integrally integrated, in which the base element is a three-dimensional circuit board.
- welding contacts can be dispensed with. This results in a not inconsiderable saving in investment and process costs as well as the avoidance of sources of error. Rather, the base element can be manufactured as a standard product in printed circuit board manufacture using standard technologies. This enables further miniaturization of the relays.
- the relay can also be designed as a rocker arm relay, in which an armature spring support is integrated in one piece in the base element, in which an armature spring is attached to the armature spring support, in which a rocker arm rotatable about a transverse axis is attached to the armature spring and the contact springs connected to the armature spring has, on which the movable contacts are arranged, and in which connection elements for the coil, the movable and the fixed contact are arranged on the side of the base element facing away from the armature.
- the inventive integration of the armature spring support and the connection elements in the base element ensures that the rocker arm relay can be produced simply and inexpensively using the standard technologies of printed circuit board manufacture.
- circuit board having regions which are made of a first thermoplastic and regions which are made of a second thermoplastic, the first plastic being without current. has tallisizable surfaces and the second plastic has no electrolessly metallizable surfaces, the surfaces of the first plastic which are not adjacent to the second plastic are electrolessly metallized and galvanically reinforced with copper, and where material on the side facing the armature of the circuit board selectively galvanically forms the fixed contacts , and on the opposite side of the circuit board, the connecting elements forming tin are deposited on the copper-plated surfaces.
- Such a printed circuit board can be produced particularly advantageously in a 2-shot injection molding process, the areas of the printed circuit board consisting of the first plastic being molded in the first shot and the areas of the printed circuit board consisting of the second plastic being molded in the second shot , wherein the surface of the first plastic is electrolessly metallized, the metallized surface is galvanically reinforced with copper and wherein the material of the fixed contacts and the tin forming the connecting elements are selectively electrodeposited on the copper-plated surfaces.
- a relay manufactured in this way has the advantage that the injection mold determines the position of the relay contacts, the armature spring support and the fixed contacts, as well as their shape. This means that smaller deviations from the nominal dimensions of the relay can be achieved than when using bending and welding operations. This advantage can also be achieved with little effort by using injection molding technology and surface technology.
- a further advantageous embodiment of the invention is a relay in which the base of further relays forms on the printed circuit board. As a result, several relays can be accommodated in a common housing, for example in a customer-specific and very space-saving manner.
- a further advantageous embodiment of the invention is a relay in which diodes, capacitors, resistors, electrical fuses or drivers are provided on the circuit board as additional electrical components. These components are usually used in the external wiring of the relays and can thus be accommodated directly on the circuit board to save space.
- Figure 1 shows a relay according to the invention in a schematic longitudinal section.
- FIG. 2 shows the relay from FIG. 1 in a schematic cross section along the axis A - A.
- Figure 3 shows a further relay according to the invention in a schematic longitudinal section.
- FIG. 1 shows a relay with coil 1, core 2, three-pole
- a double-T-shaped relay spring is attached to the armature 4 by means of a plastic coating 7.
- the crossbar of such a T shown in FIG. 1 forms the contact spring 6, at the ends of which movable contacts 5 are arranged.
- the longitudinal bars of the T not shown in FIG. 1, form the armature spring as a torsion spring which rests on the armature spring support 13.
- the armature spring support 13, the fixed contacts 9 and the solder balls 15 forming the relay connections are integrated in one piece into the three-dimensional circuit board forming the base element 8.
- the first plastic 11 made conductive on its surface by the copper layer 10 forms the electrical contact between the solder balls 15 and the solid most contacts 9 or between the solder balls 15 and the contact spring 6.
- FIG. 2 shows, as a cross section of FIG. 1, not the transverse beams of the double T but the longitudinal beams of the double T forming the anchor springs 14 and the copper layers 10 forming the contact between the solder balls 15 and the top of the printed circuit board.
- FIG. 3 shows a folding armature relay with a coil 1 which is wound on a coil former 18.
- a core 2 runs in the coil former 18.
- the entire magnet system 1, 2, 18 is embedded in a relay sheath 16.
- the relay has an armature 4, which forms a working air gap with the core 2.
- a contact spring 6 is attached to the armature 4 by means of a plastic extrusion coating 7.
- a movable contact 5 is arranged. This movable contact 5 cooperates with a fixed contact 9, which is integral with the base element
- the three-dimensional circuit board 8 consists of a first plastic 11 and a second plastic 12.
- the first plastic 11 is made conductive on its surface by a copper layer 10 and is electrically connected to a solder ball 15 forming a connection element.
- the hinged armature relay can be designed so that the movable contact 5 bridges two fixed contacts 9 (the rear one not shown in the figure) one behind the other.
- the invention is not limited to the embodiments shown, but is defined in its most general form by claim 1.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Contacts (AREA)
- Electromagnets (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000614471A JP2002543557A (ja) | 1999-04-22 | 2000-04-19 | 電磁リレーおよびその製造方法 |
EP00934955A EP1171894A1 (de) | 1999-04-22 | 2000-04-19 | Elektromagnetisches relais und verfahren zu dessen herstellung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19918368.6 | 1999-04-22 | ||
DE19918368A DE19918368A1 (de) | 1999-04-22 | 1999-04-22 | Elektromagnetisches Relais und Verfahren zu dessen Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000065619A1 true WO2000065619A1 (de) | 2000-11-02 |
Family
ID=7905555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/003574 WO2000065619A1 (de) | 1999-04-22 | 2000-04-19 | Elektromagnetisches relais und verfahren zu dessen herstellung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1171894A1 (de) |
JP (1) | JP2002543557A (de) |
DE (1) | DE19918368A1 (de) |
WO (1) | WO2000065619A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8436701B2 (en) | 2010-02-08 | 2013-05-07 | International Business Machines Corporation | Integrated electromechanical relays |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107170649A (zh) * | 2017-06-08 | 2017-09-15 | 广西睿奕科技发展有限公司 | 一种可同时关断零线和相线的磁保持继电器 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668928A (en) * | 1986-06-23 | 1987-05-26 | Tektronix, Inc. | Bi-stable switch with pivoted armature |
EP0573267A1 (de) * | 1992-06-01 | 1993-12-08 | SHARP Corporation | Mikro-Relais und Verfahren zu seiner Herstellung |
JPH07211212A (ja) * | 1994-01-26 | 1995-08-11 | Matsushita Electric Works Ltd | リレー |
EP0685864A1 (de) * | 1993-12-20 | 1995-12-06 | The Nippon Signal Co. Ltd. | Flaches tauchankerrelais und verfahren zu seiner herstellung |
EP0734037A2 (de) * | 1995-03-20 | 1996-09-25 | Nec Corporation | Oberflächenmontiertes elektromagnetisches Relais ohne Drahtanschlüsse |
US5734308A (en) * | 1995-12-21 | 1998-03-31 | Siemens Aktiengesellschaft | Electromagnetic monostable small relay |
DE19719355C1 (de) * | 1997-05-07 | 1998-11-05 | Siemens Ag | Polarisiertes elektromagnetisches Relais |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3640721C1 (en) * | 1986-11-28 | 1988-06-01 | Zettler Elektrotechn Alois | Mounting body for relays |
DE3840547A1 (de) * | 1988-12-01 | 1990-06-07 | Hengstler Bauelemente | Relais |
DE19719357C1 (de) * | 1997-05-07 | 1998-10-22 | Siemens Ag | Elektromagnetisches Relais |
-
1999
- 1999-04-22 DE DE19918368A patent/DE19918368A1/de not_active Ceased
-
2000
- 2000-04-19 WO PCT/EP2000/003574 patent/WO2000065619A1/de not_active Application Discontinuation
- 2000-04-19 EP EP00934955A patent/EP1171894A1/de not_active Withdrawn
- 2000-04-19 JP JP2000614471A patent/JP2002543557A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668928A (en) * | 1986-06-23 | 1987-05-26 | Tektronix, Inc. | Bi-stable switch with pivoted armature |
EP0573267A1 (de) * | 1992-06-01 | 1993-12-08 | SHARP Corporation | Mikro-Relais und Verfahren zu seiner Herstellung |
EP0685864A1 (de) * | 1993-12-20 | 1995-12-06 | The Nippon Signal Co. Ltd. | Flaches tauchankerrelais und verfahren zu seiner herstellung |
JPH07211212A (ja) * | 1994-01-26 | 1995-08-11 | Matsushita Electric Works Ltd | リレー |
EP0734037A2 (de) * | 1995-03-20 | 1996-09-25 | Nec Corporation | Oberflächenmontiertes elektromagnetisches Relais ohne Drahtanschlüsse |
US5734308A (en) * | 1995-12-21 | 1998-03-31 | Siemens Aktiengesellschaft | Electromagnetic monostable small relay |
DE19719355C1 (de) * | 1997-05-07 | 1998-11-05 | Siemens Ag | Polarisiertes elektromagnetisches Relais |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26) * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8436701B2 (en) | 2010-02-08 | 2013-05-07 | International Business Machines Corporation | Integrated electromechanical relays |
US8525623B2 (en) | 2010-02-08 | 2013-09-03 | International Business Machines Corporation | Integrated electromechanical relays |
US9076615B2 (en) | 2010-02-08 | 2015-07-07 | International Business Machines Corporation | Method of forming an integrated electromechanical relay |
Also Published As
Publication number | Publication date |
---|---|
DE19918368A1 (de) | 2000-11-02 |
JP2002543557A (ja) | 2002-12-17 |
EP1171894A1 (de) | 2002-01-16 |
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