WO2000064018A8 - Module laser a semi-conducteur - Google Patents

Module laser a semi-conducteur

Info

Publication number
WO2000064018A8
WO2000064018A8 PCT/JP2000/002414 JP0002414W WO0064018A8 WO 2000064018 A8 WO2000064018 A8 WO 2000064018A8 JP 0002414 W JP0002414 W JP 0002414W WO 0064018 A8 WO0064018 A8 WO 0064018A8
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor laser
temperature control
mounting surface
control element
center line
Prior art date
Application number
PCT/JP2000/002414
Other languages
English (en)
Japanese (ja)
Other versions
WO2000064018A1 (fr
Inventor
Jun Miyokawa
Hiroshi Kasahara
Yuichiro Irie
Takeo Shimizu
Original Assignee
Furukawa Electric Co Ltd
Jun Miyokawa
Hiroshi Kasahara
Yuichiro Irie
Takeo Shimizu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Jun Miyokawa, Hiroshi Kasahara, Yuichiro Irie, Takeo Shimizu filed Critical Furukawa Electric Co Ltd
Priority to CA002335529A priority Critical patent/CA2335529A1/fr
Priority to EP00915510A priority patent/EP1089406A4/fr
Publication of WO2000064018A1 publication Critical patent/WO2000064018A1/fr
Priority to US09/739,695 priority patent/US6496524B2/en
Priority to US09/875,035 priority patent/US20010038653A1/en
Publication of WO2000064018A8 publication Critical patent/WO2000064018A8/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module laser à semi-conducteur capable de restreindre la réduction du rendement du couplage d'un faisceau laser par rapport à un fibre optique, même si une surface de montage d'un élément laser à semi-conducteur subit un gauchissement dans un élément de régulation de température. L'invention porte sur un module laser à semi-conducteur (1) dans lequel un élément à rayonnement thermique (5) et un moyen de couplage optique (7a) sont montés directement ou indirectement sur la surface de montage (3a) d'un élément de régulation de température (3), et dans lequel un élément laser à semi-conducteur (6) et le moyen de couplage optique (7a) sont disposés du même côté, dans le sens d'émission du faisceau laser par rapport à une première ligne centrale (Lcpp) coupant, de manière perpendiculaire, un plan tangentiel, au niveau du centre de la surface de montage (3a) de l'élément de régulation de température (3) et/ou par rapport à une deuxième ligne centrale traversant le centre de la surface de montage de l'élément de régulation de température et respectivement perpendiculaire à la première ligne centrale et à un axe représentant le sens d'émission d'un faisceau laser produit par un élément laser à semi-conducteur.
PCT/JP2000/002414 1999-04-20 2000-04-13 Module laser a semi-conducteur WO2000064018A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CA002335529A CA2335529A1 (fr) 1999-04-20 2000-04-13 Module a diode laser
EP00915510A EP1089406A4 (fr) 1999-04-20 2000-04-13 Module laser a semi-conducteur
US09/739,695 US6496524B2 (en) 1999-04-20 2000-12-20 Laser diode module
US09/875,035 US20010038653A1 (en) 1999-04-20 2001-06-07 Laser diode module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/112382 1999-04-20
JP11238299 1999-04-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US09/739,695 Continuation-In-Part US6496524B2 (en) 1999-04-20 2000-12-20 Laser diode module

Publications (2)

Publication Number Publication Date
WO2000064018A1 WO2000064018A1 (fr) 2000-10-26
WO2000064018A8 true WO2000064018A8 (fr) 2002-01-03

Family

ID=14585292

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/002414 WO2000064018A1 (fr) 1999-04-20 2000-04-13 Module laser a semi-conducteur

Country Status (4)

Country Link
US (2) US6496524B2 (fr)
EP (1) EP1089406A4 (fr)
CA (1) CA2335529A1 (fr)
WO (1) WO2000064018A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252420A (ja) * 2000-12-15 2002-09-06 Furukawa Electric Co Ltd:The 半導体レーザ素子、半導体レーザモジュールおよびその製造方法ならびに光ファイバ増幅器
JP2002280659A (ja) * 2001-03-16 2002-09-27 Furukawa Electric Co Ltd:The レーザダイオードモジュールからなる光源
US7350987B2 (en) * 2002-09-30 2008-04-01 Intel Corporation Optical package fiber pass-through to reduce curvature of optical fiber during threading
JP4199080B2 (ja) * 2002-09-30 2008-12-17 シャープ株式会社 半導体レーザ装置及びそれを用いたピックアップ
US20060227822A1 (en) * 2005-03-29 2006-10-12 Northrop Grumman Corporation Laser trim pump
US20060237807A1 (en) * 2005-04-20 2006-10-26 Hosking Lucy G Electro-optic transducer die including a temperature sensing PN junction diode
US7706421B2 (en) * 2005-04-20 2010-04-27 Finisar Corporation Temperature sensing device patterned on an electro-optic transducer die
US7701988B2 (en) * 2005-04-20 2010-04-20 Finisar Corporation Optical transmit assembly including thermally isolated laser, temperature sensor, and temperature driver
US20060239314A1 (en) * 2005-04-20 2006-10-26 Hosking Lucy G Electro-optic transducer die mounted directly upon a temperature sensing device
US20080037601A1 (en) * 2006-07-07 2008-02-14 Torsana Laser Technologies A/S Avoiding temperature-related faults of a laser by temperature adjustment
EP2044663B1 (fr) * 2006-07-12 2010-03-17 PGT Photonics S.p.A. Prévention de désalignement dans un laser à cavité externe à stabilisation de température du résonateur et du milieu de gain
US7832944B2 (en) 2007-11-08 2010-11-16 Finisar Corporation Optoelectronic subassembly with integral thermoelectric cooler driver
KR101038264B1 (ko) * 2009-06-12 2011-06-01 (주)엠이엘 외부공진형 파장가변 레이저 모듈
US9500808B2 (en) * 2012-05-09 2016-11-22 The Boeing Company Ruggedized photonic crystal sensor packaging
US9243784B2 (en) * 2012-12-20 2016-01-26 International Business Machines Corporation Semiconductor photonic package
US9400356B2 (en) 2013-03-14 2016-07-26 International Business Machines Corporation Fiber pigtail with integrated lid
WO2017010570A1 (fr) * 2015-07-16 2017-01-19 古河電気工業株式会社 Module laser à semi-conducteur
US10901161B2 (en) 2018-09-14 2021-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Optical power transfer devices with an embedded active cooling chip

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2605418B1 (fr) * 1986-10-17 1990-04-20 Thomson Semiconducteurs Module pour le couplage entre un dispositif semi-conducteur et une fibre optique, et procede d'alignement de ce dispositif semi-conducteur et de cette fibre
JPH01111392A (ja) * 1987-10-26 1989-04-28 Japan Aviation Electron Ind Ltd 発光素子モジュール
NL8800140A (nl) 1988-01-22 1989-08-16 Philips Nv Laserdiode module.
US5068865A (en) * 1988-06-09 1991-11-26 Nec Corporation Semiconductor laser module
US5264392A (en) * 1990-07-05 1993-11-23 At&T Bell Laboratories Fabrication technique for silicon-based optical subassemblies
US5113404A (en) 1990-07-05 1992-05-12 At&T Bell Laboratories Silicon-based optical subassembly
JPH07131112A (ja) * 1993-11-05 1995-05-19 Mitsubishi Electric Corp レーザダイオードモジュール
JP2937791B2 (ja) * 1995-03-14 1999-08-23 日本電気株式会社 ペルチエクラーク
JP3116777B2 (ja) * 1995-07-07 2000-12-11 日本電気株式会社 半導体レーザモジュール
JP2697700B2 (ja) 1995-08-18 1998-01-14 日本電気株式会社 温度制御型半導体レーザ装置およびその温度制御方法
JPH10142456A (ja) * 1996-11-07 1998-05-29 Mitsubishi Materials Corp 光素子モジュールのケース
JPH10213722A (ja) * 1997-01-30 1998-08-11 Nec Corp 半導体レーザモジュール
US6178188B1 (en) * 1997-12-11 2001-01-23 Photera Technologies, Inc Laser assembly platform with silicon base
US6146025A (en) * 1998-08-03 2000-11-14 Litton Systems Inc. Laser diode and substrate

Also Published As

Publication number Publication date
CA2335529A1 (fr) 2000-10-26
US20010038653A1 (en) 2001-11-08
EP1089406A4 (fr) 2005-11-02
US6496524B2 (en) 2002-12-17
US20010004369A1 (en) 2001-06-21
WO2000064018A1 (fr) 2000-10-26
EP1089406A1 (fr) 2001-04-04

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