USD694791S1 - Baffle plate for manufacturing semiconductor - Google Patents

Baffle plate for manufacturing semiconductor Download PDF

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Publication number
USD694791S1
USD694791S1 US29/416,088 US201229416088F USD694791S US D694791 S1 USD694791 S1 US D694791S1 US 201229416088 F US201229416088 F US 201229416088F US D694791 S USD694791 S US D694791S
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United States
Prior art keywords
baffle plate
manufacturing semiconductor
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semiconductor
manufacturing
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US29/416,088
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English (en)
Inventor
Naoki Matsumoto
Jun Yoshikawa
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMOTO, NAOKI, YOSHIKAWA, JUN
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US29/416,088 2011-09-20 2012-03-19 Baffle plate for manufacturing semiconductor Active USD694791S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2011-021504 2011-09-20
JPD2011-21504F JP1438320S (enrdf_load_stackoverflow) 2011-09-20 2011-09-20

Publications (1)

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USD694791S1 true USD694791S1 (en) 2013-12-03

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US (1) USD694791S1 (enrdf_load_stackoverflow)
JP (1) JP1438320S (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735786S1 (en) * 2013-07-11 2015-08-04 Sievert Ab Blowtorch
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD890443S1 (en) * 2017-06-27 2020-07-14 Kimberly Ann Virus Feed bucket lid
USD891636S1 (en) 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD935425S1 (en) * 2018-10-04 2021-11-09 Toyo Tanso Co., Ltd. Susceptor for use in production of a semiconductor
USD937330S1 (en) * 2019-05-21 2021-11-30 Sumitomo Electric Hardmetal Corp. Cutting tool
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD1066275S1 (en) * 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1076837S1 (en) * 2023-01-19 2025-05-27 Lam Research Corporation Baffle

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050224179A1 (en) * 2002-05-22 2005-10-13 Tokyo Electron Korea Ltd. Baffle plate and plasma etching device having same
US20070010007A1 (en) * 2005-07-05 2007-01-11 3M Innovative Properties Company Sample processing device compression systems and methods
USD557266S1 (en) * 2006-05-02 2007-12-11 Sanford, L.P. Monitor and printer stand
USD582949S1 (en) * 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20090087615A1 (en) * 2002-02-14 2009-04-02 Sun Jennifer Y Corrosion-resistant gas distribution plate for plasma processing chamber
US20090096349A1 (en) * 2007-04-26 2009-04-16 Moshtagh Vahid S Cross flow cvd reactor
US20090263280A1 (en) * 2001-12-28 2009-10-22 3M Innovative Properties Company Systems for using sample processing devices
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
US20120000422A1 (en) * 2008-07-03 2012-01-05 Applied Materials, Inc. Apparatuses and methods for atomic layer deposition
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
US20130125818A1 (en) * 2011-11-22 2013-05-23 Intermolecular, Inc. Combinatorial deposition based on a spot apparatus

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090263280A1 (en) * 2001-12-28 2009-10-22 3M Innovative Properties Company Systems for using sample processing devices
US20090087615A1 (en) * 2002-02-14 2009-04-02 Sun Jennifer Y Corrosion-resistant gas distribution plate for plasma processing chamber
US20050224179A1 (en) * 2002-05-22 2005-10-13 Tokyo Electron Korea Ltd. Baffle plate and plasma etching device having same
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20070010007A1 (en) * 2005-07-05 2007-01-11 3M Innovative Properties Company Sample processing device compression systems and methods
US8080409B2 (en) * 2005-07-05 2011-12-20 3M Innovative Properties Company Sample processing device compression systems and methods
USD557266S1 (en) * 2006-05-02 2007-12-11 Sanford, L.P. Monitor and printer stand
USD582949S1 (en) * 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20090096349A1 (en) * 2007-04-26 2009-04-16 Moshtagh Vahid S Cross flow cvd reactor
US20120000422A1 (en) * 2008-07-03 2012-01-05 Applied Materials, Inc. Apparatuses and methods for atomic layer deposition
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US20130125818A1 (en) * 2011-11-22 2013-05-23 Intermolecular, Inc. Combinatorial deposition based on a spot apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735786S1 (en) * 2013-07-11 2015-08-04 Sievert Ab Blowtorch
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD890443S1 (en) * 2017-06-27 2020-07-14 Kimberly Ann Virus Feed bucket lid
USD935425S1 (en) * 2018-10-04 2021-11-09 Toyo Tanso Co., Ltd. Susceptor for use in production of a semiconductor
USD891636S1 (en) 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD937330S1 (en) * 2019-05-21 2021-11-30 Sumitomo Electric Hardmetal Corp. Cutting tool
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD1066275S1 (en) * 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1076837S1 (en) * 2023-01-19 2025-05-27 Lam Research Corporation Baffle

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Publication number Publication date
JP1438320S (enrdf_load_stackoverflow) 2015-04-06

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