USD584591S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD584591S1
USD584591S1 US29/295,292 US29529207F USD584591S US D584591 S1 USD584591 S1 US D584591S1 US 29529207 F US29529207 F US 29529207F US D584591 S USD584591 S US D584591S
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Prior art keywords
polishing pad
view
partial
enlarged sectional
enlarged
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Expired - Lifetime
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US29/295,292
Inventor
Hiroyuki Tano
Hiroshi Shiho
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JSR Corp
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JSR Corp
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Publication of USD584591S1 publication Critical patent/USD584591S1/en
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FIG. 1 is a top plan view of a polishing pad showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevation view, left and right side elevational views being a mirror image of the side shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a partial, enlarged view of portion 44 in FIG. 1;
FIG. 5 is a partial, enlarged sectional view taken along line 55 in FIG. 4
FIG. 6 is a partial, enlarged sectional view taken along line 66 in FIG. 4;
FIG. 7 is a partial, greatly enlarged sectional view of portion 7 in FIG. 5; and,
FIG. 8 is a partial, enlarged view of portion 88 in FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad, as shown and described.
US29/295,292 2004-10-26 2007-09-25 Polishing pad Expired - Lifetime USD584591S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/295,292 USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2004032516 2004-10-26
JP2004-32513 2004-10-26
JP2004032512 2004-10-26
JP2004-32514 2004-10-26
JP2004-32512 2004-10-26
JP2004032514 2004-10-26
JP2004-32516 2004-10-26
JP2004032515 2004-10-26
JP2004-32515 2004-10-26
JP2004032513 2004-10-26
US29/228,555 USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,292 USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/228,555 Division USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad

Publications (1)

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USD584591S1 true USD584591S1 (en) 2009-01-13

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Family Applications (5)

Application Number Title Priority Date Filing Date
US29/228,555 Expired - Lifetime USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,290 Expired - Lifetime USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,292 Expired - Lifetime USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 Expired - Lifetime USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 Expired - Lifetime USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad

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US29/228,555 Expired - Lifetime USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,290 Expired - Lifetime USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad

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US29/295,294 Expired - Lifetime USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 Expired - Lifetime USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad

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Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
USD902165S1 (en) * 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
USD852601S1 (en) * 2017-04-24 2019-07-02 Ehwa Diamond Ind. Co., Ltd. Polishing pad

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US88649A (en) 1869-04-06 Improvement in index for piling circular saws
US494471A (en) 1893-03-28 Grinding or polishing wheel and the art of manufacturing same
US4693036A (en) 1983-12-28 1987-09-15 Disco Abrasive Systems, Ltd. Semiconductor wafer surface grinding apparatus
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US5851140A (en) 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
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US6402594B1 (en) 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
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US20050113011A1 (en) 2003-11-04 2005-05-26 Jsr Corporation Chemical mechanical polishing pad
US20050142996A1 (en) 2003-04-11 2005-06-30 Hisatomo Ohno Polishing pad and method of producing same
US20050148183A1 (en) 2002-08-30 2005-07-07 Toray Industries, Inc. Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device
US20050191945A1 (en) 2002-03-18 2005-09-01 Angela Petroski Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US20050211376A1 (en) 2004-03-25 2005-09-29 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
USD510850S1 (en) 2002-12-20 2005-10-25 Production Chemical Mfg. Inc. Polishing pad
US20050245171A1 (en) 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US6986706B1 (en) 2004-08-10 2006-01-17 Universal Photonics, Inc. Polishing pad and method of producing the same
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US7029747B2 (en) 2002-09-17 2006-04-18 Korea Polyol Co., Ltd. Integral polishing pad and manufacturing method thereof
US7112119B1 (en) 2005-08-26 2006-09-26 Applied Materials, Inc. Sealed polishing pad methods
US20060229002A1 (en) * 2005-04-12 2006-10-12 Muldowney Gregory P Radial-biased polishing pad
US7121938B2 (en) 2002-04-03 2006-10-17 Toho Engineering Kabushiki Kaisha Polishing pad and method of fabricating semiconductor substrate using the pad
US7140955B2 (en) * 2001-06-06 2006-11-28 Ebara Corporation Polishing apparatus
US20060276109A1 (en) 2003-03-24 2006-12-07 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7183213B2 (en) 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7201640B2 (en) * 2004-03-31 2007-04-10 Fujikoshi Machinery Corp. Method of sucking water and water sucking device
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US20070197143A1 (en) * 2006-02-17 2007-08-23 Young-Sam Lim Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
US20080003935A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Polishing pad having surface texture
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559064S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559065S1 (en) * 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
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US20080070488A1 (en) * 2006-09-15 2008-03-20 Tokyo Seimitsu Co., Ltd Polishing method and polishing apparatus

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US88649A (en) 1869-04-06 Improvement in index for piling circular saws
US4693036A (en) 1983-12-28 1987-09-15 Disco Abrasive Systems, Ltd. Semiconductor wafer surface grinding apparatus
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Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
USD837015S1 (en) * 2014-06-06 2019-01-01 Husqvarna Construction Products North America, Inc. Polishing pad
USD873108S1 (en) * 2014-06-06 2020-01-21 Husqvarna Ab Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
US11084140B2 (en) 2015-09-24 2021-08-10 Husqvarna Ab Method of using polishing or grinding pad assembly
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD933440S1 (en) * 2016-09-23 2021-10-19 Husqvarna Ab Polishing or grinding pad
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD902165S1 (en) * 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
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USD600989S1 (en) 2009-09-29
USD592030S1 (en) 2009-05-12
USD592029S1 (en) 2009-05-12
USD559066S1 (en) 2008-01-08

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