CN1227647A - 传输电信号的数据载体 - Google Patents

传输电信号的数据载体 Download PDF

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CN1227647A
CN1227647A CN97197123A CN97197123A CN1227647A CN 1227647 A CN1227647 A CN 1227647A CN 97197123 A CN97197123 A CN 97197123A CN 97197123 A CN97197123 A CN 97197123A CN 1227647 A CN1227647 A CN 1227647A
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data carrier
semi
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conductor chip
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P·斯塔姆普卡
D·豪德奥
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Siemens AG
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Abstract

本发明涉及一种用于将电信号传输到读出或写入站的数据载体，此数据载体具有一个数据载体本体(2)，一个带有集成电子电路的半导体芯片(3)是构成在此数据载体本体中的。数据载体本体(2)具有两个纸板层或纸层(6，7)，一个至少部分地包围此半导体芯片(3)的加固元件(8)是置入在这些纸板层或纸层之间的。

Description

传输电信号的数据载体
本发明涉及按权利要求1的前序部分的一种数据载体。
从EP 0710919 A2中公开了一种这样的载体。此数据载体包括一个带有集成开关电路(半导体芯片)的电子模块和一个导线缠绕的线圈，在此集成开关电路直接位于缠绕的线圈上。在集成开关电路范围里此线圈是用浇注材料浇铸的。
从DE 44 03 513 A1中已公开了一种由纸和/或纸板组成的数据载体。在该文献中详述的各实施形式涉及有接点的各种芯片卡，这些芯片卡在其表面上载有接触式接点接通用的各接点面。还提及了此芯片卡也可配备一种适合于非接触式数据交换的电子模块。可是未说明这样的由纸或纸板组成无接点式芯片卡的详细细节。
按照现有方式的数据载体尤其以用信用卡规格构成的无接点式芯片卡的形式是众所周知的，基于高度的功能灵活性这种芯片卡得到了极其多种多样的应用。除了医疗保险卡、浮动工作时间采集卡、电话卡和类似的这样芯片卡的当今典型应用领域外，将来尤其在必须于尽量短的时间内掌握尽可能多的乘客的公共客运近距交通中得到应用。在这些应用中无接点芯片卡相对于有接点芯片卡所提供的优点在于，前者不必一定要插入读出或写入站，而是非接式经越这几米的距离起作用的。除了其它的优点外这种无接点芯片卡的优点在于在卡表面见不到各种技术元件，使得卡表面的外观造型不受到磁条或接点面的限制。在当今可供支配的各无接点芯片卡上的各缺点主要在于像应集成到卡中的传输线圈或电容器板那样的外加的各构件上。此外在无接点芯片卡中所必需的，用于无接点传输电信号到读出或写入站上的电子装置是比较昂贵的。能用微波、光信号、电容或电感耦合进行信号传输的各种电路原则上是适用于此的，在此由于芯片卡的扁平结构形式电容的和电感的耦合最有可能适合的。当今在大多数无接点卡上经电感途径进行传输，用此途径既可实现数据传输又可实现能量传输。因此一个或多个感应线圈是集成地构成在卡片本体中的，这些感应线圈是以合适的方式与位于半导体芯片上的电路接点接通的。按间隙耦合的变压器原理进行电信号的传输，在此载频例如位于100至300KHZ之间的范围内或几个MHZ上，尤其在13.56MHZ的工频上。为此需要各感应线圈，此感应线圈具有相对于数量级上约为10mm2的半导体芯片基面大得多的；典型地约为30至40cm2的各线圈面，在此感应线圈通常仅拥有少量匝数并且是构成为扁平的。通常以预制模块的形式安装这些半导体构件或者将这些半导体构件直接作为芯片安装到刻蚀的线圈上，随后将此以分离部件存在的芯片模块与感应线圈一起为制成芯片卡而层压入卡片本体中，在此对于在层压时的容积补偿必要时置入，配备有各冲剪孔的中间膜作为嵌入膜。
无例外地曾用全合成材料并且以符合ISO标准尺寸的各种外形尺寸来制作迄今采用的各种无接点芯片卡。除此之外对这些标准规定典型的是卡片本体的高度机械柔软性，这些标准规定却要求用于防护相对于弯曲或扭转负荷很敏感的半导体芯片的特别措施，这些措施导致无接点芯片卡的费事的和因此而成本高昂的制造和装配花费。这些应按ISO标准制作的无接点芯片卡由相互叠起层压的各合成材料单层组成。在此通常由六至七个合成材料层组成的卡片构造的制作和随此之后的从标文字和配备敷层方面的表面成型是特别费事的。通常无法由所有所希望的用途来承担这样的无接点芯片卡的与此相连的高额制造费用。
本发明的任务在于，提供一种用于将电信号传输到读出或写入站的数据载体，相对于迄今的具有合成材料本体的各无接点芯片卡可以成本有利得多地制造这些数据载体。
通过按权利要求1的数据载体解决此任务。
按本发明安排了数据载体本体具有两个纸板层或纸层，在这些层之间置入了一个至少部分地包围着半导体芯片的加固元件。按本发明的原理此加固元件至少区域性地由感应线圈的各线匝构成的。
与各ISO标准规定不一致地是在某种程度上从便宜芯片卡的意义上建议一种可极其价廉物美地制作的数据载体，这种便宜芯片卡放弃全合成材料本体。除此之外相对于各ISO标准规定按本发明数据载体的总厚度可以是增高的，以致于尤其可以去除像在迄今按ISO标准的各芯片卡上必要的防护半导体芯片的各种措施。
在本发明的特别优先的实施中考虑了，置入在两个纸板层或纸层之间的感应线圈的，反正已安排的各线匝是布置在像半导体芯片或半导体芯片壳体的相同高度上和相同安装平面上的，并且因此同时用作为在机械负荷前防护半导体芯片用的加固元件。为保证足够高的机械刚度感应线圈的由漆包线组成的各线匝拥有至少为200μm，尤其优先至少为500μm的直径。
此外可考虑给置入在两个纸板层或纸层之间的感应线圈添加一个线圈磁心，尤其是铁氧体磁心，此磁心至少部分地包围或至少近似型面啮合地容纳半导体芯片或半导体芯片壳体，并且磁心的结构高度和安装平面又相当于半导体芯片的或半导体壳体的结构高度和安装平面。在此此线圈磁心同样像由粗金属丝制作的感应线圈的线匝那样用作为半导体芯片机械防护用的加固元件。不同于前面已知的各全合成材料芯片卡按发明的数据载体总的说来明显地更有抗弯刚性，由此免去了相对于各机械负荷的半导体芯片的各特别防护措施。
在一种继续优先的实施中可以考虑，数据载体本体的两个纸板层或纸层在它们的各自朝向半导体芯片的表面上配备有一个粘结层或粘着层。此粘结层或粘着层在此既用来安装数据载体本体和应置入其中的各组成部分，也用来补偿各单个组成部分的各高度差。对此粘结和粘着层优先采用大于约20μm厚的冷粘结性的层。
此外可以考虑，在数据载体本体的边缘区中安排一个置入在两个纸板层或纸层之间的支承框架。
在制作按本发明的一种特别优先的数据载体时首先用漆包线缠绕结构高度优先为500μm的绕圈磁心或铁氧体磁心，此漆包线同样拥有约为500μm的直径。将此配备有集成电子电路的半导体芯片装入在一个由引线框架和上模压注料组成的对于半导体芯片典型的模块壳体中。随后将半导体芯片壳体型面啮合地放入线圈磁心中，此线圈磁心为此用途配备了一种合适构成的承接开口。模块壳体的总厚度又优先地约为500μm。在缠绕漆包线和将各裸露金属丝末端与引线框架电气连接之后，为了进一步提高刚度可以用一种结构高度同样约为500μm的外加支承框架包围线圈磁心。随后用可粘结的已印刷纸板层或纸层从两面配备以此方式制作的由芯片模块，感应线圈的线圈磁心和各线匝组成的毛胚，在这些纸板层或纸层中的每一个拥有优先为大于约100μm的总厚度。在此方式制作的数据载体本体在其总厚度上可以大大地位于按ISO标准规定的各相应值之上。
从以下的用图对一个实施例的说明得出本发明的其它各特征、优点和合理性。
图1示出了一个示意剖视图；以及
图2示出了用于按本发明实施例将电信号传输到读出或写入站的数据载体的一个示意俯视图。
在图1和图2中所示的本发明的实施例上示出了一种带有数据载体本体2的无接点芯片卡形式的数据载体1，一个带有(未详示的)集成电子电路的半导体芯片3已构成在此数据载体本体中。此半导体芯片3是装入在一个由(仅示意地表示的)引线框架4和电绝缘合成材料压注料5组成的本身是已知的模块壳体中的。此数据载体本体2拥有具有两个相同基面的，各自厚度约大于100μm的纸板层或纸层6和7，在这些纸板层或纸层之间置入了一个至少部分地包围半导体芯片3的带有结构高度约为500μm的加固元件8。每个纸板层或纸层6、7是在其朝向半导体芯片3的表面上配备了一个粘结层或粘着层9、10。每个粘结层或粘着层9、10拥有优先为大于约为20μm的厚度和除了用于安装各单个组成部分外还用于补偿各高度差。此加固元件8除了包括一个由磁性材料制作的缠绕磁心11外还包括各漆包线12，这些漆包线在所示情况下形成从属于半导体芯片3的电子电路的两个线匝13、14，此感应线圈相对于半导体芯片3的各外部尺寸具有更大得多的线圈外围。各线圈线匝的各末端15和16是优先地与引线框架4系统载体板的各接头点17、18钎焊的，由此完成了感应线圈与集成地构成在半导体芯片3上的电子电路的电气连接。在数据载体本体2的边缘区2上，支承框架19是安排在两个纸板层或纸层6和7之间的，此支承框架19优先地同样拥有为约500μm的厚度。

Claims (8)

1．用于将电信号无接点传输到读出或写入站上的数据载体带有一个数据载体本体(2)，其中，半导体芯片(3)是用一个集成的电子电路构成的，并且此数据载体带有至少一个从属于半导体芯片(3)的集成电子电路的、置入数据载体本体(2)之内的感应线圈，此感应线圈带有一个相对于半导体芯片(3)的各外界尺寸更大的线圈外围，其特征在于，数据载体本体(2)具有两个纸板层或纸层(6,7)，一个至少部分地包围半导体芯片(3)的、至少区域地由感应线圈各线匝(13,14)构成的加固元件(8)是置入在这些纸板层或纸层之间的。
2．按权利要求1的数据载体，其特征在于，置入在两个纸板层或纸层(6,7)之间的感应线圈的各线匝(13,14)是布置在像未加壳体的或加壳体的半导体芯片的相同结构高度上和相同的安装平面上的。
3．按权利要求1或2的数据载体，其特征在于，感应线圈的各线匝(13,14)由漆包线组成。
4．按权利要求1至3之一的数据载体，其特征在于，加固元件此外由一个线圈磁心(11)构成，此线圈磁心至少部分地包围或至少近似型面啮合地容纳未加壳体的或加壳体的半导体芯片(3)，并且线圈磁心的结构高度和安装平面又相当于未加壳体或加壳体的半导体芯片(3)的结构高度和安装平面。
5．按权利要求4的数据载体，其特征在于，线圈磁心(11)是一种铁氧体磁心，它至少部分地包围半导体芯片(3)或半导体芯片壳体，并且它的结构高度相当于半导体芯片(3)或半导体芯片壳体的结构高度。
6．按权利要求1至5之一的数据载体，其特征在于，感应线圈的各线匝(13,14)含有至少为200μm，优先至少为500μm的直径。
7．按权利要求1至6之一的数据载体，其特征在于，数据载体本体的两个纸板层或纸层(6,7)在其各自朝向半导体芯片(3)的表面上配备有一个粘结层或粘着层(9,10)。
8．按权利要求1至7之一的数据载体，其特征在于，在数据载体本体的边缘区上含有一个置入在两个纸板层或纸层(6,7)之间的支承框架(19)。
CN97197123A 1996-08-08 1997-07-16 传输电信号的数据载体 Pending CN1227647A (zh)

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DE19632117A DE19632117C1 (de) 1996-08-08 1996-08-08 Datenträger zur kontaktlosen Übertragung von elektrischen Signalen
DE19632117.4 1996-08-08

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EP0978094A1 (de) 2000-02-09
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JP2000516362A (ja) 2000-12-05
KR20000029797A (ko) 2000-05-25

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