WO1998007114A1 - Datenträger zur übertragung von elektrischen signalen - Google Patents
Datenträger zur übertragung von elektrischen signalen Download PDFInfo
- Publication number
- WO1998007114A1 WO1998007114A1 PCT/DE1997/001503 DE9701503W WO9807114A1 WO 1998007114 A1 WO1998007114 A1 WO 1998007114A1 DE 9701503 W DE9701503 W DE 9701503W WO 9807114 A1 WO9807114 A1 WO 9807114A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor chip
- data carrier
- carrier according
- cardboard
- induction coil
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a data carrier according to the preamble of claim 1.
- Such a data carrier has become known from EP 0710919 A2.
- This comprises an electronic module with an integrated circuit (semiconductor chip) and a wire-wound coil, the integrated circuit resting directly on the wound coil.
- the coil is encapsulated with a potting compound in the area of the integrated circuit.
- Data carriers of the generic type are known, in particular, in the form of a contactless chip card designed in the form of a credit card, which can be used in an extremely versatile manner due to its high functional flexibility.
- chip cards in the form of health insurance cards, flextime recording cards, telephone cards and the like, there will in particular be applications in future in local public transport where as many people as possible have to be recorded in the shortest possible time. In such applications, contactless offer
- Chip cards have advantages over contact-based chip cards in that the former are not necessarily in a reading or Must be plugged in, but function without contact over a distance of up to a few meters.
- the contactless chip card offers the advantage that no technical elements are visible on the card surface, so that the optical design of the card surface is not restricted by magnetic strips or contact areas.
- the disadvantages of the contactless chip cards currently available are primarily the additional components, such as transmission coils or capacitor plates, which have to be integrated into the card.
- the electronics required in the contactless chip card for the contactless transmission of electrical signals to the reading or writing station are more complex.
- circuits are suitable for this purpose which enable signal transmission by means of microwaves, optical signals, capacitive or inductive coupling, the capacitive and inductive coupling being the most suitable due to the flat design of the chip card.
- Most contactless cards are currently being transmitted inductively, which can be used to implement both data and energy transmission.
- One or more induction coils are thus integrated in the card body and are suitably contacted with the circuit located on the semiconductor chip.
- the transmission of electrical signals is based on the principle of the loosely coupled transformer, the carrier frequency being, for example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz.
- induction coils with an opposite to the bottom surface of the semiconductor chips of the order about 10 mm 2 substantially larger coil areas of typically from about 30 to 40 cm 2 is required, the induction coil having as a rule only a few turns and is formed flat.
- the semiconductor components are mounted in the form of prefabricated modules or directly as a chip on the etched coil.
- the card is laminated into the card body, with intermediate foils, if necessary provided with punched-outs, being inserted as ticking foils for the purpose of volume compensation during lamination.
- the contactless chip cards used so far were all made with all-plastic materials and mostly in outer dimensions that correspond to the ISO standard dimensions. Characteristic of these standard specifications is furthermore a high mechanical flexibility of the card body, which, however, requires special measures to protect the semiconductor chip, which is very sensitive to bending or torsional stress, which results in a complex and consequently costly production and assembly effort for the contactless chip card.
- the contactless chip cards, which are to be manufactured according to the ISO standard consist of individual plastic layers that are laminated on top of each other.
- the production of the card structure, which generally consists of six to seven plastic layers, and the subsequent surface design with regard to labeling and provision of a coating layer are particularly complex. The associated high manufacturing costs of such contactless chip cards cannot usually be borne by all desired applications.
- the present invention has for its object a
- the data carrier body has two cardboard or paper layers, between which a stiffening at least partially surrounding the semiconductor chip element is introduced.
- the stiffening element is formed at least in regions by the turns of the induction coil.
- Deviating from the ISO standard specifications a data carrier that can be manufactured extremely inexpensively is proposed in the sense of a low-cost chip card that does without the all-plastic body.
- the overall strength of the data carrier according to the invention can be increased compared to the ISO standard specifications, so that special measures for protecting the semiconductor chip, as are required in the previous chip cards according to the ISO standard, can be omitted.
- the windings of the induction coil inserted between the two cardboard or paper layers are arranged at the same height and at the same mounting level as the semiconductor chip or the semiconductor chip housing and thus at the same time as a stiffening element
- the turns of the induction coil which are made of enamelled wire, have a diameter of at least 200 ⁇ m, in particular preferably of at least 500 ⁇ m.
- the induction coil inserted between the two cardboard or paper layers is assigned a coil core, in particular ferrite core, which at least partially surrounds the semiconductor chip or a semiconductor chip housing or at least approximately positively accommodates it, and its overall height and mounting level in turn that of the semiconductor chip or the semiconductor chip housing corresponds.
- the coil core like the turns of the induction coil made of thick wire, serves as a stiffening element for mechanical protection of the semiconductor chip.
- the data carrier according to the invention differs from Known all-plastic chip cards are significantly more resistant to bending, making special protective measures for the semiconductor chip against mechanical loads unnecessary.
- the two cardboard or paper layers of the data carrier body are provided with an adhesive or adhesive layer on their surface facing the semiconductor chip.
- the adhesive or adhesive layer is used both to assemble the data carrier body and the components to be inserted therein, and to compensate for differences in height of the individual components.
- a more than about 20 ⁇ m thick, cold-adhesive layer is preferably used for the adhesive and adhesive layer.
- a support frame inserted between the two cardboard or paper layers is provided at the edge region of the data carrier body.
- a coil or ferrite core with a height of preferably 500 ⁇ m is first wrapped with enamelled wire, which likewise has a thickness of approximately 500 ⁇ m.
- the semiconductor chip provided with the integrated electronic circuit is installed in a module housing, which is typical for semiconductor chips and consists of a lead frame and an overmold molding compound.
- the semiconductor chip housing is then positively inserted into the coil core, which is provided with a suitably designed receiving opening for this purpose.
- the total thickness of the module housing is again preferably approximately 500 ⁇ m.
- the coil core can be surrounded with an additional support frame with a height of about 500 ⁇ m to further increase the rigidity.
- the blank produced in this way consisting of a chip module, coil core and turns of the induction coil
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR9711618A BR9711618A (pt) | 1996-08-08 | 1997-07-16 | Portador de dados para a transmissÆo de sinais el-tricos |
EP97935432A EP0978094A1 (de) | 1996-08-08 | 1997-07-16 | Datenträger zur übertragung von elektrischen signalen |
JP10509276A JP2000516362A (ja) | 1996-08-08 | 1997-07-16 | 電気信号を伝送するためのデータ担体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19632117.4 | 1996-08-08 | ||
DE19632117A DE19632117C1 (de) | 1996-08-08 | 1996-08-08 | Datenträger zur kontaktlosen Übertragung von elektrischen Signalen |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998007114A1 true WO1998007114A1 (de) | 1998-02-19 |
Family
ID=7802188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1997/001503 WO1998007114A1 (de) | 1996-08-08 | 1997-07-16 | Datenträger zur übertragung von elektrischen signalen |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0978094A1 (de) |
JP (1) | JP2000516362A (de) |
KR (1) | KR20000029797A (de) |
CN (1) | CN1227647A (de) |
BR (1) | BR9711618A (de) |
DE (1) | DE19632117C1 (de) |
WO (1) | WO1998007114A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006056324A2 (de) * | 2004-11-24 | 2006-06-01 | Bundesdruckerei Gmbh | Trägermaterial sowie verfahren zur herstellung eines wertdokumentes |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19840220A1 (de) * | 1998-09-03 | 2000-04-20 | Fraunhofer Ges Forschung | Transpondermodul und Verfahren zur Herstellung desselben |
DE19847088A1 (de) * | 1998-10-13 | 2000-05-18 | Ksw Microtec Ges Fuer Angewand | Flächig ausgebildeter Träger für Halbleiter-Chips und Verfahren zu seiner Herstellung |
JP3809056B2 (ja) * | 2000-09-14 | 2006-08-16 | 新光電気工業株式会社 | Icカード |
JP4567988B2 (ja) * | 2004-02-05 | 2010-10-27 | 株式会社日立製作所 | 紙状rfidタグおよびその製造方法 |
ITMI20042185A1 (it) * | 2004-11-15 | 2005-02-15 | Publict S P A | Tessere intelligenti senza contatto e procedimento per la loro fabbricazione |
EP1717730A1 (de) | 2005-04-20 | 2006-11-02 | VisionCard PersonalisierungsgmbH | Kontaktloser Datenträger mit thermosensitiver Deckschicht und Herstellungsverfahren |
DE102007022615A1 (de) * | 2007-05-15 | 2008-11-20 | Infineon Technologies Ag | Kontaktloses Übertragungssystem und Verfahren zum Herstellen desselben |
DE102010039156A1 (de) * | 2010-08-10 | 2012-02-16 | Robert Bosch Gmbh | Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung |
JP5810600B2 (ja) * | 2011-04-19 | 2015-11-11 | 凸版印刷株式会社 | カード製造方法 |
DE102020127160A1 (de) * | 2020-10-15 | 2022-04-21 | exceet Card Austria GmbH | Chipkarte |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0494996A (ja) * | 1990-08-10 | 1992-03-27 | Toshiba Corp | Icカード |
JPH04103399A (ja) * | 1990-08-23 | 1992-04-06 | Toshiba Corp | Icカード用基板 |
WO1992013318A1 (de) * | 1991-01-21 | 1992-08-06 | Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh | Trägerelement für integrierte halbleiter-schaltkreise, insbesondere zum einbau in chip-karten |
WO1994022110A1 (fr) * | 1993-03-18 | 1994-09-29 | Droz Francois | Procede de fabrication d'une carte comprenant au moins un element electronique et carte obtenue par un tel procede |
DE4403513A1 (de) * | 1994-02-04 | 1995-08-10 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte |
EP0669597A1 (de) * | 1994-02-24 | 1995-08-30 | Gemplus Card International | Verfahren zur Herstellung einer kontaktlosen Karte |
WO1996009175A1 (fr) * | 1994-09-22 | 1996-03-28 | Rohm Co., Ltd. | Carte de ci du type sans contact et procede de fabrication de cette carte |
EP0710919A2 (de) * | 1994-10-21 | 1996-05-08 | Giesecke & Devrient GmbH | Kontaktloses elektronisches Modul |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
-
1996
- 1996-08-08 DE DE19632117A patent/DE19632117C1/de not_active Expired - Fee Related
-
1997
- 1997-07-16 EP EP97935432A patent/EP0978094A1/de not_active Withdrawn
- 1997-07-16 CN CN97197123A patent/CN1227647A/zh active Pending
- 1997-07-16 WO PCT/DE1997/001503 patent/WO1998007114A1/de not_active Application Discontinuation
- 1997-07-16 BR BR9711618A patent/BR9711618A/pt unknown
- 1997-07-16 KR KR1019997000926A patent/KR20000029797A/ko not_active Application Discontinuation
- 1997-07-16 JP JP10509276A patent/JP2000516362A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0494996A (ja) * | 1990-08-10 | 1992-03-27 | Toshiba Corp | Icカード |
JPH04103399A (ja) * | 1990-08-23 | 1992-04-06 | Toshiba Corp | Icカード用基板 |
WO1992013318A1 (de) * | 1991-01-21 | 1992-08-06 | Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh | Trägerelement für integrierte halbleiter-schaltkreise, insbesondere zum einbau in chip-karten |
WO1994022110A1 (fr) * | 1993-03-18 | 1994-09-29 | Droz Francois | Procede de fabrication d'une carte comprenant au moins un element electronique et carte obtenue par un tel procede |
DE4403513A1 (de) * | 1994-02-04 | 1995-08-10 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte |
EP0669597A1 (de) * | 1994-02-24 | 1995-08-30 | Gemplus Card International | Verfahren zur Herstellung einer kontaktlosen Karte |
WO1996009175A1 (fr) * | 1994-09-22 | 1996-03-28 | Rohm Co., Ltd. | Carte de ci du type sans contact et procede de fabrication de cette carte |
EP0710919A2 (de) * | 1994-10-21 | 1996-05-08 | Giesecke & Devrient GmbH | Kontaktloses elektronisches Modul |
Non-Patent Citations (3)
Title |
---|
HELMUTH LEMME: "Der Mikrorechner in der Brieftasche", ELEKTRONIK, vol. 42, no. 26, 28 December 1993 (1993-12-28), MÜNCHEN, pages 70 - 80, XP000421410 * |
PATENT ABSTRACTS OF JAPAN vol. 16, no. 331 (M - 1282) 20 July 1992 (1992-07-20) * |
PATENT ABSTRACTS OF JAPAN vol. 16, no. 343 (M - 1285) 24 July 1992 (1992-07-24) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006056324A2 (de) * | 2004-11-24 | 2006-06-01 | Bundesdruckerei Gmbh | Trägermaterial sowie verfahren zur herstellung eines wertdokumentes |
WO2006056324A3 (de) * | 2004-11-24 | 2006-09-08 | Bundesdruckerei Gmbh | Trägermaterial sowie verfahren zur herstellung eines wertdokumentes |
Also Published As
Publication number | Publication date |
---|---|
DE19632117C1 (de) | 1997-12-18 |
EP0978094A1 (de) | 2000-02-09 |
JP2000516362A (ja) | 2000-12-05 |
BR9711618A (pt) | 1999-08-24 |
KR20000029797A (ko) | 2000-05-25 |
CN1227647A (zh) | 1999-09-01 |
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