USD934822S1 - Circuit board for power semiconductor module - Google Patents

Circuit board for power semiconductor module Download PDF

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Publication number
USD934822S1
USD934822S1 US29/725,416 US202029725416F USD934822S US D934822 S1 USD934822 S1 US D934822S1 US 202029725416 F US202029725416 F US 202029725416F US D934822 S USD934822 S US D934822S
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United States
Prior art keywords
circuit board
power semiconductor
semiconductor module
view
module
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US29/725,416
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English (en)
Inventor
Kotaro Shibata
Hideki Sawada
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAWADA, HIDEKI, SHIBATA, KOTARO
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US29/725,416 2019-08-29 2020-02-25 Circuit board for power semiconductor module Active USD934822S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-19213F JP1659674S (de) 2019-08-29 2019-08-29
JP2019-019213 2019-08-29

Publications (1)

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USD934822S1 true USD934822S1 (en) 2021-11-02

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ID=70682015

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US29/725,416 Active USD934822S1 (en) 2019-08-29 2020-02-25 Circuit board for power semiconductor module

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US (1) USD934822S1 (de)
JP (1) JP1659674S (de)

Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5471089A (en) * 1992-06-30 1995-11-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor power module
US6078501A (en) 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6774465B2 (en) 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
JP1536359S (de) 2014-08-19 2015-10-26
JP1536191S (de) 2014-08-19 2015-10-26
JP1536360S (de) 2014-08-19 2015-10-26
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
US20160190915A1 (en) 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD762185S1 (en) 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
US20160284618A1 (en) 2015-03-25 2016-09-29 Mitsubishi Electric Corporation Semiconductor device
US20160336245A1 (en) 2015-05-15 2016-11-17 Mitsubishi Electric Corporation Power semiconductor device
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
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US9660356B1 (en) 2015-11-25 2017-05-23 Fuji Electric Co., Ltd. Semiconductor device
USD790491S1 (en) 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
JP1585830S (de) 2017-01-05 2017-09-11
JP1585962S (de) 2017-01-05 2017-09-11
JP1585831S (de) 2017-01-05 2017-09-11
USD798832S1 (en) 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1603793S (de) 2017-09-29 2018-05-14
JP1603980S (de) 2017-09-07 2018-05-14
JP1605558S (de) 2017-01-05 2018-06-04
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD888674S1 (en) * 2018-10-17 2020-06-30 Oupiin Electronic (Kunshan) Co., Ltd. Circuit board with zigzag routes
USD892754S1 (en) 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471089A (en) * 1992-06-30 1995-11-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor power module
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6774465B2 (en) 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
JP1536360S (de) 2014-08-19 2015-10-26
JP1536191S (de) 2014-08-19 2015-10-26
USD775091S1 (en) 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
JP1536359S (de) 2014-08-19 2015-10-26
USD776071S1 (en) 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
US20160190915A1 (en) 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
US20160284618A1 (en) 2015-03-25 2016-09-29 Mitsubishi Electric Corporation Semiconductor device
US20160336245A1 (en) 2015-05-15 2016-11-17 Mitsubishi Electric Corporation Power semiconductor device
US20160372392A1 (en) * 2015-06-18 2016-12-22 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device fabrication method
USD790491S1 (en) 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
US9660356B1 (en) 2015-11-25 2017-05-23 Fuji Electric Co., Ltd. Semiconductor device
USD799439S1 (en) 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD875058S1 (en) * 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
JP1585962S (de) 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1605558S (de) 2017-01-05 2018-06-04
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
JP1585831S (de) 2017-01-05 2017-09-11
JP1585830S (de) 2017-01-05 2017-09-11
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
JP1603980S (de) 2017-09-07 2018-05-14
USD847103S1 (en) 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
JP1603793S (de) 2017-09-29 2018-05-14
USD892754S1 (en) 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD888674S1 (en) * 2018-10-17 2020-06-30 Oupiin Electronic (Kunshan) Co., Ltd. Circuit board with zigzag routes
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

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