WO1998054002A1 - Carte a circuit integre sans contact et son procede de production - Google Patents

Carte a circuit integre sans contact et son procede de production Download PDF

Info

Publication number
WO1998054002A1
WO1998054002A1 PCT/JP1998/002125 JP9802125W WO9854002A1 WO 1998054002 A1 WO1998054002 A1 WO 1998054002A1 JP 9802125 W JP9802125 W JP 9802125W WO 9854002 A1 WO9854002 A1 WO 9854002A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
card
foamed
vinyl chloride
chip
Prior art date
Application number
PCT/JP1998/002125
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiki Nishikawa
Yasuo Shimizu
Yuuji Furumichi
Original Assignee
Mitsubishi Plastics Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13675197A external-priority patent/JPH10305681A/ja
Application filed by Mitsubishi Plastics Inc. filed Critical Mitsubishi Plastics Inc.
Priority to AU72374/98A priority Critical patent/AU7237498A/en
Publication of WO1998054002A1 publication Critical patent/WO1998054002A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the present invention relates to a non-contact type IC card and a method for manufacturing the same.
  • IC cards with built-in IC chips have appeared in place of conventional magnetic stripe type cards, and commercialization of gasoline payment cards and telephone cards has begun.
  • IC cards with built-in IC chips are much more reliable in terms of information volume, processing speed, security, etc. than conventional magnetic stripe type cards. It is thought that it becomes.
  • IC cards are roughly classified into two types: a contact-type IC card, whose contact with a reader / writer that reads and writes information on the IC chip is exposed on the card surface, and an antenna coil and IC chip inside the card.
  • a contact-type IC card whose contact with a reader / writer that reads and writes information on the IC chip is exposed on the card surface
  • an antenna coil and IC chip inside the card There are two types of “contactless IC cards” that are built-in and can read and further rewrite the information on the IC chip with the induced current generated in the coil when a force passes through a magnetic field.
  • the contact type IC force is a force that can use a high-performance IC chip.It requires a card to be inserted into a reader / writer, which is troublesome, and the reader / writer physically contacts the card. Therefore, the durability of the card due to friction and wear and the maintenance of the reader / writer become problems.
  • non-contact IC cards do not need to be inserted into reader / writers, There is no physical contact with the reader / writer.For example, if a non-contact IC card is used for the telephone card, the telephone can be prevented from being stained due to contact with the card, so This has the advantage that maintenance is easier. Also, there is no need to insert the card into the reader / writer every time. For example, information can be exchanged at the nonstop when passing through automatic ticket gates on expressways or tollgates on expressways. This is effective in eliminating the problem. Therefore, the non-contact type IC card is expected to have a large market as a pre-paid card for public institutions and telephone cards.
  • Non-contact IC cards were mainly manufactured by the injection molding method in which an IC chip and a loop coil for an antenna were fixed in a force-shaped mold, and then resin was injected and integrated. .
  • Tokoro force s in the production of IC force one de In this method, or IC chip is subjected to damage by the pressure and temperature at the time of resin injection, it must be subjected to printing in the IC card one by one after the molding Cost-ups were a problem.
  • a method has been adopted in which large-sized sheets are embedded with IC chips (COB) without using injection molding, and a large number of cards are cut out from the large-sized sheets.
  • COB IC chips
  • a rigid PVC sheet is usually used for a large-sized sheet from the viewpoint of physical properties such as mechanical properties and mechanical properties, and from the viewpoint of cost and the like.
  • the manufacturing method will be specifically described. First, cut the concave part for mounting the IC chip on the center sheet of the card (hereafter referred to as the “core sheet”) (hereafter referred to as “counterboring processing”) and then load the IC chip into the concave part.
  • an IC chip After punching out a window of the size of an Ic chip, an IC chip is loaded into the punched window, and a sheet for concealing the IC chip on one or both sides of the core sheet (hereinafter referred to as “oversheet”) ), And heat-sealed and integrated by heat press to embed the IC chip etc. (COB) Form a large sheet. After that, it is punched and finished into a card shape.
  • the oversheet may be printed in advance, or may be printed on the oversheet after hot pressing and before punching.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a non-contact IC force guide which does not cause sink marks and has excellent surface smoothness and a method for producing the same. It is in.
  • the first aspect of the non-contact type IC card of the present invention is that the antenna loop coil and the IC chip are incorporated into a foamed vinyl chloride sheet which has been foamed so that the antenna loop coil and the IC chip can be embedded. It is characterized by being carried out.
  • a second aspect of the non-contact type IC force of the present invention is that the antenna sheet is formed on a foam sheet which has been foamed so that the antenna loop coil and the IC chip can be embedded.
  • a loop coil and an Ic chip are incorporated, an oversheet is provided outside the foam sheet, and the foam sheet is heat-fusible with the oversheet.
  • the foamed sheet may be a foamed vinyl chloride sheet
  • the over sheet may be a vinyl chloride sheet.
  • the foamed vinyl chloride-based sheet may contain a post-chlorinated vinyl chloride resin.
  • a skin layer may be provided on the outer surface of the foamed sheet or the foamed vinyl chloride-based sheet.
  • the antenna loop coil and the IC chip may be arranged on a plastic sheet and then incorporated in a foamed vinyl chloride sheet or foamed sheet.
  • a loop coil for antenna and an IC chip are sandwiched between foamed chloride-based sheets, and heated and pressed in an atmosphere sucked to a vacuum state. After that, the foam is crushed by foaming and then cooled while maintaining the crushed state of the foam in the foamed vinyl chloride sheet to obtain a non-contact IC card.
  • a loop coil for an antenna and an IC chip are sandwiched between foam sheets, a paper sheet is provided outside the foam sheet, and the vacuum sheet is sucked. After heating and pressurizing in a heated atmosphere to collapse the foam, the foam in the foamed chlorinated vinyl sheet is cooled while maintaining the collapsed state to obtain a non-contact IC card. .
  • the plastic sheet is made of a foamed polyvinyl chloride sheet or foamed sheet. of It may be sandwiched inside.
  • a skin layer may be further provided on the outer surface of the foamed vinyl chloride sheet or foamed sheet.
  • FIG. 1 is a partially enlarged cross-sectional view schematically showing a state before pressurization in one embodiment of a method for producing a non-contact IC force of the present invention.
  • a loop coil for an antenna, an IC chip and the like are incorporated in a foam sheet.
  • the expansion ratio of the foam sheet is set so that a loop coil for an antenna and an IC chip (COB) can be embedded.
  • the value of the expansion ratio is not particularly limited as long as the foamed sheet is foamed so that the thickness of the foamed sheet is equal to or greater than the thickness of C0B, and is not particularly limited, but is usually 1.5 to 5.0 times. Range. If the expansion ratio of the sheet is less than 1.5 times, when the thickness of the IC chip to be used is large, the card surface after pressing may be distorted by the IC chip and the smoothness may be deteriorated. Become.
  • the expansion ratio was set to 5 times is that, for example, since a PVC compound has a high melt viscosity, a sheet having an expansion ratio exceeding 5 times is difficult to obtain as a practical problem.
  • the foaming ratio even if the foaming ratio is increased by increasing the amount of the foaming agent added, the physical properties of the sheet will decrease and discoloration will occur, and furthermore, there will be problems such as discoloration due to the foaming agent residue during pressing. Because. Therefore, when the PVC compound is not used, the expansion ratio may be larger than 5 times.
  • the foamed sheet used in the present invention can have a desired expansion ratio by adding, for example, a foaming agent.
  • a foaming agent added to foam sheet
  • the class is not particularly limited, and for example, a foaming agent such as an azodicarboxylic acid amide-based foaming agent can be used.
  • the sheet may be foamed by forcibly injecting an inert gas into the molten resin using an extruder.
  • the foam sheet used in the present invention can contain additives.
  • the type of the additive used in the present invention is not particularly limited.
  • a heat stabilizer and a lubricant required for ordinary PVC processing, a pigment necessary for hiding as a card, and the like can be added.
  • a processing aid such as a foam cell stabilizer for making the cell uniform and an impact modifier for preventing card cracking may be added.
  • a plasticizer may be contained in an amount within a range that does not significantly lower the softening temperature of the card. Generally, the softening temperature of the card is preferably higher. From the practical point of view, the amount of the plasticizer added is, for example, in the case of a foamed vinyl chloride sheet, 5 parts per 100 parts by weight of PVC or the like. It is preferable that the amount is not more than part by weight.
  • the foamed sheet used in the present invention examples include, but are not limited to, a foamed vinyl chloride-based sheet and a foamed soft acryl-based resin sheet.
  • the foamed vinyl chloride sheet includes a sheet containing a post-chlorinated vinyl chloride resin (post-chlorinated PVC), a sheet of a PVCC vinyl acetate copolymer, and the like.
  • post-chlorinated PVC post-chlorinated vinyl chloride resin
  • PVCC vinyl acetate copolymer a sheet of acetate copolymer
  • heat-resistant PVC it is preferable to use post-chlorinated PVC, so-called heat-resistant PVC.
  • a PVCC vinyl acetate copolymer can be used.
  • the IC chip and the like may be directly incorporated between the foamed sheets, but may be incorporated in the plastic sheet in advance, and the plastic sheet may be incorporated between the foamed sheets.
  • the plastic sheet must be heat-fusible with the foam sheet. Examples include vinyl chloride sheets, acryl resin sheets, and ABS resin sheets.
  • the thickness of the sheet is not particularly limited as long as it has an appropriate strength capable of holding an IC chip or the like, and may be appropriately determined from the final thickness of the IC card to be used.
  • the number of foam sheets may be one, but an IC chip or the like may be incorporated between two layers of foam sheets, or a sheet composed of two or more layers of foam sheets may be used. It may be incorporated in between.
  • an over sheet can be provided outside the foam sheet.
  • the material used for the oversheet is not particularly limited, but it has good adhesiveness to the foam sheet, so that the foam sheet can be adhered at the same time as the foam sheets are adhered to each other. Therefore, non-foamed chloride-based sheets (non-foamed PVC sheets) are preferably used.
  • the oversheet may be a transparent sheet or an opaque sheet, and the oversheet may be printed in advance or may be printed after pressing.
  • the oversheet may be laminated on one side or both sides of the foam sheet.
  • a heat-sensitive rewritable recording medium capable of repeating printing by heating and erasing of printing may be applied to the surface of the oversheet after pressing.
  • a skin layer may be provided on a surface of the foam sheet that is not in contact with the IC chip or the like, and a skin layer may be provided on one surface of the foam sheet or on both surfaces. It may be.
  • the skin layer is a printable layer having a smooth surface.
  • a white chloride chloride film or the like is used as the skin layer.
  • a plurality of sets of antenna loop coils, IC chips and the like are arranged at predetermined positions between two foam sheets having a suitable foaming ratio. Overlap the oversheet on the outside and put it on two While sandwiched between chrome-plated steel sheets, heat and apply pressure while evacuated to a vacuum to crush bubbles in the foam sheet. After cooling to room temperature, it is punched into a card shape. Get the card.
  • the antenna loop coil, IC chip, etc. were made into one set, and many sets of IC chips, etc. were arranged on the polymer layer at equal intervals in consideration of the desired card size, etc., and temporarily fixed with an adhesive. .
  • This sheet was punched into a set of IC chips and the like to finish it into a card shape, and a non-contact IC card was manufactured.
  • the number of turns of the coil for the antenna can be appropriately selected according to the method of using the card.
  • the foamed sheet is a foamed vinyl chloride sheet, it is not necessary to provide a transparent sheet. Further, the two foam sheets sandwiching the IC chip or the like may be composed of a plurality of foam sheets, respectively.
  • the non-contact type IC card of the present invention has a skin layer
  • the skin layer is provided by being melted and integrated on one surface of the foamed sheet.
  • An IC chip or the like is arranged on the surface of the sheet where the skin layer is not provided, and a non-contact type IC force is manufactured as described above.
  • the obtained foamed polyvinyl chloride sheet was cut into a width of 30 cm and a length of 40 cm, and a 4-turn antenna loop coil in which a copper wire with a wire diameter of 0.15 was turned four times, and a length of 5 mm X 5 mm IC chips with a size of 0.35 mm and a thickness of 0.35 mm are arranged at equal intervals in consideration of the desired card size, temporarily fixed with a cyanoacrylate-based instant adhesive, and sandwiched between the IC chips, etc. In this way, the foamed vinyl chloride sheets cut to 30 cm in width and 40 cm in length were stacked.
  • a non-foamed PVC sheet, a foamed vinyl chloride sheet temporarily fixed with a loop coil for an antenna or an IC chip (COB), a foamed vinyl chloride sheet, and a non-foamed PVC sheet are stacked in this order.
  • One sheet on each side was sandwiched between two chrome plated steel sheets. Subsequently, in a vacuum-sucked atmosphere, this state was maintained under the conditions of a press temperature of 140 ° C. and a press pressure of 20 kgZcm 2 until the bubbles in the foam sheet were completely crushed.
  • the mixture was cooled to room temperature, and cut into a card shape to produce a non-contact type IC card of Example 1.
  • the resulting card had a laminated sheet thickness of 800 m after pressing.
  • the sheet No. 1 in Table 2 was used as the non-foamed vinyl chloride sheet (non-foamed PVC), and the sheet No. 3 was used as the foamed vinyl chloride-based sheet. .
  • Noncontact IC cards of Examples 2 to 4 and Comparative Example were produced in the same manner as in Example 1 except that the combination of sheets was changed as shown in Table 3.
  • the surface smoothness of the obtained non-contact type IC cards of Examples 1 to 4 and Comparative Example 1 was visually judged. Table 3 summarizes the results. However, in the criteria for determining the surface smoothness, a symbol “ ⁇ ” indicates a favorable state without distortion, and a symbol “X” indicates a large distortion.
  • Comparative Example 1 had poor surface smoothness, but Examples 1 to 4 had no distortion and excellent surface smoothness. In Examples 1 to 4, similar results can be obtained even when a non-foamed PVC sheet is provided as an oversheet and a power oversheet is not provided.
  • Example 5
  • An antenna circuit was formed by bonding a 30-micron-thick copper foil to one side of a 100-micron-thick white vinyl chloride sheet, followed by etching.
  • a through hole for inserting the IC chip is formed in the sheet at the end of the formed circuit, and an IC chip of 5 mm X 5 mm and 0.35 mm thickness is used as an antenna through contacts.
  • Joined with the circuit In this form, both sides of the plastic sheet are sandwiched between sheets of sheet No. 4 in Table 2, and both sides of the sheet are made of a 50-micron thick transparent vinyl chloride sheet obtained by Formulation A in Table 1.
  • the press temperature 1 in a state of vacuum suction 4 0 ° C, under the conditions of a press pressure 2 0 kg / cm 2, collapsing air bubbles in the foam sheet total This state was maintained until the end. Thereafter, while maintaining the state in which the bubbles were crushed, the mixture was cooled to room temperature and punched into a card shape to obtain a non-contact IC force of Example 5.
  • the resulting card had a thickness of 800 microns.
  • both sides of the sheet were sandwiched between transparent vinyl chloride sheets having a thickness of 80 ⁇ m obtained by Formulation A in Table 1, and then sandwiched between two chrome plated steel sheets. This condition was maintained under the conditions of 40 ° C. and a press pressure of 20 kg / cm 2 until all the bubbles in the foam sheet were crushed. Thereafter, while maintaining the state in which the bubbles were crushed, the mixture was cooled to room temperature and punched into a card shape to obtain a non-contact IC card of Example 6. The resulting card had a thickness of 800 microns.
  • the non-contact IC card of the present invention does not require counterboring or drilling, and therefore has no sink marks and excellent surface smoothness. Further, since the non-contact type IC card of the present invention had a smooth surface, the printed pattern had no distortion and was excellent in printability.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à circuit intégré sans contact, qui est exempte de dépressions en surface et présente un excellent lissé de surface. Cette carte comprend une bobine de cadre d'antenne et une puce à circuit intégré, ces deux éléments étant incorporés à une feuille de chlorure de vinyle qui a été expansée de façon que la bobine de cadre et la puce à circuit intégré puissent y être enterrées.
PCT/JP1998/002125 1997-05-27 1998-05-14 Carte a circuit integre sans contact et son procede de production WO1998054002A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU72374/98A AU7237498A (en) 1997-05-27 1998-05-14 Non-contact ic card and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9/136751 1997-05-27
JP13675197A JPH10305681A (ja) 1997-03-07 1997-05-27 非接触式ｉｃカードおよびその製造方法

Publications (1)

Publication Number Publication Date
WO1998054002A1 true WO1998054002A1 (fr) 1998-12-03

Family

ID=15182660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/002125 WO1998054002A1 (fr) 1997-05-27 1998-05-14 Carte a circuit integre sans contact et son procede de production

Country Status (4)

Country Link
KR (1) KR20010013016A (fr)
AU (1) AU7237498A (fr)
TW (1) TW367467B (fr)
WO (1) WO1998054002A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042569A1 (fr) * 1999-01-13 2000-07-20 Brady Worldwide, Inc. Étiquette rfid stratifiee et son procede de fabrication

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020081826A (ko) * 2001-04-19 2002-10-30 주식회사 쓰리비 시스템 비접촉식 아이씨칩 카드

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251449A (ja) * 1987-04-06 1988-10-18 Nippon Carbide Ind Co Ltd 耐熱性熱可塑性樹脂組成物
JPH0535355U (ja) * 1991-10-24 1993-05-14 ソニーケミカル株式会社 プラスチツクカード
JPH05201186A (ja) * 1992-01-30 1993-08-10 Mitsubishi Electric Corp 非接触形携帯記憶装置
JPH09286189A (ja) * 1996-04-24 1997-11-04 Sony Chem Corp Ｉｃカード及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251449A (ja) * 1987-04-06 1988-10-18 Nippon Carbide Ind Co Ltd 耐熱性熱可塑性樹脂組成物
JPH0535355U (ja) * 1991-10-24 1993-05-14 ソニーケミカル株式会社 プラスチツクカード
JPH05201186A (ja) * 1992-01-30 1993-08-10 Mitsubishi Electric Corp 非接触形携帯記憶装置
JPH09286189A (ja) * 1996-04-24 1997-11-04 Sony Chem Corp Ｉｃカード及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042569A1 (fr) * 1999-01-13 2000-07-20 Brady Worldwide, Inc. Étiquette rfid stratifiee et son procede de fabrication
US6429831B2 (en) 1999-01-13 2002-08-06 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6569508B2 (en) 1999-01-13 2003-05-27 Brady Worldwide, Inc. Label having a protective cavity and method of manufacture

Also Published As

Publication number Publication date
AU7237498A (en) 1998-12-30
TW367467B (en) 1999-08-21
KR20010013016A (ko) 2001-02-26

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