USD934189S1 - Circuit board for power semiconductor module - Google Patents

Circuit board for power semiconductor module Download PDF

Info

Publication number
USD934189S1
USD934189S1 US29/725,414 US202029725414F USD934189S US D934189 S1 USD934189 S1 US D934189S1 US 202029725414 F US202029725414 F US 202029725414F US D934189 S USD934189 S US D934189S
Authority
US
United States
Prior art keywords
circuit board
power semiconductor
semiconductor module
view
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/725,414
Other languages
English (en)
Inventor
Kotaro Shibata
Hideki Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAWADA, HIDEKI, SHIBATA, KOTARO
Application granted granted Critical
Publication of USD934189S1 publication Critical patent/USD934189S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

US29/725,414 2019-08-29 2020-02-25 Circuit board for power semiconductor module Active USD934189S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-19212F JP1659673S (de) 2019-08-29 2019-08-29
JP2019-019212 2019-08-29

Publications (1)

Publication Number Publication Date
USD934189S1 true USD934189S1 (en) 2021-10-26

Family

ID=70682134

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/725,414 Active USD934189S1 (en) 2019-08-29 2020-02-25 Circuit board for power semiconductor module

Country Status (2)

Country Link
US (1) USD934189S1 (de)
JP (1) JP1659673S (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969761S1 (en) * 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module

Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5471089A (en) * 1992-06-30 1995-11-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor power module
US6078501A (en) 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6774465B2 (en) 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
JP1536359S (de) 2014-08-19 2015-10-26
JP1536191S (de) 2014-08-19 2015-10-26
JP1536360S (de) 2014-08-19 2015-10-26
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
US20160190915A1 (en) 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD762185S1 (en) 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
US20160284618A1 (en) 2015-03-25 2016-09-29 Mitsubishi Electric Corporation Semiconductor device
US20160336245A1 (en) 2015-05-15 2016-11-17 Mitsubishi Electric Corporation Power semiconductor device
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
US20160372392A1 (en) * 2015-06-18 2016-12-22 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device fabrication method
US9660356B1 (en) 2015-11-25 2017-05-23 Fuji Electric Co., Ltd. Semiconductor device
USD790491S1 (en) 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
JP1585830S (de) 2017-01-05 2017-09-11
JP1585962S (de) 2017-01-05 2017-09-11
JP1585831S (de) 2017-01-05 2017-09-11
USD798832S1 (en) 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1603793S (de) 2017-09-29 2018-05-14
JP1603980S (de) 2017-09-07 2018-05-14
JP1605558S (de) 2017-01-05 2018-06-04
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD888674S1 (en) * 2018-10-17 2020-06-30 Oupiin Electronic (Kunshan) Co., Ltd. Circuit board with zigzag routes
USD892754S1 (en) 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471089A (en) * 1992-06-30 1995-11-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor power module
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6774465B2 (en) 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
JP1536360S (de) 2014-08-19 2015-10-26
JP1536191S (de) 2014-08-19 2015-10-26
USD775091S1 (en) 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
JP1536359S (de) 2014-08-19 2015-10-26
USD776071S1 (en) 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
US20160190915A1 (en) 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
US20160284618A1 (en) 2015-03-25 2016-09-29 Mitsubishi Electric Corporation Semiconductor device
US20160336245A1 (en) 2015-05-15 2016-11-17 Mitsubishi Electric Corporation Power semiconductor device
US20160372392A1 (en) * 2015-06-18 2016-12-22 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device fabrication method
USD790491S1 (en) 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
US9660356B1 (en) 2015-11-25 2017-05-23 Fuji Electric Co., Ltd. Semiconductor device
USD799439S1 (en) 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD875058S1 (en) * 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
JP1585962S (de) 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1605558S (de) 2017-01-05 2018-06-04
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
JP1585831S (de) 2017-01-05 2017-09-11
JP1585830S (de) 2017-01-05 2017-09-11
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
JP1603980S (de) 2017-09-07 2018-05-14
USD847103S1 (en) 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
JP1603793S (de) 2017-09-29 2018-05-14
USD892754S1 (en) 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD888674S1 (en) * 2018-10-17 2020-06-30 Oupiin Electronic (Kunshan) Co., Ltd. Circuit board with zigzag routes
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969761S1 (en) * 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module

Also Published As

Publication number Publication date
JP1659673S (de) 2020-05-18

Similar Documents

Publication Publication Date Title
USD997146S1 (en) Electronic device
USD965544S1 (en) Electronic device
USD909319S1 (en) Circuit board
USD919589S1 (en) Electronic device
USD941793S1 (en) Electronic device
USD918898S1 (en) Electronic device
USD950511S1 (en) Electronic device
USD902164S1 (en) Integrated circuit card
USD937793S1 (en) Circuit board
USD892754S1 (en) Power module
USD897965S1 (en) Circuit breaker
USD884662S1 (en) Semiconductor module
USD989014S1 (en) Circuit board
USD934190S1 (en) Circuit board for power semiconductor module
USD927437S1 (en) Power semiconductor module
USD923591S1 (en) Semiconductor driving circuit module
USD944219S1 (en) Circuit board
USD934189S1 (en) Circuit board for power semiconductor module
USD923587S1 (en) Semiconductor driving circuit module
USD900044S1 (en) Circuit board
USD993201S1 (en) Semiconductor module
USD934188S1 (en) Power semiconductor module
USD934187S1 (en) Integrated circuit package
USD968344S1 (en) Circuit board
USD872038S1 (en) LED chips on a printed circuit board

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY