WO1998014302A1 - A method of processing a material by means of a laser beam - Google Patents

A method of processing a material by means of a laser beam Download PDF

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Publication number
WO1998014302A1
WO1998014302A1 PCT/DK1997/000412 DK9700412W WO9814302A1 WO 1998014302 A1 WO1998014302 A1 WO 1998014302A1 DK 9700412 W DK9700412 W DK 9700412W WO 9814302 A1 WO9814302 A1 WO 9814302A1
Authority
WO
WIPO (PCT)
Prior art keywords
focal points
cutting
laser beam
adjacent
focal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DK1997/000412
Other languages
English (en)
French (fr)
Other versions
WO1998014302B1 (en
Inventor
Steen Erik Nielsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Force Technology
Original Assignee
Force Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26065164&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1998014302(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to EP97942816A priority Critical patent/EP0929376B2/en
Priority to JP10516153A priority patent/JP2001501133A/ja
Priority to DK97942816T priority patent/DK0929376T4/da
Priority to US09/269,197 priority patent/US6175096B1/en
Priority to DE69710346T priority patent/DE69710346T3/de
Application filed by Force Technology filed Critical Force Technology
Priority to AU44513/97A priority patent/AU4451397A/en
Priority to AT97942816T priority patent/ATE211668T1/de
Publication of WO1998014302A1 publication Critical patent/WO1998014302A1/en
Publication of WO1998014302B1 publication Critical patent/WO1998014302B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing

Definitions

  • the invention relates to a method of processing a material with a first and a second surface by means of a laser beam which for instance by means of a multilens objective is focused in a number of focal points, where said focal points are approximately positioned on a common axis forming an angle with the first surface and are spaced apart.
  • German Auslegeschrift No. 2,71 3,904 discloses a way of processing an article by means of a laser beam, said laser beam being focused in two focal points by means of a multilens objective.
  • This processing method is used for drilling holes, whereby one focused bundle of rays is used for a melting of the surface of the article and the second bundle of rays presents a focal point positioned below the focal point of the first bundle of rays and is used for preheating the area surrounding the location of the article to be melted so as subsequently to be removed by way of evaporation.
  • Such a processing method avoids to a certain degree formation of burrs at the edge of the hole.
  • the lower focal point is, however, not utilized.
  • the second surface of the material is encumbered with problems of an increased amount of adhering slags and a poor cutting quality, which inter alia results in a poor separation of the cut parts and may necessitate a finishing processing.
  • the object of the invention is to provide a method of processing material by means of a laser, which ensures an improved processing quality in connection with thick materials. Furthermore, the expenditure of protecting gases must be low.
  • a method of the above type is according to the invention used for cutting plates, whereby several focal points are utilized for melting/cutting the plate material.
  • the multilens objective has the effect that the total bundle of rays is relatively narrow, whereby the nozzle for protecting gases and consequently the expenditure of said protecting gases can be reduced correspondingly. It is well known that the protecting gases are very important for the quality and the cut.
  • the focal points are positioned at a fixed distance relative to one another and to the first and the second surface.
  • the distance between the head com- prising the optical instruments and the first surface can be increased in such a manner that the focal point adjacent the second surface during the cutting can be caused to be positioned on the first surface, the so-called starting holes thereby being provided in an improved manner.
  • the risk of the optical instrument being damaged by metal sprayings has been reduced.
  • a further advantage is found in connection with ignition, melting and removal of melt and slags by at least one of the focal points being positioned between the first and the second surface, adjacent the second surface or adjacent the first and the second surface, respectively.
  • the focusing optical instruments focus the laser beam in several focal points, the distance of which from the second surface is increased concurrently with an increasing distance of the light from the central axis of the laser beam in such a manner that the central portion of the laser beam is focused in the focal point adjacent the second surface.
  • Fig. 1 a illustrates a laser cutting head with transmittent optical instruments
  • Fig. 1 b illustrates a laser cutting head with reflecting optical instruments
  • Fig. 2a shows a transmittent optical instrument forming three focal points
  • Fig. 2b shows a reflecting optical instrument forming three focal points
  • Fig. 3a illustrates the cutting head of Fig. 1 a at a distance from the sur ⁇ face
  • Fig. 3b ⁇ illustrates the cutting head of Fig. 1 b at a distance from the surface.
  • a plate 6 to be cut by means of a laser is shown.
  • the plate comprises a first surface 8 and a second surface 9.
  • a movable, integrated optics/nozzle system, also called a cutting head 1 0, is provided above the first surface 8 of the plate 6.
  • the cutting head 10 is movable in a plane parallel to the first surface 8 of the material to be cut in, whereby optional shapes can be cut in said material. The latter is known per se and is therefore not discussed in greater detail.
  • the cutting head 1 0 is movable to a predetermined degree perpendicular to the first surface 8 in such a manner that during the cutting it can enter an optimum distance relative to a flow of cutting gas and the focusing of the laser beam 2.
  • the cutting head 1 0 comprises a pressure chamber 3 with an inlet opening 4 allowing a continuous filling of cutting gases into said pressure chamber 3, as well as an outlet opening 5 directing the gas towards the cutting location.
  • the gas used depends on the material to be cut, but typically it is oxygen in connection with ordinary steel to be burnt away, or an inert gas, such as nitrogen, in connection with stainless steel being melt away.
  • the cutting head 1 0 comprises an optical instrument 1.a, 1 b, 21 a, 21 b focusing a laser beam 2 in a number of focal points F F 2 , ,
  • FIGS. 1 a and 1jb are diagrammatic vies of a cutting notch 7, in which the focal point F is positioned.
  • the optical instrument 1 a, 1 b is formed such that the central portion of the instrument, i.e. within d 2 , focuses the central portion of the laser beam 2 in the focal point F 2 adjacent the second surface 9 of the material, whereas the circumferential portion outside d 2 focuses the outer portion of said laser beam 2 in the focal point F 1 adjacent the first surface 8 of the material.
  • the focal point F 1 is placed above the surface 8 in view of the cutting, but it is also possible to place all the focal points F-, , F 2 , ...., F n between the first and the second surface 8, 9.
  • the optical instrument can be structured in many ways.
  • the Figures illu- strate simple embodiments using a lens 1 a or a mirror 1 b.
  • FIGS. 2a and 2b show embodiments of optical instruments 21 a, 21jb with several focal points F 1 r F 2 , ..., F n , only three being illustrated for the sake of clarity.
  • the focal points of respective concentric portions of the optical instrument 21 a., 21 b are formed such that the focal length decreases concurrently with an increasing distance from the centre.
  • the distance between the entire cutting head 1 0 and the first surface is variable in such a manner that during the starting procedure it can be increased whereby the focal point F 2 ordinarily positioned adjacent the second surface 9 during the cutting can be caused to be positioned on the first surface.
  • the resultingly increased distance between the cutting head 10 and the first surface 8 reduces the risk of sprayings of melt material returning through the nozzle 5 so as to destroy the optical instruments 1 a, 1 b, cf.
  • Figures 3a and 3b where the diagrammatic cutting notch 7 has been maintained for illustrative reasons so as to provide an improved view of the beam passage, but said notch does not, of course, exist before the cutting has been initiated.
  • the embodiments include simple lens members, it is also possible to use more complicated arrangements, such as combinations of lenses which in combination form the desired number of focal points.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
PCT/DK1997/000412 1996-09-30 1997-09-30 A method of processing a material by means of a laser beam Ceased WO1998014302A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT97942816T ATE211668T1 (de) 1996-09-30 1997-09-30 Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung
JP10516153A JP2001501133A (ja) 1996-09-30 1997-09-30 レーザービームによる材料の加工方法
DK97942816T DK0929376T4 (da) 1996-09-30 1997-09-30 Fremgangsmåde tl bearbejdning af et materiale ved hjælp af en laserstråle
US09/269,197 US6175096B1 (en) 1996-09-30 1997-09-30 Method of processing a material by means of a laser beam
DE69710346T DE69710346T3 (de) 1996-09-30 1997-09-30 Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung
EP97942816A EP0929376B2 (en) 1996-09-30 1997-09-30 A method of processing a material by means of a laser beam
AU44513/97A AU4451397A (en) 1996-09-30 1997-09-30 A method of processing a material by means of a laser beam

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DK1067/96 1996-09-30
DK106796 1996-09-30
DK1091/97 1997-09-23
DK109197A DK109197A (da) 1996-09-30 1997-09-23 Fremgangsmåde til bearbejdning af et materiale ved hjælp af en laserstråle

Publications (2)

Publication Number Publication Date
WO1998014302A1 true WO1998014302A1 (en) 1998-04-09
WO1998014302B1 WO1998014302B1 (en) 1998-05-07

Family

ID=26065164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK1997/000412 Ceased WO1998014302A1 (en) 1996-09-30 1997-09-30 A method of processing a material by means of a laser beam

Country Status (10)

Country Link
US (1) US6175096B1 (https=)
EP (1) EP0929376B2 (https=)
JP (1) JP2001501133A (https=)
AT (1) ATE211668T1 (https=)
AU (1) AU4451397A (https=)
DE (1) DE69710346T3 (https=)
DK (2) DK109197A (https=)
ES (1) ES2171273T5 (https=)
PT (1) PT929376E (https=)
WO (1) WO1998014302A1 (https=)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001021353A1 (en) * 1999-09-17 2001-03-29 Isis Innovation Limited Laser apparatus for use in material processing
FR2803550A1 (fr) * 2000-01-10 2001-07-13 Air Liquide Procede et installation de coupage laser d'acier inoxydable ou revetu, ou d'aluminium et d'alliages avec optique bifocale
FR2803549A1 (fr) * 2000-01-10 2001-07-13 Air Liquide Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale
DE19961918A1 (de) * 1999-12-21 2001-07-19 Highyag Lasertechnologie Gmbh Variables Doppelfokusformungsmodul und Verfahren zu seiner Anwendung
EP1238747A1 (fr) * 2001-03-09 2002-09-11 L'air Liquide, S.A. à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédés Georges Claude Procédé et installation de coupage laser avec optique à bifocales et gaz d'assistance à base d'hydrogène
FR2826892A1 (fr) * 2001-07-03 2003-01-10 Air Liquide Procede et installation de soudage laser avec melange gazeux ar/he a teneurs controlees en fonction de la puissance laser
US6664504B2 (en) * 2000-12-13 2003-12-16 L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and plant for laser cutting with dual-flow and double-focus cutting head
EP1371446A1 (fr) 2002-06-14 2003-12-17 L'Air Liquide S. A. à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédés Georges Claude Utilisation de mélanges gazeux hélium/azote en soudage laser de flancs raboutés
US6753500B2 (en) 2001-07-06 2004-06-22 Data Storage Institute Method and apparatus for cutting a substrate using laser irradiation
US6831248B2 (en) 2002-06-14 2004-12-14 L'air Liquide, S.A. Use of helium/nitrogen gas mixtures for the laser welding of stainless steel pipes
FR2880566A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec une lentille revetue de baf2
FR2880567A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur
FR2880568A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur
US7385158B2 (en) 2002-01-11 2008-06-10 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and installation for laser welding with a N2/He gas mixture, the N2/He content being controlled according to the laser power
US7772519B2 (en) 2001-11-26 2010-08-10 Semiconductor Energy Laboratory Co., Ltd Laser irradiation apparatus, laser irradiation method, and manufacturing method for a semiconductor device
CN102230983A (zh) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 用于激光加工的光学元件及激光加工设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
FR2828825B1 (fr) * 2001-08-22 2003-12-26 Air Liquide Procede et installation de coupage par faisceau laser utilisant un objectif a multifocales et une tuyere convergente/divergente
US8247731B2 (en) * 2002-02-25 2012-08-21 Board Of Regents Of The University Of Nebraska Laser scribing and machining of materials
ES2639733T3 (es) 2002-03-12 2017-10-30 Hamamatsu Photonics K.K. Método de división de sustrato
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
CN1758985A (zh) 2003-03-12 2006-04-12 浜松光子学株式会社 激光加工方法
US7812016B2 (en) * 2003-05-13 2010-10-12 Smithkline Beecham Corporation Naphthyridine integrase inhibitors
FR2855084A1 (fr) * 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
GB2402230B (en) * 2003-05-30 2006-05-03 Xsil Technology Ltd Focusing an optical beam to two foci
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7060934B2 (en) * 2003-12-04 2006-06-13 Universal Laser Systems, Inc. High resolution laser beam delivery apparatus
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4716663B2 (ja) * 2004-03-19 2011-07-06 株式会社リコー レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体
JP2005324248A (ja) * 2004-04-15 2005-11-24 Denso Corp レーザ加工方法及びレーザ加工装置
JP4800661B2 (ja) * 2005-05-09 2011-10-26 株式会社ディスコ レーザ光線を利用する加工装置
CN1962154A (zh) * 2005-11-10 2007-05-16 鸿富锦精密工业（深圳）有限公司 模仁加工装置及加工方法
DE102007024701A1 (de) 2007-05-25 2008-11-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialabtragung sowie Vorrichtung zur Durchführung des Verfahrens
DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
US20100072182A1 (en) * 2008-09-25 2010-03-25 Air Liquide Industrial Us Lp Fiber Laser Cutting Process with Multiple Foci
FR2952315B1 (fr) * 2009-11-10 2012-01-20 Inovalaser Dispositif universel a laser pour l'usinage et/ou l'assemblage de pieces
DE102010007323A1 (de) 2010-02-08 2011-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 Verfahren zum Bestimmen des Schneidergebnisses eines Laserschneidprozesses
EP2774713A1 (de) * 2013-03-07 2014-09-10 Siemens Aktiengesellschaft Laserverfahren mit unterschiedlichen Laserstrahlbereichen innerhalb eines Strahls und Vorrichtungen
CN103551732A (zh) * 2013-11-13 2014-02-05 苏州德龙激光股份有限公司 激光切割装置及切割方法
CN112427812B (zh) * 2020-09-22 2022-09-09 厦门云天半导体科技有限公司 一种通过间距性超微细激光通孔实现超薄工件分离的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2713904A1 (de) * 1977-03-29 1978-10-05 Siemens Ag Verfahren und vorrichtung zur herstellung von mittels laserstrahl erzeugten gratfreien bohrungen
DE4034745A1 (de) * 1989-10-30 1991-07-18 Univ Schiller Jena Verfahren zur lasermaterialbearbeitung mit dynamischer fokussierung
US5521352A (en) * 1993-09-23 1996-05-28 Laser Machining, Inc. Laser cutting apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122690A (en) * 1980-02-28 1981-09-26 Nec Corp Laser welding device
JPS63299881A (ja) * 1987-05-30 1988-12-07 Toshiba Corp レ−ザ光集光装置
JPS6448692A (en) * 1987-08-20 1989-02-23 Mitsubishi Heavy Ind Ltd Multifocusing laser beam condensing device
JPH0767633B2 (ja) † 1987-11-30 1995-07-26 三菱重工業株式会社 同軸多焦点式レーザビーム集光装置
US5063280A (en) * 1989-07-24 1991-11-05 Canon Kabushiki Kaisha Method and apparatus for forming holes into printed circuit board
JPH05138385A (ja) † 1991-11-14 1993-06-01 Toshiba Corp レーザ加工方法及びその装置
JPH08108289A (ja) † 1994-10-07 1996-04-30 Sumitomo Electric Ind Ltd レーザ加工用光学装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2713904A1 (de) * 1977-03-29 1978-10-05 Siemens Ag Verfahren und vorrichtung zur herstellung von mittels laserstrahl erzeugten gratfreien bohrungen
DE4034745A1 (de) * 1989-10-30 1991-07-18 Univ Schiller Jena Verfahren zur lasermaterialbearbeitung mit dynamischer fokussierung
US5521352A (en) * 1993-09-23 1996-05-28 Laser Machining, Inc. Laser cutting apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Vol. 13, No. 237; & JP,A,01 048 692 (MITSUBISHI HEAVY IND LTD), 23 February 1989. *
PATENT ABSTRACTS OF JAPAN, Vol. 5, No. 206; & JP,A,56 122 690 (NIPPON DENKI K.K.), 26 Sept. 1981. *

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WO2001021353A1 (en) * 1999-09-17 2001-03-29 Isis Innovation Limited Laser apparatus for use in material processing
DE19961918A1 (de) * 1999-12-21 2001-07-19 Highyag Lasertechnologie Gmbh Variables Doppelfokusformungsmodul und Verfahren zu seiner Anwendung
DE19961918C2 (de) * 1999-12-21 2002-01-31 Highyag Lasertechnologie Gmbh Variables Doppelfokusformungsmodul und Verfahren zu seiner Anwendung
US6521864B2 (en) 2000-01-10 2003-02-18 L'air Liquide Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitatiion Des Procedes Georges Claude Method and apparatus for the laser cutting of mild steel or structural steel with a multifocus optical component
FR2803550A1 (fr) * 2000-01-10 2001-07-13 Air Liquide Procede et installation de coupage laser d'acier inoxydable ou revetu, ou d'aluminium et d'alliages avec optique bifocale
FR2803549A1 (fr) * 2000-01-10 2001-07-13 Air Liquide Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale
EP1120187A1 (fr) * 2000-01-10 2001-08-01 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Procédé et installation de coupage laser d'acier inoxydable ou revêtu, ou d'aluminium et alliages avec optique bifocale
EP1147848A1 (fr) * 2000-01-10 2001-10-24 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Procédé et installation de coupage laser d'acier doux ou de construction avec optique multifocale
AU771021B2 (en) * 2000-01-10 2004-03-11 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and apparatus for the laser cutting of mild steel or structural steel with a multifocus optical component
US6664504B2 (en) * 2000-12-13 2003-12-16 L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and plant for laser cutting with dual-flow and double-focus cutting head
FR2821776A1 (fr) * 2001-03-09 2002-09-13 Air Liquide Procede et installation de coupage laser avec optique a brifocales et gaz d'assistance a base d'hydrogene
EP1238747A1 (fr) * 2001-03-09 2002-09-11 L'air Liquide, S.A. à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédés Georges Claude Procédé et installation de coupage laser avec optique à bifocales et gaz d'assistance à base d'hydrogène
FR2826892A1 (fr) * 2001-07-03 2003-01-10 Air Liquide Procede et installation de soudage laser avec melange gazeux ar/he a teneurs controlees en fonction de la puissance laser
WO2003004213A1 (fr) 2001-07-03 2003-01-16 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Procede et installation de soudage laser avec melange gazeux ar/he a teneurs controlees en fonction de la puissance laser
US6753500B2 (en) 2001-07-06 2004-06-22 Data Storage Institute Method and apparatus for cutting a substrate using laser irradiation
US7772519B2 (en) 2001-11-26 2010-08-10 Semiconductor Energy Laboratory Co., Ltd Laser irradiation apparatus, laser irradiation method, and manufacturing method for a semiconductor device
US7385158B2 (en) 2002-01-11 2008-06-10 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and installation for laser welding with a N2/He gas mixture, the N2/He content being controlled according to the laser power
US6831248B2 (en) 2002-06-14 2004-12-14 L'air Liquide, S.A. Use of helium/nitrogen gas mixtures for the laser welding of stainless steel pipes
EP1371446A1 (fr) 2002-06-14 2003-12-17 L'Air Liquide S. A. à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédés Georges Claude Utilisation de mélanges gazeux hélium/azote en soudage laser de flancs raboutés
FR2880567A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur
FR2880568A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur
EP1681126A1 (fr) 2005-01-12 2006-07-19 L'air liquide - Societe anonyme a directoire et conseil de surveillance pour l'etude et l'exploitation des procedes G. Claude Coupage laser avec lentille à double focale de pièces métalliques de faible épaisseur
EP1681127A1 (fr) * 2005-01-12 2006-07-19 L'air Liquide S.A. Coupage laser avec lentille à double focale de pièces métalliques de forte épaisseur
FR2880566A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec une lentille revetue de baf2
CN102230983A (zh) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 用于激光加工的光学元件及激光加工设备

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ATE211668T1 (de) 2002-01-15
DK0929376T4 (da) 2007-07-23
AU4451397A (en) 1998-04-24
EP0929376A1 (en) 1999-07-21
JP2001501133A (ja) 2001-01-30
DE69710346D1 (de) 2002-03-21
ES2171273T5 (es) 2007-11-16
EP0929376B2 (en) 2007-04-04
DK109197A (da) 1998-03-31
DE69710346T3 (de) 2007-10-31
PT929376E (pt) 2002-06-28
EP0929376B1 (en) 2002-01-09
DE69710346T2 (de) 2002-10-24
US6175096B1 (en) 2001-01-16
DK0929376T3 (da) 2002-04-08

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