WO2000035994A1 - Organopolysiloxanharze - Google Patents
Organopolysiloxanharze Download PDFInfo
- Publication number
- WO2000035994A1 WO2000035994A1 PCT/EP1999/007260 EP9907260W WO0035994A1 WO 2000035994 A1 WO2000035994 A1 WO 2000035994A1 EP 9907260 W EP9907260 W EP 9907260W WO 0035994 A1 WO0035994 A1 WO 0035994A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- acid
- water
- organopolysiloxane resins
- organic solvent
- organopolysiloxane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
Definitions
- the invention relates to organopolysiloxane resins and their production.
- Organopolysiloxane resins with a glass transition temperature (Tg) of up to approximately 55 ° C. are known. However, these organopolysiloxane resins are not stable in an environment in which this temperature or a higher temperature prevails, since they then soften and their further processing is no longer possible. are also known
- Organopolysiloxane resins with a Tg above 55 ° C. However, these have an OH content of significantly less than 1% by weight and thus a greatly reduced reactivity.
- the invention relates to organopolysiloxane resins which have a glass transition temperature (Tg) of more than 60 ° C. and an OH content of at least 1% by weight, based on the organopolysiloxane resin.
- Tg glass transition temperature
- the organopolysiloxane resins are conventional organopolysiloxane resins which are produced according to the process described below.
- the organopolysiloxane resins according to the invention have a glass transition temperature (Tg) of above 60 ° C. to preferably 200 ° C. and an OH content of at least 1% by weight to preferably 8% by weight and a molecular weight of preferably 500 to 10,000 g / mol and particularly preferably from 1000 to 8000 g / mol.
- the invention further relates to a process for the preparation of organopolysiloxane resins, alkoxysilanes, which may be the same or different, of the following general formula I: R x Si (OR ⁇ ) ⁇ , where
- R can be the same or different and represent hydrogen atom or organic radical and R ⁇ has the meaning of R, x is 0 to 3 and y is 4 to 1,
- the radical R is preferably a linear alkyl radical having 1 to 18 carbon atoms, particularly preferred are alkyl radicals such as the methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl , tert. -Butyl, n-pentyl, iso-pentyl, neo-pentyl, tert.-Pentyl, hexyl, such as the n-hexyl, heptyl, such as the n-heptyl, octyl, such as the n-octyl and iso- Octyl residues, such as the 2,2,4-
- Trimethylpentyl nonyl such as the n-nonyl, decyl such as the n-decyl, dodecyl such as the n-dodecyl, octadecyl such as the n-octadecyl; the alkyl radicals preferably having mercapto radicals, epoxy-functional radicals, carboxy radicals, amino radicals, such as
- Aminoethylamino residue, iso-cyano residues, aryloxy residues, methacryloxy residues, hydroxy residues can be substituted; Alkenyl groups such as the vinyl and allyl groups; Cycloalkyl residues such as cyclopentyl, cyclohexyl, cycloheptyl residues and methylcyclohexyl residues; Aryl radicals, such as the phenyl, naphthyl and anthryl and phenanthryl radical; Alkaryl groups such as o-, m-, p-tolyl groups, xylyl groups and ethylphenyl groups; Aralkyl radicals, such as the benzyl radical, the alpha and the ⁇ -phenylethyl radical, the methyl to propyl radical or phenyl radical are very particularly preferred.
- R ⁇ corresponds to the rest of R.
- the alkoxysilanes which may be the same or different, are preferably used in stoichiometric molar. Quantity ratios of the alkoxysilane RSi (OR ⁇ ) 3 of more than 50 mol% are preferred as one of the alkoxysilanes, where R is phenyl and R ⁇ is ethyl.
- the further or further alkoxysilanes can then be any of those described by means of formula I.
- acids preferably mineral acids, such as hydrochloric acid, sulfuric acid, nitric acid or phosphoric acid, with hydrochloric acid being preferred, polyacids, such as polyphosphoric acid, polyacrylic acid and polyvinylsulfuric acid, or carboxylic acids such as formic acid, acetic acid, propionic acid, oxalic acid, malonic acid, succinic acid, adipic acid, benzoic acid , Phthalic acid, citric acid in amounts of 1 ppm to 1% by weight, preferably less than 0.1% by weight, based on the total weight of the compositions.
- acids preferably mineral acids, such as hydrochloric acid, sulfuric acid, nitric acid or phosphoric acid, with hydrochloric acid being preferred, polyacids, such as polyphosphoric acid, polyacrylic acid and polyvinylsulfuric acid, or carboxylic acids such as formic acid, acetic acid, propionic acid, oxalic acid, malonic acid,
- Water is used in a molar amount of 0.1 to 10, preferably 0.5 to 2, based on the alkoxy groups to be hydrolyzed.
- organic solvent which has a boiling point higher than that of water, aromatic ones are preferred
- Hydrocarbons such as toluene, xylene and benzene or mixtures of linear and / or branched, optionally substituted hydrocarbons such as octane, nonane and decane, or pentanone, hexanone, heptanone, etc. or their isomers or in amounts of 1 to 1000% by weight are preferred 10 to 100% by weight based on the total weight of the compositions used.
- the preparation of the organopolysiloxane resins according to the invention is particularly preferably at temperatures of 20 to 190 ° C., preferably 40 and 150 ° C. and preferably a pressure of 500 to 10,000 hPa (abs.), Preferably 950 to 6000 hPa (abs.) carried out at a slightly reduced pressure of about 950 hPa (abs.).
- the organopolysiloxane resins according to the invention can preferably be produced continuously or preferably by a batch process, in the batch process the alcohol formed being distilled off with water in a first step and in a second stage the organic solvent which has a boiling point above that of the water, is added and later the acid is removed by distillation.
- the reaction mixture is preferably circulated by a pump. Fresh water and the organoalkoxysilanes, as well as the acid catalyst, are continuously supplied. A corresponding part of the reaction mixture of organopolysiloxanes of the general formula I described above and the alcohol formed in the reaction, as well as water and the acid catalyst, are also continuously removed from the process. After e-in part of the azeotrope (alcohol and water) has been distilled off, a sufficient amount of an organic solvent is added and the alcohol remaining in the reaction mixture is distilled off from the reaction mixture together with the water and the acidic hydrolysis catalyst. A solution of a high molecular weight organopolysiloxane in an organic solvent is obtained. If desired, the organic solvent can then be completely removed by distillation or spray drying.
- a mixture of the preferred organoalkoxysilanes is mixed with water and initially charged with the acidic hydrolysis catalyst.
- the reaction mixture is then heated to a temperature sufficient for the reaction.
- the reaction begins and the alcohol formed in the reaction is distilled off azeotropically together with the water.
- a sufficient amount of an organic solvent is added and the alcohol remaining in the reaction mixture is distilled off from the reaction mixture together with the water and the acidic hydrolysis catalyst.
- a solution of a high molecular weight organopolysiloxane in an organic solvent is obtained. If desired, the organic solvent can then be completely removed by distillation or spray drying.
- the organopolysiloxane resins according to the invention or produced according to the invention can be used for all purposes for which organopolysiloxane resins have hitherto also been used, for example as binders for the production of coatings (coatings) or lacquers (powder lacquers) which, owing to their increased reactivity, are easy to process.
- the organopolysiloxane resins according to the invention have the advantage that they can still be processed well even at elevated ambient temperatures of above 55 ° C. since they do not melt together.
- the process according to the invention has the particular advantage that no filtration is necessary since no salts are formed.
- the system for the discontinuous production of the organopolysiloxane resins according to the invention consists of a 2 liter four-necked round bottom flask equipped with an internal thermometer, a reflux condenser and a distillation bridge
- Distillate collector and a stirrer is provided.
- the heating of the piston is ensured by a heating element.
- the reaction mixture is optionally completely freed from the solvent on a rotary evaporator under reduced pressure.
- 1st example In the apparatus described above, 1120 g of phenyltriethoxysilane, 300 g of water and 4.2 g of a 20% hydrochloric acid are introduced. The reaction mixture is then heated to reflux temperature and part of the alcohol formed in the hydrolysis / condensation reaction is distilled off together with part of the water initially introduced. After adding 400 g of toluene, the mixture is distilled up to a top temperature of 110.degree. The crude product obtained is then completely freed from the solvent on a rotary evaporator at 150 ° C. and 10 mbar.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99948910A EP1137691B1 (de) | 1998-12-11 | 1999-09-30 | Organopolysiloxanharze |
JP2000588248A JP4125873B2 (ja) | 1998-12-11 | 1999-09-30 | オルガノポリシロキサン樹脂 |
US09/857,661 US6552151B1 (en) | 1998-12-11 | 1999-09-30 | Organopolysiloxane resins |
DE59910307T DE59910307D1 (de) | 1998-12-11 | 1999-09-30 | Organopolysiloxanharze |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19857348.0 | 1998-12-11 | ||
DE19857348A DE19857348A1 (de) | 1998-12-11 | 1998-12-11 | Organopolysiloxanharze |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000035994A1 true WO2000035994A1 (de) | 2000-06-22 |
Family
ID=7890845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1999/007260 WO2000035994A1 (de) | 1998-12-11 | 1999-09-30 | Organopolysiloxanharze |
Country Status (8)
Country | Link |
---|---|
US (1) | US6552151B1 (de) |
EP (1) | EP1137691B1 (de) |
JP (1) | JP4125873B2 (de) |
KR (1) | KR100483449B1 (de) |
CN (1) | CN1149249C (de) |
DE (2) | DE19857348A1 (de) |
TW (1) | TW526226B (de) |
WO (1) | WO2000035994A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1747900A1 (de) * | 2005-07-28 | 2007-01-31 | Eastman Kodak Company | Infrarotempfindlicher positivarbeitender Flachdruckplattenvorläufer. |
EP1747899A1 (de) * | 2005-07-28 | 2007-01-31 | Eastman Kodak Company | Zweischichtige infrarotempfindliche Bildaufzeichnungselemente mit Polysiloxanüberschicht. |
EP2357530A2 (de) | 2010-02-17 | 2011-08-17 | Fujifilm Corporation | Verfahren zur Herstellung einer Flachdruckplatte |
WO2011125913A1 (ja) | 2010-03-31 | 2011-10-13 | 富士フイルム株式会社 | 平版印刷版原版処理用の現像液、該現像液を用いた平版印刷版の作製方法、及び、印刷方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1611141B1 (de) | 2003-04-07 | 2006-06-28 | Consortium für elektrochemische Industrie GmbH | Organosilylfunktionalisierte partikel und deren herstellung |
DE102004022400A1 (de) * | 2004-05-06 | 2005-12-15 | Consortium für elektrochemische Industrie GmbH | Feuchtigkeitsvernetzbare alkoxysilyfunktionelle Partikel enthaltende Zusammensetzung |
WO2007145765A2 (en) | 2006-06-09 | 2007-12-21 | Dow Corning Corporation | Process for the preparation of solid solventless mq resins |
KR100967759B1 (ko) * | 2010-03-02 | 2010-07-05 | 윤기영 | 링겔팩 안착결합부가 구비된 다기능 모자 |
RU2456308C2 (ru) * | 2010-07-23 | 2012-07-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова (ИСПМ РАН) | Способ получения линейных полидиметилсилоксанов с концевыми гидроксильными группами поликонденсацией диметилдиалкоксисиланов в активной среде |
JP2020076057A (ja) * | 2018-09-21 | 2020-05-21 | 公立大学法人首都大学東京 | ポリシルセスキオキサンガラス |
CN109553772B (zh) * | 2018-10-26 | 2021-07-20 | 广州嘉睿复合材料有限公司 | 一种聚硅氧烷树脂及其制备方法 |
KR20240112363A (ko) | 2021-12-03 | 2024-07-18 | 와커 헤미 아게 | 분지형 유기폴리실록산의 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2415331A1 (de) * | 1974-03-29 | 1975-10-16 | Bayer Ag | Verfahren zur herstellung silanolgruppen enthaltender organopolysiloxanharze |
US4877837A (en) * | 1988-10-07 | 1989-10-31 | The Glidden Company | Epoxy functional and silicone thermosetting powder coatings |
EP0604847A1 (de) * | 1992-12-23 | 1994-07-06 | Wacker-Chemie GmbH | Verfahren zur Herstellung von Organopolysiloxanharz |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2604498B2 (ja) * | 1990-11-09 | 1997-04-30 | 東芝シリコーン株式会社 | 非反応性シリコーン樹脂及び艶出し剤 |
JP3150731B2 (ja) * | 1991-09-30 | 2001-03-26 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーン樹脂の製造方法 |
JP3024473B2 (ja) * | 1993-12-07 | 2000-03-21 | 信越化学工業株式会社 | 熱可塑性フルオロシリコーン樹脂及びその製造方法 |
JP3445831B2 (ja) * | 1994-06-28 | 2003-09-08 | ジーイー東芝シリコーン株式会社 | シリコーン樹脂組成物 |
JP3541075B2 (ja) * | 1995-03-01 | 2004-07-07 | ジーイー東芝シリコーン株式会社 | ポリメチルシロキサン樹脂の製造法 |
US5962568A (en) * | 1998-03-31 | 1999-10-05 | Morton International, Inc. | Coating powder for high temperature resistant coatings |
US6034178A (en) * | 1998-09-30 | 2000-03-07 | Morton International, Inc. | Coating powder for high temperature resistant coatings |
-
1998
- 1998-12-11 DE DE19857348A patent/DE19857348A1/de not_active Withdrawn
-
1999
- 1999-09-30 KR KR10-2001-7007174A patent/KR100483449B1/ko active IP Right Grant
- 1999-09-30 US US09/857,661 patent/US6552151B1/en not_active Expired - Lifetime
- 1999-09-30 EP EP99948910A patent/EP1137691B1/de not_active Expired - Lifetime
- 1999-09-30 WO PCT/EP1999/007260 patent/WO2000035994A1/de active IP Right Grant
- 1999-09-30 CN CNB998140651A patent/CN1149249C/zh not_active Expired - Lifetime
- 1999-09-30 DE DE59910307T patent/DE59910307D1/de not_active Expired - Lifetime
- 1999-09-30 JP JP2000588248A patent/JP4125873B2/ja not_active Expired - Lifetime
- 1999-12-09 TW TW088121537A patent/TW526226B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2415331A1 (de) * | 1974-03-29 | 1975-10-16 | Bayer Ag | Verfahren zur herstellung silanolgruppen enthaltender organopolysiloxanharze |
US4877837A (en) * | 1988-10-07 | 1989-10-31 | The Glidden Company | Epoxy functional and silicone thermosetting powder coatings |
EP0604847A1 (de) * | 1992-12-23 | 1994-07-06 | Wacker-Chemie GmbH | Verfahren zur Herstellung von Organopolysiloxanharz |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1747900A1 (de) * | 2005-07-28 | 2007-01-31 | Eastman Kodak Company | Infrarotempfindlicher positivarbeitender Flachdruckplattenvorläufer. |
EP1747899A1 (de) * | 2005-07-28 | 2007-01-31 | Eastman Kodak Company | Zweischichtige infrarotempfindliche Bildaufzeichnungselemente mit Polysiloxanüberschicht. |
EP2357530A2 (de) | 2010-02-17 | 2011-08-17 | Fujifilm Corporation | Verfahren zur Herstellung einer Flachdruckplatte |
WO2011125913A1 (ja) | 2010-03-31 | 2011-10-13 | 富士フイルム株式会社 | 平版印刷版原版処理用の現像液、該現像液を用いた平版印刷版の作製方法、及び、印刷方法 |
Also Published As
Publication number | Publication date |
---|---|
TW526226B (en) | 2003-04-01 |
CN1149249C (zh) | 2004-05-12 |
CN1329631A (zh) | 2002-01-02 |
KR20010080728A (ko) | 2001-08-22 |
EP1137691A1 (de) | 2001-10-04 |
JP2002532595A (ja) | 2002-10-02 |
US6552151B1 (en) | 2003-04-22 |
KR100483449B1 (ko) | 2005-04-14 |
DE19857348A1 (de) | 2000-06-15 |
DE59910307D1 (de) | 2004-09-23 |
JP4125873B2 (ja) | 2008-07-30 |
EP1137691B1 (de) | 2004-08-18 |
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