USD845921S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD845921S1
USD845921S1 US29/623,907 US201729623907F USD845921S US D845921 S1 USD845921 S1 US D845921S1 US 201729623907 F US201729623907 F US 201729623907F US D845921 S USD845921 S US D845921S
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United States
Prior art keywords
semiconductor device
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design
ornamental design
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US29/623,907
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English (en)
Inventor
Koshun SAITO
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAITO, KOSHUN
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US29/623,907 2017-05-02 2017-10-27 Semiconductor device Active USD845921S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-9670F JP1592769S (enrdf_load_stackoverflow) 2017-05-02 2017-05-02
JP2017-009670 2017-05-02

Publications (1)

Publication Number Publication Date
USD845921S1 true USD845921S1 (en) 2019-04-16

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US29/623,907 Active USD845921S1 (en) 2017-05-02 2017-10-27 Semiconductor device

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US (1) USD845921S1 (enrdf_load_stackoverflow)
JP (1) JP1592769S (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD1076838S1 (en) * 2025-01-17 2025-05-27 Junyong ZHOU Camera circuit board
USD1082726S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1082727S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
US6355877B1 (en) * 1999-04-02 2002-03-12 Alps Electric Co Ltd Electronic device with excellent shielding and productivity
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD605930S1 (en) * 2009-06-01 2009-12-15 DisplayCraft, Inc. Small shelf bracket
USD632948S1 (en) * 2008-12-02 2011-02-22 Jesse D. Travis Support structure
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6355877B1 (en) * 1999-04-02 2002-03-12 Alps Electric Co Ltd Electronic device with excellent shielding and productivity
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD632948S1 (en) * 2008-12-02 2011-02-22 Jesse D. Travis Support structure
USD605930S1 (en) * 2009-06-01 2009-12-15 DisplayCraft, Inc. Small shelf bracket
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office Action issued for counterpart Japanese Design Application No. 2017-009670, dated Aug. 25, 2017, 6 pages including English translation.

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD1082726S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1082727S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1076838S1 (en) * 2025-01-17 2025-05-27 Junyong ZHOU Camera circuit board

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