WO1996035091A1 - Unibody crucible - Google Patents

Unibody crucible Download PDF

Info

Publication number
WO1996035091A1
WO1996035091A1 PCT/US1996/006267 US9606267W WO9635091A1 WO 1996035091 A1 WO1996035091 A1 WO 1996035091A1 US 9606267 W US9606267 W US 9606267W WO 9635091 A1 WO9635091 A1 WO 9635091A1
Authority
WO
WIPO (PCT)
Prior art keywords
orifice
section
crucible
base section
peripheral dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1996/006267
Other languages
English (en)
French (fr)
Inventor
Paul E. Colombo
Robert F. Donadio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chorus Corp
Original Assignee
Chorus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23718594&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1996035091(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Chorus Corp filed Critical Chorus Corp
Priority to AT96915496T priority Critical patent/ATE224525T1/de
Priority to JP8533541A priority patent/JPH11504613A/ja
Priority to DE69623765T priority patent/DE69623765T2/de
Priority to AU57257/96A priority patent/AU5725796A/en
Priority to EP96915496A priority patent/EP0826131B1/en
Publication of WO1996035091A1 publication Critical patent/WO1996035091A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00Casings; Linings; Walls; Roofs
    • F27D1/16Making or repairing linings ; Increasing the durability of linings; Breaking away linings
    • F27D1/1636Repairing linings by projecting or spraying refractory materials on the lining
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/01Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • C23C16/342Boron nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • C30B23/06Heating of the deposition chamber, the substrate or the materials to be evaporated
    • C30B23/066Heating of the material to be evaporated
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B14/00Crucible or pot furnaces
    • F27B14/08Details specially adapted for crucible or pot furnaces
    • F27B14/10Crucibles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B14/00Crucible or pot furnaces
    • F27B14/08Details specially adapted for crucible or pot furnaces
    • F27B14/10Crucibles
    • F27B2014/102Form of the crucibles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]

Definitions

  • This invention relates, generally, to apparatus used in the manufacture of
  • the invention relates to a crucible for a molecular beam epitaxy (MBE) effusion cell or source.
  • MBE molecular beam epitaxy
  • Molecular beam epitaxy is a growth process which involves the deposition of
  • MBE is widely used in compound semiconductor research and in the semiconductor device fabrication
  • Thermal effusion cells have a crucible which contains the effusion
  • the crucible is formed of gallium, arsenic, or other elements or compounds.
  • a plurality of cells are mounted, via ports, in the growth chamber.
  • One or more of the cells are actuated and generate a beam which is directed at a
  • Control of the beam is typically accomplished via shutters and/or valves.
  • shutters and/or valves In use,
  • the formed wafer is cooled, inspected, and processed for removal from the chamber.
  • Source crucibles are constructed of an inert material which is stable at high
  • a preferred material is pyrolytic boron nitride (PBN).
  • crucibles are typically formed by a chemical vapor deposition (CVD) process
  • Capacity relates to the ability of the crucible to hold an amount of material necessary for a particular MBE process. Greater capacity permits construction of
  • Uniformity may also be compositional. Uniformity has been achieved in
  • crucibles having a conic configuration throughout have limited capacity, exhibit depletion effects, and are prone to flux transients.
  • Oval defects are morphological defects present on the formed semiconductor
  • Source related oval defects are thought to be caused by spitting from the
  • Flux transients are particularly a problem in crucible designs having a conic
  • this invention to provide a crucible which maximizes capacity, uniformity and long
  • a unibody containment structure such as a crucible
  • the present invention provides a container comprising a rigid wall structure
  • the interior space having a first peripheral dimension
  • the second peripheral dimension being less than the first peripheral
  • Figure 1 is a perspective view, partially cut-away, of an MBE effusion cell
  • Figure 2 is a crossectional view of a portion of a dual filament effusion cell
  • Figure 3 is a perspective view of an embodiment of the unibody, monolithic
  • Figure 4 is a front view of the crucible shown in Figure 3.
  • Figure 5 is crossectional view of the crucible taken along line 5-5 of Figure 3.
  • Figure 6 is a top view of the crucible as shown in Figure 4.
  • Figure 7 is a bottom view of the crucible.
  • Figure 8 is a side view, partially in crossection, of the CVD mandrel assembly
  • Figure 9 is a side view, partially in crossection, of the top member of the
  • Figure 10 is a side view, partially in crossection, of the bottom member of the
  • Figure 11 is a side view of a center stud member of the mandrel assembly.
  • Figure 12 is a side view of a hanger member which is attached to the mandrel
  • Figure 13 is a crossectional view, taken along the center axis, of another
  • the crucible of the present invention is well suited for use in an MBE effusion
  • a typical MBE effusion cell 10 such as one manufactured
  • flange and support assembly 12 couples the effusion cell 10 to an MBE growth
  • the assembly 12 further supports the head assembly 11 at a
  • assembly 12 includes a cylindrical sealing flange 21 of a predetermined diameter, and
  • thermocouple lead 24 extend from the power connector 19 and thermocouple connector 20, respectively, through the flange 21 and to the head
  • the head assembly 11 includes a centrally interiorly disposed crucible
  • the filament 14 is preferably
  • the heat shield 15 is preferably
  • thermocouple 16 is connected to the exterior of the crucible 13 near its base.
  • thermocouple leads 24 are connected to the filament 14 and the thermocouple leads 24
  • the crucible 13 has a conical configuration with an outwardly oriented orifice 17 of a predetermined diameter with an annular lip
  • the crucible 13 is constructed of PBN, for example.
  • the effusion cell 10 may
  • Figure 2 shows another head assembly structure manufactured by EPI MBE
  • the heating system includes a first filament 28 for
  • the filaments 28 and 29 are
  • the crucible 27 comprises a cylindrical body 31 and a conical insert 32.
  • the cylindrical body 31 has straight or substantially straight walls with little or no positive draft (taper), and no negative
  • the walls of the body 31 define a predetermined interior volume which is
  • the crucible body 31 separates, and insulates to a certain extent, the tip filament 29 from the conical insert 33. This separation is believed to
  • the present invention integrates the
  • the invention further provides
  • the crucible 40 generally comprises a base section 41 and a conical
  • the crucible 40 is formed of an inert, corrosion resistant material.
  • a preferred material is PBN, such as Pyrosyl® sold by CVD Products, Inc. of Hudson. New Hampshire.
  • the preferred thickness of PBN for the crucible 40 is
  • the crucible 40 is constructed via a chemical
  • the crucible 40 embodiment shown is approximately 5.3
  • the base section 41 has a substantially cylindrical configuration with a side
  • wall 44 has a predetermined substantially uniform circumference and a predetermined
  • the diameter of the base section 41 shown is approximately 1.4 inches (3.5
  • the length base section 41 is approximately 2.9 inches (7.3 cm.).
  • draft wall 46 tapers inwardly (laterally) towards the central longitudinal axis (not
  • the negative draft wall 46 terminates at its outward end to define a
  • the second orifice 47 is a region of smallest diameter in
  • the crucible 40 is approximately 0.6 inches (1.5 cm.) in this embodiment.
  • the conical section 42 is defined by the portion of the crucible extending from the second orifice 47 to the periphery of the first orifice 43.
  • the conical section 42 is defined by the portion of the crucible extending from the second orifice 47 to the periphery of the first orifice 43.
  • the section in this embodiment is approximately 2.3 inches (5.8 cm.).
  • the wall 48 tapers outwardly (laterally) away from the central longitudinal axis of the crucible 40 at a preferred approximate angle of 9.0 degrees measured with respect to the central axis.
  • the annular lip 49 extends outwardly from the terminal edge of the wall 48 preferably
  • the first orifice has a preferred diameter of approximately 1.5
  • the annular lip 49 has a width of
  • the crucible 40 is typically oriented upwardly at
  • An element or compound is added to the crucible and heated by
  • the dual filament system for example, of an effusion source to form a melt 50.
  • an effusion source to form a melt 50.
  • the conical section 42 of the crucible 40 yields a level of thickness uniformity which matches that provided by conical crucibles. Additionally though, the design minimizes depletion effects. In all types of cells the beam equivalent pressure at a
  • the inner orifice 47 provided by the integral conical section 42 forms a thermal baffle between melt 50 and the shutter (not shown) improving hydrodynamic stability and reducing shutter-related transients.
  • the integrally formed conical section 42 enables optimal positioning of the tip filament of the dual filament heating system to minimize oval defect production.
  • one piece design crucible 90 is cylindrical and generally comprises a base section 91
  • the crucible 90 is preferably constructed of PBN via a vapor
  • This particular crucible 90 embodiment is approximately 8.1
  • the base section 91 has straight side walls 93 and a bottom wall 94 closing
  • Tapered wall 95 is disposed at the opposite end of the wall 93 and has a
  • Conical section 92 has a tapered wall 97 with a positive
  • the conical section 92 has a significantly reduced size (approximately 0.3 inches (0.7 cm.) axial length) in
  • unibody design permits construction of a crucible 90 which is essentially a "virtual crucible" in that it has a very small orifice or nozzle and enables placement of the effusion cell shutter very close to the source material or melt.
  • the shutter may also be made much smaller because of this.
  • the prior art teaches large orifices and requires a cell design wherein the shutter is large and is disposed a greater distance
  • the crucibles 40 and 90 described above are constructed by chemical vapor
  • Chemical vapor deposition is practiced, for example, by CVD Products.
  • PBN is produced by introducing gaseous boron trichloride
  • ammonia and a diluant into a growth chamber at a submillimeter pressure and a
  • the forming mandrel 55 is a four part assembly constructed of
  • graphite basically comprises a top member 56, a bottom member 57, and a center
  • top and bottom member 56 and 57 are separate components
  • top stud 59 which is connected to a
  • the bottom member 57 is formed of graphite, preferably a fine grained, high density, pre-purified graphite, and has a hollow, bored out center. Graphite begins to oxidize at approximately 300 degrees C. The dimensions of the bottom member 57
  • the member 57 is cylindrical and approximately 3.1 inches long and 1.3
  • the bottom edge 64 of the member 57 has a radius.
  • the top edge has a negative draft forming tapered neck 65 of angle "A", preferably 45
  • the diameter of the top end of the neck 65 is preferably
  • An axial bore 68 in the bottom member 57 is preferably
  • Axial bore 68 has a threaded upper
  • top member 56 is also hollow and formed of
  • top member 56 is also dependent of the dimensions of the crucible
  • the member 56 is curvilinear with a positive draft forming
  • 56 taper neck 73 has a length of approximately 2.1 inches, a bottom diameter of
  • neck 73 and base 74 is preferably radiused.
  • An axial bore 75 in the top member 56 is
  • Axial bore 75 has a threaded upper portion 60, which is 1.0 inch deep and 3/4-10
  • the center stud 58 is also hollow and constructed of graphite, preferably a fine grained, high density, pre-purified graphite.
  • the dimensions of the stud 58 are dependent upon the size and configuration of the
  • the stud 58 preferably has a length of approximately 1.5 inches, a threaded 3/8-16 UNC periphery , and an axial channel 80.
  • the stud 58 wall thickness (equal to one half the
  • outside diameter of the stud 58 body minus the bore 80 diameter is thick enough to
  • top or hanger stud 59 is preferably solid and
  • top and bottom member 56 With respect to the crucible 40 embodiment discussed
  • the stud 59 preferably has a length of approximately 4.5 inches and a threaded
  • the stud 59 has an axial bore 84 in one end which is 3/16
  • top member 56 a distance such that the lateral bore 85 remains on the exterior of the mandrel 55.
  • the bores 84 and 85 provide a venting means for the
  • the process of manufacturing the crucible of the present invention comprises the following steps. First, the top and bottom member 56 and 57 are mated by screwing them together with the center stud 58. Next, the hanger stud 59 is screwed
  • hanger stud 59 are oriented to vent pressure in the aligned axial channels 75 and 68 of
  • the resultant mandrel assembly 55 is placed in a CVD growth
  • the mandrel/container assembly is cooled.
  • the graphite materials of the forming mandrel 55 contract or shrink at a higher rate than does the PBN due to a high difference in
  • stud 58 is designed to fracture. The fracture allows the top and bottom members 56
  • predetermined period of time preferably approximately 40 hours, to oxidize the
  • Oxidization destroys the bottom member 57, which would
  • the method may be used to manufacture 18
  • structures may be constructed from a variety of compounds produced by chemical
  • crucible designs may be made using the aforementioned method, including but not

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Saccharide Compounds (AREA)
  • Cookers (AREA)
  • Thermally Insulated Containers For Foods (AREA)
PCT/US1996/006267 1995-05-03 1996-05-03 Unibody crucible Ceased WO1996035091A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AT96915496T ATE224525T1 (de) 1995-05-03 1996-05-03 Einteiliger tiegel
JP8533541A JPH11504613A (ja) 1995-05-03 1996-05-03 単体るつぼ
DE69623765T DE69623765T2 (de) 1995-05-03 1996-05-03 Einteiliger tiegel
AU57257/96A AU5725796A (en) 1995-05-03 1996-05-03 Unibody crucible
EP96915496A EP0826131B1 (en) 1995-05-03 1996-05-03 Unibody crucible

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/433,033 US5820681A (en) 1995-05-03 1995-05-03 Unibody crucible and effusion cell employing such a crucible
US08/433,033 1995-05-03

Publications (1)

Publication Number Publication Date
WO1996035091A1 true WO1996035091A1 (en) 1996-11-07

Family

ID=23718594

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US1996/006267 Ceased WO1996035091A1 (en) 1995-05-03 1996-05-03 Unibody crucible
PCT/US1996/006223 Ceased WO1996034994A1 (en) 1995-05-03 1996-05-03 Chemical vapor deposition method and apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US1996/006223 Ceased WO1996034994A1 (en) 1995-05-03 1996-05-03 Chemical vapor deposition method and apparatus

Country Status (7)

Country Link
US (3) US5820681A (https=)
EP (2) EP1215307A3 (https=)
JP (2) JPH11504613A (https=)
AT (1) ATE224525T1 (https=)
AU (2) AU5725796A (https=)
DE (1) DE69623765T2 (https=)
WO (2) WO1996035091A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0851042A3 (en) * 1996-12-27 1999-03-24 Shin-Etsu Chemical Co., Ltd. Crucible of pyrolytic boron nitride for molecular beam epitaxy
WO2000015883A1 (en) * 1998-09-15 2000-03-23 Coherent, Inc. Effusion cell and method of use in molecular beam epitaxy
US8512806B2 (en) 2008-08-12 2013-08-20 Momentive Performance Materials Inc. Large volume evaporation source

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202591B1 (en) * 1998-11-12 2001-03-20 Flex Products, Inc. Linear aperture deposition apparatus and coating process
US6140624A (en) * 1999-07-02 2000-10-31 Advanced Ceramics Corporation Pyrolytic boron nitride radiation heater
AU2001227824A1 (en) * 2000-01-12 2001-07-24 Applied Epi, Inc. Ultra-low temperature effusion cell
JP2001220286A (ja) 2000-02-02 2001-08-14 Sharp Corp 分子線源および分子線エピタキシ装置
US7194197B1 (en) * 2000-03-16 2007-03-20 Global Solar Energy, Inc. Nozzle-based, vapor-phase, plume delivery structure for use in production of thin-film deposition layer
US6551405B1 (en) * 2000-09-22 2003-04-22 The Board Of Trustees Of The University Of Arkansas Tool and method for in situ vapor phase deposition source material reloading and maintenance
DE10056686B4 (de) * 2000-11-15 2005-09-29 Forschungsverbund Berlin E.V. Verdampferzelle und ein Verfahren zur Herstellung von Aufdampfschichten
JP2003002778A (ja) * 2001-06-26 2003-01-08 International Manufacturing & Engineering Services Co Ltd 薄膜堆積用分子線セル
US6926920B2 (en) * 2002-06-11 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd Chemical vapor deposition (CVD) calibration method providing enhanced uniformity
JP4344631B2 (ja) * 2004-03-02 2009-10-14 長州産業株式会社 有機物薄膜堆積用分子線源
US20050232824A1 (en) * 2004-04-14 2005-10-20 Pangrcic Robert A High temperature electrolyte testing container
US20050229856A1 (en) * 2004-04-20 2005-10-20 Malik Roger J Means and method for a liquid metal evaporation source with integral level sensor and external reservoir
US7493691B2 (en) * 2004-05-20 2009-02-24 Honeywell International Inc. Co-molding metallic-lined phenolic components
JP4442558B2 (ja) * 2005-01-06 2010-03-31 三星モバイルディスプレイ株式會社 蒸発源の加熱制御方法,蒸発源の冷却制御方法および蒸発源の制御方法
US20060185599A1 (en) * 2005-02-22 2006-08-24 Bichrt Craig E Effusion Cell Valve
US7732737B2 (en) * 2005-10-11 2010-06-08 Kimberly-Clark Worldwide, Inc. Micro powered warming container
JP4673190B2 (ja) * 2005-11-01 2011-04-20 長州産業株式会社 薄膜堆積用分子線源とその分子線量制御方法
US20070218199A1 (en) * 2006-02-13 2007-09-20 Veeco Instruments Inc. Crucible eliminating line of sight between a source material and a target
US8747554B2 (en) * 2006-06-20 2014-06-10 Momentive Performance Materials Inc. Multi-piece ceramic crucible and method for making thereof
EP1967606A1 (en) * 2007-03-08 2008-09-10 Applied Materials, Inc. Evaporation crucible and evaporation apparatus with adapted evaporation characteristic
US20090169781A1 (en) * 2007-12-31 2009-07-02 Marc Schaepkens Low thermal conductivity low density pyrolytic boron nitride material, method of making, and articles made therefrom
JP5502069B2 (ja) 2008-04-15 2014-05-28 グローバル ソーラー エナジー インコーポレーテッド 薄膜太陽電池セルを製造するための装置および方法
US9187821B2 (en) * 2008-08-11 2015-11-17 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
US20100282167A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
WO2011065999A1 (en) * 2008-12-18 2011-06-03 Veeco Instruments Inc. Linear deposition source
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
WO2010110871A2 (en) * 2009-03-25 2010-09-30 Veeco Instruments Inc. Deposition of high vapor pressure materials
WO2011082179A1 (en) * 2009-12-28 2011-07-07 Global Solar Energy, Inc. Apparatus and methods of mixing and depositing thin film photovoltaic compositions
TWI477646B (zh) * 2010-08-09 2015-03-21 Hon Hai Prec Ind Co Ltd 化學氣相沉積設備
JP5720379B2 (ja) 2011-03-31 2015-05-20 日本電気株式会社 水流発電装置
DE102011121148A1 (de) * 2011-12-15 2013-06-20 Dr. Eberl Mbe-Komponenten Gmbh Vorrichtung zum Verdampfen eines Verdampfungsguts
DE102011122591A1 (de) * 2011-12-30 2013-07-04 Dr. Eberl Mbe-Komponenten Gmbh Vorrichtung zum Verdampfen eines Verdampfungsguts
US9776865B2 (en) 2013-11-01 2017-10-03 Bnnt, Llc Induction-coupled plasma synthesis of boron nitride nanotubes
TWI513839B (zh) * 2013-12-12 2015-12-21 Nat Inst Chung Shan Science & Technology An apparatus and method for improving sublimation deposition rate
KR101771872B1 (ko) 2014-04-24 2017-08-25 비엔엔티 엘엘씨 연속 질화붕소 나노튜브 섬유
EP3212571B1 (en) 2014-11-01 2019-08-14 Bnnt, Llc Method for synthesizing boron nitride nanotubes
CA2972769C (en) 2014-12-17 2023-01-03 Bnnt, Llc Boron nitride nanotube enhanced electrical components
CA2985795C (en) 2015-05-13 2023-11-07 Bnnt, Llc Boron nitride nanotube neutron detector
CA2986250C (en) 2015-05-21 2024-01-02 Bnnt, Llc Boron nitride nanotube synthesis via direct induction
US20180245206A1 (en) * 2015-07-13 2018-08-30 Applied Materials, Inc. Evaporation source
US10685750B2 (en) 2016-03-08 2020-06-16 TerraPower, LLC. Fission product getter
TWI737718B (zh) 2016-04-25 2021-09-01 美商創新先進材料股份有限公司 含有瀉流源的沉積系統及相關方法
CA3016932C (en) 2016-05-20 2024-04-09 Terrapower, Llc Sodium-cesium vapor trap system and method
CN207038182U (zh) 2017-03-29 2018-02-23 泰拉能源有限责任公司 铯收集器
JP7078462B2 (ja) * 2018-06-13 2022-05-31 株式会社アルバック 真空蒸着装置用の蒸着源
WO2019239192A1 (en) * 2018-06-15 2019-12-19 Arcelormittal Vacuum deposition facility and method for coating a substrate
US11626213B2 (en) 2019-08-23 2023-04-11 Terrapower, Llc Sodium vaporizer and methods
TW202129092A (zh) * 2019-10-17 2021-08-01 美商維克儀器公司 具有可變之基板對來源(substrate-to-source)配置的分子束磊晶系統
US12480853B2 (en) * 2021-09-28 2025-11-25 University Of Central Florida Research Foundation, Inc. Crucibles for thermogravimetric analysis (TGA)
WO2024006828A1 (en) * 2022-06-28 2024-01-04 Cornell University Reduction of surface oxidation in molecular beam epitaxy sources
WO2024015129A1 (en) 2022-07-13 2024-01-18 Terrapower, Llc Oxidation of cesium as method for removing cesium vapor from cover gas in nuclear reactors
CN119085320B (zh) * 2024-11-06 2025-05-02 苏州焜原光电有限公司 一种测温坩埚组件及测温方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646680A (en) * 1985-12-23 1987-03-03 General Electric Company Crucible for use in molecular beam epitaxial processing
US5432341A (en) * 1992-07-29 1995-07-11 Gspann; Juergen Process and apparatus for producing agglomerate rays

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US464680A (en) * 1891-12-08 Wind-wheel
FR1164034A (fr) * 1956-12-27 1958-10-06 Perfectionnements aux creusets pour le dépôt de couches métallisées
US3467583A (en) * 1966-05-16 1969-09-16 Camin Lab Process for making a hollow body with protective inner layer for high-temperature applications
US4035460A (en) * 1972-05-16 1977-07-12 Siemens Aktiengesellschaft Shaped bodies and production of semiconductor material
US4217855A (en) * 1974-10-23 1980-08-19 Futaba Denshi Kogyo K.K. Vaporized-metal cluster ion source and ionized-cluster beam deposition device
USD282894S (en) 1983-10-11 1986-03-11 General Foods Corporation Cruet
USD295145S (en) 1984-09-17 1988-04-12 Maison Paul Jeanjean Carafe
FR2598721B1 (fr) * 1986-05-15 1988-09-30 Commissariat Energie Atomique Cellule pour epitaxie par jets moleculaires et procede associe
JPS6353259A (ja) * 1986-08-22 1988-03-07 Mitsubishi Electric Corp 薄膜形成方法
US4856457A (en) * 1987-02-20 1989-08-15 Hughes Aircraft Company Cluster source for nonvolatile species, having independent temperature control
US4833319A (en) * 1987-02-27 1989-05-23 Hughes Aircraft Company Carrier gas cluster source for thermally conditioned clusters
JPH01153595A (ja) * 1987-12-09 1989-06-15 Nec Corp 分子線発生装置
US5034604A (en) * 1989-08-29 1991-07-23 Board Of Regents, The University Of Texas System Refractory effusion cell to generate a reproducible, uniform and ultra-pure molecular beam of elemental molecules, utilizing reduced thermal gradient filament construction
JP2619068B2 (ja) * 1989-09-08 1997-06-11 三菱電機株式会社 薄膜形成装置
US5032366A (en) * 1990-04-30 1991-07-16 Union Carbide Coatings Service Technology Corporation Boron nitride boat and process for producing it
US5158750A (en) * 1990-06-06 1992-10-27 Praxair S.T. Technology, Inc. Boron nitride crucible
JPH04274316A (ja) * 1991-02-28 1992-09-30 Mitsubishi Electric Corp 分子線エピタキシー用セル
JPH05294787A (ja) * 1992-04-22 1993-11-09 Mitsubishi Electric Corp 結晶成長方法及びその装置
US5453233A (en) * 1993-04-05 1995-09-26 Cvd, Inc. Method of producing domes of ZNS and ZNSE via a chemical vapor deposition technique
JP3369643B2 (ja) * 1993-07-01 2003-01-20 信越化学工業株式会社 熱分解窒化ほう素成形体の製造方法
JP2595894B2 (ja) * 1994-04-26 1997-04-02 日本電気株式会社 水素ラジカル発生装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646680A (en) * 1985-12-23 1987-03-03 General Electric Company Crucible for use in molecular beam epitaxial processing
US5432341A (en) * 1992-07-29 1995-07-11 Gspann; Juergen Process and apparatus for producing agglomerate rays

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EPI DISCLOSURE OF CRUCIBLE WELDMENT DRAWING, EPI 1290, Hammond Road, St. Paul, Minnesota, 18 May 1992. *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0851042A3 (en) * 1996-12-27 1999-03-24 Shin-Etsu Chemical Co., Ltd. Crucible of pyrolytic boron nitride for molecular beam epitaxy
WO2000015883A1 (en) * 1998-09-15 2000-03-23 Coherent, Inc. Effusion cell and method of use in molecular beam epitaxy
US8512806B2 (en) 2008-08-12 2013-08-20 Momentive Performance Materials Inc. Large volume evaporation source

Also Published As

Publication number Publication date
DE69623765T2 (de) 2003-07-17
US5932294A (en) 1999-08-03
AU5636796A (en) 1996-11-21
EP1215307A3 (en) 2002-09-04
EP0826131B1 (en) 2002-09-18
WO1996034994A1 (en) 1996-11-07
US5800753A (en) 1998-09-01
EP1215307A2 (en) 2002-06-19
ATE224525T1 (de) 2002-10-15
JP5174137B2 (ja) 2013-04-03
US5820681A (en) 1998-10-13
JP2011079736A (ja) 2011-04-21
EP0826131A1 (en) 1998-03-04
EP0826131A4 (en) 1998-07-15
JPH11504613A (ja) 1999-04-27
AU5725796A (en) 1996-11-21
DE69623765D1 (de) 2002-10-24

Similar Documents

Publication Publication Date Title
EP0826131B1 (en) Unibody crucible
US5827371A (en) Unibody crucible and effusion source employing such a crucible
US5158750A (en) Boron nitride crucible
US8197596B2 (en) Crystal growth method and reactor design
US11661671B2 (en) Technique for controlling temperature uniformity in crystal growth apparatus
US5976263A (en) Sources used in molecular beam epitaxy
EP0865518B1 (en) A device for heat treatment of objects
US5075055A (en) Process for producing a boron nitride crucible
KR101435676B1 (ko) 여러 단편으로 된 세라믹 도가니 및 그의 제조방법
US20010004875A1 (en) Device and method for producing at least one SiC single crystal
EP2019153B1 (en) Gas supply pipe for plasma treatment
US20100040780A1 (en) Large volume evaporation source
US5698168A (en) Unibody gas plasma source technology
JPH1160375A (ja) 分子線エピタキシー用分子線源ルツボ
JP2005053729A (ja) 薄膜堆積用分子線源用るつぼ
JPH07331418A (ja) 真空蒸着装置および真空蒸着方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU BB BG BR BY CA CH CN CZ DE DK ES FI GB GE HU IS JP KE KG KP KR KZ LK LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TR TT UA UG UZ VN

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): KE LS MW SD SZ UG AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
ENP Entry into the national phase

Ref country code: JP

Ref document number: 1996 533541

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 1996915496

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1996915496

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: CA

WWG Wipo information: grant in national office

Ref document number: 1996915496

Country of ref document: EP