USD925481S1 - Inlet liner for substrate processing apparatus - Google Patents

Inlet liner for substrate processing apparatus Download PDF

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Publication number
USD925481S1
USD925481S1 US29/693,715 US201929693715F USD925481S US D925481 S1 USD925481 S1 US D925481S1 US 201929693715 F US201929693715 F US 201929693715F US D925481 S USD925481 S US D925481S
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US
United States
Prior art keywords
processing apparatus
substrate processing
inlet liner
liner
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/693,715
Inventor
Toru Kagaya
Shinya EBATA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
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Kokusai Electric Corp
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Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EBATA, SHINYA, KAGAYA, TORU
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FIG. 1 is a front, top and right side perspective view of an inlet liner for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 6.
The broken line arrow shows the association of the two sides of the cross sectional view in FIG. 8 and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an inlet liner for substrate processing apparatus, as shown and described.
US29/693,715 2018-12-06 2019-06-04 Inlet liner for substrate processing apparatus Active USD925481S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-026606 2018-12-06
JPD2018-26606F JP1638504S (en) 2018-12-06 2018-12-06

Publications (1)

Publication Number Publication Date
USD925481S1 true USD925481S1 (en) 2021-07-20

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ID=67474416

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/693,715 Active USD925481S1 (en) 2018-12-06 2019-06-04 Inlet liner for substrate processing apparatus

Country Status (3)

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US (1) USD925481S1 (en)
JP (1) JP1638504S (en)
TW (1) TWD203479S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1700778S (en) 2021-03-15 2021-11-29

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6099651A (en) * 1997-09-11 2000-08-08 Applied Materials, Inc. Temperature controlled chamber liner
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US6911093B2 (en) * 2003-06-02 2005-06-28 Lsi Logic Corporation Lid liner for chemical vapor deposition chamber
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7234412B2 (en) * 2002-04-11 2007-06-26 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
US20170088948A1 (en) 2014-03-26 2017-03-30 Hitachi Kokusai Electric Inc. Substrate processing apparatus and furnace opening cover
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
JP1598442S (en) 2017-08-09 2018-02-26
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6099651A (en) * 1997-09-11 2000-08-08 Applied Materials, Inc. Temperature controlled chamber liner
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US7234412B2 (en) * 2002-04-11 2007-06-26 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US6911093B2 (en) * 2003-06-02 2005-06-28 Lsi Logic Corporation Lid liner for chemical vapor deposition chamber
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
US20170088948A1 (en) 2014-03-26 2017-03-30 Hitachi Kokusai Electric Inc. Substrate processing apparatus and furnace opening cover
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
JP1598442S (en) 2017-08-09 2018-02-26

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TWD203479S (en) 2020-03-21
JP1638504S (en) 2019-08-05

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