WO1995023833A1 - Binder composition for friction materials, and friction material - Google Patents
Binder composition for friction materials, and friction material Download PDFInfo
- Publication number
- WO1995023833A1 WO1995023833A1 PCT/JP1995/000344 JP9500344W WO9523833A1 WO 1995023833 A1 WO1995023833 A1 WO 1995023833A1 JP 9500344 W JP9500344 W JP 9500344W WO 9523833 A1 WO9523833 A1 WO 9523833A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- friction material
- mass
- resin
- binder composition
- binder
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 239000011230 binding agent Substances 0.000 title claims abstract description 65
- 239000002783 friction material Substances 0.000 title claims abstract description 57
- 229920005989 resin Polymers 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 52
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 35
- 239000005011 phenolic resin Substances 0.000 claims description 47
- 150000002902 organometallic compounds Chemical class 0.000 claims description 35
- 238000002156 mixing Methods 0.000 claims description 30
- 229920000548 poly(silane) polymer Polymers 0.000 claims description 29
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 26
- 229920001568 phenolic resin Polymers 0.000 claims description 26
- 239000003054 catalyst Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 238000009833 condensation Methods 0.000 claims description 17
- 230000005494 condensation Effects 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 14
- 230000001737 promoting effect Effects 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 229910008045 Si-Si Inorganic materials 0.000 claims description 2
- 229910006411 Si—Si Inorganic materials 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000001639 boron compounds Chemical class 0.000 claims description 2
- 150000002291 germanium compounds Chemical class 0.000 claims description 2
- 150000002611 lead compounds Chemical class 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229920003257 polycarbosilane Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 150000003606 tin compounds Chemical class 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 3
- 239000002841 Lewis acid Substances 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims 1
- 150000007517 lewis acids Chemical class 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005299 abrasion Methods 0.000 abstract description 4
- 150000002736 metal compounds Chemical class 0.000 abstract description 2
- 238000005562 fading Methods 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 61
- 239000000843 powder Substances 0.000 description 39
- 230000000052 comparative effect Effects 0.000 description 37
- 229910052757 nitrogen Inorganic materials 0.000 description 32
- 239000011295 pitch Substances 0.000 description 26
- 239000002131 composite material Substances 0.000 description 24
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 22
- 239000000126 substance Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- 239000012299 nitrogen atmosphere Substances 0.000 description 11
- 239000003607 modifier Substances 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000012783 reinforcing fiber Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000003763 carbonization Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- -1 polysiloxane Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 101001012040 Pseudomonas aeruginosa (strain ATCC 15692 / DSM 22644 / CIP 104116 / JCM 14847 / LMG 12228 / 1C / PRS 101 / PAO1) Immunomodulating metalloprotease Proteins 0.000 description 2
- 229910018540 Si C Inorganic materials 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011300 coal pitch Substances 0.000 description 2
- 229940052810 complex b Drugs 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000011490 mineral wool Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 239000003039 volatile agent Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- VXZBYIWNGKSFOJ-UHFFFAOYSA-N 2-[4-[5-(2,3-dihydro-1H-inden-2-ylamino)pyrazin-2-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC=1N=CC(=NC=1)C=1C=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2 VXZBYIWNGKSFOJ-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 241000531908 Aramides Species 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000761389 Copa Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 241000287462 Phalacrocorax carbo Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011337 anisotropic pitch Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 230000037396 body weight Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- HHFAWKCIHAUFRX-UHFFFAOYSA-N ethoxide Chemical compound CC[O-] HHFAWKCIHAUFRX-UHFFFAOYSA-N 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000006533 methyl amino methyl group Chemical group [H]N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 230000011987 methylation Effects 0.000 description 1
- 238000007069 methylation reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011301 petroleum pitch Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012258 stirred mixture Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000011318 synthetic pitch Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D69/00—Friction linings; Attachment thereof; Selection of coacting friction substances or surfaces
- F16D69/02—Composition of linings ; Methods of manufacturing
- F16D69/025—Compositions based on an organic binder
- F16D69/026—Compositions based on an organic binder containing fibres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D69/00—Friction linings; Attachment thereof; Selection of coacting friction substances or surfaces
- F16D69/02—Composition of linings ; Methods of manufacturing
- F16D69/025—Compositions based on an organic binder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D2200/00—Materials; Production methods therefor
- F16D2200/0082—Production methods therefor
- F16D2200/0086—Moulding materials together by application of heat and pressure
Definitions
- the present invention relates to a binder composition for a friction material and a friction material.
- the fade resistance and abrasion resistance of the friction materials are used. It can greatly improve properties and the like.
- the binder used in the above 1) and 2) is also an organic substance, and to a certain extent, it is required to maintain the temperature between 400 ° C and 500 ° C. Since it decomposes at temperature, large quantities of gas or tar-like substances are inevitable.
- the technology of 3) can suppress the generation of decomposition products, but not only requires a high temperature of 300 to 500 ° C during manufacturing, but also the mainstream of reinforcing fibers for friction materials at present.
- an organic reinforcing fiber which can be easily formed into a fibrillated fiber such as aramid fiber and mixed with other components cannot be used.
- a main object of the present invention is to provide a friction material which can be easily manufactured even in a conventional facility, has a low volatile content, and has excellent fade resistance, abrasion resistance, etc., when operated at high temperatures. It is in providing a corner binder.
- thermosetting resin and an organic metal When a compound, especially a mixture with an organic silicon compound having at least Si-Si bond, is used as a binder, excellent heat resistance, wear resistance, etc. are obtained. They found that a friction material could be obtained, and completed the present invention. '
- the present invention provides the following binder and friction material for a friction material
- a binder composition for a friction material comprising a thermosetting resin and an organometallic compound.
- a friction material comprising the binder composition according to item 1 as a binder component.
- thermosetting resins include novolac type phenolic resin.
- thermosetting resin a resin obtained by appropriately modifying or modifying these thermosetting resins, for example, a cash resin, a furan-modified phenol resin, or the like can be used.
- the thermosetting resin may be blended with a pitch within a range not exceeding 30% by mass.
- the force is not particularly limited as the pitch, and the softening point (R & B method) is about 40 to 350 ° C, more preferably about 60 to 150 ° C.
- a carbonization yield of 40% by mass or more is preferred. If the addition amount of the pitch is less than 30% by mass, the thermosetting property of the resin is hardly affected, and the carbonization yield of the mixture is improved (that is, the volatile content at high temperatures is reduced). Decrease).
- an organic gay compound may be added to the pitch prior to mixing with the thermosetting resin.
- the inherently thermoplastic pitch is heated to a temperature of about 250 to 350 ° C. in the presence of an organic gay compound, so that the heat is cured. Was revealed.
- the amount of the organic gay compound added to the pitch is about 1 to 50% by mass based on the pitch.
- an organic gay compound an organic boron compound, an organic germanium compound, an organic tin compound, an organic lead compound, or the like can be used as the organometallic compound.
- Organometallic compounds may be used alone or More than one species may be used in combination. Among these organometallic compounds, organometallic compounds having a lower radical generation (decomposition) temperature than a sublimation or evaporation temperature are more preferable.
- organic gay compound examples include those having structures represented by the following formulas (1) and (2).
- R is the same or different and is a hydrogen atom, a methyl group, an ethyl group or a phenyl group.
- n is usually about 3 to 200, and more preferably 5 to about L00.
- examples of the organic gay compound include network phenininole polysiloxane.
- a network phenylpolysilan is defined as having a phenyl group of 0, and those without a bond are assumed to have ⁇ or Si bonded. Refers to the one represented by equation (3).
- n is usually about 3 to 200, more preferably 5 to about L00.
- the organic gay compounds represented by the formulas (1), (2) and (3) include, for example, dimethylpolysilan, ethynolepolysilane, phenylethylenopolysilane, and phenol.
- Examples include Ninole Metinole Polysilane, diphenyl Nine Repo Polysilane, and network phenyl polysilane. Those having a phenyl group, such as lan, diphenylpolysilan, and network phenylpolysilane, are more preferred.
- condensation promoting catalyst When a mixture of a thermosetting resin and an organometallic compound is used as a binder, a condensation promoting catalyst is used to promote crosslinking between the thermosetting resin and the organometallic compound. This is preferred. Particularly preferred condensation promoting catalysts include the following.
- Amines N, N—dimethyl benzylamine, N,
- N dimethylethylamine, 2, 4, 6 — tris (dimethylaminomethyl) phenol, etc.
- B Noraleic acid and Protonic acid: Copa chloride, lute, ferric chloride, zinc chloride, p-tonolene sulfonic acid, etc.
- C Metal: cobalt, iron, titanium emissions, tin, copper, zinc
- c D metal oxides, and metal sulfides: C o O, C o 304 , C u 2 0, F e O, Z n O, M g O, Z r 0 2 , S n O, C u S, F e S, Z n S, such as M o S.
- the metal oxide and the metal sulfide as long as they are the same metal, the lower the oxidation state is, the more preferable it is (for example, Cu 20 is more preferable than the Cu ⁇ ).
- the condensation promoting catalyst used as a mixture with the compound is a solid, a smaller particle diameter is expected to have a higher effect.
- the mixing ratio between the thermosetting resin (when the pitch is mixed, the composite containing the pitch is treated as the thermosetting resin) and the organometallic compound is usually 99.9 to 9%. 0 to 30% by mass with respect to 0% by mass, preferably 99.5 to 80% by mass with respect to the latter, preferably 0.05 to 20% by mass with respect to 0% by mass. Particularly preferably, the former is about 9.90 to 90% by mass, and the latter is about 0.1 to 10% by mass.
- the mixing ratio of the condensation promoting catalyst is About 0.1 to 30% by mass, preferably about 0.1 to 15% by mass, and more preferably about 1 to 10% by mass, based on the mixture with the functional resin. is there.
- the amount of the condensation promoting catalyst may be reduced.
- the reaction is effectively promoted by uniformly mixing the thermosetting resin and the organometallic compound with the condensation-promoting catalyst in advance and then mixing with the components of the friction material. be able to.
- the heat treatment is performed at a temperature at which the mixture of the thermosetting resin, the organometallic compound, and the condensation promoting catalyst does not lose the properties of the binder, that is, the temperature equal to or lower than the curing reaction starting temperature of the binder. In this case, since the reaction can partially proceed, the carbonization yield of the binder can be effectively improved.
- thermosetting resin organometallic compound and condensation promoting catalyst
- thermosetting resin When the thermosetting resin is melted at a temperature of 100 to 230 ° C, an organometallic compound can be added thereto. It is also effective to add an organometallic compound during the synthesis of the thermosetting resin. When the thermosetting resin is liquid at room temperature, the organometallic compound can be directly mixed. In these cases, some of the resulting mixture will react, while the rest will remain unreacted.
- the raw materials such as the binder composition, known friction modifiers, and reinforcing fibers are blended, molded according to a conventional method, and heat-treated ( binder).
- the amount of the composition used is about 5 to 25% of the total mass of the friction modifier and the reinforcing fibers.
- the amount of force added depends on the type of metal, etc.
- the content is preferably about 5 to 80% by mass of the friction material, and particularly preferably about 10 to 50% by mass.
- the amount of addition is preferably about 0.5 to 30% by mass of the friction material (the friction modifier and the reinforcing fiber). It is particularly preferable to set it to about 20% by mass.
- thermosetting resin containing an organometallic compound such as phenolic resin or cash resin, cured at about 200 to 350 ° C, or a pitch containing an organometallic compound. Can be used for cured products.
- friction modifiers may be used alone or in combination of two or more, depending on the performance required of the friction material.
- the binder composition of the present invention As a cured product of the binder composition of the present invention in which a normal phenol resin or a cash resin is used as a thermosetting resin, the binder composition is used at a temperature of 130 to 300 °. After curing at about C (more preferably about 150 to 250 ° C), about 200 to 350 ° C (more preferably about 220 to 300 ° C) (About ° C) for about 6 to 30 hours after curing.
- This cured product is preferably crushed and sized to l / zm to lmm before use.
- a material obtained by adding the organometallic compound of the present invention to a pitch and heating and curing the same as a friction adjusting material can also be used.
- the pitch examples include petroleum pitch, coal pitch, synthetic pitch made from aromatic hydrocarbons such as naphthalene and acenaphthylene, and modified products of these pitches. Either isotropic pitch or anisotropic pitch can be used.
- the mixing ratio of the pitch to the organometallic compound is usually about 99 to 50% by mass of the former and about 1 to 50% by mass of the latter, and more preferably 95 to 75% by mass of the former. %, The latter being about 5 to 25% by mass.
- the mixing of the two can be performed by a method of mixing the organometallic compound after heating and melting the pitch, a method of mixing both powders, and a method of mixing both in a solvent.
- the friction modifier made of such a cured product is made of a composition comprising a thermoplastic resin and an organic metal compound at about 200 to 450 ° C. (more preferably, 250 to 40 ° C.). (About 0 ° C), and then after curing at about 250 to 450 ° C for about 6 to 30 hours
- Such a cured product is also preferably ground and sized to about 1 m to lmm before use.
- a friction modifier such a cured product is more likely to emit gas, tar, and the like than a commonly used phenolic resin-cured resin-cured material. Reduces production rate and improves fade resistance.
- the amount of addition is determined by the friction material raw material (friction adjusting material + reinforcing fiber). ) Is preferably about 1 to 30% by mass.
- the particle size of the friction adjusting material is not particularly limited, and can be appropriately determined according to characteristics required for the friction material. For example, when using metal, about 10 ⁇ m ⁇ 5mm, when using inorganic substance, about lm ⁇ lmm, when using organic substance, 1 1 ⁇ ! The particle size may be selected from a range of about lmm to about lmm.
- Reinforcing fibers include metal fibrous bodies such as copper, brass, iron and stainless steel, carbon fibers, rock wool, inorganic fibers such as asbestos-ceramic fibers, glass fibers, and glass fibers.
- Organic fibers such as amide fibers can be used in combination. These fibers not only have a reinforcing effect, but also have the effect of increasing the coefficient of friction.
- the method of mixing the friction material is not particularly limited, and may be a dry mixing method, a method of granulating the raw material using a small amount of binder, a method of wet mixing, a method of wet papermaking, or the like.
- the molding temperature is about 150 to 400 ° C, preferably 180 to 300 ° C. extent, at a molding pressure of 1 to 5 about 0 M pa, in 1 to 1 0 minutes to conditions of a line of the Hare c molding process, in order to line a cormorant appropriate degassing, an operation of clamping one opening 2 It is preferable to repeat about 6 times. It is also preferable to carry out preheating by high frequency, micro wave, etc. before molding.
- post-curing After molding, post-curing (post cure) is performed by heat treatment in air at about 200 to 450 for about 6 to 30 hours.
- high-temperature heat treatment such as scorch treatment at about 500 to 600 ° C., which is conventionally performed, is also effective.
- the binder composition of the present invention containing an organometallic compound can be used in a nitrogen atmosphere or in air at 490 to 800 °, compared to a binder composition containing no organometallic compound.
- the generation of volatiles due to thermal decomposition in the temperature range of C is significantly reduced.
- the organometallic compound mixed or reacted with the thermosetting resin changes the polar radical due to frictional heat during braking.
- the components that are generated and would otherwise volatilize by decomposition are cross-linked to polymerize and, for example, Si—C bonds are introduced, which only improves the fade property of the friction material. Nevertheless, heat resistance and abrasion resistance are greatly improved.
- 1 Omg of the sample is precisely weighed on a platinum sample dish, and then heated from normal temperature to 49 ° C and 800 ° C at a temperature rise rate of 10 ° CZ in a nitrogen stream of 50m1min. The temperature was raised to ° C, and the mass loss (%) during that time was measured. When air was used instead of nitrogen, the flow rate was the same as that of nitrogen.
- Novolak type phenolic resin manufactured by Kashiichi Co., Ltd., product number "NR-2235", containing 10% of hexamine curing agent
- 100 parts by mass of net 5 parts by mass of phenolic polysilane weight-average molecular weight: MW 618, dispersity: MWZM N 2.27, decomposition temperature: 365 ° (by: Osaka Gas Co., Ltd.)
- the obtained phenolic resin-polysilicon complex is pulverized to about 60 mesh, and the volatile components of the obtained pulverized substance are dispersed in a nitrogen stream at 49 ° C. and 800 ° C. Was measured.
- a ground product of a phenol resin-polysilane composite was prepared in the same manner as in Example 1 except that the amount of the network polysilane was changed to 3 parts by mass, and the pulverized product was obtained.
- the volatiles of the material were measured at 490 ° C and 800 ° C in a nitrogen stream.
- Diphenylpolysilane (weight-average molecular weight MW 176, dispersity MWZ MN 4.69, decomposition temperature 373 ° C, Osaka Gas Co., Ltd.) in place of network polysilane was prepared in the same manner as in Example 1 except that 5 parts by mass of the phenol resin was used in the same manner as in Example 1; Measured at 0 ° C and 800 ° C.
- a resole-type phenolic resin (trademark "S-8999", manufactured by Kanebo Co., Ltd.) was used.
- a pulverized product of a phenolic resin-polysilane composite was prepared in the same manner as in Example 1 except that 0 parts by mass was used, and volatile components of the pulverized product were dispersed in a nitrogen stream. The measurements were taken at 0 ° C and 800 ° C.
- Pulverization of a phenolic resin-polysilicon complex in the same manner as in Example 1 except that the amount of the network phenol-polyphenol used was 25 parts by mass.
- the pulverized product was prepared, and the volatile content of the pulverized product was measured at 49 ° C. and 800 ° C. in an air stream.
- Example 2 100 parts by mass of the same phenolic phenolic resin as in Example 1 was mixed with 10 parts by mass of diphenylpolysilane as in Example 3, and the mixture was uniformly powdered. The mixture was mixed to prepare a polystyrene phenol resin complex B.
- the composite C obtained above was pulverized, and the volatile content of the obtained pulverized product was measured at 490 ° C. and 800 ° C. in a nitrogen stream in the same manner as in Example 1.
- the novolaic phenol resin was heated in air at 170 ° C for 20 minutes according to Example 1 without blending the network phenol polysilane. It was cured and post-cured in air at 200 ° C for 6 hours. The obtained cured product was pulverized to about 60 mesh, and the volatile content of the obtained pulverized product was measured at 490 ° C and 800 ° C in a nitrogen stream. Comparative Example 2
- the same resole-type phenolic resin as in Example 4 was cured by heating in air at 170 ° C for 20 minutes without blending the network phenylpolysilane. In addition, post-curing was performed at 200 ° C in air for 6 hours.
- the obtained phenolic resin was pulverized to about 60 mesh, and the volatile content of the obtained pulverized substance was measured at 490 ° C. and 800 ° C. in a nitrogen stream.
- the novolak type phenolic resin was heated in air at 170 ° C. for 20 minutes according to Example 6. The mixture was further cured in the air at 200 ° C. for 6 hours. The obtained cured product was pulverized to about 60 mesh, and the volatile content of the obtained pulverized product was measured at 490 ° C and 800 ° C in an air stream.
- Example 7 100 parts by mass of the straight coal pitch of Example 7 was heated at 350 ° C. for 3 hours in an autoclave under a nitrogen atmosphere. After mixing 3 parts by mass of this and 7 parts by mass of a Novavolan phenol resin powder in a powdered state at room temperature, the mixture was cured in air at 240 ° C for 12 hours. Thus, a pitch / phenol resin composite was prepared. The obtained composite is pulverized to about 60 mesh and the volatile components are removed in a nitrogen stream at 490 ° C. Measured at 800 ° C
- Example 2 Nitrogen 1 1.5 3 0 3 Example 3 Nitrogen 1 3 5 3 0 5 Example 4 Nitrogen 1 1 4 2 7 5 Example 5 Nitrogen 1 3 5 3 3 5 Example 6 Air 28, 8 9 1.1
- Example 7 Nitrogen 18.0 27.3 Comparative Example 1 Nitrogen 1 1 1 40.3 Comparative Example 2 Nitrogen 12.7 3 5 1 Comparative Example 3 Air 4 9 9 9 9 • 5 Comparative Example 4 Nitrogen 2 2 • 44.5 From the results shown in Table 1, according to the present invention, the carbonization yield of the binder composition is improved by the introduction of Si—C bonds. Heat resistance of the friction material It is evident that the quality will improve significantly.
- Example 1 (a combination of a novolak type phenolic resin and a network phenylpolysilane) and Comparative Example 1 (a single use of a novolak type phenolic resin) were used.
- Example 4 (combination of resole-type phenolic resin and network phenolic polysilane) was compared with Comparative Example 2 (resole-type phenolic resin alone). In the former, the amount of volatile matter generated at high temperatures is significantly reduced.
- Example 6 (a combination of a novolak type phenolic resin and a network phenylpolysilane) and Comparative Example 3 (a single use of a novolak type phenolic resin) Comparing with the former, the volatile matter (oxidation depletion) in the high-temperature air is significantly reduced in the former.
- Example 7 a combination of pitch + divinyl polysilane + novolak phenolic resin
- Comparative Example 4 pitch + novolak phenol resin
- Resole-type phenol resin (manufactured by Kanebo Co., Ltd., part number "S-895") 100 parts by mass and the same net as in Example 1 And 100 parts by mass of the resulting mixture, 100 parts by mass of ethanol was added, and the mixture was stirred and mixed at room temperature, and the solvent was removed with an evaporator. After drying in a vacuum dryer at 40 ° C for 4 hours, the obtained dried product was kept in a nitrogen atmosphere at 250 ° C for 1 hour. And cured. The obtained phenol resin-polysilane complex was pulverized into about 60 mesh, and the volatile content of the obtained pulverized substance was measured at 800 ° C. in a nitrogen stream.
- Table 2 shows the results of this example, together with the results of Example 9 14 and Comparative Example 5.
- Example 14 Instead of Z n C l 2 of Example 9, C o C l 2 ' 6 H 2 0 ( Example 1 0), F e C l 3' 6 H 2 0 ( Example 1 1), p - DOO Noree Nsuruho phosphate ⁇ 1 Eta 2 0 (example 1 2) 2 4 6 - Application Benefits scan ( ⁇ ⁇ - dimethyl Chirua Mi Roh methylation) off d It was prepared in the same manner as in Example 9 except that 3 parts by weight of each of Nore (Example 13) and N, N-dimethyl benzolenoreamine (Example 14) were used. The volatile content of the pulverized material was measured at 800 ° C in a nitrogen stream.
- Example 8 To 100 parts by mass of the same resol-type phenol resin as in Example 8, 100 parts by mass of ethanol was added, and the mixture was stirred and dried and cured under the same conditions as in Example 1. went.
- the resulting dried product was cured by holding at 250 ° C. for 1 hour in a nitrogen atmosphere.
- the obtained phenolic resin-polysilane composite was pulverized to about 60 mesh, and the volatile content of the obtained pulverized substance was measured at 800 ° C. in a nitrogen stream.
- Example 8 To 100 parts by mass of the same resin-type phenol resin as in Example 8, 10 parts by mass of the same network funininole polysiloxane as in Example 1 was added, and room temperature was added. The mixture was homogeneously mixed with each other, and the obtained mixture was cured at 250 ° C. for 1 hour in a nitrogen atmosphere. The obtained phenolic resin-polysilan complex was pulverized to about 60 mesh, and the volatile content of the obtained pulverized substance was measured at 800 ° C. in a nitrogen stream.
- Example 16 The results of this example and Examples 16 to 29 and Comparative Examples 6 to 8 are also shown in Table 3 below.
- Example 17 To 100 parts by mass of the same resole-type phenol resin as in Example 8, 10 parts by mass of the same network phenol resin as in Example 1 was added, and the mixture was uniformly mixed at room temperature. 100 parts by mass of the obtained mixture were used as a condensation promoting catalyst as Co powder (Example 17), Sn powder (Example 18), Ti powder (Example 19), reduced iron powder (Example 19).
- example 2 0 C o O powder (example 2 1), C 0 3 0 4 powder (example 2 2), C u 2 0 powder (real ⁇ 2 3), Z n O powder (example 2 4), M g O powder (example 2 5), Z r 0 2 powder (example 2 6), S n O powder (example 2 7), Z n S powder (example 28), 3 parts by mass of CuS powder (Example 29) were added and uniformly mixed at room temperature, and the resulting mixture was dried at 250 ° C in a nitrogen atmosphere at 250 ° C. Hold for a time to cure.
- the obtained phenolic resin-polysilane composite was pulverized to about 60 mesh, and the volatile content of the obtained pulverized substance was measured at 800 ° C. in a nitrogen stream.
- Example 8 The same resin-type phenol resin as in Example 8 was cured by holding at 250 ° C. for 1 hour in a nitrogen atmosphere.
- the obtained phenol resin cured product was pulverized to about 60 mesh, and the volatile content of the obtained pulverized product was measured at 800 ° C. in a nitrogen stream.
- Japanese Patent Application Laid-Open No. 61-77653 which is cited as a prior art document, contains a silicone-based oligomer in a binder. You. Therefore, 100 mass parts of silicone resin (Glass Resin GR950, manufactured by Owens Illinois of the United States) was added to 100 mass parts of the same resol-type phenol resin as in Example 8, and the mass was 100 mass parts. After uniform mixing at room temperature, the mixture was cured by holding it at 250 ° C. for 1 hour in a nitrogen atmosphere. The obtained cured product was pulverized to about 60 mesh, and the volatile content of the obtained pulverized product was measured at 800 ° C. in a nitrogen stream.
- silicone resin Glass Resin GR950, manufactured by Owens Illinois of the United States
- Example 18 Sn powder (average particle size 3 zm) 36.1
- Example 19 Ti powder (350 mesh or less) 3 5-0
- Example 20 Reduced iron powder (average particle size: 5 m) 36.5
- Example 21 CoO powder (350 mesh or less) 36.7
- Example 26 Zr0 2 powder (200 mesh or less) 3 4.4
- Example 27 SnO powder (less than 200 / sh) 35.0
- Powdered phenolic resin (bell) at the ratio (parts by mass) shown in Table 4 Polysilane (same as in Example 1) is mixed with the product number (S-895 ") manufactured by Spinning Co., Ltd. (Example 30), or phenol resin and polystyrene are mixed. a mixture of M g 0, Z r 0 2 or C u 2 0 known emissions (example 3 1-3 3), a composite by Sunda one a (example 3 0), B (example 3 1), C (Example 32) and D (Example 33) were produced, respectively.
- Each mixture was placed in a molding die, and subjected to heat compression molding under the conditions of 150 ° C and 10 MPa, and the obtained molded product was post-cured at 200 ° C for 5 hours. Was performed to obtain a sample.
- the obtained sample was transferred to a constant speed friction tester (the friction surface was FC 2 50 mm, friction disc diameter 350 mm, thickness 10 mm, mounting position of test material is 150 mm from center, test piece size is length 25 mm x width 25 mm x thickness 6 mm), and measured the coefficient of friction in a drag and intermittent test at a peripheral speed of 8111/5, a surface pressure of 1 MPa, and a temperature of 300 ° C in accordance with JISD-4441. Were obtained.
- the drag test was performed for 30 minutes by pressing the test piece against the friction surface with the surface pressure IMPa. Since the data was unstable during the first 10 minutes, it was excluded and the measured values during the next 20 minutes were used as data.
- the test piece was pressed against the friction surface with the surface pressure IMPa for 20 seconds, and then the load was released for 20 seconds, and the cycle test was performed with 60 cycles as one cycle. Note that the data was unstable for the first 10 cycles, so they were excluded, and the measured values for the subsequent 50 cycles were used as data.
- R 2 average intermittent average drag
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Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69514593T DE69514593T2 (de) | 1994-03-03 | 1995-03-03 | Bindemittelzusammensetzung fuer reibmaterialien und reibmaterial |
EP95910736A EP0699728B1 (en) | 1994-03-03 | 1995-03-03 | Binder composition for friction materials, and friction material |
US08/545,625 US5889081A (en) | 1994-03-03 | 1995-03-03 | Binder composition for friction materials, and friction material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6/33628 | 1994-03-03 | ||
JP3362894 | 1994-03-03 |
Publications (1)
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WO1995023833A1 true WO1995023833A1 (en) | 1995-09-08 |
Family
ID=12391721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP1995/000344 WO1995023833A1 (en) | 1994-03-03 | 1995-03-03 | Binder composition for friction materials, and friction material |
Country Status (5)
Country | Link |
---|---|
US (1) | US5889081A (ja) |
EP (1) | EP0699728B1 (ja) |
CA (1) | CA2162027A1 (ja) |
DE (1) | DE69514593T2 (ja) |
WO (1) | WO1995023833A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0934967A1 (en) * | 1998-02-09 | 1999-08-11 | M3D Société Anonyme | A polymeric composition for friction elements |
DE19815698A1 (de) * | 1998-04-08 | 1999-10-14 | Karlsruhe Forschzent | Beschichtete Partikel, Verfahren zu deren Herstellung und deren Verwendung |
FR2802999A1 (fr) | 1999-12-28 | 2001-06-29 | Valeo | Garniture de friction, disque de friction equipe d'une telle garniture, embrayage a friction, notamment pour vehicule automobile, equipe d'un tel disque de friction, et procede de realisation d'une garniture de friction |
US7033485B2 (en) * | 2001-05-11 | 2006-04-25 | Koppers Industries Of Delaware, Inc. | Coal tar and hydrocarbon mixture pitch production using a high efficiency evaporative distillation process |
US7179850B2 (en) | 2001-09-25 | 2007-02-20 | Honeywell International, Inc. | Friction materials containing tin oxides |
JP2004138121A (ja) * | 2002-10-16 | 2004-05-13 | Nsk Warner Kk | 湿式摩擦材 |
JP2006306970A (ja) * | 2005-04-27 | 2006-11-09 | Akebono Brake Ind Co Ltd | 摩擦材 |
US8960384B2 (en) * | 2008-08-08 | 2015-02-24 | Freni Brembo S.P.A. | Method for making a ceramic matrix material for friction components of brakes and ceramic matrix material made by such method |
DE202010003143U1 (de) * | 2009-06-30 | 2010-06-02 | Honeywell Bremsbelag Gmbh | Reibbelagmischung für einen Reibwerkstoff, insbesondere für Brems- und Kupplungsbeläge |
WO2011078269A1 (ja) * | 2009-12-22 | 2011-06-30 | 曙ブレーキ工業株式会社 | 摩擦材及び摩擦材の製造方法 |
JP5738801B2 (ja) * | 2012-05-29 | 2015-06-24 | 日清紡ブレーキ株式会社 | 摩擦材 |
US9970501B2 (en) | 2013-06-28 | 2018-05-15 | Nisshinbo Brake, Inc. | Friction material |
MX2016011388A (es) * | 2014-03-05 | 2016-12-07 | Eng Arresting Systems Corp | Particulas de baja densidad para sistemas de detencion de vehiculos. |
US11248172B2 (en) | 2019-07-23 | 2022-02-15 | Koppers Delaware, Inc. | Heat treatment process and system for increased pitch yields |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4911300A (ja) * | 1972-05-29 | 1974-01-31 | ||
JPS5592738A (en) * | 1979-01-04 | 1980-07-14 | Bayer Ag | Novolak denatured with siloxane*its manufacture and use for manufacturing friction lining |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4020226A (en) * | 1975-04-23 | 1977-04-26 | Andrianov Kuzma A | Fibrous friction material |
JPS5692982A (en) * | 1979-12-27 | 1981-07-28 | Sumitomo Deyurezu Kk | Friction material |
JPH0692524B2 (ja) * | 1985-02-22 | 1994-11-16 | 信越化学工業株式会社 | 摩擦材料用結合剤 |
US4658951A (en) * | 1985-02-27 | 1987-04-21 | Saunders Stanley S | Reciprocating transfer conveyor with sensing accumulating pads |
JPS62215134A (ja) * | 1986-03-17 | 1987-09-21 | Aisin Chem Co Ltd | 二層成形クラツチフエ−シング |
US5438113A (en) * | 1992-03-30 | 1995-08-01 | Kabushiki Kaisha Toshiba | Thermosetting resin composition |
US5364513A (en) * | 1992-06-12 | 1994-11-15 | Moltech Invent S.A. | Electrochemical cell component or other material having oxidation preventive coating |
JPH06306186A (ja) * | 1993-04-27 | 1994-11-01 | Aisin Chem Co Ltd | 摩擦材 |
-
1995
- 1995-03-03 US US08/545,625 patent/US5889081A/en not_active Expired - Fee Related
- 1995-03-03 CA CA002162027A patent/CA2162027A1/en not_active Abandoned
- 1995-03-03 DE DE69514593T patent/DE69514593T2/de not_active Expired - Fee Related
- 1995-03-03 EP EP95910736A patent/EP0699728B1/en not_active Expired - Lifetime
- 1995-03-03 WO PCT/JP1995/000344 patent/WO1995023833A1/ja active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4911300A (ja) * | 1972-05-29 | 1974-01-31 | ||
JPS5592738A (en) * | 1979-01-04 | 1980-07-14 | Bayer Ag | Novolak denatured with siloxane*its manufacture and use for manufacturing friction lining |
Non-Patent Citations (1)
Title |
---|
See also references of EP0699728A4 * |
Also Published As
Publication number | Publication date |
---|---|
DE69514593T2 (de) | 2000-08-10 |
DE69514593D1 (de) | 2000-02-24 |
EP0699728B1 (en) | 2000-01-19 |
US5889081A (en) | 1999-03-30 |
CA2162027A1 (en) | 1995-09-08 |
EP0699728A1 (en) | 1996-03-06 |
EP0699728A4 (en) | 1996-08-21 |
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