WO2000064018A8 - Module laser a semi-conducteur - Google Patents
Module laser a semi-conducteurInfo
- Publication number
- WO2000064018A8 WO2000064018A8 PCT/JP2000/002414 JP0002414W WO0064018A8 WO 2000064018 A8 WO2000064018 A8 WO 2000064018A8 JP 0002414 W JP0002414 W JP 0002414W WO 0064018 A8 WO0064018 A8 WO 0064018A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor laser
- temperature control
- mounting surface
- control element
- center line
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002335529A CA2335529A1 (en) | 1999-04-20 | 2000-04-13 | Laser diode module |
EP00915510A EP1089406A4 (en) | 1999-04-20 | 2000-04-13 | LASER MODULE WITH SEMICONDUCTOR |
US09/739,695 US6496524B2 (en) | 1999-04-20 | 2000-12-20 | Laser diode module |
US09/875,035 US20010038653A1 (en) | 1999-04-20 | 2001-06-07 | Laser diode module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11/112382 | 1999-04-20 | ||
JP11238299 | 1999-04-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/739,695 Continuation-In-Part US6496524B2 (en) | 1999-04-20 | 2000-12-20 | Laser diode module |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000064018A1 WO2000064018A1 (fr) | 2000-10-26 |
WO2000064018A8 true WO2000064018A8 (fr) | 2002-01-03 |
Family
ID=14585292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/002414 WO2000064018A1 (fr) | 1999-04-20 | 2000-04-13 | Module laser a semi-conducteur |
Country Status (4)
Country | Link |
---|---|
US (2) | US6496524B2 (ja) |
EP (1) | EP1089406A4 (ja) |
CA (1) | CA2335529A1 (ja) |
WO (1) | WO2000064018A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002252420A (ja) * | 2000-12-15 | 2002-09-06 | Furukawa Electric Co Ltd:The | 半導体レーザ素子、半導体レーザモジュールおよびその製造方法ならびに光ファイバ増幅器 |
JP2002280659A (ja) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | レーザダイオードモジュールからなる光源 |
US7350987B2 (en) * | 2002-09-30 | 2008-04-01 | Intel Corporation | Optical package fiber pass-through to reduce curvature of optical fiber during threading |
JP4199080B2 (ja) * | 2002-09-30 | 2008-12-17 | シャープ株式会社 | 半導体レーザ装置及びそれを用いたピックアップ |
US20060227822A1 (en) * | 2005-03-29 | 2006-10-12 | Northrop Grumman Corporation | Laser trim pump |
US20060237807A1 (en) * | 2005-04-20 | 2006-10-26 | Hosking Lucy G | Electro-optic transducer die including a temperature sensing PN junction diode |
US7706421B2 (en) * | 2005-04-20 | 2010-04-27 | Finisar Corporation | Temperature sensing device patterned on an electro-optic transducer die |
US7701988B2 (en) * | 2005-04-20 | 2010-04-20 | Finisar Corporation | Optical transmit assembly including thermally isolated laser, temperature sensor, and temperature driver |
US20060239314A1 (en) * | 2005-04-20 | 2006-10-26 | Hosking Lucy G | Electro-optic transducer die mounted directly upon a temperature sensing device |
US20080037601A1 (en) * | 2006-07-07 | 2008-02-14 | Torsana Laser Technologies A/S | Avoiding temperature-related faults of a laser by temperature adjustment |
EP2044663B1 (en) * | 2006-07-12 | 2010-03-17 | PGT Photonics S.p.A. | Misalignment prevention in an external cavity laser having temperature stabilistion of the resonator and the gain medium |
US7832944B2 (en) | 2007-11-08 | 2010-11-16 | Finisar Corporation | Optoelectronic subassembly with integral thermoelectric cooler driver |
KR101038264B1 (ko) * | 2009-06-12 | 2011-06-01 | (주)엠이엘 | 외부공진형 파장가변 레이저 모듈 |
US9500808B2 (en) * | 2012-05-09 | 2016-11-22 | The Boeing Company | Ruggedized photonic crystal sensor packaging |
US9243784B2 (en) * | 2012-12-20 | 2016-01-26 | International Business Machines Corporation | Semiconductor photonic package |
US9400356B2 (en) | 2013-03-14 | 2016-07-26 | International Business Machines Corporation | Fiber pigtail with integrated lid |
WO2017010570A1 (ja) * | 2015-07-16 | 2017-01-19 | 古河電気工業株式会社 | 半導体レーザモジュール |
US10901161B2 (en) | 2018-09-14 | 2021-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Optical power transfer devices with an embedded active cooling chip |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2605418B1 (fr) * | 1986-10-17 | 1990-04-20 | Thomson Semiconducteurs | Module pour le couplage entre un dispositif semi-conducteur et une fibre optique, et procede d'alignement de ce dispositif semi-conducteur et de cette fibre |
JPH01111392A (ja) * | 1987-10-26 | 1989-04-28 | Japan Aviation Electron Ind Ltd | 発光素子モジュール |
NL8800140A (nl) | 1988-01-22 | 1989-08-16 | Philips Nv | Laserdiode module. |
US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
US5264392A (en) * | 1990-07-05 | 1993-11-23 | At&T Bell Laboratories | Fabrication technique for silicon-based optical subassemblies |
US5113404A (en) | 1990-07-05 | 1992-05-12 | At&T Bell Laboratories | Silicon-based optical subassembly |
JPH07131112A (ja) * | 1993-11-05 | 1995-05-19 | Mitsubishi Electric Corp | レーザダイオードモジュール |
JP2937791B2 (ja) * | 1995-03-14 | 1999-08-23 | 日本電気株式会社 | ペルチエクラーク |
JP3116777B2 (ja) * | 1995-07-07 | 2000-12-11 | 日本電気株式会社 | 半導体レーザモジュール |
JP2697700B2 (ja) | 1995-08-18 | 1998-01-14 | 日本電気株式会社 | 温度制御型半導体レーザ装置およびその温度制御方法 |
JPH10142456A (ja) * | 1996-11-07 | 1998-05-29 | Mitsubishi Materials Corp | 光素子モジュールのケース |
JPH10213722A (ja) * | 1997-01-30 | 1998-08-11 | Nec Corp | 半導体レーザモジュール |
US6178188B1 (en) * | 1997-12-11 | 2001-01-23 | Photera Technologies, Inc | Laser assembly platform with silicon base |
US6146025A (en) * | 1998-08-03 | 2000-11-14 | Litton Systems Inc. | Laser diode and substrate |
-
2000
- 2000-04-13 EP EP00915510A patent/EP1089406A4/en not_active Withdrawn
- 2000-04-13 WO PCT/JP2000/002414 patent/WO2000064018A1/ja not_active Application Discontinuation
- 2000-04-13 CA CA002335529A patent/CA2335529A1/en not_active Abandoned
- 2000-12-20 US US09/739,695 patent/US6496524B2/en not_active Expired - Lifetime
-
2001
- 2001-06-07 US US09/875,035 patent/US20010038653A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CA2335529A1 (en) | 2000-10-26 |
US20010038653A1 (en) | 2001-11-08 |
EP1089406A4 (en) | 2005-11-02 |
US6496524B2 (en) | 2002-12-17 |
US20010004369A1 (en) | 2001-06-21 |
WO2000064018A1 (fr) | 2000-10-26 |
EP1089406A1 (en) | 2001-04-04 |
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