WO1999050476A1 - Substrat pourvu d'un placage a base de nickel et son procede de preparation - Google Patents

Substrat pourvu d'un placage a base de nickel et son procede de preparation Download PDF

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Publication number
WO1999050476A1
WO1999050476A1 PCT/JP1999/001352 JP9901352W WO9950476A1 WO 1999050476 A1 WO1999050476 A1 WO 1999050476A1 JP 9901352 W JP9901352 W JP 9901352W WO 9950476 A1 WO9950476 A1 WO 9950476A1
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WO
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Prior art keywords
electroless
based plating
substrate
glass substrate
film
Prior art date
Application number
PCT/JP1999/001352
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English (en)
Japanese (ja)
Inventor
Hidenori Hayashida
Toshikuni Yoshimoto
Original Assignee
World Metal Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by World Metal Co., Ltd. filed Critical World Metal Co., Ltd.
Publication of WO1999050476A1 publication Critical patent/WO1999050476A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Definitions

  • Ni-based plating substrate Ni-based plating substrate and its manufacturing method
  • the present invention provides an electroless Ni-based film having good adhesion as a base polar metal film on a glass substrate made of glass, glass ceramics or ceramics, particularly on a glass substrate for a memory medium such as a hard disk.
  • the present invention relates to a technique for forming a tack film.
  • a substrate (memory) for a storage element of a magnetic memory device such as a memory disk, a fixed hard disk, an optical disk, a magneto-optical disk, and a magnetic disk (hereinafter, these are collectively referred to as a memory medium).
  • A1 disk substrates are widely used as media substrates.
  • a memory medium is manufactured by forming a memory layer by a sputtering method or the like on a disk-shaped memory medium substrate. Therefore, it is necessary that the surface of the memory medium substrate is composed of a multi-layered polar metal. Therefore, when a memory medium is manufactured using a glass substrate for a memory medium, a metal film having a polarity (hereinafter, referred to as a base polar metal film) is formed on the glass substrate in advance.
  • the base polar metal film is required to have good adhesion to the glass substrate, to have a thermal expansion coefficient close to that of the glass substrate, and to be able to improve the recording density. ing.
  • a glass substrate as a substrate for a memory medium is used. It is conceivable to use an electroless plating method to form the underlying polar metal film on the substrate. For example, a glass substrate is immersed in a stannous chloride solution to perform Pd activation treatment, washed with water, and then poured into a known electroless Ni-based plating solution to easily add N 2 to the surface of the substrate.
  • i-type coating film Pure Ni film, Ni-P film containing P, Ni-B film containing B
  • This Ni-based plating film can be deposited very easily when the substrate surface is roughened.
  • the Ni-based plating film obtained by such an electroless plating method has extremely low adhesion strength to a glass substrate, and is difficult to use industrially.
  • the present invention has been made to solve the problems of the prior art described above, and an electroless Ni-based plating film is formed on a glass substrate, especially a glass substrate for a memory medium, with good adhesion and low cost.
  • the purpose is to be formed by Disclosure of the invention
  • the present inventors have found that the above object can be achieved by including Zn in the electroless Ni-based plating film, and have completed the present invention.
  • the present invention is characterized in that in an Ni-based plating substrate in which an electroless Ni-based plating film is formed on a glass substrate, the electroless Ni-based plating film contains Zn. Provide a Ni-based plating substrate.
  • the present invention provides a method for producing an Ni-based plating substrate in which an electroless Ni-based plating film is formed on a glass substrate, the method comprising a nickel salt, an organic acid and a reducing agent;
  • the glass substrate is electroless Ni-plated with an electroless Ni-based plating liquid containing 0.01 mg / L to 20 g of ZL.
  • a production method characterized by forming an electroless Ni-based plating film.
  • the present invention also provides an electroless Ni-based plating solution for forming an electroless Ni-based plating film on a glass substrate, comprising a nickel salt, an organic acid and a reducing agent, To provide an electroless Ni-based plating solution containing 0.01 mg / L to 20 g ZL.
  • the present invention provides a memory medium comprising a glass substrate on which an electroless Ni-based plating film is formed, and a memory layer formed on the electroless Ni-based plating film.
  • a memory medium characterized in that the i-type plating film contains Zn.
  • Ni-based plating substrate of the present invention will be described in detail.
  • the Ni-based plating substrate of the present invention is a glass substrate on which an electroless Ni-based plating film containing Zn is formed with good adhesion.
  • a glass substrate for use in the present invention, a glass (crystallized glass (e.g. S i O 2 - L i 0 2 - M g O- P 2 0 5 based glass), tempered glass (e.g. Soviet one da-lime glass substrate made of L i ⁇ 2 based glass or the like) or sera mission-box (A l 2 ⁇ 3, etc.) -) and the like), glass ceramic box (S i ⁇ 2 - A 1 2 0 3 based glass, S i O 2 There is no limitation on the surface roughness, and those having various uses can be used.
  • crystalstallized glass e.g. S i O 2 - L i 0 2 - M g O- P 2 0 5 based glass
  • tempered glass e.g. Soviet one da-lime glass substrate made of L i ⁇ 2 based glass or the like
  • sera mission-box A l 2 ⁇ 3, etc.
  • glass ceramic box S i ⁇ 2 - A
  • Such a crystallized glass substrate is useful as a glass substrate for memory media such as hard disks.
  • Z contained in the electroless Ni-based plating film is n includes those in an ionic state such as Zn or Zn2 + , ZnO, and Zn ( ⁇ H) 2 .
  • the plating film becomes brittle, it is preferably 3% by weight or less, more preferably 0.00001 to 3% by weight.
  • the electroless Ni-based plating film may be a Ni—Zn coating composed of Ni and Zn or an electroless Ni-based plating film containing other elements. included.
  • a Ni—Zn—P film further containing P, a Ni—Zn—B film further containing B, and the like can be preferably mentioned.
  • the electroless Ni-based plating film may have, if necessary, Si, Tl, Mo, Ti, Pb, Sn, Fe, S, Bi, Cd, Md.
  • One or more elements selected from n, Mg, W, Cu, Pd, In, Sb, Se, As, Ca, and Co may be further contained.
  • the concentration when these are contained can be appropriately determined according to the type of element to be contained, the purpose of use of the metal-based plating substrate, and the like.
  • the thickness of the electroless 1-based paint film is preferably 0.0001 / x m to 2 O m from the viewpoint of adhesion to the glass substrate.
  • the Ni-based plating substrate of the present invention as described above contains a nickel salt, an organic acid, and a reducing agent, and further contains Zn at 0.1 mg / L to 20 g / L.
  • the glass substrate can be easily manufactured by subjecting the glass substrate to the electroless Ni plating treatment using the electroless Ni plating solution.
  • the nickel salts include acetate, formate, oxalate and the like. Preference is given to acid salts, sulphamate salts, sulphates, chlorides, borofluorides and the like. Further, the concentration in the plating solution is preferably 0.1 to 100 g ZL, particularly preferably 1 to 5 g ZL, as Ni 2 + .
  • the organic acid linoleic acid, succinic acid, citric acid, lactic acid, tartaric acid, oxalic acid, formic acid, glycolic acid, gluconic acid, adipic acid, EDTA, NTA, glutamate and the like are preferable.
  • the concentration of the organic acid in the plating solution is preferably 1 to 100 g ZL, particularly preferably 5 to 30 g ZL.
  • the reducing agent depends on the type of electroless Ni coating film to be formed (for example, Ni—Zn coating, Ni—Zn—P coating, or Ni—Zn—B coating). And select as appropriate. For example, when forming a Ni—Zn film, formalin, formic acid, oxalic acid and the like are preferable, and when a Ni—Zn—P film is formed, hypophosphorous acid, phosphorous acid, or these are preferable. preferably salts of, n i- Z n - when forming the B film, DMA B (dimethyl aminoborane), n a BH 4, KBH 4, TMAB (trimethyl aminoborane) or the like are preferable.
  • DMA B dimethyl aminoborane
  • n a BH 4, KBH 4, TMAB trimethyl aminoborane
  • the concentration of the reducing agent in the electroless Ni-based plating solution is preferably 1 to 100 gZL, particularly 3 to 20 g when hypophosphorous acid or phosphite is used as the reducing agent. ZL is preferred.
  • the salt simultaneously serves as a source of Ni and hypophosphorous acid.
  • the use amount of Ni hypophosphite is preferably 1 to 50 g / L, more preferably 5 to 30 g / L.
  • Zn is a characteristic component of the electroless Ni-based plating solution of the present invention, and inorganic salts such as zinc sulfate, chloride and sulfamate, and organic salts such as tartaric acid, acetic acid and lactate. It is preferably supplied as an acid salt. Of these, zinc sulfate, chloride, sulfamate, acetate and tartrate are preferred.
  • the concentration of Zn in the electroless Ni-based plating solution is from 0.01 mg / L 20 g / L, preferably 0.3 mg / L to 3 g / L. If the amount is less than 0.01 mg ZL, the adhesion between the electroless Ni-based plating film and the glass substrate is reduced. If the amount exceeds 20 g ZL, the electroless Ni-based plating film tends to become brittle.
  • the electroless Ni-based plating solution contains, in addition to the above-mentioned nickel salts, organic acids, reducing agents and Zn, if necessary, Si, Tl, Mo, Ti, Pb, Sn, One or two selected from Fe, S, Bi, Cd, Mn, Mg, W, Cu, Pd, In, Sb, Se, As, Ca, and Co
  • the above elements can be contained.
  • the concentration when these are contained can be appropriately determined according to the kind of element to be contained, the purpose of use of the Ni-based plating substrate, and the like. For example, when tin sulfate is contained, it is preferable to contain 0.1 to 0.5 g ZL.
  • the pH of the electroless Ni-based plating solution is preferably adjusted to 3 to 12, and particularly preferably 3.5 to 9.0.
  • the method of performing electroless plating on a glass substrate using the electroless Ni-based plating solution of the present invention can be performed according to a known electroless Ni plating method.
  • a glass substrate is first immersed in a stannous chloride solution, washed with water, then immersed in a palladium chloride solution to perform a Pd activation treatment, washed with water, and electroless Ni-based plating solution.
  • the temperature of the plating solution is preferably room temperature to 95 ° C, particularly preferably 40 to 80 ° C.
  • the electroless Ni-based plating liquid of the present invention is preferably used when an electroless Ni-based plating film is formed on a glass substrate for a memory medium such as a glass substrate for a hard disk.
  • a glass substrate for a memory medium such as a glass substrate for a hard disk.
  • General other than glass substrates for memory media It can also be preferably used when forming an electroless Ni-based plating film showing good adhesion to a glass substrate for use.
  • a memory medium can be obtained by forming a conventionally known memory layer on the electroless N1-based plating film.
  • a known magnetic material ⁇ one F e 2 ⁇ 3, C o - C r alloy
  • Ru may be mentioned preferably a magnetic memory layers were RiNarumaku by the sputtering evening method.
  • Such memory layer further, can be appropriately form a lubricating layer made of coercive Mamoruso or carbon or the like consisting of S i ⁇ 2, S i C, and the like.
  • a Zn-containing electroless Ni-based plating film (for example, 0.3 to 1. ⁇ thick) on a glass substrate is known.
  • the memory layer After performing the mechanical texturing (Mechanica 1 texturing), the memory layer may be laminated.
  • the Zn-containing electroless Ni-based plating film (for example, 0.5 to 2.0 im thick) was slightly polished for the purpose of removing nodule pits. After performing the mechanical texturing, the memory layer may be laminated.
  • the Zn-containing electroless Ni-based plating film was replaced with a Ni strike film for ensuring the adhesion between the glass substrate and the conventional general electroless Ni-based plating film for A1 substrates. It can be used as a wood layer. In this case, it is possible to suppress a change in the manufacturing process of the conventional memory medium.
  • a commercially available disk-shaped crystallized glass substrate for hard disks with a diameter of 2.5 inch, a thickness of 0.635 mm and a surface roughness (Ra) of 2-3 A was used. Then, an electroless Ni plating treatment was performed as follows, and a 0.5 (500 OA) thick Ni-Zn-P film was formed on the surface.
  • the glass substrate was washed with a cleaning solution containing a nonionic surfactant (2 g / L), and then washed with water. Subsequently, the mixture was immersed in a sensitizer solution composed of stannous chloride (2 g L) and 36% HC1 (20 m1 / L) at 50 ° C for 3 minutes, and washed with water.
  • a sensitizer solution composed of stannous chloride (2 g L) and 36% HC1 (20 m1 / L) at 50 ° C for 3 minutes, and washed with water.
  • an electroless Ni consisting of nickel sulfate (10 g / L), citric acid (20 g ZL), sodium hypophosphite (10 g ZL), and zinc acetate (0.5 g / L).
  • a system-based plating solution pH 5.0 was prepared, heated to 70 ° C, and the activated glass substrate was poured into the solution for 20 minutes.
  • An i plating process was performed to form a 0.5 izm thick Ni—Zn—P film to obtain a memory medium substrate.
  • the adhesion of the Ni—Zn—P film was evaluated. That is, after the memory medium substrate was heated at 150 ° C. for 120 minutes, a grid test (100 squares of 1 mm square was produced with a cutter knife) using an adhesive tape was performed according to a conventional method. Was. As a result, the non-peeled piece / test piece was 100 Z 100, and no peeling occurred.
  • the Ni-Zn-P film (unpolished) formed on the glass substrate is coated on the Ni-Zn-P film of the memory medium substrate according to the conventional method.
  • 0- 3 T orr at 0. 2 ITI thickness ⁇ over F e 2 0 3 force, Ranaru
  • the magnetic memory layers are laminated to form a memory medium by stacking 1 m thick S 1 ⁇ 2 under a pressure of 1 0- 3 T orr as a protective layer.
  • the obtained memory medium did not have poor adhesion between the magnetic memory layer and the glass substrate, and the recording density increased 150 times as compared with the memory medium formed from the conventional A1 disk substrate.
  • An electroless Ni plating process was performed on a glass substrate in the same manner as in Example 1 except that Zn 2 + was not added to the electroless Ni plating solution at all.
  • OA A thick electroless Ni-based plating film was formed to fabricate a substrate for memory media.
  • the obtained memory medium substrate was subjected to a grid test in the same manner as in Example 1. As a result, the non-peeled test piece was 0 Z 100, and no adhesion was obtained.
  • a glass substrate was subjected to ultrasonic cleaning at 30 ° C. for 10 minutes using a cleaning solution containing a nonionic surfactant (1 g L).
  • a cleaning solution containing a nonionic surfactant (1 g L) After washing with water, the plate was immersed in a sensitizer solution containing stannous borofluoride (3 g L) and borofluoric acid (10 g L) at 50 ° C. for 3 minutes, and washed with water.
  • stannous borofluoride 3 g L
  • borofluoric acid 10 g L
  • it was immersed in an active liquid composed of palladium chloride (0.1g / L) and 36% HC1 (10m1 / L) at 50 ° C for 3 minutes and washed with water.
  • Ni-based plating solution consisting of (1 / L) was prepared, heated to 80 ° C, and the above-mentioned glass substrate was placed therein.
  • An electroless Ni plating treatment was performed to form a 5 / m-thick Ni—Zn—P film to obtain a memory medium substrate.
  • the obtained memory medium substrate was washed with water and dried, and the components of the Ni—Zn—P film were analyzed. As a result, it was found that Ni 93 wt%, P 7 wt%, and ZnO.l wt% there were.
  • the Ni-Zn-P film (unpolished) formed on the glass substrate is coated on the Ni_Zn_P film of the memory medium substrate by the sputtering method (10 _ 3 T orr) as a magnetic memory layer of 2 Paiiota thickness 0. in ⁇ - at F e 2 ⁇ 3 was laminated, the spa Tsu evening method of carbon 3 m thickness 0.5 as a protective layer to al By stacking, a memory medium was manufactured. As a result, there was no poor adhesion between the magnetic memory layer and the glass substrate, and the recording density was increased by a factor of 100 compared to a conventional memory medium formed from an A1 disk substrate.
  • An electroless Ni plating treatment was performed on a glass substrate in the same manner as in Example 2 except that zinc tartrate was not added to the electroless Ni plating solution at all, and a surface of 511 m thick electroless Ni plating was applied to the surface.
  • a plating film was formed to produce a memory medium substrate.
  • the obtained memory medium substrate was subjected to a grid test in the same manner as in Example 1. As a result, the non-peeled test piece was 0100, and no adhesion was obtained.
  • a glass Ceramic substrates using cleaning fluid consisting of a non-ionic surfactant (2 g ZL) and Arai ⁇ then formulated from S n C 1 2, P d C 1 2 and HC 1 It was immersed in a so-called Kya list solution (Pd2 + (0.1 g / L), Sn2 + (0.2 g / L)) at 40 ° C for 5 minutes and washed with water.
  • an electroless material consisting of nickel chloride (S g ZL), diammonium citrate (10 g / L), sodium hypophosphite (3 g ZL), and zinc chloride (0.5 g ZL)
  • a Ni-based plating solution pH 5.0
  • a non-electrolytic solution was prepared by introducing a glass-ceramic substrate treated with a catalyst.
  • a Ni plating process was performed to form a 0.1 lm (l OOOA) thick Ni-Zn-P film, thereby obtaining a memory medium substrate.
  • An electroless Ni plating treatment was performed on the glass ceramic substrate in the same manner as in Example 3 except that zinc chloride was not added to the electroless Ni-based plating solution at all. Form a Ni-based plating film and use it as a substrate for memory media. Was prepared.
  • a cleaning fluid consisting of a non-ionic surfactant (1 g / L), subjected to ultrasonic cleaning, S n C 1 2 (0. 2 g ZL), 3 6 % HC 1 immersed in (3 ml / L) consisting of Senses evening I the one-part 3 0 ° C for 5 minutes, washed with water, P d C 1 2 (0 . 0 5 g Bruno L), 3 6% HC 1 (10 ml / L) of the active solution was immersed at 30 ° C. for 5 minutes and washed with water.
  • a cleaning fluid consisting of a non-ionic surfactant (1 g / L), subjected to ultrasonic cleaning, S n C 1 2 (0. 2 g ZL), 3 6 % HC 1 immersed in (3 ml / L) consisting of Senses evening I the one-part 3 0 ° C for 5 minutes, washed with water, P d C 1 2 (0 . 0 5 g
  • Ni-based plating solution (pH 4.0), which was heated to a solution temperature of 70, Electroless Ni plating is performed by putting a ceramics substrate that has been treated with a synthesizer into the Ni-Zn-P coating with a thickness of 0.4 Atm (400 A). Thus, a substrate for a memory medium was obtained.
  • Comparative Example 4 Except that no zinc acetate was added to the electroless Ni-based plating solution, the electroless Ni plating process was applied to the ceramic (alumina) substrate for the hard disk in the same manner as in Example 4, and the surface was treated with a 0.1 ⁇ m-thick aluminum plate. A 4 tm thick electroless Ni-based plating film was formed to produce a substrate for memory media.
  • the obtained memory medium substrate was subjected to a grid test in the same manner as in Example 1. As a result, the non-peeled test piece was 0 Z100, and no adhesion was obtained.
  • the glass substrate was washed with a cleaning solution containing a nonionic surfactant (2 gZL), and then washed with water. Then, add a solution of stannous chloride (2 g / L) and 36% HC1 (SOmlZL)
  • an electroless Ni-based system consisting of nickel sulfate (10 gZL), citric acid (20 gZL), sodium hypophosphite (10 g / L), and zinc acetate (0.5 g / L)
  • a plating solution pH 5.0
  • Ni plating treatment was performed to form a Ni-Zn-P coating having a thickness of 0 as a Ni strike plating coating.
  • Ni—P-based plating solution (pH 4.0) was prepared, heated to 70 ° C, and charged with the glass substrate described above. Electrolytic Ni plating was performed to form a Ni—P film having a thickness of ⁇ ⁇ . Thus, a substrate for a memory medium was obtained.
  • a memory medium was obtained by forming a magnetic memory layer and a protective layer in the same manner as in Example 1.
  • the obtained memory medium has no adhesion failure between the glass substrate and the Ni-P film and between the Ni-P film and the magnetic memory layer, and is a memory medium formed from a conventional A1 disk substrate.
  • the recording density was dramatically improved as compared with. Industrial applicability
  • an electroless Ni-based paint film can be formed on a glass substrate having an arbitrary surface roughness with good adhesion. Therefore, the electroless Ni-based plating film as the underlying polar metal film can be formed on the glass substrate for the memory medium at low cost by the electroless Ni plating process. Even when the surface of the glass substrate is a mirror surface, it can be formed with good adhesion. For this reason, a so-called glass hard disk obtained by applying the Ni-based plating substrate of the present invention to a glass substrate for a hard disk is superior in impact resistance and thinner than a conventional aluminum hard disk. High rigidity and hardness, excellent smoothness, and high-speed rotation (for example, 700 rpm or more) are possible, so that the flying height of the magnetic head can be reduced. The recording density is improved.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

L'invention porte sur un substrat de verre destiné à un support mémoire et pourvu d'un film de revêtement à base de nickel dans lequel est incorporé Zn de façon à renforcer le contact entre ledit film de revêtement et le substrat de verre.
PCT/JP1999/001352 1998-04-01 1999-03-18 Substrat pourvu d'un placage a base de nickel et son procede de preparation WO1999050476A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/107008 1998-04-01
JP10700898 1998-04-01

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WO1999050476A1 true WO1999050476A1 (fr) 1999-10-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3650579A4 (fr) * 2017-06-28 2021-10-13 Kojima Chemicals Co. Ltd. Solution d'amorçage au nickel autocatalytique et procédé de formation d'un film de nickelage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56136966A (en) * 1980-03-31 1981-10-26 Hitachi Ltd Electroless plating method
JPH0997417A (ja) * 1995-09-29 1997-04-08 Kao Corp 磁気記録媒体
JPH1074318A (ja) * 1996-06-03 1998-03-17 Komag Inc 磁気ディスク用支持体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56136966A (en) * 1980-03-31 1981-10-26 Hitachi Ltd Electroless plating method
JPH0997417A (ja) * 1995-09-29 1997-04-08 Kao Corp 磁気記録媒体
JPH1074318A (ja) * 1996-06-03 1998-03-17 Komag Inc 磁気ディスク用支持体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3650579A4 (fr) * 2017-06-28 2021-10-13 Kojima Chemicals Co. Ltd. Solution d'amorçage au nickel autocatalytique et procédé de formation d'un film de nickelage
EP4086368A1 (fr) * 2017-06-28 2022-11-09 Kojima Chemicals Co. Ltd. Solution d'amorçage au nickel autocatalytique et procédé de formation de film de nickel

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