WO2000030419A1 - Procede de production de tableaux de connexions - Google Patents

Procede de production de tableaux de connexions Download PDF

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Publication number
WO2000030419A1
WO2000030419A1 PCT/JP1998/005193 JP9805193W WO0030419A1 WO 2000030419 A1 WO2000030419 A1 WO 2000030419A1 JP 9805193 W JP9805193 W JP 9805193W WO 0030419 A1 WO0030419 A1 WO 0030419A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
hole
sheet
substrate
layer
Prior art date
Application number
PCT/JP1998/005193
Other languages
English (en)
Japanese (ja)
Inventor
Eiji Yoshimura
Original Assignee
Daiwa Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiwa Co., Ltd. filed Critical Daiwa Co., Ltd.
Priority to JP52152999A priority Critical patent/JP3325903B2/ja
Priority to PCT/JP1998/005193 priority patent/WO2000030419A1/fr
Priority to TW087120090A priority patent/TW404149B/zh
Priority to TW087120091A priority patent/TW411748B/zh
Publication of WO2000030419A1 publication Critical patent/WO2000030419A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Definitions

  • the present invention relates to a method for manufacturing a wiring board having via holes or through holes formed for purposes other than conductive connection for conductive connection between wiring layers, and more particularly, to filling a resin into the through holes during a via hole forming process or the like.
  • the present invention relates to a method of manufacturing a wiring board having a resin filling step for performing the above. Background art
  • a method of manufacturing a multilayer wiring board includes a bonding method in which a wiring layer is formed on each of a plurality of base materials, and an insulating sheet is interposed between the base materials to perform bonding and the like, and a method in which a wiring pattern is formed.
  • a build-up method in which an insulating layer is formed on the insulating layer and a wiring pattern is formed on the insulating layer, and then the insulating layer and the wiring pattern are sequentially formed to form a laminated structure.
  • the latter build-up method it is not necessary to join a plurality of base materials and insulating sheets corresponding to each wiring layer as in the former, so that a thin multilayer wiring board can be formed with high density and relatively easily. be able to. For this reason, the latter can mount circuits and electronic components at a higher density than the former.
  • a conventional resin filling method for example, a method by screen printing, a method described in Japanese Patent Application Laid-Open No. 9-83140, and the like can be mentioned.
  • a metal mask such as a stainless steel plate opened corresponding to the through hole is arranged, liquid resin is injected into the through hole, the metal mask is removed, and then the resin liquid is heated or the like. This is a method of curing.
  • an object of the present invention is to provide a method of manufacturing a wiring board having a resin filling step in which a resin is less likely to cause a defect in a filled resin and a resin can be preferably filled in a through-hole by a simple process using an inexpensive material. Is to provide. Disclosure of the invention
  • the method for manufacturing a wiring board according to the present invention is characterized by including a resin filling step including the following steps.
  • the amount of air bubbles is extremely small, and defects are hardly generated in the solidified resin.
  • the resin sheet is softened by heating, the steps corresponding to the conventional liquid resin supply / application step and injection step can be simplified, and the temperature, time, pressure and the like of heating and pressing (hot pressing) can be reduced. By adjusting, the amount of resin to be inserted can be easily controlled. Then, since the resin sheet can be solidified as it is after being embedded, there is no need to provide a step such as a metal mask removal step, and a step corresponding to the hardening step from the conventional injection step can be simplified.
  • the release sheet since the release sheet is used, the solidified resin sheet can be easily peeled, and at that time, the resin embedded and solidified in the through hole remains in the through hole and is filled with the resin. Will be.
  • the release sheet is pressed by the resin sheet when heated and pressed, and adheres closely to the substrate. Therefore, it is not necessary to perform smooth processing with high precision as in a conventional metal mask. Etc. can be used. Therefore, there is no need for reuse, and the use of a transparent material facilitates alignment with the through-hole of the substrate.
  • the through-hole may not be a conductive connection between wiring layers, but is preferably a through-hole for conductively connecting between a plurality of wiring layers.
  • Such a through hole is frequently used in a multilayer wiring board as described above, and it is indispensable to fill the resin without defects in order to improve the high-frequency characteristics of the board and to form an upper layer of the build-up.
  • the resin filling step of the present invention may have an additional step as described below in addition to the above steps a to d, and in particular, after the step d, (e) It is preferable to have a step of flattening a protruding portion of the resin filled in the through hole of the substrate or the base material layer.
  • a subsequent build-up upper layer forming step that is, an insulating layer forming step, can be favorably performed.
  • the resin sheet As the resin sheet, a force s which can use any of various resin sheets containing a thermosetting resin or a thermoplastic resin as described below, the resin sheet is softened by heating. It is preferable that the resin sheet contains a resin material that cures at a high temperature. By using such a resin sheet, the resin can be cured by heating as it is after being embedded, so that a step such as cooling is not required, and the resin can be solidified in an extremely short time. Further, such a thermosetting resin has high heat resistance, so that it exhibits good performance and durability even in a high-temperature process such as a soldering process.
  • the a step may be any method as long as the release sheet is disposed on at least one side surface of the substrate or the base material layer.
  • the a step includes disposing the release sheet on both surfaces of the substrate or the base material layer. It is preferable that This makes it possible to easily remove and remove the extra resin existing on both sides of the substrate or the like using the release sheet.
  • the wiring board of the present invention is a wiring board manufactured by any one of the above manufacturing methods.
  • the filled resin has few defects, the reliability of the board in terms of conductive connectivity, high-frequency characteristics, and the like is enhanced.
  • FIG. 1 is a process chart (1) to (5) showing an example of a method for manufacturing a wiring board of the present invention.
  • FIG. 2 is a process chart (6) to (9) showing an example of a method for manufacturing a wiring board according to the present invention.
  • FIG. 3 is a process chart (10) to (13) showing an example of a method for manufacturing a wiring board of the present invention.
  • FIG. 4 is a partial cross section showing an example of a multilayer wiring board that can be formed according to the present invention.
  • 1 denotes a release sheet
  • la denotes an opening
  • 2 denotes a resin sheet
  • 14 denotes a filled resin
  • 14a denotes a protruding portion
  • BL denotes a base material layer
  • TH denotes a through hole.
  • release sheets are arranged on both surfaces of a base material layer.
  • a through hole 10a is formed in a base material 10.
  • copper plating is applied to the front and back surfaces of 0 and the through hole 10a.
  • the plating layers 11 and 12 are formed on the front and back of the substrate 10, respectively, and these plating layers 11 and 12 are formed on the inner surface of the through hole 10a.
  • Layer 13 is conductively connected. In this way, a base material layer BL on which a through hole TH for filling the resin is formed is prepared.
  • the release sheet 1 having the opening 1a opened corresponding to the through hole TH is aligned with the opening la in the base material layer BL.
  • they are arranged on both sides of the base material layer BL.
  • the release sheet 1 may have a certain degree of heat resistance and strength.
  • various release papers used in the production of a double-sided wiring board by hot pressing and various types of resin such as sapphire resin.
  • a release film made of a heat-resistant resin can be used.
  • the step b in which the alignment is easy by using the highly transparent release sheet 1, is as follows: As shown in Fig. 1 (4), the surface on which the release sheet 1 is placed is softened by heating and cooled or cooled. A resin sheet 2 that is solidified by curing is provided.
  • the resin sheet 2 in the present embodiment is a resin sheet containing a resin material that softens when heated and hardens at a high temperature.
  • a prepreg in which an epoxy resin is impregnated into glass fiber or the like, and a prepreg in which a copper foil layer is formed on one surface of the prepreg are commercially available and can be used in the present invention.
  • the invention is not limited thereto, and any of various resin sheets containing various thermosetting resins, thermoplastic resins having a certain degree of heat resistance, and the like can be used.
  • a thermosetting resin containing an epoxy resin as a main component is used, good filling can be performed since the heat shrinkage is small.
  • step c as shown in FIG. 1 (5), the resin sheet 2 is softened by heating and pressing, a part of the resin sheet 2 is embedded in the through-hole TH, and then solidified by curing.
  • the softening of the resin sheet 2 is performed at 80 to 250 ° C., and is controlled by adjusting the temperature of the press surface of the heat press device.
  • the amount of resin to be embedded can be controlled by the degree of softening, time, pressure and the like.However, since the excess resin 2 & flows out to the back side of the lower layer BL and can be removed in a later step, it is particularly strict. No control is required.
  • the amount of the resin to be embedded is also determined to some extent.
  • the base material layer BL is placed on a press table (not shown).
  • the press table does not prevent the excess resin 2a from flowing out to the lower side of the base material layer BL.
  • the resin can be embedded by flowing the resin into the gap between the release sheet 1 and the sheet.
  • a material that does not prevent the excessive resin 2a from flowing out include a perforated plate having a larger diameter opening, a jig having a concave portion, and an inorganic porous material corresponding to the through hole TH.
  • the embedded resin is usually cured at a higher temperature (for example, 130 to 250 ° C.) than at the time of softening, but in the present embodiment, the softening and the curing are performed in a single heating process.
  • the resin can be embedded and solidified in a very short time at a time. After these steps, the layer BL is removed from the hot press.
  • step d as shown in FIG. 2 (6), the release sheet 1 is peeled from the base material layer BL. Peeling of the peeling sheet 1 can be carried out manually or by mechanical operation by simply peeling both off from the ends. At this time, both the upper release sheet 1 and the resin sheet 2 are separated from the base material layer BL, and at the same time, the resin sheet 2 and the embedded and solidified filling resin 14 are cut off. Further, the lower release sheet 1 is peeled off from the layer BL together with the excess resin 2a, and at the same time, the filling resin 14 and the excess resin 2a are cut off. As a result, the filling resin 14 having a shape as shown in FIG. 2 (7) is filled in the through hole TH.
  • the step e is for flattening the protruding portion 14a of the filling resin 14 filled in the through hole TH which is a through hole.
  • the step e is for flattening, for example, belt the surface of S layer BL It can be performed by lightly polishing with sanding, puff polishing or the like. By this polishing, the surface of the filling resin 14 is formed almost flush with the plating layers 11 and 12 and flattened. Further, by forming a predetermined mask on the printing layers 11 and 12 using photolithography technology and performing an etching process, the wiring layers 15 and 16 having a predetermined pattern can be formed. (See Figure 2 (8)).
  • an insulating resist 17 is applied on the surface, only the region connected to the upper layer is opened using photolithography.
  • an insulating resist 18 is further applied in the same manner, and similarly, only the above-mentioned region is opened using the photolithography technique. This opening region is the filling resin 14 and the wiring portion around the filling resin 14 in the figure.
  • a coating material 19 containing a large number of fillers in a predetermined reactive resin is screen-printed on the insulating resist 18 of the second layer. Is applied so as to avoid the filled resin 14 and its surrounding wiring.
  • the reactive resin of the coating material 19 various thermosetting resins or photocurable resins can be used.
  • the filler contained therein elutable fine particles such as calcium carbonate, for example, particles having a particle size of about several meters are used.
  • the coating material 19 is applied and cured by heating or light irradiation, its surface is lightly polished with a puff (dashed arrow A in the figure) as shown in Fig. 3 (11), and then several tens of By performing sand blasting using abrasive grains having a particle size of about m, a uniform rough surface is formed and the filler embedded near the surface is exposed. By performing soft etching using an acid solution for cleaning in this state, the filler is eluted to form fine irregularities on the surface.
  • a step of forming a through hole 10b in the substrate is provided as necessary.
  • This through hole 10b is formed by drilling or the like, like the through hole 10a shown in FIG. 1 (1).
  • the through-hole 10b is provided at a portion where conductive connection between the wiring layer 16 and the upper wiring layer is required.
  • an electroless plating is performed on the surface of the coating material 19 roughened in this way to form a first plating layer 20 over the entire surface.
  • the second plating layer 21 is formed by plating. In this way, the plating layer is formed into two layers The reason for this is to maintain the smoothness of the surface of the plating layer while increasing the adhesion strength of the plating layer.
  • the conductive connection portion C is formed by these plating layers.
  • the printing layers 20 and 21 are etched by the same photolithography technique as described above to form a wiring layer 22 in a predetermined pattern.
  • the filling resin 23 is filled into the through holes 1 Ob by the resin filling step of the present invention in the same manner as the filling resin 14 described above. be able to.
  • the resin 24 is filled into the concave portion formed above the conductive connection portion C by screen printing or the like.
  • the opening surface of the filling resin 14 is mechanically polished and flattened, the upper surface of the wiring layer can be flattened to form an upper layer structure. Therefore, it is possible to prevent the topographical effect on the upper layer (such as the unevenness of the lower layer affecting the formation of the upper layer and causing the wiring to be lost or disconnected).
  • a multilayer wiring board 30 as shown in FIG. 4, for example, can be manufactured.
  • This multilayer wiring board 30 is a six-layer board having a circuit configuration of six layers of wiring layers 31 to 36 in the board.
  • Blind via hole structures 37, 38a to 38c are formed in the interior, and the blind via hole structures 38a to 38c are filled with resin by the resin filling step of the present invention. It was done.
  • the blind via hole structure 38a connects the first wiring layer and the second wiring layer, and can be formed by the above-described resin filling step.
  • the blind via hole structure 38 b connects the first wiring layer to the third wiring layer.
  • a through hole is formed, and the resin filling step of the present invention is performed there. It can be formed by filling in. The same applies to the blind via hole structure 38c.
  • the multi-layer wiring board 30 is a surface-mount type having a brand 39, and the through-holes 40 are provided for wiring connection.
  • resin filling can be performed according to the present invention.
  • the release sheets 1 are arranged on both sides of the base material layer BL.
  • the release sheet 1 may be arranged on only one side surface (the hot press side) of the layer. Good. In that case, removal of excess resin flowing out to the back side of the hot press poses a problem, but can be suitably removed by the following method.
  • the resin is controlled by the above-described method so that the amount of excess resin flowing out is reduced as much as possible. After solidification is performed as it is, the excess resin can be removed by the flattening step.
  • a mesh sheet or the like is interposed between the press table and the base material layer, and excess resin flowing out to the back side of the base layer is fixed to the mesh sheet or the like, and a mesh sheet or the like is formed. Exfoliation can remove excess resin.
  • a mesh sheet or the like it is not necessary to position the openings as in the case of the peeling sheet, and the operation becomes simpler.
  • the through-hole for conductively connecting the first wiring layer and the second wiring layer is filled with resin, and then the upper layer is further formed.
  • the subsequent step can be performed without filling the resin.
  • the resin filling step of the present invention may be performed using an opening for the peeling sheet that is not provided for some of the through holes.
  • a resin in which some of the through holes are not filled with the resin can be formed.
  • the present invention is useful for a method for manufacturing a wiring board having via holes for conductive connection between wiring layers or through holes formed for purposes other than conductive connection. More specifically, when filling the through-hole with a resin in a via-hole forming process or the like, the filled resin The resin can be suitably filled by a simple process using an inexpensive material with few defects. Therefore, the present invention has high industrial applicability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé de production de tableaux de connexions. Ce procédé est caractérisé les opérations suivantes : on pose sur au moins une surface d'un substrat ou d'une couche de substrat une feuille détachable présentant une ouverture qui correspond à une traversée devant être remplie de résine, en alignant les ouvertures sur les traversées du substrat ou de la couche de substrat. On forme ensuite une couche de résine, pouvant être ramollie par chauffage et solidifiée par refroidissement ou par traitement, sur la surface du substrat comprenant la feuille détachable. On procède ensuite à l'introduction de la résine dans la traversée: en appliquant une source de chaleur et une pression, on enfonce une partie de la couche de résine ramollie dans la traversée puis on solidifie la résine par refroidissement ou par traitement. Pour finir on détache la feuille détachable du substrat ou de la couche de substrat. Cette opération de remplissage de résine permet d'empêcher dans une large mesure la résine d'entrer en contact avec un défaut, et permet un remplissage adéquat d'une traversée avec de la résine, à l'aide d'un matériel peu onéreux et d'une opération simple.
PCT/JP1998/005193 1998-11-18 1998-11-18 Procede de production de tableaux de connexions WO2000030419A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP52152999A JP3325903B2 (ja) 1998-11-18 1998-11-18 配線基板の製造方法
PCT/JP1998/005193 WO2000030419A1 (fr) 1998-11-18 1998-11-18 Procede de production de tableaux de connexions
TW087120090A TW404149B (en) 1998-11-18 1998-12-03 Production method for wiring board
TW087120091A TW411748B (en) 1998-11-18 1998-12-03 Production method for multi-layer wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/005193 WO2000030419A1 (fr) 1998-11-18 1998-11-18 Procede de production de tableaux de connexions

Publications (1)

Publication Number Publication Date
WO2000030419A1 true WO2000030419A1 (fr) 2000-05-25

Family

ID=14209430

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/005193 WO2000030419A1 (fr) 1998-11-18 1998-11-18 Procede de production de tableaux de connexions

Country Status (3)

Country Link
JP (1) JP3325903B2 (fr)
TW (2) TW411748B (fr)
WO (1) WO2000030419A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179972A2 (fr) * 2000-08-09 2002-02-13 Japan Radio Co., Ltd Procédé de remplissage de trous pour un panneau à circuit imprimé
JP2010268682A (ja) * 2010-09-01 2010-11-25 Mitsui High Tec Inc 回転子積層鉄心の樹脂封止方法
CN113826453A (zh) * 2020-04-13 2021-12-21 野田士克林股份有限公司 印刷基板的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526575B2 (ja) * 2009-03-30 2014-06-18 凸版印刷株式会社 半導体素子用基板の製造方法および半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58220451A (ja) * 1982-06-17 1983-12-22 Kyodo Printing Co Ltd Ｉｃモジユ−ル
JPH05226814A (ja) * 1992-02-13 1993-09-03 Tokuyama Soda Co Ltd 回路基板の製造方法
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58220451A (ja) * 1982-06-17 1983-12-22 Kyodo Printing Co Ltd Ｉｃモジユ−ル
JPH05226814A (ja) * 1992-02-13 1993-09-03 Tokuyama Soda Co Ltd 回路基板の製造方法
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179972A2 (fr) * 2000-08-09 2002-02-13 Japan Radio Co., Ltd Procédé de remplissage de trous pour un panneau à circuit imprimé
EP1179972A3 (fr) * 2000-08-09 2003-12-03 Japan Radio Co., Ltd Procédé de remplissage de trous pour un panneau à circuit imprimé
JP2010268682A (ja) * 2010-09-01 2010-11-25 Mitsui High Tec Inc 回転子積層鉄心の樹脂封止方法
CN113826453A (zh) * 2020-04-13 2021-12-21 野田士克林股份有限公司 印刷基板的制造方法
EP3944728A4 (fr) * 2020-04-13 2023-10-04 Noda Screen Co., Ltd Procédé de fabrication de carte de circuit imprimé

Also Published As

Publication number Publication date
TW411748B (en) 2000-11-11
TW404149B (en) 2000-09-01
JP3325903B2 (ja) 2002-09-17

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