USD785577S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD785577S1 USD785577S1 US29/555,470 US201629555470F USD785577S US D785577 S1 USD785577 S1 US D785577S1 US 201629555470 F US201629555470 F US 201629555470F US D785577 S USD785577 S US D785577S
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- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- broken lines
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings represent portions of the semiconductor device, that form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/555,470 USD785577S1 (en) | 2013-08-21 | 2016-02-22 | Semiconductor device |
US29/591,886 USD805485S1 (en) | 2013-08-21 | 2017-01-25 | Semiconductor device |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-019056 | 2013-08-21 | ||
JP2013019057 | 2013-08-21 | ||
JP2013019056 | 2013-08-21 | ||
JP2013-019030 | 2013-08-21 | ||
JP2013-019057 | 2013-08-21 | ||
JP2013019030 | 2013-08-21 | ||
US29/472,087 USD754084S1 (en) | 2013-08-21 | 2013-11-08 | Semiconductor device |
US29/555,470 USD785577S1 (en) | 2013-08-21 | 2016-02-22 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/472,087 Division USD754084S1 (en) | 2013-08-21 | 2013-11-08 | Semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/591,886 Division USD805485S1 (en) | 2013-08-21 | 2017-01-25 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD785577S1 true USD785577S1 (en) | 2017-05-02 |
Family
ID=55700351
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/472,087 Active USD754084S1 (en) | 2013-08-21 | 2013-11-08 | Semiconductor device |
US29/555,470 Active USD785577S1 (en) | 2013-08-21 | 2016-02-22 | Semiconductor device |
US29/591,886 Active USD805485S1 (en) | 2013-08-21 | 2017-01-25 | Semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/472,087 Active USD754084S1 (en) | 2013-08-21 | 2013-11-08 | Semiconductor device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/591,886 Active USD805485S1 (en) | 2013-08-21 | 2017-01-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (3) | USD754084S1 (en) |
Cited By (32)
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USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
USD805485S1 (en) * | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD805680S1 (en) * | 2013-12-09 | 2017-12-19 | Kenall Manufacturing Company | Driver housing |
USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD810706S1 (en) * | 2014-12-24 | 2018-02-20 | Fuji Electric Co., Ltd | Semiconductor module |
USD814433S1 (en) * | 2014-11-28 | 2018-04-03 | Fuji Electric Co., Ltd | Semiconductor module |
USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
USD838680S1 (en) * | 2015-02-20 | 2019-01-22 | Microduino Inc. | Modular electronic device |
USD847104S1 (en) * | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD847103S1 (en) * | 2017-09-07 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
USD853342S1 (en) * | 2017-02-28 | 2019-07-09 | Infineon Technologies Ag | High-performance semiconductor module |
USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
USD858467S1 (en) | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD864883S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864882S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) * | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865689S1 (en) * | 2015-02-20 | 2019-11-05 | Microduino Inc. | Electrical module |
USD879729S1 (en) * | 2017-06-30 | 2020-03-31 | Microduino Inc. | Electrical module |
USD884662S1 (en) * | 2018-06-01 | 2020-05-19 | Fuji Electric Co., Ltd. | Semiconductor module |
USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD923591S1 (en) * | 2019-03-15 | 2021-06-29 | Tamura Corporation | Semiconductor driving circuit module |
USD927437S1 (en) * | 2019-08-29 | 2021-08-10 | Rohm Co., Ltd. | Power semiconductor module |
USD934189S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934188S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Power semiconductor module |
USD934190S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934822S1 (en) | 2019-08-29 | 2021-11-02 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD969761S1 (en) | 2019-08-29 | 2022-11-15 | Rohm Co., Ltd. | Power semiconductor module |
USD981354S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD981355S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD1003889S1 (en) * | 2019-12-24 | 2023-11-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing chip |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD803663S1 (en) | 2014-11-20 | 2017-11-28 | Green Inova Lighting Technology Limited | Bracket |
JP1551316S (en) * | 2015-09-30 | 2016-06-13 | ||
JP1551317S (en) * | 2015-09-30 | 2016-06-13 | ||
JP1577498S (en) * | 2016-09-30 | 2017-05-29 | ||
JP1586205S (en) * | 2017-01-26 | 2017-09-19 | ||
JP1584883S (en) * | 2017-01-31 | 2017-08-28 | ||
JP1584651S (en) * | 2017-01-31 | 2017-08-28 | ||
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
JP1641098S (en) | 2018-06-26 | 2019-09-09 | ||
TWD206651S (en) * | 2020-04-24 | 2020-08-21 | 財團法人工業技術研究院 | Power module |
USD984397S1 (en) * | 2021-03-16 | 2023-04-25 | Yidong Cai | Circuit board |
JP1713167S (en) * | 2021-11-17 | 2022-04-21 | Semiconductor module |
Citations (53)
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US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4987474A (en) * | 1987-09-18 | 1991-01-22 | Hitachi, Ltd. | Semiconductor device and method of manufacturing the same |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
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USD364385S (en) | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
USD364384S (en) | 1994-05-23 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
USD364383S (en) | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
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USD441726S1 (en) | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
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US6521983B1 (en) | 2000-08-29 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for electric power |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD476959S1 (en) | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD525215S1 (en) | 2004-01-27 | 2006-07-18 | Yamaichi Electronics Co., Ltd. | Base for a semiconductor carrier |
USD539761S1 (en) | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD587662S1 (en) | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD589012S1 (en) | 2008-03-17 | 2009-03-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD606951S1 (en) | 2008-11-14 | 2009-12-29 | Fuji Electric Device Technology Co, Ltd. | Semiconductor device |
US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
USD653634S1 (en) | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD674760S1 (en) | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD686174S1 (en) | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
US8526199B2 (en) | 2010-05-07 | 2013-09-03 | Mitsubishi Electric Corporation | Semiconductor device |
USD689446S1 (en) | 2010-10-28 | 2013-09-10 | Fuji Electric Co., Ltd. | Semiconductor |
USD699693S1 (en) | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
USD703625S1 (en) | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
USD704671S1 (en) | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704670S1 (en) | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD706232S1 (en) | 2012-12-21 | 2014-06-03 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710318S1 (en) | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710319S1 (en) | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD759604S1 (en) * | 2015-06-17 | 2016-06-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772184S1 (en) * | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
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JPS60239043A (en) * | 1984-05-14 | 1985-11-27 | Oki Electric Ind Co Ltd | Manufacture of package for semiconductor device |
US6774465B2 (en) * | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
JP1536360S (en) * | 2014-08-19 | 2015-10-26 | ||
USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
-
2013
- 2013-11-08 US US29/472,087 patent/USD754084S1/en active Active
-
2016
- 2016-02-22 US US29/555,470 patent/USD785577S1/en active Active
-
2017
- 2017-01-25 US US29/591,886 patent/USD805485S1/en active Active
Patent Citations (55)
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US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4987474A (en) * | 1987-09-18 | 1991-01-22 | Hitachi, Ltd. | Semiconductor device and method of manufacturing the same |
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USD364385S (en) | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
USD364383S (en) | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
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Cited By (35)
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USD805485S1 (en) * | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD805680S1 (en) * | 2013-12-09 | 2017-12-19 | Kenall Manufacturing Company | Driver housing |
USD844216S1 (en) * | 2013-12-09 | 2019-03-26 | Kenall Manufacturing Company | Driver housing |
USD814433S1 (en) * | 2014-11-28 | 2018-04-03 | Fuji Electric Co., Ltd | Semiconductor module |
USD827593S1 (en) | 2014-11-28 | 2018-09-04 | Fuji Electric Co., Ltd | Semiconductor module |
USD810706S1 (en) * | 2014-12-24 | 2018-02-20 | Fuji Electric Co., Ltd | Semiconductor module |
USD838680S1 (en) * | 2015-02-20 | 2019-01-22 | Microduino Inc. | Modular electronic device |
USD865689S1 (en) * | 2015-02-20 | 2019-11-05 | Microduino Inc. | Electrical module |
USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD875058S1 (en) | 2017-01-05 | 2020-02-11 | Rohm Co., Ltd. | Power semiconductor module |
USD858467S1 (en) | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD853342S1 (en) * | 2017-02-28 | 2019-07-09 | Infineon Technologies Ag | High-performance semiconductor module |
USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
USD879729S1 (en) * | 2017-06-30 | 2020-03-31 | Microduino Inc. | Electrical module |
USD847103S1 (en) * | 2017-09-07 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD864883S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) * | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864882S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD847104S1 (en) * | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD884662S1 (en) * | 2018-06-01 | 2020-05-19 | Fuji Electric Co., Ltd. | Semiconductor module |
USD923591S1 (en) * | 2019-03-15 | 2021-06-29 | Tamura Corporation | Semiconductor driving circuit module |
USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD927437S1 (en) * | 2019-08-29 | 2021-08-10 | Rohm Co., Ltd. | Power semiconductor module |
USD934189S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934188S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Power semiconductor module |
USD934190S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934822S1 (en) | 2019-08-29 | 2021-11-02 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD969761S1 (en) | 2019-08-29 | 2022-11-15 | Rohm Co., Ltd. | Power semiconductor module |
USD981354S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD981355S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD1003889S1 (en) * | 2019-12-24 | 2023-11-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing chip |
Also Published As
Publication number | Publication date |
---|---|
USD805485S1 (en) | 2017-12-19 |
USD754084S1 (en) | 2016-04-19 |
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