Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
  • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
  • H05K7/20927—Liquid coolant without phase change

Definitions

• the invention relates to a multi-phase converter with semiconductor power components and a capacitor, the type defined in the preamble of claim 1.
• the object of the present invention is to arrange the components in such a way that compared to the known construction and
• the arrangement according to the invention of the components of a converter with the characterizing features of claim 1 has the advantage over the known construction and arrangement method that it takes up much less space for the same output and also ensures a much more intensive cooling of the capacitor.
• the invention packs the components together compactly with significantly improved use of space. A given volume of space, in particular essentially in a cylindrical shape, and the cooling is optimally used.
• the carrier is designed as a hollow body, the inside of the capacitor or an arrangement of capacitors connected in parallel is provided as closely and precisely as possible, and the semiconductor power components are arranged on the outside.
• the semiconductor power components are thus arranged around the capacitor as a center, separated by the heat sink acting as a carrier.
• the hollow body is designed such that it has a substantially cylindrical or cuboid shape on the outside and a cylindrical shape or a shape adapted to the outside shape of the capacitor arrangement on its inside.
• the outside of the hollow body is provided with suitable surfaces on which the semiconductor power components can be attached in good thermal contact with the coolable hollow body.
• the hollow body is provided with flat surfaces, and four flat outer surfaces are provided in particular in the case of two-phase converters and six in the case of three-phase converters.
• the components belonging to a bridge half or a third of the bridge can be arranged very clearly and appealingly in the form of a cuboid or approximately cylindrical around the cooling carrier, while the condenser or the condenser arrangement sits in the center and can also be cooled.
• This compact arrangement is further improved in that the hollow body is made in the axial direction essentially as long as it corresponds to the length of the capacitor or the capacitor arrangement.
• a cuboid or cylindrical cover is provided, which, apart from the hollow body serving as a carrier, together with the components mounted in and on it necessary connection contacts, finally surrounds.
• the components are thus protected against external influences and a self-contained, connectable and installable, very compact component is provided.
• the hollow body also serves as a carrier for electrical boards.
• electrical control boards for the semiconductor power components are on the outside of the semiconductor
• electrical control boards can be provided and attachable to one or both end faces of the hollow body-shaped carrier.
• the hollow body is provided with suitable and suitably arranged cooling channels and a coolant, in particular a liquid, can be driven through these cooling channels.
• a coolant in particular a liquid
• the hollow body is on one
• the end face is provided with a carrier part containing cooling channels, by means of which cooling channels provided in the outer carrier wall can be connected to one another and as a result of which the hollow body is given a pot-like shape.
• the condenser provided on the inside is therefore surrounded in a very favorable manner almost on its entire outside by the cooling hollow body-shaped carrier.
• the arrangement according to the invention is used in a very expedient manner in various applications, in particular it is intended and suitable for use in a motor vehicle or in an electric vehicle or in a hybrid vehicle or in a starter-generator drive.
• Fig. 1 shows a schematic plan view of the arrangement according to the invention, wherein in the example shown of a three-phase converter, the supporting hollow body is cylindrical on the inside and six flat on the outside
• Fig. 2 shows schematically in side view and partially in section the arrangement of a three-phase shown in Fig. 1
• Fig. 3 schematically shows an electrical circuit diagram of the three-phase bridge circuit with the associated semiconductor power components, the arrangement of the
• FIG. 1 The arrangement of the components of a converter according to the invention is shown schematically in a top view in FIG. 1 and in a side view and partly in section in FIG. 2.
• the illustrated embodiment is based on a three-phase converter, the electrical circuit diagram of the associated three-phase bridge circuit with the necessary semiconductor power components is shown in FIG. 3.
• a carrier 1 designed as a hollow body is provided with cooling channels 2 and is cylindrical on its inside 3 and on its outside 4 as a hexagon. This creates an essentially cylindrical shape on the outside 4 of the hollow body-shaped carrier 1.
• the hollow body-shaped carrier 1 can be provided on one end face with a carrier part 6 containing cooling channels 5.
• This carrier part 6 gives the hollow body a pot-like shape and it is possible to connect the cooling channels 2 contained in the wall of the carrier 1 to one another by means of the carrier part 6 and its cooling channels 5.
• the cooling channels 2 in the hollow body-shaped carrier 1 are suitably shaped and attached at a suitable location. In the example shown with the hexagonal shape, they are preferably accommodated in the edge region, where the wall thickness is somewhat larger.
• the two connections 8 and 9 protrude for the positive and the negative pole.
• the condenser 7, except for this end face is closely surrounded on all sides by the cup-shaped hollow body 1 serving as a carrier and is thus fully exposed to its cooling.
• the semiconductor power components 10 and 11 are each applied to one surface on the outside of the hollow body 1.
• the semiconductor power components denoted by 10 and 11 can each have, for example in accordance with FIG. 3, a transistor T1 and a transistor connected in parallel with it
• Diodes Dl or T4 and D4 which are assigned to a phase and are arranged on two adjacent surfaces. These are then via a connecting line 12 or 13 or 14 in the illustrated Three-phase converter led outside.
• the transistors Tl and the diode Dl as well as the transistor T4 and the diode D4 connected in parallel with them belong to the line 12 on the adjacent surface.
• These semiconductor power components are connected to a line, in particular a line 12, line 13 or line 14, each through a bus bar called 15.
• the second phase, which is brought out on line 13 includes the bridge part with the transistor T2 and the diode D2 and the transistor T5 and the diode associated with it D5.
• the third phase which is brought out on line 13 includes the bridge part with the transistor T2 and the diode D2 and the transistor T5 and the diode associated with it D5.
• Bridge part of the three-phase converter is assigned to transistor T3 with its diode D3 and transistor T6 with its diode D6 on line 14.
• the semiconductor power components assigned to each third of the bridge are thus each on one side of the line 12, 13 or 14 on the symmetrical to this
• control boards 17 are provided on each of the six surfaces, which directly control the semiconductor power components located underneath. These six control boards 17 are connected to a further board, the control board 18, either via connector 19 or flexible
• PCB connector 20 as shown on the left or right in FIG. 2.
• circuit board 18 there shown, which can be installed in the converter for purposes not relevant here.
• This entire arrangement is surrounded by a cover 21, which is cylindrical in the case shown and completely surrounds all components except for the cable leads 8, 9, 12, 13, 14. This gives you a ready-to-install, self-contained component that can be connected to lines 8, 9, 12, 13 and 14 with a very compactly packed converter.
• a cylindrical, predetermined construction volume is optimally utilized.
• the cylindrical capacitor 7 is arranged.
• Carrier 1 is a circuit breaker or there are several connected in parallel and attached there, the three-phase pulse inverter. As shown in the exemplary embodiment, the two switches of a half bridge or of a bridge part belonging to one another are ideally located on adjacent ones
• the half bridges are connected via busbars 15 and 16, respectively.
• the five line connections 8, 9, 12, 13, 15 can be led out at any suitable position, be it radial or axial. In the example shown, they are brought together axially on one end face.
• the axial extension of the hollow body or cup-shaped carrier 1 is preferably as long as it is determined by the height of the necessary capacitor 7.
• the design of the outer surface of the hollow-body-shaped carrier can be made so that four outer surfaces are provided, and on each two adjacent outer surfaces, the semiconductor power components, which belong to a half bridge, are arranged adjacent.
• the connection and control with the respective elements is then similar to the exemplary embodiment shown.
• a cuboid cover is then used here as a cover.
• the entire construction volume given by the cuboid is optimally used by the components and not only a part.
• a capacitor arrangement consisting of a series of capacitors connected in parallel can be used and can be arranged centrally in the interior of the hollow body.
• the inner surface of the hollow-body-shaped carrier must then be optimally adapted to the given shape and the cooling channels 2 should be provided in the most suitable places.
• the basic idea of the present invention is therefore to arrange the capacitor or capacitors centrally in a hollow body and to arrange the necessary semiconductor components on the outside of the hollow body.
• the wall of the hollow body contains those through which a cooling liquid flows, in particular
• Cooling channels 2 at a suitable point and cools both the semiconductor components mounted on the outside in a heat-conducting transition and the power capacitor or capacitors provided on the inside.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Inverter Devices (AREA)
• Electric Propulsion And Braking For Vehicles (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (1)

Family

ID=7883676

Family Applications (1)

Country Status (5)

Cited By (11)

Families Citing this family (42)

Citations (4)

Family Cites Families (7)

• 1998
  • 1998-10-07 DE DE19846156A patent/DE19846156C1/de not_active Expired - Fee Related
• 1999
  • 1999-10-02 JP JP2000575209A patent/JP2002528028A/ja active Pending
  • 1999-10-02 US US09/807,157 patent/US6501653B1/en not_active Expired - Fee Related
  • 1999-10-02 DE DE59902974T patent/DE59902974D1/de not_active Expired - Fee Related
  • 1999-10-02 EP EP99970217A patent/EP1119899B1/de not_active Expired - Lifetime
  • 1999-10-02 WO PCT/DE1999/003185 patent/WO2000021187A1/de not_active Ceased

Patent Citations (4)

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