USD934821S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD934821S1
USD934821S1 US29/720,895 US202029720895F USD934821S US D934821 S1 USD934821 S1 US D934821S1 US 202029720895 F US202029720895 F US 202029720895F US D934821 S USD934821 S US D934821S
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United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
perspective
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Active
Application number
US29/720,895
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English (en)
Inventor
Masahide Taguchi
Ryosuke Okawa
Toshikazu Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
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Nuvoton Technology Corp Japan
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Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. reassignment PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IMAI, Toshikazu, OKAWA, Ryosuke, TAGUCHI, MASAHIDE
Assigned to PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. reassignment PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN reassignment NUVOTON TECHNOLOGY CORPORATION JAPAN CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN reassignment NUVOTON TECHNOLOGY CORPORATION JAPAN CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 056522 FRAME: 0334. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
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US29/720,895 2019-07-24 2020-01-16 Semiconductor device Active USD934821S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-016521 2019-07-24
JPD2019-16521F JP1664282S (enrdf_load_stackoverflow) 2019-07-24 2019-07-24

Publications (1)

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USD934821S1 true USD934821S1 (en) 2021-11-02

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US29/720,895 Active USD934821S1 (en) 2019-07-24 2020-01-16 Semiconductor device

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US (1) USD934821S1 (enrdf_load_stackoverflow)
JP (1) JP1664282S (enrdf_load_stackoverflow)
TW (1) TWD209934S (enrdf_load_stackoverflow)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1001753S1 (en) * 2019-09-09 2023-10-17 The Noco Company Circuit board
USD1004127S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004130S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1050059S1 (en) * 2022-06-17 2024-11-05 Seiko Epson Corporation Circuit board for computer printers
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module
USD1083851S1 (en) 2019-09-09 2025-07-15 The Noco Company Circuit board

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USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
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US6836002B2 (en) * 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD687898S1 (en) * 2012-06-11 2013-08-13 Raymond Lupkas Set of pai-gow tiles
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
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USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD789456S1 (en) * 2015-02-12 2017-06-13 Wenlan H. Frost Set of square domino tiles
JP1581768S (enrdf_load_stackoverflow) 2016-08-02 2017-07-24
JP1588125S (enrdf_load_stackoverflow) 2017-04-26 2017-10-16
JP1588481S (enrdf_load_stackoverflow) 2017-04-26 2017-10-16
JP1632160S (enrdf_load_stackoverflow) 2018-09-28 2019-05-27
JP1632597S (enrdf_load_stackoverflow) 2018-09-28 2019-05-27
JP1641049S (enrdf_load_stackoverflow) 2018-06-19 2019-09-09
JP1640664S (enrdf_load_stackoverflow) 2018-06-19 2019-09-09
JP1641048S (enrdf_load_stackoverflow) 2018-06-19 2019-09-09
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module

Patent Citations (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US273559A (en) * 1883-03-06 Chaeles s
US295023A (en) * 1884-03-11 Jesse l
US729489A (en) * 1902-10-04 1903-05-26 Mattson Rubber Company Game-piece.
US1998526A (en) * 1932-09-23 1935-04-23 Schubert Philipp Domino
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
US5370398A (en) * 1993-06-30 1994-12-06 Nguyen; Thang V. Close and open game
US5757082A (en) * 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5994772A (en) * 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
US6307269B1 (en) * 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
US6836002B2 (en) * 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
USD457146S1 (en) * 2000-11-29 2002-05-14 Kabushiki Kaisha Toshiba Substrate for a semiconductor element
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
US6753482B1 (en) * 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
US8618540B2 (en) * 2010-06-08 2013-12-31 Samsung Electronics Co., Ltd. Semiconductor packages
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD687898S1 (en) * 2012-06-11 2013-08-13 Raymond Lupkas Set of pai-gow tiles
USD752000S1 (en) * 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD775093S1 (en) * 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD789456S1 (en) * 2015-02-12 2017-06-13 Wenlan H. Frost Set of square domino tiles
USD813182S1 (en) 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
JP1581768S (enrdf_load_stackoverflow) 2016-08-02 2017-07-24
JP1588125S (enrdf_load_stackoverflow) 2017-04-26 2017-10-16
JP1588481S (enrdf_load_stackoverflow) 2017-04-26 2017-10-16
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
JP1641049S (enrdf_load_stackoverflow) 2018-06-19 2019-09-09
JP1640664S (enrdf_load_stackoverflow) 2018-06-19 2019-09-09
JP1641048S (enrdf_load_stackoverflow) 2018-06-19 2019-09-09
JP1632160S (enrdf_load_stackoverflow) 2018-09-28 2019-05-27
JP1632597S (enrdf_load_stackoverflow) 2018-09-28 2019-05-27
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1083851S1 (en) 2019-09-09 2025-07-15 The Noco Company Circuit board
USD1001753S1 (en) * 2019-09-09 2023-10-17 The Noco Company Circuit board
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1004129S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004128S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004130S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1016323S1 (en) * 2021-04-09 2024-02-27 Ananda Devices Inc. Microfluidic slab
USD1004127S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1050059S1 (en) * 2022-06-17 2024-11-05 Seiko Epson Corporation Circuit board for computer printers

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Publication number Publication date
JP1664282S (enrdf_load_stackoverflow) 2020-07-27
TWD209934S (zh) 2021-02-21

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