WO1982003193A1 - Materiau de protection pour percage - Google Patents
Materiau de protection pour percage Download PDFInfo
- Publication number
- WO1982003193A1 WO1982003193A1 PCT/SE1982/000081 SE8200081W WO8203193A1 WO 1982003193 A1 WO1982003193 A1 WO 1982003193A1 SE 8200081 W SE8200081 W SE 8200081W WO 8203193 A1 WO8203193 A1 WO 8203193A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- drilling
- backup material
- facing
- paper
- corrugated board
- Prior art date
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 65
- 239000000463 material Substances 0.000 title claims abstract description 57
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 9
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- 238000005470 impregnation Methods 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract 3
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- KKEBXNMGHUCPEZ-UHFFFAOYSA-N 4-phenyl-1-(2-sulfanylethyl)imidazolidin-2-one Chemical compound N1C(=O)N(CCS)CC1C1=CC=CC=C1 KKEBXNMGHUCPEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000011888 foil Substances 0.000 description 12
- 238000001816 cooling Methods 0.000 description 9
- 239000000428 dust Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
- B23B35/005—Measures for preventing splittering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27G—ACCESSORY MACHINES OR APPARATUS FOR WORKING WOOD OR SIMILAR MATERIALS; TOOLS FOR WORKING WOOD OR SIMILAR MATERIALS; SAFETY DEVICES FOR WOOD WORKING MACHINES OR TOOLS
- B27G19/00—Safety guards or devices specially adapted for wood saws; Auxiliary devices facilitating proper operation of wood saws
- B27G19/10—Measures preventing splintering of sawn portions of wood
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
- B32B2317/127—Corrugated cardboard
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Definitions
- the present invention relates to a backup material for drilling which consists of a sheet-like laminate and is intended, in relation to a work-table or a similar base, to form a support for a panel-shaped or other pla- nar material when drilling through the material with a drilling tool.
- the object of the invention is to solve these problems by providing a drilling backup material which has a wavy or fluted central layer to permit sucking off dust and particles from the drill holes and efficiently cooling the drilling tools, and which additionally causes little wear of the tools, which is highly important.
- Another essential object of the invention is to provide a drilling backup material that is inexpensive, this being also of great importance, especially since
- Fig. 1 schematically shows a drill with a pres- 10 sure foot, a work-table and a drilling backup material according to the invention for sheets or laminates with printed circuits to be drilled.
- Fig. 2 is a view similar
- Fig. 1 there is shown part of a drilling machine with a work-table 1, a pressure foot 2 and a 20 drilling tool 3 for drilling a number of sheets or panels 4 with printed electric circuits, for instance copper circuits on ' glass fibre laminate.
- the sheets or panels 4 are placed on a drilling backup material 5 according to the invention which itself is placed on 25 the work-table 1.
- drilling top cover there may be disposed on top of the sheets of panels 4 a thin sheet 6 of a suitable material, for instance phenolic resin- impregnated paper if this is desirable or in a special case is deemed advantageous.
- This stack consisting of sheets or panels 4 with printed circuits, the backup material 5 and the top cover 6 is held together and maintained at the work- table 1 in a conventional fashion by means of a number of stacking pins 7 which extend through holes in the 35 stack of sheets and backup material and into holes in the work-table 1.
- the pressure foot 2 is applied against the stack.
- the pressure foot 2 comprises a housing which sur ⁇ rounds the drilling tool 3 (or each drilling tool) and is connected by an 4 opening 8 and a tube 9 to a suction source ⁇ not shown) for sucking off particles and dust.
- corrugated board i.e. a paper product consisting of one layer of fluted paper 12 and at least one facing, i.e. single faced corrugated board, or one layer of fluted paper 12 and two facings 11, 14, i.e. double faced corrugated board.
- the flute tubes 10 can be used as ducts for air through-flow in the drilling backup material and for sucking off dust and particles through the drill hole and by the pressure foot 2 to the dust extractor as soon as the tip of the drilling tool 3 has penetrated through the top facing 11 of the corrugated board.
- the air flow from the flute tubes 10 through the drill hole is immediately initiated when the drilling tool 3 punctures the facing 11, and the upward air stream, for instance a helical flow along the twist drill 3, will effectively clean both the drilling tool and the edges of the drill hole and further has the beneficial effect of effectively cooling the drilling tool immediately after a drilling operation has been performed and during the withdrawal of the drilling tool, dust and particles detached from the material and the drilling tool being sucked off during the extraction of the drilling tool.
- OMPI ous in so far as it gives, for . a desired small total amount of material and weight, a relatively great thickness to provide the desired distance between the material 4 to be drilled and the work-table 1. 5 Particles that are not sucked upwards and out of the housing 2 when the drill tip has penetrated through the top facing 11 of the panel of corrugated board are not entrapped in the drill hole proper, from where they could penetrate in between the sheets 4 and the backup 10 material, but can fall freely into the empty spaces defined by the flute tubes 10.
- Corrugated board being a paper product, one might 30 believe that dust and fibres would loosen and contaminate or completely ruin the printed circuit boards. Even if the dust extraction as described with reference to Fig. 2 would produce a certain effect, it was believed that the drilling tools in all likelihood would ruin 35 the printed circuit boards by fraying the edges of the drill holes and cause flocculation of loose fibres which by the extraction of the drilling tools are pulled
- corrugated board is an inex ⁇ pensive material which in standard qualities is manufac ⁇ tured in thicknesses that are suitable and with flute tubes that are sufficiently large to ensure the above- described dust extraction and air cooling.
- Phenolic resin can readily be applied to the facing or facings by spraying or perfusion, which should and can easily be so performed that the glue joints of the corrugated board are not dissolved but rather, upon curing of the resin, are strengthened at the flute crests and without the flute tubes being clogged and thus obstructed.
- the material is cured in a furnace, for instance for about 40 min. or more at about 170°C de ⁇ pending on the basis weight of the corrugated board and
- the drilling backup board As basic material for the drilling backup board according to the invention use is preferably made of corrugated board of standard quality with a thickness of at least 1 mm and most preferably between 1.5 and 3
- corrugated board with a thickness of 2 mm requires phenolic resin with setting agent in an
- the production costs for the backup material according to the invention will then amount approximately to only about 10-25 % of the pro ⁇ duction costs for the drilling backup materials which have hitherto been used and of which the backup material composed of one layer of fluted metal foil and two
- the backup material according to the invention is an improvement in all respects contemplated herein and, as far as is known, inferior in no other respect. Above all, the material according to the invention is far more gentle with respect to the drill in that the facing or cover layer of paper is hard after impregnation, yet brittle and readily punctured by the drill tips, forming clean hole edges without burrs during drilling.
- the cured resin will not soften and will entail no tendency to sticking at prevailing temperatures which can be kept relatively low by the reduced penetration work, which will entail less wear and extended tool life.
- the foregoing description has been concerned with printed electric circuits, circuit boards etc., but it goes without saying that the drilling backup - aterial according -to the invention is also useful in the drill ⁇ ing of other materials in which the problems encountered are equivalent to those met with in conjunction with the drilling of boards with printed electric circuits, and in paifticular where it is vital that the temperature of the drilling tools is kept relatively low.
- Good results are possible to obtain according to the invention also with resinous impregnating agents other than phenolic resin, such as epoxy resin, phenolic resin being however preferred since, among other things, it is relatively . inexpensive. For the same reason, corrugated board of any commercial type is preferred.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
- Laminated Bodies (AREA)
Abstract
Materiau de protection pour percage consistant en un lamine qui est essentiellement constitue d'une couche de papier cannele (12) et de placages (11, 14), a savoir du carton ondule, par exemple du carton ondule a une seule face ou paroi, lesquelles couches d'au moins du ou des placage(s) colle(s) sont impregnees d'une composition resineuse, telle qu'une resine phenolique, qui se polymerise apres impregnation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8101814A SE446953B (sv) | 1981-03-23 | 1981-03-23 | Borrunderlegg |
SE8101814810323 | 1981-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1982003193A1 true WO1982003193A1 (fr) | 1982-09-30 |
Family
ID=20343393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE1982/000081 WO1982003193A1 (fr) | 1981-03-23 | 1982-03-22 | Materiau de protection pour percage |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0077781A1 (fr) |
JP (1) | JPS58500436A (fr) |
SE (1) | SE446953B (fr) |
WO (1) | WO1982003193A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1272337A1 (fr) * | 2000-03-27 | 2003-01-08 | Arnold B. Finestone | Contenant en carton et carton ondule a parois stratifiees |
US20170232527A1 (en) * | 2016-02-17 | 2017-08-17 | The Boeing Company | Methods of forming holes in a workpiece and associated systems |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3700341A (en) * | 1970-07-27 | 1972-10-24 | Lcoa Laminating Co Of America | Laminated board and method of making same |
WO1981000368A1 (fr) * | 1979-07-30 | 1981-02-19 | Lcoa Laminating Co Of America | Materiau de soutien utilise dans le percage de plaques de circuits imprimes |
-
1981
- 1981-03-23 SE SE8101814A patent/SE446953B/sv not_active IP Right Cessation
-
1982
- 1982-03-22 JP JP57501013A patent/JPS58500436A/ja active Pending
- 1982-03-22 EP EP82901033A patent/EP0077781A1/fr not_active Ceased
- 1982-03-22 WO PCT/SE1982/000081 patent/WO1982003193A1/fr not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3700341A (en) * | 1970-07-27 | 1972-10-24 | Lcoa Laminating Co Of America | Laminated board and method of making same |
WO1981000368A1 (fr) * | 1979-07-30 | 1981-02-19 | Lcoa Laminating Co Of America | Materiau de soutien utilise dans le percage de plaques de circuits imprimes |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1272337A1 (fr) * | 2000-03-27 | 2003-01-08 | Arnold B. Finestone | Contenant en carton et carton ondule a parois stratifiees |
EP1272337A4 (fr) * | 2000-03-27 | 2003-04-02 | Arnold B Finestone | Contenant en carton et carton ondule a parois stratifiees |
US20170232527A1 (en) * | 2016-02-17 | 2017-08-17 | The Boeing Company | Methods of forming holes in a workpiece and associated systems |
US10399151B2 (en) * | 2016-02-17 | 2019-09-03 | The Boeing Company | Methods of forming holes in a workpiece and associated systems |
Also Published As
Publication number | Publication date |
---|---|
EP0077781A1 (fr) | 1983-05-04 |
SE8101814L (sv) | 1982-09-24 |
SE446953B (sv) | 1986-10-20 |
JPS58500436A (ja) | 1983-03-24 |
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