WO1999023648A1 - Tete optique, enregistreur optique, microlentille et fabrication de cette microlentille - Google Patents

Tete optique, enregistreur optique, microlentille et fabrication de cette microlentille Download PDF

Info

Publication number
WO1999023648A1
WO1999023648A1 PCT/JP1998/004987 JP9804987W WO9923648A1 WO 1999023648 A1 WO1999023648 A1 WO 1999023648A1 JP 9804987 W JP9804987 W JP 9804987W WO 9923648 A1 WO9923648 A1 WO 9923648A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
optical
forming
microlens
manufacturing
Prior art date
Application number
PCT/JP1998/004987
Other languages
English (en)
Japanese (ja)
Inventor
Takeshi Irita
Yoshihiko Suzuki
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31906797A external-priority patent/JP4164888B2/ja
Priority claimed from JP9326980A external-priority patent/JPH11144293A/ja
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO1999023648A1 publication Critical patent/WO1999023648A1/fr

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/122—Flying-type heads, e.g. analogous to Winchester type in magnetic recording
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1359—Single prisms
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1362—Mirrors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/10532—Heads
    • G11B11/10534—Heads for recording by magnetising, demagnetising or transfer of magnetisation, by radiation, e.g. for thermomagnetic recording
    • G11B11/10536—Heads for recording by magnetising, demagnetising or transfer of magnetisation, by radiation, e.g. for thermomagnetic recording using thermic beams, e.g. lasers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/10532—Heads
    • G11B11/10541—Heads for reproducing
    • G11B11/10543—Heads for reproducing using optical beam of radiation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/1055—Disposition or mounting of transducers relative to record carriers
    • G11B11/10552—Arrangements of transducers relative to each other, e.g. coupled heads, optical and magnetic head on the same base
    • G11B11/10554—Arrangements of transducers relative to each other, e.g. coupled heads, optical and magnetic head on the same base the transducers being disposed on the same side of the carrier
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/1055—Disposition or mounting of transducers relative to record carriers
    • G11B11/1058—Flying heads

Definitions

  • the present invention relates to an optical head, an optical recording device, a microlens, and a method for manufacturing a microlens.
  • the present invention relates to an optical head and an optical recording apparatus for recording or reproducing information by irradiating a light beam onto an optical recording medium, and further relates to a microlens used for such an optical head for optical recording and reproduction. And a microlens array and a method for producing them. Background technology
  • a solid immersion lens hereinafter, referred to as “SIL”
  • a recording method has been proposed in which the effective numerical aperture of the optical system is set to 1 or more.
  • An experimental example in which such a SIL is mounted on a flying head of a magneto-optical disk is disclosed by BD Terriers et al. In Applied Physics Letters, 68 (2), 14-143 (1996). The flying head is shown in Fig. 15.
  • a head 20 includes a slider 21 supported by a suspension 24, a SIL 22 mounted on the slider 21, and a SIL 22 located above the SIL 22. And the objective lens 23 for converging and entering the laser beam L into the objective lens 23.
  • the objective lens 23 is formed separately from the slider 21.
  • the slider 21 floats by air bearing utilizing the air flow generated by the rotation of the magneto-optical disk 30, and the S 1 L 22 mounted on the slider 21 has a constant surface with the magneto-optical disk surface 30a. Is configured to maintain a gap
  • the head 20 is configured such that only the SIL 22 is mounted on the slider 21 and other optical members such as the objective lens 23 are formed separately from the slider 21.
  • the relative position between the central axis of the SIL 22 and the central axis of the objective lens 23 is shifted in a plane (xy plane) parallel to the magneto-optical disk surface 30a, and the tracking accuracy is reduced.
  • mm lenses are manufactured by mechanically polishing materials such as glass, or by press molding using a mold.
  • the manufacturing method using mechanical polishing has limitations in terms of lens size and shape accuracy and mass productivity.
  • the type of lens material is limited, and it is difficult to employ a high refractive index material, so that it is difficult to increase the numerical aperture of the lens. .
  • an object of the present invention is to provide a small and lightweight optical head, and an optical recording device using the optical head, with improved tracking accuracy, reading and writing accuracy.
  • Another object of the present invention is to provide a manufacturing method capable of stably manufacturing a large number of microlenses and microlens arrays having a diameter of 1 mm or less.
  • Another object of the present invention is to provide a microlens and a microlens array having a diameter of 1 mm or less.
  • an optical head for condensing a light beam on a rotating optical recording medium, and a slider floating by an air flow formed by rotating the optical recording medium.
  • a solid immersion lens, an objective lens, and an optical mirror are formed in a body.
  • the optical recording device supports the optical head with a gap from the rotating optical recording medium, and writes or reads information on the optical recording medium via the optical head.
  • a solid immersion lens, an objective lens, and an optical mirror are integrally formed on a slider that floats by an air flow formed by rotating an optical recording medium, and are supported by an arm.
  • the arm is configured such that the optical head is movable in a radial direction of the optical recording medium.
  • the optical components necessary for the optical head that is, the S1L, the objective lens, and the optical mirror (for example, a micro prism) are integrally formed on the slider.
  • the relative positional relationship between each optical component is fixed, so that tracking can be performed stably-read and write accuracy is improved.
  • the entire optical head is made smaller, thinner, and lighter.
  • Optical recording media and optical heads Can also configure the multi Blatter type optical recording apparatus in which a plurality laminating a de in the same housing, compact high capacity optical recording apparatus can be realized a while the first embodiment of the micro lens according to the present invention Forming at least one recess in a substrate made of a first material; embedding a second material to form a microlens in the at least one recess; Separating the second material from the substrate.
  • a concave portion is formed in the substrate, and a lens material (second material) is embedded in the concave portion.
  • Micro lenses are manufactured by separating the embedded lens material from the substrate.
  • the semiconductor manufacturing technology in each stage, and it is possible to stably manufacture a microlens having a very small size and a good shape accuracy.
  • a material having a high refractive index can be used as the lens material, and therefore, a minute lens having a high numerical aperture can be manufactured.
  • a large number of the concave portions are formed in the substrate, a large amount of microlenses can be stably obtained.
  • the step of forming the at least one concave portion includes etching the substrate to form the at least one concave portion on the substrate. This includes the step of forming one recess.
  • the manufacturing method according to the second aspect is a specific example of the first aspect, and is an example in which etching is employed for forming the concave portion.
  • a method for manufacturing a microlens according to a third aspect of the present invention is the manufacturing method according to the first aspect, wherein the step of forming the at least one concave portion includes the steps of: forming a film having etching resistance on a substrate; Forming an opening in the film to expose the surface of the substrate; Anisotropically etching; and removing the film after the etching.
  • the manufacturing method according to the third embodiment is a specific example of the first embodiment, and employs isotropic etching for forming the concave portion. A hemispherical microlens with high roundness can be obtained.
  • a method for manufacturing a microlens according to a fourth aspect of the present invention is the manufacturing method according to any one of the first to third aspects, wherein the step of embedding the second material comprises: Forming the second material on the substrate so as to be embedded in at least one concave portion; and forming the second material on a portion other than the concave portion of the second material formed on the substrate. Removing the second material.
  • the manufacturing method according to the fourth aspect is a specific example of the first to third aspects, in which a portion other than the concave portion of the lens material (second material) formed on the substrate having the concave portion is formed. Is to be removed
  • the method for manufacturing a microlens according to a fifth aspect of the present invention is the manufacturing method according to any one of the first to fourth aspects, wherein after the step of forming the at least one concave portion, Forming a thin film made of a third material that can be selectively eluted on the substrate along a wall of the at least one recess before the step of embedding the material. The step of selectively eluting the thin film.
  • the manufacturing method according to the fifth aspect is a specific example of the first to fourth aspects, wherein the separation of the substrate and the lens material (lens material) is performed by interposing a thin film in advance between the two.
  • the thin film is a release layer, so to speak.
  • the lens material can be easily separated from the substrate.
  • a method for manufacturing a microlens according to a sixth aspect of the present invention is the manufacturing method according to any one of the first to fourth aspects, wherein the step of separating includes the step of selectively eluting the substrate. .
  • the manufacturing method according to the sixth aspect is a specific example of the first to fourth aspects, and is an example in which separation of a substrate and a lens material (lens material) is performed by selectively eluting the substrate. According to this sixth aspect, the lens material can be easily separated from the substrate.
  • the method for manufacturing a microlens according to the seventh aspect of the present invention comprises the steps of: forming a plurality of recesses in a substrate made of a first material; and forming the plurality of recesses.
  • the manufacturing method of the seventh aspect it is basically the same as each of the above-mentioned aspects, and it is possible to stably produce a large number of microlenses having a high numerical aperture and good shape accuracy.
  • the lens material is formed on the substrate after removing a part of the thin film used as the release layer, so that after the thin film is eluted, the plurality of minute lens portions are formed on the opposing substrate. Although separated from the inner wall of the recess, multiple microlens portions face the substrate Accordingly, in the case of the fourth aspect, after elution of the thin film used as the release layer, a plurality of microlenses are individually dispersed.
  • the plurality of microlenses do not fall apart, which is convenient for carrying and storing.
  • individual minute lenses can be separated from the structure by, for example, cutting at a connection portion thereof.
  • the method for manufacturing a microlens according to an eighth aspect of the present invention is the manufacturing method according to the seventh aspect, wherein after the step of forming the second material, and before the step of eluting the thin film. Patterning the second material so that the second material constitutes a beam portion, a microlens portion in each of the recesses, and a support portion that is in direct contact with the surface of the substrate.
  • the beam portion, the microlens portion, and the support portion are integrally continuous, and the microlens portion and the beam portion are integrally continuous at an edge of the microlens portion.
  • the manufacturing method according to the eighth aspect is a specific example of the seventh aspect, wherein the lens material (the second material) forms the integrally continuous beam portion and the microlens portion as the supporting portion, Since the microlens portion and the beam portion are integrally continuous at the edge portion of the microlens portion, the structure described above can be easily formed without damaging the optically effective portion of the microlens. Can separate individual micro lenses
  • a method for manufacturing a microlens according to a ninth aspect of the present invention is the manufacturing method according to any one of the first to eighth aspects, wherein the first material is silicon.
  • the substrate material used in the present invention is not limited to this. Instead, a material having good workability can be used as appropriate.
  • a method for manufacturing a microlens according to a tenth aspect of the present invention is the manufacturing method according to any one of the first to ninth aspects, wherein the second material is glass, amorphous silicon, diamond, or resin.
  • Silicon titanium dioxide, gallium arsenide, aluminum gallium arsenide, indium phosphide, germanium, cadmium telluride, indium arsenide, indium antimony, lead sulfide, silicon carbide, gallium phosphide, arsenic sulphide, strontium titanate, It is one of rutile, zinc sulfide, lithium niobate, zirconium oxide, and silicon nitride.
  • the manufacturing method of the tenth aspect is an example of a lens material.
  • the lens material used in the present invention is not limited to these examples.
  • the microlens of the eleventh aspect according to the present invention Is manufactured by the manufacturing method according to any one of the first to tenth aspects.
  • the microlens of the eleventh aspect is manufactured according to the first to tenth aspects, the numerical aperture is high, the shape accuracy is good, and the cost is low.
  • a method of manufacturing a microlens array according to a twelfth aspect of the present invention includes the steps of: forming a plurality of concave portions on a substrate made of a first material; and forming a second material to form a microlens array in the plurality of concave portions. a step of embedding, in which the second material and a step of separating from the substrate ⁇
  • the manufacturing method of the twelfth aspect similarly to the case of the first aspect, it is possible to stably manufacture a fine lens array having a high numerical aperture and a fine lens with good shape accuracy, If the concave portion is formed by a plurality of microlens arrays, a large amount of microlens arrays can be stably obtained.
  • the method for manufacturing a microlens array according to a thirteenth aspect of the present invention comprises: In the manufacturing method according to aspect 12, the step of forming the plurality of recesses includes a step of forming the plurality of recesses on the substrate by etching the substrate.
  • the manufacturing method according to the thirteenth aspect is a specific example of the above-described thirteenth aspect, and is an example in which etching is employed for forming the concave portions.
  • a method for manufacturing a microlens array according to a fourteenth aspect of the present invention is the manufacturing method according to the first aspect, wherein the step of forming the plurality of recesses includes forming a film having etching resistance on the substrate. Forming an opening in the film to expose a surface of the substrate; etching the substrate isotropically from the opening; and removing the film after the etching. Is included.
  • the manufacturing method according to the fourteenth aspect is a specific example of the above-described second aspect, and employs isotropic etching for forming the concave portion. As described above, when isotropic etching is employed, a microlens array having a hemispherical microlens with extremely high roundness can be obtained.
  • the method for manufacturing a microlens array according to a fifteenth aspect of the present invention is the manufacturing method according to any one of the first to fourteenth aspects, wherein after the step of forming the plurality of recesses, Prior to the step of embedding the second material, forming a thin film of a third material that can be selectively eluted on the substrate along the inner walls of the plurality of recesses; Includes a step of selectively eluting the thin film.
  • the manufacturing method according to the fifteenth aspect is a specific example of the first to the fourteenth aspects, wherein the separation of the substrate and the lens material (lens array material) is performed by interposing a thin film in advance between the two. This is an example in which the thin film is selectively eluted later. According to the fifteenth aspect, the thin film is a so-called release layer. The lens material can be easily separated from the substrate.
  • the step of separating selectively elutes the substrate includes steps.
  • the manufacturing method according to the sixteenth aspect is a specific example of the first to the fourteenth aspects, and separates the substrate from the lens material (lens array material) by selectively eluting the substrate.
  • the lens material can be easily separated from the substrate.
  • the method for manufacturing a microlens array according to the seventeenth aspect of the present invention is characterized in that in the manufacturing method according to any one of the first to sixteenth aspects,
  • the material is silicon or gallium arsenide
  • the substrate material used in the present invention is not limited thereto, as appropriate processability Good materials can be used.
  • the manufacturing method of a microlens array according to an eighteenth aspect of the present invention is the manufacturing method according to any one of the first to seventeenth aspects, wherein the second material is glass, amorphous silicon, diamond, or resin.
  • the second material is glass, amorphous silicon, diamond, or resin.
  • the manufacturing method according to the eighteenth aspect exemplifies a lens array material.
  • the lens array material used in the present invention is not limited to these examples.
  • the microlens array according to the nineteenth aspect of the present invention is manufactured by the manufacturing method according to any one of the first to eighteenth aspects.
  • the microlens array according to the nineteenth aspect is Since it is manufactured according to the above-mentioned embodiments 12 to 18, it is possible to provide a microlens having a high numerical aperture and a good shape accuracy, and it is inexpensive.
  • Figure 1 is a second diagram ⁇ is a plan view of an optical recording apparatus according to the first embodiment is a sectional view of an optical recording apparatus according to the first embodiment.
  • FIG. 3 is a cross-sectional view of the optical recording device according to the second embodiment.
  • Figure 4 is a bottom view of an embodiment of a microphone port coil 3
  • FIG. 5 is a sectional view of an optical recording device according to a third embodiment of the present invention.
  • 6A to 6I are schematic views showing steps of a method for manufacturing a microlens according to a fourth embodiment of the present invention.
  • FIGS. 6A to 6D are schematic diagrams showing steps subsequent to the steps shown in FIGS. 6A to 6D.
  • FIGS. 8A to 8D are schematic views showing the steps of a method for manufacturing a microlens according to the fifth embodiment.
  • 9A to 9D are schematic views showing steps of a method for manufacturing a microlens according to the sixth embodiment.
  • FIGS. 10A to 1OD are schematic views showing steps subsequent to the steps shown in FIG.
  • FIGS. 11A to 11D are schematic cross-sectional views showing steps of a method of separating individual microlenses from the structure shown in FIGS. 10A to 10D.
  • FIGS. 12A to 12D are schematic views showing steps of a method for manufacturing a microlens array according to the seventh embodiment.
  • FIG. 13 is a schematic cross-sectional view showing a step that follows the step shown in FIGS. 12A to 12D.
  • FIGS. 14A to 14D are schematic sectional views showing steps of a method for manufacturing a microlens array according to the eighth embodiment.
  • FIG. 15 is a cross-sectional view of an optical recording device according to a conventional optical head device.
  • FIG. 1 the optical recording apparatus shown in FIGS. 1 and 2 according to the first embodiment of the present invention is a plan view
  • FIG. 2 is a cross-sectional view.
  • FIG. 2 shows a cross section taken along a plane A in FIG.
  • an optical disk 1 as an information recording medium (that is, an optical recording medium) is configured to be rotatable around a rotation axis 2 a by a spindle motor 2.
  • the optical head 10 supported by the tip of the head 15 is arranged with a certain distance from the optical disk 1.
  • the optical disk 1 rotates in the direction from the head arm 15 to the optical head.
  • Direction (toward the arrow in the figure)
  • the head arm 15 is composed of an arm body 15a made of a rigid body and a suspension 15b formed at the tip and made of an elastic body.
  • the optical head 10 is a suspension 1 at the tip. Attached to 5b.
  • the end of the arm main body 15a opposite to the optical head 10 side is attached to the rotating shaft 3a of the voice coil motor 3, and is rotated by rotating the rotating shaft 3a around the optical axis.
  • the head 10 can be moved at a high speed in the radial direction of the optical disc 1.
  • the optical head 10 includes a slider 11, and the slider 11 is formed so as to float by air bearing using an air flow generated by rotation of the optical disk 1.
  • the slider 11 has an SIL (solid immersion lens) 12, an objective lens 13, and a microprism 14 integrally formed along the optical path of the laser light L.
  • the portion of the slider 11 sandwiched between the objective lens 13 and the SIL 12 is cut out to form a gap 17.
  • a high-reflection film 16 that reflects the laser beam L is provided on the prism surface 14 a of the microprism 14 to form a mirror surface.
  • the slider 11 By rotating the optical disk 1 at a predetermined speed to generate an airflow on the optical disk recording surface 1a, the slider 11 can rotate the optical disk recording surface 1a by air bearing. It floats with a small gap with a.
  • the laser light L is emitted from a fixed optical system (not shown) arranged near the rotation axis 3a of the voice coil motor 3, and is guided to the optical head 10 as a parallel light flux.
  • the laser light L is reflected by the reflecting surface 14 a of the microprism 14 and enters the objective lens 13.
  • the laser beam L that has passed through the objective lens 13 passes through the gap 17 and enters the SIL 12, where it converges and converges the recording spot on the optical disk recording surface 1 a, and thus the optical disk recording surface Record information on 1a or reproduce information on optical disc recording surface 1a.
  • the gap between the optical disc 1 and the slider 11 is kept constant. Therefore, the gap between the optical disc 1 and the slider 11 1 floating on the optical disc 1, ie, By making the flying height of the slider 11 coincide with the distance between the SIL 12 and the focal point of the recording spot, the recording spot is collected on the optical disc recording surface 1a.
  • the laser beam L can be focused automatically by optimally designing the constant rotation speed of the optical disc 1 and the flying height of the slider 11 scanning for 1 0 of the optical disc 1 radially, i.e. tracking, u performs the rotation control of the voice coil motor - 3 the rotation of the voice coil motor 3 is controlled by the control unit 4.
  • each optical component is formed.
  • the optical path of the laser beam L is stabilized, and the spot diameter does not fluctuate, so that tracking can be performed stably and reading and writing accuracy is improved.
  • the entire optical head 10 can be reduced in size, thickness, and weight.
  • a multi-blatter type optical recording device in which a plurality of optical disks 1 and optical heads 10 are stacked in the same housing can be formed, and a small-sized and large-capacity optical recording device can be realized.
  • the slider 11 is formed of a material that is transparent to the laser beam L, it is not necessary to form a gap 17 between the SIL 12 and the objective lens 13 in the slider 11.
  • Akuchiyueta is also possible to use Li two ⁇ type Akuchiyueta ⁇
  • FIG. 3 shows an optical recording apparatus according to a second embodiment of the present invention.
  • a micro mirror 51 is arranged as an optical mirror instead of the micro prism 14 of the first embodiment.
  • Micro mirror 5 1 is formed by applying a high-reflection film 52 to one side surface of a block of a suitable material (the same material as the slider 11).
  • a square-shaped recess 41 surrounding SI 12 is provided on the bottom surface 11 a of the slider 11, and a micro coil 4 having a coil-shaped wiring pattern shown in FIG. 2 are arranged.
  • a micro coil 4 having a coil-shaped wiring pattern shown in FIG. 2 are arranged.
  • FIG. 5 shows an optical recording apparatus according to a third embodiment of the present invention.
  • the micro-mirror 53 is attached to the micro-mirror 53.
  • the microactuator 54 swings the micromirror 53 with the line of intersection of the incident surface of the laser beam L and the micromirror 53 as the rotation center axis, and changes the installation angle of the micromirror 53. It is configured so that By operating the fine movement actuator 54, the light beam to the optical disk 1 can be tilted by a small angle in the radial direction of the optical disk 1, whereby the tracking operation of the optical head 10 can be performed by the voice coil motor.
  • Fine adjustment by 3 and fine adjustment by adjusting the installation angle of micromirror 5 3 by fine actuator 5 4 on slider 1 1 can perform two-stage control, enabling extremely high-precision tracking Becomes
  • the optical components necessary for the optical head that is, the SIL, and the objective lens And the micro prism are formed integrally with the slider, so that the relative positional relationship between the optical components is fixed, so that tracking can be performed stably, and reading and writing accuracy is improved.
  • the entire optical head can be reduced in size, thickness, and weight.
  • a multi-blutter type optical recording device in which a plurality of optical recording media and optical heads are stacked in the same housing can be configured, and a small-sized large-capacity optical recording device can be realized.
  • FIGS. 6A to 6H and FIGS. 7A to 7F The method for manufacturing a microlens according to the fourth embodiment of the present invention will be described with reference to FIGS. 6A to 6H and FIGS. 7A to 7F.
  • FIGS. 6A to 6H are schematic views showing the steps of the method for manufacturing a microlens according to the present embodiment
  • FIGS. 7A to 7F are schematic views showing the steps subsequent to the steps shown in FIGS. 6A to 6H.
  • FIG. 6A to 6H and 7A to 7F the left side shows a schematic cross-sectional view, the right side shows a schematic top view, and the side-by-side figures show the same steps.
  • a substrate 1 made of silicon (S i) as a first material is used.
  • a chromium (Cr) film 2 is formed on the Si substrate 1 by vapor deposition as a film having etching resistance to isotropic etching of the Si substrate 1 described later.
  • a circular opening 2a is formed in the Cr film 2 by photolithography and etching, and the surface of the Si substrate 1 is exposed from the opening 2a (FIGS. 6A and 6B).
  • the Si substrate 1 is isotropically etched from the opening 2a with a hydrofluoric acid / nitric acid based etchant to form a hemispherical concave portion 1a on the Si substrate 1 (Sixth, 6D figure).
  • the circular pattern of the opening 2a of the Cr film 2 is very close to a perfect circle, and if the composition and temperature of the hydrofluoric acid-nitric acid etching solution are appropriately controlled, the concave portion 1a due to the etching can be extremely accurate. (Sphericity of about 0.2 ⁇ ).
  • the ⁇ wall of the recess 1 a is a spherical surface and a curved surface
  • the Cr film 2 is removed (FIGS. 6E and 6F).
  • the above steps constitute the stage of preparing the substrate 1 having the concave portion la shown in FIGS. 6E and 6F.
  • the substrate 1 shown in FIGS. 6E and 6F can be used many times in the production of a microlens.
  • silicon phosphate glass (Phospo Silicate Glass: PSG) 3 as a third material that can be selectively eluted is shown in FIGS. 6C and 6D by low pressure chemical vapor deposition (LP CVD). thinning deposited below about 1 mu Paiiota entire upper surface of the substrate 1 in the state (the 6 G, 6 H diagram) upsilon i.e., the P SG thin film 3, on the substrate 1 along the inner wall of the recess 1 a Formed over the entire surface.
  • LP CVD low pressure chemical vapor deposition
  • an optical glass 4 such as 7059-G1 ass made by K. Jung as a second material (lens material) is sputtered so that the concave portion 1a of the substrate 1 is buried.
  • a film is formed on the entire surface of the substrate 1 in the state shown in FIGS. 6G and 6H (FIGS. 7A and 7B).
  • the optical glass 4 formed on the portion other than the concave portion 1a of the optical glass 4 formed on the substrate 1 is removed by a method such as RIE (reactive ion etching) (7C, 7D). If the thickness of the optical glass 4 in the concave portion 1a of the substrate 1 is different from that of the optical glass 4 in the other portion, the polishing is performed to remove the glass 4 in the portion other than the concave portion 1a by polishing. After planarization, RIE etching is performed.
  • the substrate in the state shown in FIGS. 7C and 7D is immersed in a hydrofluoric acid solution to selectively elute the PSG thin film 3 (FIGS. 7E and 7F).
  • the PSG dissolves quickly in the hydrofluoric acid solution.
  • the hemispherical glass 4 is separated from the Si substrate 1, and the microlens 5 composed of the hemispherical glass 4 is completed.
  • the size of the circular opening 2a of the Cr film 2 and the substrate 1 are reduced.
  • the size of the hemispherical concave portion 1a (therefore, the size of the microlens 5) can be arbitrarily determined depending on the etching time at the time of cutting, for example, from a diameter of about 1 mm to a diameter of about several ⁇ m. It is possible to manufacture the minute lens 5 of FIG.
  • the microlenses 5 are manufactured as described above, and the semiconductor manufacturing technology is used at each stage, and the microlenses 5 are extremely small in size and have good shape accuracy.
  • the degree of freedom in selecting a lens material a material corresponding to the optical glass 4
  • a material having a high refractive index can be used as the lens material, and thus a high A minute lens 5 having a numerical aperture can be manufactured.
  • a large number of the concave portions 1a are formed in the substrate 1, a large number of microlenses 5 can be stably obtained.
  • 8A to 8H are schematic views showing steps of a method for manufacturing a microlens according to the present embodiment.
  • 8A to 8B the left side shows a schematic cross-sectional view
  • the right side shows a schematic top view
  • the right and left side figures show the same process.
  • Elements that are the same as or correspond to the elements in FIGS. 6H and 7A-7F are given the same reference numerals, and duplicate descriptions thereof are omitted.
  • an optical glass 4 such as 7059-G1 ass of Kojung Co., Ltd. as a second material (lens material) is formed on the substrate 1 by a sputtering method.
  • a film is formed on the entire surface of the substrate 1 in the state shown in FIGS. 8A and 8B so that 1a is embedded (FIGS. 8C and 8D).
  • the optical glass 4 formed on the portion other than the concave portion 1a of the optical glass 4 formed on the substrate 1 is removed by a method such as RIE (reactive ion etching) (No. 8E, 8F). If the thickness of the optical glass 4 in the concave portion 1a of the substrate 1 is different from the thickness of the optical glass 4 in the other portion, the force to remove the glass 4 in the portion other than the concave portion 1a by polishing is used. Perform RIE etching after flattening a
  • the substrate in the state shown in Figs. 8E and 8F is immersed in an aqueous solution of potassium hydroxide (KOH) to selectively elute the Si substrate 1 (Figs. 8G and 8H).
  • KOH potassium hydroxide
  • Silicon dissolves much more rapidly in aqueous potassium hydroxide than glass 4.
  • the hemispherical glass 4 is separated from the Si substrate 1, and the microlens 5 composed of the hemispherical glass 4 is completed.
  • the same advantages as those of the fourth embodiment can be obtained.
  • FIGS. 9A to 9D and FIGS. 10A to 10D Next, a method for manufacturing a microlens according to the sixth embodiment of the present invention will be described with reference to FIGS. 9A to 9D and FIGS. 10A to 10D.
  • FIGS. 9A to 9D are schematic views showing the steps of the method for manufacturing a microlens according to the present embodiment, and FIGS. 1OA to 10D show the steps subsequent to the steps shown in FIGS. 9A to 9D.
  • FIG. 9A, FIG. 9C and FIG. 10A, FIG. 10C is a schematic sectional view
  • FIGS. 9B and 9D and FIGS. 10B and 10D are schematic top views.
  • FIGS. 9A and 9B, FIGS. 9C and 9D, FIGS. 108 and 108, and FIGS. 10C and 10D show the same steps, respectively. .
  • FIG. 1OA shows a cross section taken along line X 1 -X 1 ′ in FIG. 10B, and FIG.
  • 10C shows a cross section taken along line X 2 -X 2 ′ in FIG. 10D.
  • the cross section along is shown.
  • 9A to 9D and 10A to 10D the same or corresponding elements as those in FIGS. 6A to 6H and FIGS. Duplicate description will be omitted.
  • the state becomes the same as the state shown in FIGS. 6G and 6H.
  • the openings 2a are formed in many rows, and the concave portions 1a are formed in many rows on the Si substrate 1.
  • the PSG thin film 2 deposited on the substrate 1 by photolithography and etching is patterned on the substrate 1 in this state, and a peripheral portion of the substrate 1 (for example, a region of the substrate 1 is formed). Is divided into a plurality of blocks each including a plurality of openings 2a, and only the periphery of each block may be considered.) Only the surface of the Si substrate 1 is exposed (FIGS. 9A and 9B). That is, the PSG thin film 2 in a part of the region other than the concave portion 1 a is removed to expose the surface of the substrate 1.
  • a second material and to the titanium Sens strontium (hereinafter, S r T I_ ⁇ 3) 1 4, by sputtering, as the recess 1 a of the substrate 1 is embedded as shown in 9 a, 9 is deposited on the entire surface of the substrate 1 in the state shown in B view (No. 9 C, 9 D view) No. 9 C, 9 D view, the deposited S r T I_ ⁇ 3 film 14 is in contact with Si only in the portion where the surface of the Si substrate 1 is exposed in FIGS. 9C and 9D.
  • the part 14b is a part that is continuously connected integrally at the edge of the micro lens part 14a.
  • a to 1 ID diagrams are schematic sectional views showing each step of the method.
  • adhesive tapes 21 and 22 of UV-curing type are attached to both sides of the structure shown in Figs. 10C and 10D (Fig. 11A) .
  • the structure in the state shown in FIG. 11A is set in a dicing apparatus, cut along a dotted line in FIG. 11A by dicing, and the peripheral portion of the substrate 1 is cut off.
  • S r T i ⁇ 3 film 1 4 including a micro lens 1 4 b is separated from the S i substrate 1 (first 1 1 B Figure).
  • microlens 1 4 b can be separated (Fig. 11D).
  • FIGS. 12A to 12D are schematic views showing the steps of the method for manufacturing a microlens array according to the present embodiment
  • FIG. 13 is a schematic view showing the steps subsequent to the steps shown in FIGS. 12A to 12D
  • FIG. FIGS. 12A, 12C and 13 are schematic sectional views
  • FIGS. 12B and 12D are schematic top views.
  • FIGS. 12A and 12B, and FIGS. 12C and 12D show the same process.
  • Figs. 12A to l2D and Fig. 13 the same reference numerals are given to the same or corresponding elements as those in Figs. 6A to 6H and 7A to 7F. Duplicate description will be omitted.
  • the first 12A is similar to the state shown in FIGS. 6G and 6H. And the state shown in FIG. 12B.
  • the openings 2a are formed in many rows, and the concave portions 1a are formed in many rows on the Si substrate 1. To achieve.
  • an optical glass 4 such as 7059-Glass manufactured by KOJUNG Co., Ltd. is sputtered so that the concave portion 1a of the substrate 1 is buried, and A film is formed on the entire surface of the substrate 1 in a state shown in FIGS. 12A and 12B so as to have a thickness. Thereafter, the optical glass 4 is patterned by a method such as RIE according to the desired external shape of the microlens array (FIGS. 12C and 12D).
  • the substrate in the state shown in FIGS. 12C and 12D is immersed in a hydrofluoric acid solution to selectively elute the PSG thin film 3 (FIG. 13).
  • PSG dissolves quickly in hydrofluoric acid solution.
  • the glass 4 including a plurality of hemispherical portions is separated from the Si substrate 1, and a microlens array 25 including the glass 4 including the plurality of hemispherical portions is completed.
  • the present embodiment similarly to the above-described fourth embodiment, it is possible to stably manufacture the microlens array 25 having the microlenses having a high numerical aperture and good shape accuracy. Can be obtained stably in a large amount by forming a plurality of microlens arrays.
  • FIGS. 14A to 14C are schematic cross-sectional views showing steps of a method for manufacturing a microlens array according to the present embodiment.
  • the same reference numerals are given to the same or corresponding elements as those in FIGS. 6A to 6H and FIGS. 7A to 7F, and the duplicated description will be omitted. .
  • FIG. 6F the state shown in FIG. 6E and the state shown in FIG. 14A similar to the state shown in FIG. 6F are obtained.
  • the openings 2 a are formed in many rows, and the concave portions 1 a are formed in many rows on the Si substrate 1.
  • an optical glass 4 such as, for example, 705-G 1 ass of Kojung Co., Ltd. as a second material (lens array material) was formed on the substrate 1 by sputtering.
  • a film is formed on the entire surface of the substrate 1 in the state shown in FIG. 14A so that the concave portion 1a is embedded and has a desired thickness.
  • the microlens array is formed into a desired external shape.
  • the optical glass 4 is putt réelle by a method such as RIE (Fig. 14B).
  • the substrate in the state shown in FIG. 14B is immersed in an aqueous solution of potassium hydroxide (KOH) to selectively elute the Si substrate 1 (FIG. 14C).
  • KOH potassium hydroxide
  • silicon dissolves much more rapidly in an aqueous potassium hydroxide solution than the glass 4.
  • the glass 4 including a plurality of hemispherical portions is separated from the Si substrate 1, and a microlens array 25 including the glass 4 including the plurality of hemispherical portions is completed.
  • the present embodiment similarly to the above-described fourth embodiment, it is possible to stably manufacture the microlens array 25 having the microlenses having a high numerical aperture and good shape accuracy. If a plurality of microlens arrays are formed, a large number of microlens arrays can be stably obtained.
  • the embodiments of the present invention have been described above. However, the present invention is limited to these embodiments. What is not done ⁇
  • glass and amorphous silicon were taken as materials for forming the microlens and the microlens array.
  • the present invention is not limited thereto.
  • silicon is used as the material of the substrate 1 in which the concave portion 1a is formed.
  • any other material may be used as long as it has good workability.
  • PSG is used as the material of the thin film 3 which is finally eluted for separating the substrate and the microlenses, etc., but any material that can be selectively eluted is used. Other materials can be used at all.
  • micro lenses and micro lens array formed as described above by being incorporated into the optical recording and reproducing apparatus, to allow high-density recording and reproduction ⁇ particularly, 1 mm diameter or less of the micro lens SIL (So It is effective to use it for lid Immersion on Lens) and its associated objective lens.
  • the micro lens SIL So It is effective to use it for lid Immersion on Lens
  • a large number of microlenses and microlens arrays having a diameter of 1 mm or less can be stably manufactured. Can be. Further, according to the production method of the present invention, a microlens and a microlens array having a diameter of 1 mm or less can be provided.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optical Head (AREA)

Abstract

Cette invention se rapporte à un enregistreur optique qui soutient une tête optique tout en maintenant un intervalle par rapport à un support d'enregistrement optique en rotation et qui inscrit des informations sur ce support d'enregistrement optique et lit les informations contenues dans ce support par l'intermédiaire de la tête optique. Cette tête optique comprend un élément glissant maintenu flottant par l'action d'un flux d'air produit par la rotation du support d'enregistrement optique, ainsi qu'une lentille carburée solide, une lentille objectif et un miroir optique faisant partie intégrante de l'élément glissant. On forme la lentille carburée solide et la lentille objectif en remplissant un évidement ménagé dans un substrat de silicium avec un verre optique, par exemple par élimination du verre périphérique et par élution du substrat de silicium lui-même.
PCT/JP1998/004987 1997-11-05 1998-11-05 Tete optique, enregistreur optique, microlentille et fabrication de cette microlentille WO1999023648A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9/319067 1997-11-05
JP31906797A JP4164888B2 (ja) 1997-11-05 1997-11-05 微小レンズ及び微小レンズアレイの製造方法
JP9326980A JPH11144293A (ja) 1997-11-12 1997-11-12 光学ヘッドおよび光学記録装置
JP9/326980 1997-11-12

Publications (1)

Publication Number Publication Date
WO1999023648A1 true WO1999023648A1 (fr) 1999-05-14

Family

ID=26569588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/004987 WO1999023648A1 (fr) 1997-11-05 1998-11-05 Tete optique, enregistreur optique, microlentille et fabrication de cette microlentille

Country Status (1)

Country Link
WO (1) WO1999023648A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1039458A2 (fr) * 1999-03-19 2000-09-27 Fujitsu Limited Tête optique et bobine magnetique utilisée dans un tel système

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102053A (ja) * 1986-10-20 1988-05-06 Nippon Telegr & Teleph Corp <Ntt> 光磁気ヘツド
JPH0218720A (ja) * 1988-05-12 1990-01-23 Digital Equip Corp <Dec> 光学ヘッド装置
JPH03214432A (ja) * 1990-01-19 1991-09-19 Hitachi Ltd 分離型光ヘッド，密閉型光ディスク装置及び光デイスク媒体
JPH03215802A (ja) * 1990-01-19 1991-09-20 Nippon Sheet Glass Co Ltd 平板レンズの製造方法
JPH0573980A (ja) * 1991-09-12 1993-03-26 Ricoh Co Ltd 光デイスクドライブ装置の光ヘツド
JPH05189796A (ja) * 1991-03-14 1993-07-30 Univ Leland Stanford Jr 固体液浸レンズ
JPH0612723A (ja) * 1992-03-06 1994-01-21 Hewlett Packard Co <Hp> 光磁気書込み／読取りヘッド
JPH0763904A (ja) * 1993-08-25 1995-03-10 Asahi Glass Co Ltd 複合球面マイクロレンズアレイ及びその製造方法
JPH07176069A (ja) * 1993-12-20 1995-07-14 Sharp Corp 浮上型光ヘッド及びその製造方法
JPH07281007A (ja) * 1994-04-06 1995-10-27 Nippon Sheet Glass Co Ltd 平板型レンズアレイおよびその製造方法／平板型レンズアレイを用いた液晶表示素子
JPH0829601A (ja) * 1994-07-20 1996-02-02 Ricoh Opt Ind Co Ltd マイクロ凹面配列をもつ光学デバイスおよびその製造方法
JPH0899368A (ja) * 1994-09-30 1996-04-16 Casio Comput Co Ltd マイクロレンズアレイの製造方法
JPH08315404A (ja) * 1995-05-18 1996-11-29 Sony Corp 光学ピックアップ装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102053A (ja) * 1986-10-20 1988-05-06 Nippon Telegr & Teleph Corp <Ntt> 光磁気ヘツド
JPH0218720A (ja) * 1988-05-12 1990-01-23 Digital Equip Corp <Dec> 光学ヘッド装置
JPH03214432A (ja) * 1990-01-19 1991-09-19 Hitachi Ltd 分離型光ヘッド，密閉型光ディスク装置及び光デイスク媒体
JPH03215802A (ja) * 1990-01-19 1991-09-20 Nippon Sheet Glass Co Ltd 平板レンズの製造方法
JPH05189796A (ja) * 1991-03-14 1993-07-30 Univ Leland Stanford Jr 固体液浸レンズ
JPH0573980A (ja) * 1991-09-12 1993-03-26 Ricoh Co Ltd 光デイスクドライブ装置の光ヘツド
JPH0612723A (ja) * 1992-03-06 1994-01-21 Hewlett Packard Co <Hp> 光磁気書込み／読取りヘッド
JPH0763904A (ja) * 1993-08-25 1995-03-10 Asahi Glass Co Ltd 複合球面マイクロレンズアレイ及びその製造方法
JPH07176069A (ja) * 1993-12-20 1995-07-14 Sharp Corp 浮上型光ヘッド及びその製造方法
JPH07281007A (ja) * 1994-04-06 1995-10-27 Nippon Sheet Glass Co Ltd 平板型レンズアレイおよびその製造方法／平板型レンズアレイを用いた液晶表示素子
JPH0829601A (ja) * 1994-07-20 1996-02-02 Ricoh Opt Ind Co Ltd マイクロ凹面配列をもつ光学デバイスおよびその製造方法
JPH0899368A (ja) * 1994-09-30 1996-04-16 Casio Comput Co Ltd マイクロレンズアレイの製造方法
JPH08315404A (ja) * 1995-05-18 1996-11-29 Sony Corp 光学ピックアップ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1039458A2 (fr) * 1999-03-19 2000-09-27 Fujitsu Limited Tête optique et bobine magnetique utilisée dans un tel système
EP1039458A3 (fr) * 1999-03-19 2000-11-15 Fujitsu Limited Tête optique et bobine magnetique utilisée dans un tel système
US6567347B1 (en) 1999-03-19 2003-05-20 Fujitsu Limited Optical head having a plurality of coil elements connected in parallel to each other
US6898157B2 (en) 1999-03-19 2005-05-24 Fujitsu Limited Optical head having a plurality of coil elements connected in parallel to each other

Similar Documents

Publication Publication Date Title
US6181485B1 (en) High numerical aperture optical focusing device for use in data storage systems
JP2006114196A (ja) ソリッドイマージョンレンズとこれを用いた集光レンズ、光学ピックアップ装置、光記録再生装置及びソリッドイマージョンレンズの形成方法
EP1233410B1 (fr) Appareil d&#39;enregistrement / de reproduction d&#39;informations
US6717738B2 (en) Optical element, metal mold for producing optical element and production method for optical element
JP2006154765A (ja) ミラー素子及びミラーアレイ
JP3544461B2 (ja) 光ピックアップ用光学素子および光ピックアップ用光学素子の製造方法および光ピックアップ
WO1999023648A1 (fr) Tete optique, enregistreur optique, microlentille et fabrication de cette microlentille
KR20060030369A (ko) 마이크로 미러 및 그 제조방법
JP2001023230A (ja) 光ヘッド及び光記録再生装置
JP2002342955A (ja) 光ディスク装置
EP1043716A2 (fr) Un dispositif de micromirror et une tête optique l&#39;utilisant
US7002226B2 (en) Microelectro mechanical system for magneto-optic data storage apparatus
JP4443024B2 (ja) 近視野光ヘッド及びその製造方法。
KR100331802B1 (ko) 초소형 솔리드 이머션 렌즈의 제조방법 및 이 렌즈를 이용하는 광정보 기록/재생 장치
JP2000021010A (ja) 光記録用フライングヘッド
WO2007116723A1 (fr) Tete d&#39;enregistrement optique et appareil d&#39;enregistrement optique
JP2005302267A (ja) ソリッドイマージョンレンズ、これを用いた集光レンズ、光学ピックアップ装置及び光記録再生装置及びソリッドイマージョンレンズの形成方法
JP4367102B2 (ja) 光学レンズ、集光レンズ、光学ピックアップ装置、及び光記録再生装置
JP4620166B2 (ja) 近視野光ヘッド及びその製造方法
KR20060046789A (ko) 광렌즈, 집광 렌즈, 광픽업 장치, 및 광기록재생 장치
JP2002350609A (ja) 光学素子作製方法、光学素子および光ピックアップ装置
JP2000076695A (ja) 光ヘッドおよびその製造方法
JP2006113108A (ja) 薄膜素子及びその製造方法
JP2000067456A (ja) 微小レンズ付き光ヘッド及びこの製造方法並びに微小レンズ付き光ヘッドを有した光記録再生装置並びに光記録再生検査装置
JP2000149306A (ja) 光ピックアップ用光学素子及び光ピックアップ用光学素子の作製方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA CN KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: KR

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: CA