WO1996005954A1 - Composition a base de resine amino utilisee pour le nettoyage de moules - Google Patents

Composition a base de resine amino utilisee pour le nettoyage de moules Download PDF

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Publication number
WO1996005954A1
WO1996005954A1 PCT/JP1995/001659 JP9501659W WO9605954A1 WO 1996005954 A1 WO1996005954 A1 WO 1996005954A1 JP 9501659 W JP9501659 W JP 9501659W WO 9605954 A1 WO9605954 A1 WO 9605954A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
cleaning
resin composition
weight
fatty acid
Prior art date
Application number
PCT/JP1995/001659
Other languages
English (en)
Japanese (ja)
Inventor
Akira Omura
Nobuyuki Sawada
Hiroshi Mizuoka
Original Assignee
Nippon Carbide Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kabushiki Kaisha filed Critical Nippon Carbide Kogyo Kabushiki Kaisha
Priority to GB9607369A priority Critical patent/GB2298650B/en
Priority to KR1019960702081A priority patent/KR100305180B1/ko
Publication of WO1996005954A1 publication Critical patent/WO1996005954A1/fr
Priority to HK98110534A priority patent/HK1009697A1/xx

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning

Definitions

  • the present invention relates to a resin composition for cleaning a mold, which cleans the surface of a mold in the molding of a curable resin molding material, and shows a good mold cleaning effect under a wide range of molding conditions and a good tablettability.
  • the present invention relates to an amino resin composition for cleaning a mold.
  • Japanese Patent Publication No. 52-7888 states that “Amino resin is mainly used to remove dirt on the mold surface during molding of a curable resin molding material (excluding an amino resin molding material).
  • a method of cleaning the mold surface by molding with a material to be modified and proposes an organic base material such as amino resin, wood flour, pulp and Z or
  • a resin composition for cleaning a mold comprising an inorganic base material such as silica and calcium carbonate and a release agent is disclosed.
  • Japanese Patent Publication No. 64-10162 discloses a co-condensation resin of an amino resin and a phenol resin and a mineral powder having a new Mohs' hardness of 6 to 15.
  • a mold cleaning resin composition is disclosed.
  • mold cleaning resin compositions are often used in the form of a tablet having the same size as the molding material, and the tablet temperature is controlled to be 90 ° C to 110 ° C.
  • the mold cleaning resin composition is applied to the entire mold by pre-heating and molding, and the mold surface is cleaned by taking in the dirt on the mold surface during curing. .
  • This automatic molding machine is used to mold encapsulation molded products such as IC'LSI with a small mold that takes several to several tens of pieces.
  • the encapsulation resin used has a diameter of about 5 mm to 40 mm. It is supplied as a mini-tablet.
  • the present inventors have found that lubricating effects can be improved even without increasing the content of lubricant, as a lubricant capable of improving the yield of evening-blended.
  • Metallic stones are used as non-metallic fatty acid-based lubricants with excellent heat stability and fluidity during cleaning and mold release.
  • the inventors have found that the tablettability can be improved while maintaining good cleaning performance, and the present invention has been completed.
  • the present invention has been made on the basis of the above-described findings, and it is an object of the present invention to provide a mold-cleaning amino-based resin composition which removes stains on a mold surface during molding of a curable resin molding material. It is intended to provide an amide-based resin composition for mold cleaning, characterized by containing the above fatty acid-based lubricant.
  • the amino resin in the present invention refers to a melamine resin, a melamine-phenyl phenol co-condensate, a melamine-urea co-condensate, or the like.
  • Min-phenol co-condensate is a product obtained by co-condensing triazines such as melamin, aldehydes such as phenol or formaldehyde, and the like.
  • the melamine-urea co-condensation resin is a resin obtained by co-condensing a triazine, a urea or an aldehyde such as melamine.
  • the above-mentioned melamine resin is obtained by condensing triazines such as melamine and aldehydes, and the urea resin is obtained by condensing ureides with aldehydes. It is obtained by doing Examples of the triazines include, in addition to melamin, 100 parts by weight of the triazines, such as benzoguanidine and acetate guanamine. Triazines other than May be contained in a proportion of 30 parts by weight or less.
  • phenols examples include, in addition to phenol, 100 parts by weight of the phenol, for example, cresol or xylenol.
  • Phenols other than phenols such as phenol, ethyl phenol and butynolephenol may be contained in a proportion of 30 parts by weight or less.
  • the above-mentioned aldehydes may contain, in addition to formaldehyde, for example, formaldehydes such as phenol, laformaldehyde, and acetoaldehyde.
  • the amide-based resin composition for mold cleaning used in the present invention is characterized in that the resin and the secondary resin that can be blended are mixed in an amount that does not adversely affect the above-mentioned improved properties of the composition of the present invention. It can be compounded with.
  • resins include alkyd resins, polyester resins, acryl-based resins, epoxy resins, rubbers and the like.
  • nonmetallic fatty acid-based lubricant used in the present invention examples include fatty acids such as stearic acid, oleic acid and behenic acid, butyl stearate, dodecyl stearate and the like.
  • Fatty acid esters monoglyceride stearate, monoglyceride oleate, monoglyceride hydroxesterate, penis erythritol stearate, polyglyceride Fatty acid partial esters such as phosphorus stearate, sorbitan trioleate, lauric acid amide, myristate acid Fatty acid amides such as amides, erlic acid amides, oleic acid amides, stearic acid amides, methylene bisstearic acid amides, ethylene bis stearic acids Examples include fatty acid bisamides such as amide and ethylene bisoleic acid amide.
  • fatty acids, fatty acid amides, and fatty acid bisamides which are effective in small amounts, are effective.
  • fatty acid amides and fatty acid bis amides are more preferred, and fatty acid bis amides having excellent heat stability are particularly preferred.
  • the nonmetallic fatty acid-based lubricant is preferably used in an amount of 0.1 to 1.5 parts by weight, more preferably 100 parts by weight, based on 100 parts by weight of the amide-based resin composition for mold cleaning. Is preferably added in an amount of 0.2 to 0.8 parts by weight, particularly preferably 0.2 to 0.6 parts by weight.
  • the amount of the non-metallic fatty acid-based lubricant is less than 0.1 part by weight, the pressure at the time of removing the tablet is excessively high, so that a squeaking noise occurs when the tablet is removed. In some cases, defects such as cracks and chips occur on the tablet, and the defect rate increases. On the other hand, if the amount of the lubricant exceeds 1.5 parts by weight, the cleanability is significantly reduced, and the lubricant may bleed and contaminate the mold.
  • the metal stone used in the present invention is involved in improving the fluidity of the molten resin in the mold and the releasability after the resin is cured, and includes, for example, calcium stearate, zinc stearate, Magnesium stearate, aluminum stearate and Examples thereof include zinc myristate. These metal stones are preferably used in an amount of 0.1 to 1.5 parts by weight, more preferably 0.2 parts by weight, based on 100 parts by weight of the amide-based resin composition for mold cleaning. Parts to 1 part by weight, particularly preferably 0.3 parts to 0.8 parts by weight. If the metal stone is insufficient, poor cleaning due to insufficient penetration of the above-mentioned amino resin composition to minute parts of complex molds and poor cleaning due to poor mold release of the cured amino resin composition May occur.
  • the mold-cleaning resin composition of the present invention uses the above-mentioned lubricant in combination.
  • the total amount of the lubricant is limited to the mold-cleaning resin composition. It is preferably 1.5 parts by weight or less, more preferably 1 part by weight or less, based on 100 parts by weight of the resin composition.
  • the amide-based resin composition for cleaning a mold of the present invention contains a mineral powder in addition to the above-mentioned resin.
  • a mineral powder for example, natural materials such as corundum, gemry, garnet, gay stone, etc., and gallium, iron, titanium, sodium, calcium, magnesium, aluminum, chromium, boron And oxides and the like.
  • oxides and carbides include gallium oxide, magnesium oxide, aluminum oxide, gallium carbide, and boron carbide.
  • the particle size of the above mineral powder is not particularly limited, generally, from # 10 to # 800, preferably from # 50 to # It is preferably from 400, more preferably from # 100 to # 200. If the particle size is smaller than # 800, the cleaning effect will be worse, and dust will be generated during handling, and disadvantages such as deterioration of the working environment will easily occur. If the particle size is larger than # 10, Defects such as mold damage and uneven cleaning are likely to occur.
  • the amount of the mineral powder used is not particularly limited, but is preferably 100 parts by weight based on 100 parts by weight of the amide-based resin composition for mold cleaning of the present invention. Parts to 90 parts by weight, more preferably 10 parts to 30 parts by weight.
  • the amide-based resin composition for mold cleaning of the present invention may contain, in addition to the above-mentioned mineral powder, other inorganic or organic fillers, coloring agents, curing catalysts, antioxidants, and the like.
  • Other additives may be included. Examples of such additives include, for example, pulp, wood flour, vinyl fiber, glass powder, glass fiber, untreated calcium carbonate, talc, aluminum hydroxide, barium sulfate And other inorganic or organic fillers such as zinc sulfide; inorganic pigments such as titanium oxide, carbon black, zinc white, cadmium yellow, red iron oxide, phthalocyanine-based, ab-based, etc.
  • Organic pigments such as diazos, fluorescent pigments such as benzoxazoles, naphthol, boules, and co-polymers, and dyes such as anthraquinones, indicos, and azos.
  • Colorants such as: For example, organic acids such as benzoic acid, phthalic anhydride, oxalic acid, sulfamic acid, p-toluenesulfonic acid, and inorganic acids such as hydrochloric acid and sulfuric acid.
  • organic acids such as benzoic acid, phthalic anhydride, oxalic acid, sulfamic acid, p-toluenesulfonic acid, and inorganic acids such as hydrochloric acid and sulfuric acid.
  • Curing catalyst examples thereof include antioxidants such as nap
  • pulp straw pulp, bamboo pulp, wood pulp (conifer pulp, hardwood pulp) and the like may be used, and any of chemical pulp and mechanical pulp may be used.
  • the size of the filler such as pulp and wood flour is not particularly limited, but it is preferably 5 to 1000 mm, more preferably about 10 to 200 cm.
  • the amount of the pulp, wood flour and the like is preferably 15 to 70 parts by weight, more preferably 100 to 100 parts by weight of the amino resin composition. 20 to 60 parts by weight are generally used.
  • the amino-based resin, the mineral substance powder, and, if desired, other secondary amounts of the resin and additives can be mixed uniformly.
  • the following means can be adopted.
  • a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll kneader, a grinder, a sunset blur, and the like can be exemplified.
  • the amide-based resin composition for cleaning a mold of the present invention comprises a
  • the T90 value measured by the meter is preferably 220 to 420 seconds at a mold surface temperature of 144 ° C, and more preferably 250 to 400 seconds. I like it.
  • the T90 value is 420 seconds or less, even when the molding temperature is low, wiping does not easily occur during molding, and the above-mentioned amino resin composition remains little. If the T90 value is 220 seconds or more, the cleaning effect does not decrease even when the molding temperature is high. Therefore, it is preferable to be within the above range.
  • the method for setting the T90 value of the above-mentioned amino resin composition in the above range there is no particular limitation on the method for setting the T90 value of the above-mentioned amino resin composition in the above range.
  • the amount of the curing catalyst used the mixing ratio of the resin component amount to the total amount, Adjustment of the molar ratio of aldehydes to melamine and the like in the epoxy resin, and combinations thereof.
  • Examples of the curable resin molding material capable of cleaning a mold using the composition of the present invention include, for example, an epoxy resin molding material and a phenol resin molding material, preferably an epoxy resin molding material. Epoxy resin molding materials for semiconductor encapsulation are particularly preferred.
  • the mold to which the amide-based resin composition for cleaning a mold of the present invention is applied may be any mold that is used for automatically molding the cured resin molding material. Possible force Generally applied to molds made of iron, chrome, etc.
  • the amide-based resin composition for mold cleaning having the composition of the present invention can reduce the mold cleaning effect even under a wide range of conditions. It is possible to increase the yield of the sunset without any problem, and it is possible to mold the tablet with high yield and high yield, especially in the molding of the mini-brain.
  • the mini-tablet is a tablet having a diameter of about 5 to 4 Om m which is generally used for cleaning an automatic molding machine for a cured resin.
  • the tableting property, T90 value and cleaning effect were measured by the following methods.
  • the mold surface temperature was set to 144 ° C, vibration with constant amplitude was applied, and the change in the generated stress of the mold cleaning resin composition with respect to the curing time was detected. I do.
  • the maximum value at which the stress change becomes almost constant is taken as 100%, and the time from the start of hardening to the generated stress corresponding to 90% of the maximum stress is taken as T90 value (second).
  • the sealed molded product was cut into 400 shots with a mold for an automatic molding machine. After molding the mold and contaminating the mold, a test mold cleaning resin composition was molded in the mold, and the number of shots and the cleaning effect were evaluated as follows. The molding was performed at a mold surface temperature of 180 and a curing time of 240 seconds.
  • a commercially available epoxy resin molding material (Nittron MP, manufactured by Nitto Denko Corporation) Using a mini-tablet, molds for an automatic molding machine can be used to mold the sealed molded product into a 400 shot transfer fan. -Molding and contamination of the mold. Next, the mold was used as the test temperature, the curing time was changed, and 5 shot molding was performed using the resin composition for mold cleaning.The mold surface was observed and the cleaning effect was tested. Method-1 and It was evaluated similarly.
  • a melamine-phenol co-condensation resin solution was prepared by a known method and dried under reduced pressure to obtain a powder 70 parts by weight, silica powder having a particle size of # 200 20 parts by weight, 9.5 parts by weight of powdered pulp, 0.1 part by weight of benzoic acid and 0.5 part by weight of zinc stearate were ground with a ball mill to obtain ethylene bis stearic acid amide.
  • the resin composition A for mold cleaning was obtained by adding 3 parts by weight with a Nauter mixer.
  • Table 1 shows the test results (1) of the tableting properties and the cleaning effect using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 value and the test results (2) of the cleaning effect. It was noted in. As is clear from the test results, a very good cleaning effect was obtained.
  • Table 1 shows the test results (1) of the tableting properties and the cleaning effect using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 value and the test results (2) of the cleaning effect. It was noted in. As is clear from the test results, a very good cleaning effect was obtained.
  • melamine 36 3 parts by weight, urea 87 parts by weight and formalin (37% aqueous solution) 550 parts by weight, the melamine and the A condensed resin liquid was prepared and dried under reduced pressure to obtain a powder.
  • Parts by weight and 0.5 parts by weight of calcium stearate were ground with a ball mill, and 0.4 parts by weight of ethylene bisoleic acid amide was added with a Now Yuichi mixer. This was used as a resin composition C for cleaning a mold.
  • Table 1 shows the test results (1) of the tableting properties and the cleaning effect using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 value and the test results (2) of the cleaning effect. It was noted in. As is clear from the test results, a very good cleaning effect was obtained. (Example 4)
  • a melon-phenol-co-condensation resin compound was obtained. 30 parts by weight of this compound, 50 parts by weight of a commercially available melamine resin (Nikajin S-176 of Nippon Carbide Co., Ltd.), silica powder having a particle size of # 200 20 parts by weight, 0.1 part by weight of benzoic acid and 0.5 part by weight of zinc myristate were ground with a ball mill, and 0.3 part by weight of erucic acid amide was added. Yuichi The mixture added by the mixer was used as resin composition D for cleaning the mold.
  • Table 1 shows the test results of the tableting properties and cleaning effect (1) using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 values and the test results of the cleaning effect (2). It was noted in. As is clear from the test results, a very good cleaning effect was obtained.
  • a mold cleaning resin composition E was obtained in the same manner as in Example 1, except that the ethylene bisstearic acid amide in Example 1 was changed to stearic acid.
  • Table 1 shows the test results (1) of the tableting properties and cleaning effect using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 value and the test results (2) of the cleaning effect. It was noted in. As is clear from the test results, a very good cleaning effect was obtained. (Example 6)
  • a mold cleaning resin composition F was prepared in the same manner as in Example 1 except that the ethylene bisstearic acid amide in Example 1 was changed to pentyl erythritol stearic acid ester. I got
  • Table 1 shows the test results (1) of the tableting properties and the cleaning effect using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 value and the test results of the cleaning effect (2). It was noted in. As is clear from the test results, a very good cleaning effect was obtained.
  • Example 2 The same operation as in Example 1 was performed, except that the amount of benzoic acid used in Example 1 was changed to 0.05 part by weight, to obtain a resin composition G for cleaning a mold.
  • Table 1 shows the test results (1) of the tableting property and cleaning effect using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 value and the test results (2) of the cleaning effect. It was noted in. As is clear from the test results, a very good cleaning effect was obtained.
  • Table 1 shows the test results of the tableting properties and cleaning effect (1) using the obtained resin composition for mold cleaning
  • Table 2 shows the T90 values and the test results of the cleaning effect (2). It was noted in. As is clear from the test results, a very good cleaning effect was obtained.
  • Example 1 the resin composition for mold cleaning was designated as I, in which the amounts of ethylene bisstearate amide and zinc stearate were both set to 0.
  • Table 1 shows the test results (1) of the tableting properties and the cleaning effect using the obtained resin composition for mold cleaning
  • Table 3 shows the T90 value and the test results (2) of the cleaning effect. It was noted in.
  • Example 1 J was the mold cleaning resin composition in which the amount of ethylene bissulfate amide used was 0.
  • Table 1 shows the test results (1) of the tableting properties and cleaning effect using the obtained resin composition for mold cleaning
  • Table 3 shows the T90 value and the test results (2) of the cleaning effect. It was noted in.
  • Example 1 the mold cleaning resin composition in which the amount of zinc stearate used was 0 was designated as K.
  • Table 1 shows the test results (1) of the tableting properties and cleaning effect using the obtained resin composition for mold cleaning, and Table 3 shows the T90 value and the test results (2) of the cleaning effect. It was noted in.
  • Example 1 L was used as the mold cleaning resin composition in which the usage amount of ethylene bisstearic acid amide was 1.2 parts by weight.
  • Table 1 shows the test results (1) of the tableting properties and cleaning effect using the obtained resin composition for mold cleaning
  • Table 3 shows the T90 value and the test results (2) of the cleaning effect. It was noted in.
  • the resin composition for cleaning a mold of the present invention contains a metal stone bean jam and a nonmetallic fatty acid-based lubricant, a good tablet can be obtained particularly at the time of mini-jet molding. It is characterized by exhibiting good cleaning effect under a wide range of molding conditions while exhibiting properties.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Detergent Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)

Abstract

Composition à base de résine amino utilisée pour le nettoyage des surfaces souillées d'un moule servant au moulage d'une résine polymérisable. Cette composition contient un savon métallique et un lubrifiant acide gras non métallique.
PCT/JP1995/001659 1994-08-24 1995-08-22 Composition a base de resine amino utilisee pour le nettoyage de moules WO1996005954A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9607369A GB2298650B (en) 1994-08-24 1995-08-22 Amino resin compositions for cleaning mold
KR1019960702081A KR100305180B1 (ko) 1994-08-24 1995-08-22 금형청소용아미노계수지조성물
HK98110534A HK1009697A1 (en) 1994-08-24 1998-09-08 Amino resin compositions for cleaning mold

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6/220853 1994-08-24
JP22085394A JP3781445B2 (ja) 1994-08-24 1994-08-24 金型清掃用樹脂組成物

Publications (1)

Publication Number Publication Date
WO1996005954A1 true WO1996005954A1 (fr) 1996-02-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1995/001659 WO1996005954A1 (fr) 1994-08-24 1995-08-22 Composition a base de resine amino utilisee pour le nettoyage de moules

Country Status (8)

Country Link
JP (1) JP3781445B2 (fr)
KR (1) KR100305180B1 (fr)
CN (1) CN1073499C (fr)
GB (1) GB2298650B (fr)
HK (1) HK1009697A1 (fr)
MY (1) MY112167A (fr)
TW (1) TW343171B (fr)
WO (1) WO1996005954A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI835120B (zh) * 2021-06-14 2024-03-11 日商Ｔｏｗａ股份有限公司 樹脂成型品的製造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3783042B2 (ja) * 1995-08-23 2006-06-07 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP3270312B2 (ja) * 1995-10-24 2002-04-02 日本カーバイド工業株式会社 金型清掃用樹脂組成物タブレット
JP3270315B2 (ja) * 1995-10-31 2002-04-02 日本カーバイド工業株式会社 金型清掃用樹脂組成物タブレット
TW320600B (fr) * 1995-10-24 1997-11-21 Nippon Denseki Kogyo Kk
DE10005574A1 (de) * 2000-02-09 2001-08-23 Reckitt Benckiser Nv Reinigungsmittelzusammensetzung in Tablettenform
KR20020006342A (ko) * 2000-07-12 2002-01-19 마이클 디. 오브라이언 포밍다이의 도금 찌꺼기 제거 방법
WO2002030648A1 (fr) * 2000-10-11 2002-04-18 Nippon Carbide Kogyo Kabushiki Kaisha Composition a base de resine pour le nettoyage de moules
KR100818454B1 (ko) * 2001-04-25 2008-04-01 닛뽕 카바이도 고교 가부시키가이샤 금형 청소용 수지 조성물
KR100905843B1 (ko) * 2002-01-21 2009-07-02 닛뽕 카바이도 고교 가부시키가이샤 금형 청소용 수지 조성물
CN100408296C (zh) * 2002-12-06 2008-08-06 日本碳化物工业株式会社 成型模具用清洗材料和清洗方法
JP2004323780A (ja) * 2003-04-28 2004-11-18 Nippon Carbide Ind Co Inc 洗浄用熱可塑性樹脂組成物
SG11201404265PA (en) * 2012-01-23 2014-10-30 Nippon Carbide Kogyo Kk Resin composition for cleaning die
JP6803165B2 (ja) * 2015-08-07 2020-12-23 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP6715627B2 (ja) * 2016-03-18 2020-07-01 日本カーバイド工業株式会社 金型清掃用樹脂組成物

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS63246210A (ja) * 1988-02-19 1988-10-13 Nippon Carbide Ind Co Ltd 金型清掃用樹脂組成物
JPH0132050B2 (fr) * 1979-02-23 1989-06-29 Nippon Carbide Kogyo Kk
JPH0381111A (ja) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd 金型清掃用成形材料および金型清掃方法

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH0132050B2 (fr) * 1979-02-23 1989-06-29 Nippon Carbide Kogyo Kk
JPS63246210A (ja) * 1988-02-19 1988-10-13 Nippon Carbide Ind Co Ltd 金型清掃用樹脂組成物
JPH0381111A (ja) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd 金型清掃用成形材料および金型清掃方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI835120B (zh) * 2021-06-14 2024-03-11 日商Ｔｏｗａ股份有限公司 樹脂成型品的製造方法

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Publication number Publication date
GB9607369D0 (en) 1996-06-26
JPH0857865A (ja) 1996-03-05
JP3781445B2 (ja) 2006-05-31
CN1134129A (zh) 1996-10-23
KR100305180B1 (ko) 2001-11-22
KR960705667A (ko) 1996-11-08
CN1073499C (zh) 2001-10-24
HK1009697A1 (en) 1999-09-10
GB2298650B (en) 1998-08-05
MY112167A (en) 2001-04-30
GB2298650A (en) 1996-09-11
TW343171B (en) 1998-10-21

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